JPH05299796A - Multi-layer printed wiring board adhesive sheet and metal clad laminated board using the sheet - Google Patents
Multi-layer printed wiring board adhesive sheet and metal clad laminated board using the sheetInfo
- Publication number
- JPH05299796A JPH05299796A JP10151492A JP10151492A JPH05299796A JP H05299796 A JPH05299796 A JP H05299796A JP 10151492 A JP10151492 A JP 10151492A JP 10151492 A JP10151492 A JP 10151492A JP H05299796 A JPH05299796 A JP H05299796A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- sheet
- layer
- layer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高周波領域で使用され
る多層印刷配線板用の接着シートおよびそれを用いた金
属張積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive sheet for a multilayer printed wiring board used in a high frequency range and a metal-clad laminate using the same.
【０００２】[0002]
【従来の技術】最近の電子工業、通信工業、コンピュー
タの各分野において使用される周波数は次第に高周波の
領域に移行している。高周波領域では信号速度や信号の
損失の回路性能への影響が大きく、使用する電気部品や
印刷回路配線板に対して、高周波領域での信号速度の向
上、損失の低減が求められている。回路の信号速度は配
線板の誘電体の比誘電率（以下εｒとする）に依存して
おり、εｒの低いほど信号速度は速くなる。また、信号
の損失は誘電体のεｒと誘電正接（以下ｔａｎδとす
る）に依存しており、εｒやｔａｎδが低いほど損失が
少なくなる。このため、高周波領域で使用される配線板
の誘電体にはεｒやｔａｎδの低いものが要求されてい
る。また、印刷配線板は多層化が進み、高周波用印刷配
線板も例外ではない。2. Description of the Related Art Frequencies used in recent fields of electronics industry, telecommunications industry, and computer are gradually shifting to the high frequency range. In the high frequency region, the signal speed and the loss of the signal have a great influence on the circuit performance, and it is required to improve the signal speed and reduce the loss in the high frequency region for the electric parts and the printed circuit wiring board to be used. The signal speed of the circuit depends on the relative permittivity (hereinafter referred to as εr) of the dielectric of the wiring board, and the lower εr, the faster the signal speed. Further, the signal loss depends on εr and dielectric loss tangent (hereinafter referred to as tan δ) of the dielectric material, and the lower εr and tan δ, the smaller the loss. For this reason, the dielectric material of the wiring board used in the high frequency region is required to have a low εr or tan δ. In addition, printed wiring boards are becoming multi-layered, and high-frequency printed wiring boards are no exception.
【０００３】我々はεｒやｔａｎδの低い誘電体の基板
として、先に特願平２−１５３３８６号、特願平２−１
５３３８８号において、超高分子量ポリエチレン（以下
ＵＨＭＷＰＥと称することがある）樹脂のみの多孔質焼
結シート、樹脂含浸補強層と金属導体層を組合わせた基
板を提案した。さらにこれらに続いて特願平３−１７１
５５２号においてスルーホールの接続信頼性向上のため
に、ＵＨＭＷＰＥに下記に示すような1,2,3,4,7,8,9,1
0,13,13,14,14- ドデカクロロ-1,4,4a,5,6,6a,7,10,10
a,11,12,12a ドデカハイドロ-1,4,7,10-ジメタノジベン
ゾ(a,e) シクロオクテン（オキシデンタルケミカル社
商品名デクロランプラス、以下商品名で表示する）を熱
膨張率の低減およびスルーホールめっきの密着性向上の
ためのフィラーとして配合する方法を提案した。この誘
電体は多孔質焼結シートと樹脂含浸補強層の積層体であ
るため、薄くすることが困難である。従って多層印刷配
線板へ適用すると多層印刷配線板が厚くなってしまうと
いう問題があった。We have previously proposed Japanese Patent Application No. 2-153386 and Japanese Patent Application No. 2-1 as substrates of dielectrics having a low εr and tan δ.
In Japanese Patent No. 53388, a porous sintered sheet of only ultra-high molecular weight polyethylene (hereinafter sometimes referred to as UHMWPE) resin, a substrate in which a resin-impregnated reinforcing layer and a metal conductor layer are combined is proposed. Further to these, Japanese Patent Application No. 3-171
In order to improve the connection reliability of through holes in No. 552, 1,2,3,4,7,8,9,1 shown below in UHMWPE
0,13,13,14,14- Dodecachloro-1,4,4a, 5,6,6a, 7,10,10
a, 11,12,12a Dodecahydro-1,4,7,10-dimethanodibenzo (a, e) cyclooctene (Occidental Chemical Company
We proposed a method of blending the product name Dechloran Plus (hereinafter referred to as the product name) as a filler for reducing the coefficient of thermal expansion and improving the adhesion of through-hole plating. Since this dielectric is a laminate of a porous sintered sheet and a resin-impregnated reinforcing layer, it is difficult to make it thin. Therefore, when applied to a multilayer printed wiring board, there is a problem that the multilayer printed wiring board becomes thick.
【０００４】高周波用多層印刷配線板にこれまで使用さ
れていたのは、低εｒの熱硬化性樹脂をガラス布に含浸
したプリプレグであり、例えば、変性ＰＰＯ樹脂を用い
た特開平１−２１５３１などが挙げられる。この場合、
高εｒのガラス布を使用しているため、εｒがそれぼど
低くならないという欠点があった。また、ふっ素樹脂を
用いる特公平３−５４８７５号公報などや、石英の布を
用いる特開昭６１−２３５４３６号公報などが提案され
ているが、これらはいずれも材料が高価である。さらに
エポキシ樹脂にポリエチレンパウダーを混合する特開昭
６２−９５３２５号公報があるが、ポリエチレンの溶融
粘度が低いため耐熱性が劣る。What has been used so far for a multilayer printed wiring board for high frequencies is a prepreg obtained by impregnating a glass cloth with a low εr thermosetting resin. For example, Japanese Patent Laid-Open No. 1-21531 using a modified PPO resin. Is mentioned. in this case,
Since a glass cloth having a high εr is used, there is a drawback that εr does not become so low. Further, Japanese Patent Publication No. 3-54875 using a fluorine resin and Japanese Patent Application Laid-Open No. 61-235436 using a quartz cloth have been proposed, but these materials are expensive. Further, there is JP-A-62-95325 in which a polyethylene powder is mixed with an epoxy resin, but the heat resistance is poor because the melt viscosity of polyethylene is low.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上述した事情
に鑑みてなされてものであって、εｒやｔａｎδが低
く、安価な多層印刷配線板用接着シートおよびそれを用
いた金属張積層板を提供しようとするものである。The present invention has been made in view of the above circumstances, and provides an inexpensive adhesive sheet for a multilayer printed wiring board having a low εr and tan δ and a metal-clad laminate using the same. It is the one we are trying to provide.
【０００６】[0006]
【課題を解決するための手段】上記課題について本発明
者らは鋭意検討を重ねた結果、低εｒ、低ｔａｎδの超
高分子量ポリエチレン多孔質焼結シートに硬化していな
い熱硬化性樹脂を含浸させた接着シート、およびこれを
用いた金属張積層板が多層印刷配線板用材料として良好
であることを見い出し、本発明を完成するに至った。な
お本発明は、ガラス布などの補強基材を用いていないの
で、プリプレグと称さず接着シートという名称を用いて
いる。Means for Solving the Problems As a result of intensive studies made by the present inventors on the above problems, a low εr, low tan δ ultra high molecular weight polyethylene porous sintered sheet was impregnated with an uncured thermosetting resin. The present inventors have completed the present invention by discovering that the above-mentioned adhesive sheet and the metal-clad laminate using the same are suitable as materials for multilayer printed wiring boards. Since the present invention does not use a reinforcing base material such as glass cloth, the name "adhesive sheet" is used instead of "prepreg".
【０００７】以下、図面に基づき本発明を詳細に説明す
る。図１は本発明による多層印刷配線板用接着シートで
ある。１はＵＨＭＷＰＥの粒子であり、焼結により連続
気泡の多孔質シートを形成している。２は含浸された硬
化していない熱硬化性樹脂であり、接着力保持の機能を
持つ。シート中に気泡が残っているが多層化接着の際に
なくすことができる。図２は本発明による接着シートを
用いた多層印刷配線板の多層化接着前の構成を示してい
る。８が本発明による金属張積層板であり、７、７′が
本発明による接着シートである。機械的強度を確保する
必要がある時は、６、６′に示すようにガラス布補強基
材と組み合わせた多層印刷配線板とすればよい。The present invention will be described in detail below with reference to the drawings. FIG. 1 is an adhesive sheet for a multilayer printed wiring board according to the present invention. Reference numeral 1 is UHMWPE particles, which form a porous sheet having open cells by sintering. Reference numeral 2 denotes an impregnated uncured thermosetting resin, which has a function of retaining the adhesive force. Air bubbles remain in the sheet, but they can be eliminated during multi-layer adhesion. FIG. 2 shows the structure of a multilayer printed wiring board using the adhesive sheet according to the present invention before multilayer adhesion. 8 is a metal-clad laminate according to the present invention, and 7 and 7'are adhesive sheets according to the present invention. When it is necessary to secure the mechanical strength, a multilayer printed wiring board combined with a glass cloth reinforcing substrate as shown in 6, 6'may be used.
【０００８】本発明に用いるＵＨＭＷＰＥ多孔質焼結シ
ートに用いられるＵＨＭＷＰＥは、チーグラー法重合技
術により製造され、その平均分子量は粘度法による測定
で１００万〜５００万と一般のポリエチレンの２万〜２
０万に比べて極めて大きい分子量を持つものである。例
えば、三井石油化学工業（ハイゼックスミリオン，ミペ
ロン）、旭化成工業（サンテック）、西独ヘキスト社
（ＨＯＳＴＡＬＥＮ．ＧＵＲ）、米国ハーキュレス社
（ＨＩＦＬＡＸ．１０００）などで上市しているものが
好適に用いられる。UHMWPE used for the UHMWPE porous sintered sheet used in the present invention is produced by the Ziegler polymerization technique, and its average molecular weight is 1,000,000 to 5,000,000 as measured by the viscosity method and 20,000 to 2,000,000 of general polyethylene.
It has an extremely large molecular weight as compared with that of 100,000. For example, those marketed by Mitsui Petrochemical Industry (Hi-Zex Million, Miperon), Asahi Kasei (Suntec), West German Hoechst Co. (HOSTALEN.GUR), USA Hercules Co. (HIFLAX.1000) and the like are preferably used.
【０００９】ＵＨＭＷＰＥの多孔質焼結シートはＵＨＭ
ＷＰＥ粉末粒子を焼結させ、粒子同士を融着により接合
し、厚み０．０５〜１mmに成形したものである。接合し
た粒子の外側には空気の連続層が存在する。多層印刷配
線板用接着シートとして使用することを考えると、厚み
０．０５〜０．２mmが好ましい。UHMWPE porous sintered sheet is UHM
The WPE powder particles are sintered, the particles are joined together by fusion bonding, and molded into a thickness of 0.05 to 1 mm. There is a continuous layer of air on the outside of the bonded particles. Considering use as an adhesive sheet for a multilayer printed wiring board, a thickness of 0.05 to 0.2 mm is preferable.
【００１０】このＵＨＭＷＰＥ多孔質焼結シートには機
械強度付与、増量などのための充填剤や安定剤、難燃
剤、着色剤などを添加することもできる。前述したデク
ロランプラスを添加すれば、εｒ、ｔａｎδを増加させ
ずにスルーホール接続信頼性を向上させることができ、
誘電特性、スルーホール接続信頼性共に良好な多層印刷
配線板を得ることができる。Fillers and stabilizers for imparting mechanical strength and increasing the amount, flame retardants, colorants and the like can be added to the UHMWPE porous sintered sheet. If the above-mentioned dechlorane plus is added, the through hole connection reliability can be improved without increasing εr and tanδ,
It is possible to obtain a multilayer printed wiring board having good dielectric properties and through-hole connection reliability.
【００１１】ＵＨＭＷＰＥ多孔質焼結シートの製造法
は、例えばフィルム、金属ベルトなどの基材上に必要な
場合は充填剤を混合したＵＨＭＷＰＥの粉末粒子を投入
し、これをロールやバーにより、それらと基材との間隔
を一定に保つようにして得た間隙に通し、ＵＨＭＷＰＥ
の粉末粒子を一定の厚みに賦形し、さらに加熱炉に通
し、粒子同士を加熱焼結させる方法がある。この時ＵＨ
ＭＷＰＥ粉末を液体中に分散させて、スリラー状で賦形
してもよい。The UHMWPE porous sintered sheet is produced by, for example, introducing UHMWPE powder particles mixed with a filler, if necessary, onto a substrate such as a film or a metal belt, and then using a roll or a bar to form the particles. The UHMWPE by passing it through the gap so that the gap between the substrate and the base material is kept constant.
There is a method in which the powder particles of (1) are shaped into a certain thickness and then passed through a heating furnace to heat and sinter the particles. UH at this time
The MWPE powder may be dispersed in a liquid and shaped into a chiller.
【００１２】ＵＨＭＷＰＥ粉末は平均粒子径０．００１
〜１mmであるものが好ましい。得られるＵＨＭＷＰＥ多
孔質焼結シートの表面が平滑になるためには、平均粒子
径が０．００１〜０．１mmであるものが特に好ましい。UHMWPE powder has an average particle size of 0.001
It is preferably 1 mm. In order to make the surface of the obtained UHMWPE porous sintered sheet smooth, it is particularly preferable that the average particle diameter is 0.001 to 0.1 mm.
【００１３】含浸させる熱硬化性樹脂は、ポリエステル
樹脂、エポキシ樹脂、フェノール樹脂、メラミン樹脂、
ジアリルフタレート樹脂、ポリイミド樹脂、ビスマレイ
ミド・トリアジン樹脂、ＰＰＯ樹脂もしくはＰＰＳ樹脂
と架橋性ポリマー又は架橋性モノマーとの樹脂組成物が
挙げられる。好ましくはεｒやｔａｎδが比較的低いポ
リエステル樹脂、エポキシ樹脂、ポリイミド樹脂が用い
られる。コストの面からエポキシ樹脂が、耐熱性の面か
らポリイミド樹脂がさらに好ましい。金属導体層は、
銅、白銅、青銅、黄銅等の銅合金、アルミニウム、ニッ
ケル、鉄、ステンレス等の鉄合金、金銀、白金の箔であ
る。好ましくは、銅箔、アルミニウム箔である。また金
属箔の代わりに所定の導体が形成された銅めっき、金め
っき等の導体層でもよい。これらの厚さは通常８〜７０
μｍである。The thermosetting resin to be impregnated is polyester resin, epoxy resin, phenol resin, melamine resin,
The resin composition includes a diallyl phthalate resin, a polyimide resin, a bismaleimide / triazine resin, a PPO resin or a PPS resin, and a crosslinkable polymer or a crosslinkable monomer. A polyester resin, an epoxy resin, or a polyimide resin having a relatively low εr or tan δ is preferably used. Epoxy resin is more preferable in terms of cost, and polyimide resin is more preferable in terms of heat resistance. The metal conductor layer is
It is a copper alloy such as copper, white copper, bronze, or brass, an iron alloy such as aluminum, nickel, iron, or stainless steel, gold, silver, or platinum foil. Copper foil and aluminum foil are preferable. Further, instead of the metal foil, a conductor layer such as copper plating or gold plating on which a predetermined conductor is formed may be used. These thicknesses are usually 8 to 70
μm.
【００１４】金属張積層板は熱プレスによる加熱加圧で
積層される。この条件は通常１３０〜２５０℃、印加圧
力２０〜８０kg/cm2（０．２〜７．８ＭＰａ）、印加時
間２０〜１２０分で行われる。The metal-clad laminate is laminated by heating and pressurizing by a hot press. The conditions are usually 130 to 250 ° C., applied pressure of 20 to 80 kg / cm 2 (0.2 to 7.8 MPa), and applied time of 20 to 120 minutes.
【００１５】[0015]
【作用】本発明で用いたＵＨＭＷＰＥは低εｒ、低ｔａ
ｎδの樹脂であり、溶融粘度が高いため耐熱性が良好で
ある。これに熱硬化性樹脂を組み合わせることにより、
耐熱性および銅箔との接着性を向上でき、コストを低減
できる。またガラス布を使用しないため、低εｒ、低ｔ
ａｎδとすることができ、しかも薄くできる。The UHMWPE used in the present invention has low εr and low ta.
It is a resin of n δ and has a high melt viscosity and therefore has good heat resistance. By combining this with a thermosetting resin,
The heat resistance and the adhesiveness with the copper foil can be improved, and the cost can be reduced. Also, since no glass cloth is used, low εr and low t
It can be an δ and can be made thin.
【００１６】[0016]
【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto.
【００１７】実施例１〜４ ＵＨＭＷＰＥ粉末にミペロンＸＭ−２２０（平均粒子形
０．０３mm、融点１３６℃、嵩密度０．４ｇ/cm3、ポリ
エチレンの真密度０．９ｇ/cm3、三井石油化学工業株式
会社商品名）を用い、充填剤としてデクロランプラス＃
２５（平均粒子形０．００５mm、融点３５０℃、嵩密度
０．７ｇ/cm3、真密度１．９４ｇ/cm3、オキシデンタル
ケミカル社商品名）をトルエン中に分散させた。配合量
はＵＨＭＷＰＥ１００重量部に対してデクロランプラス
を８０重量部、トルエンを１３５重量部とした。これら
を混合後、よく攪拌し、ガラス板上に０．２mm厚みに賦
形し、１２５℃で１０分乾燥した後、１６０℃で１５分
焼結を行い、厚み０．１４mm、密度０．８５ｇ/cm3（空
隙率３０％）のＵＨＭＷＰＥ多孔質焼結シートを得た。
このシートに溶媒をメチルエチルケトンとメチレングリ
コールの１：１重量比混合液とし、ジシアンジアミドを
硬化剤とした臭素化ビスフェノールＡ型エポキシ樹脂の
溶液を含浸させ、０．１４mm間隔のロッドの間隙を通過
させてエポキシ樹脂溶液付着量を制御し、３０分風乾さ
せた後、１７０℃で３分間乾燥して厚み０．１４mmの多
層印刷配線板用接着シートを得た。この時１７０℃はＵ
ＨＭＷＰＥの融点を越えているので、シートの形状を保
つためにステンレスメッシュ上で乾燥を行った。エポキ
シ樹脂溶液の濃度は表１に示す。溶液濃度の変化により
接着シート中のエポキシ樹脂量を制御した。Examples 1 to 4 UHMWPE powder with Miperon XM-220 (average particle shape 0.03 mm, melting point 136 ° C., bulk density 0.4 g / cm 3 , true density of polyethylene 0.9 g / cm 3 , Mitsui Petrochemical (Industrial Co., Ltd. product name) and dechloran plus as a filler #
25 (average particle form 0.005 mm, melting point 350 ° C., a bulk density of 0.7 g / cm 3, the true density of 1.94 g / cm 3, Occidental Chemical trade name) were dispersed in toluene. The compounding amounts were 80 parts by weight of dechlorane plus and 135 parts by weight of toluene based on 100 parts by weight of UHMWPE. After mixing these, stir well, shape to a thickness of 0.2 mm on a glass plate, dry for 10 minutes at 125 ° C., and sinter for 15 minutes at 160 ° C., thickness 0.14 mm, density 0.85 g A UHMWPE porous sintered sheet having a / cm 3 (porosity of 30%) was obtained.
This sheet was mixed with a mixture of methyl ethyl ketone and methylene glycol in a weight ratio of 1: 1 and impregnated with a solution of brominated bisphenol A type epoxy resin using dicyandiamide as a curing agent, and allowed to pass through a rod gap of 0.14 mm. The amount of the epoxy resin solution attached was controlled, air-dried for 30 minutes, and then dried at 170 ° C. for 3 minutes to obtain an adhesive sheet for a multilayer printed wiring board having a thickness of 0.14 mm. At this time 170 ℃ is U
Since it exceeds the melting point of HMWPE, it was dried on a stainless mesh to maintain the shape of the sheet. The concentration of the epoxy resin solution is shown in Table 1. The amount of epoxy resin in the adhesive sheet was controlled by changing the solution concentration.
【００１８】実施例５〜８ 熱硬化性樹脂に以下の配合によるポリイミド樹脂を用
い、表２に示す濃度とする以外は、実施例１〜４と同様
にして厚み０．１４mmの多層印刷配線板用接着シートを
得た。ポリイミド樹脂溶液は、溶媒をメチルエチルケト
ンとメチルセロソロブの１：１重量比混合液とし、ジシ
アンジアミドを硬化剤としたフェノールノボラック型エ
ポキシ樹脂変性ビスマレイミド樹脂の溶液とした、溶液
の濃度は表１に示す。Examples 5 to 8 A multilayer printed wiring board having a thickness of 0.14 mm was prepared in the same manner as in Examples 1 to 4 except that a polyimide resin having the following composition was used as the thermosetting resin and the concentrations shown in Table 2 were used. An adhesive sheet for use was obtained. The polyimide resin solution was a solution of methyl ethyl ketone and methyl cellosolve in a 1: 1 weight ratio mixture, and a phenol novolac-type epoxy resin-modified bismaleimide resin solution using dicyandiamide as a curing agent. The concentration of the solution is shown in Table 1.
【００１９】比較例１ 実施例で述べたＵＨＭＷＰＥ焼結多孔質シートをそのま
ま接着シートとして用いた。Comparative Example 1 The UHMWPE sintered porous sheet described in the examples was used as it was as an adhesive sheet.
【００２０】比較例２ 実施例１〜４のエポキシ樹脂溶液を７０％の濃度とし、
厚み０．１mmのガラス布に含浸した。０．１２mm間隔の
ロッドの間隙を通過させてエポキシ樹脂溶液付着量を制
御し、１７５℃で３分間乾燥して厚み０．１２mmの多層
印刷配線板用接着シートを得た。Comparative Example 2 The epoxy resin solutions of Examples 1 to 4 were made to have a concentration of 70%,
A glass cloth having a thickness of 0.1 mm was impregnated. The adhesion amount of the epoxy resin solution was controlled by passing through the gaps of rods at intervals of 0.12 mm and dried at 175 ° C. for 3 minutes to obtain an adhesive sheet for a multilayer printed wiring board having a thickness of 0.12 mm.
【００２１】比較例３ 実施例５〜８のポリイミド樹脂溶液（濃度７０％）を用
いる他は、比較例２と同様にして作製した。Comparative Example 3 The procedure of Comparative Example 2 was repeated except that the polyimide resin solutions of Examples 5 to 8 (concentration 70%) were used.
【００２２】比較例４ 比較例１のシートの両面に０．０５mmのガラス布を用い
る他は、比較例２と同様にして得たプリプレグを配置
し、１７５℃、０．２ＭＰａで１０分熱プレスを行い、
厚み０．３mmの多層印刷配線板用接着シートを得た。Comparative Example 4 A prepreg obtained in the same manner as in Comparative Example 2 was arranged, except that a 0.05 mm glass cloth was used on both sides of the sheet of Comparative Example 1, and hot pressing was performed at 175 ° C. and 0.2 MPa for 10 minutes. And then
An adhesive sheet for a multilayer printed wiring board having a thickness of 0.3 mm was obtained.
【００２３】実施例、比較例で得たシートの多層印刷配
線板用接着シートとしての特性を調べるために、平滑面
を黒化処理した銅箔を黒化処理面を内側にして両面に配
置し、１７５℃、０．２ＭＰａで１．５時間熱プレスを
行い、熱硬化性樹脂を硬化させ、接着シート中に残った
気孔を消滅させると同時に銅箔と接着させた。この試料
の銅箔引きはがし強さを測定した。また、金属張積層板
としての特性を調べるために、銅箔粗化面を内側にして
両面に配置し、上述した条件で熱プレスし、金属張積層
板を作製し、銅箔引きはがし強さを測定した。さらに銅
箔をエッチングにより除去した試料を空胴共振器によ
り、εｒ、ｔａｎδを測定した。この銅箔除去試料の厚
みをマイクロメータで測定した。結果を表１、２に示
す。In order to investigate the characteristics of the sheets obtained in Examples and Comparative Examples as an adhesive sheet for a multilayer printed wiring board, a copper foil having a blackened surface was placed on both sides with the blackened surface inside. Hot pressing was performed at 175 ° C. and 0.2 MPa for 1.5 hours to cure the thermosetting resin to eliminate the pores remaining in the adhesive sheet, and at the same time, bond the copper foil. The copper foil peeling strength of this sample was measured. In addition, in order to investigate the properties of the metal-clad laminate, the copper foil roughened surface is placed on both sides, and the both surfaces are hot pressed to produce a metal-clad laminate, and the copper foil peeling strength is determined. Was measured. Further, the sample from which the copper foil was removed by etching was measured for εr and tan δ with a cavity resonator. The thickness of this copper foil removed sample was measured with a micrometer. The results are shown in Tables 1 and 2.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【表２】 [Table 2]
【００２６】比較例２、３に示すガラスエポキシ、ガラ
スポリイミドプリプレグと比べると実施例はεｒが特に
低く、ｔａｎδも低い。比較例１の接着シートと比べる
と粗化面の引きはがし強さが大きく、金属張積層板とし
ての特性がよい。またガラスエポキシプリプレグとＵＨ
ＭＷＰＥシートの積層物の比較例４と比べると、厚みが
薄い。Compared with the glass epoxies and glass polyimide prepregs shown in Comparative Examples 2 and 3, the examples have particularly low εr and tan δ. Compared with the adhesive sheet of Comparative Example 1, the peeling strength of the roughened surface is large and the characteristics as a metal-clad laminate are good. Also glass epoxy prepreg and UH
Compared with the comparative example 4 of the laminate of MWPE sheets, the thickness is thin.
【００２７】[0027]
【発明の効果】実施例で述べたように本発明により、ε
ｒ、ｔａｎδが低く、薄くて引きはがし強さの大きい多
層印刷配線板用接着シートおよび金属張積層板を得るこ
とができる。As described in the embodiments, according to the present invention, ε
It is possible to obtain an adhesive sheet for a multilayer printed wiring board and a metal-clad laminate which have a low r and tan δ and have a large peel strength.
【図１】本発明による多層印刷配線板用接着シートの断
面図である。FIG. 1 is a cross-sectional view of an adhesive sheet for a multilayer printed wiring board according to the present invention.
【図２】本発明による接着シートを用いた多層印刷配線
板の多層化接着前の構成を示す断面図である。FIG. 2 is a cross-sectional view showing the structure of a multilayer printed wiring board using the adhesive sheet according to the present invention before multilayer adhesion.
１ ＵＨＭＷＰＥの粒子よりなる連続気泡の多孔質シー
ト ２ 含浸された硬化していない熱硬化性樹脂 ３ 金属導体層 ４，４′ 硬化した熱硬化性樹脂 ５ ガラス布 ６，６′ ガラス布補強基材 ７，７′ 本発明による接着シート ８ 本発明にかかる金属張積層板1 Porous sheet of open cells made of UHMWPE particles 2 Impregnated uncured thermosetting resin 3 Metal conductor layer 4, 4'Cured thermosetting resin 5 Glass cloth 6, 6'Glass cloth reinforced substrate 7,7 ′ Adhesive sheet according to the present invention 8 Metal-clad laminate according to the present invention
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山口 豊 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yutaka Yamaguchi 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Research Center
Claims (4)
トに熱硬化性樹脂を含浸させてなる多層印刷配線板用接
着シート。1. An adhesive sheet for a multilayer printed wiring board, which is obtained by impregnating a thermosetting resin into an ultrahigh molecular weight polyethylene porous sintered sheet.
項１記載の多層印刷配線板用接着シート。2. The adhesive sheet for a multilayer printed wiring board according to claim 1, wherein the thermosetting resin is an epoxy resin.
求項１記載の多層印刷配線板用接着シート。3. The adhesive sheet for a multilayer printed wiring board according to claim 1, wherein the thermosetting resin is a polyimide resin.
着シートの両面または片面に金属導体層を積層した金属
張積層板。4. A metal-clad laminate in which a metal conductor layer is laminated on both sides or one side of the adhesive sheet for a multilayer printed wiring board according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10151492A JPH05299796A (en) | 1992-04-22 | 1992-04-22 | Multi-layer printed wiring board adhesive sheet and metal clad laminated board using the sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10151492A JPH05299796A (en) | 1992-04-22 | 1992-04-22 | Multi-layer printed wiring board adhesive sheet and metal clad laminated board using the sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05299796A true JPH05299796A (en) | 1993-11-12 |
Family
ID=14302656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10151492A Pending JPH05299796A (en) | 1992-04-22 | 1992-04-22 | Multi-layer printed wiring board adhesive sheet and metal clad laminated board using the sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05299796A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1272022A2 (en) * | 2001-06-18 | 2003-01-02 | Nitto Denko Corporation | Multilayer wiring board and method of manufacturing the same |
| WO2003005787A1 (en) * | 2001-07-02 | 2003-01-16 | Nitto Denko Corporation | Method for manufacturing multilayer wiring board |
| EP1307075A2 (en) * | 2001-10-25 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Prepreg and circuit board and method for manufacturing the same |
| EP1194020A3 (en) * | 2000-09-27 | 2004-03-31 | Matsushita Electric Industrial Co., Ltd. | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| US6976850B2 (en) | 2003-03-20 | 2005-12-20 | Japan Aviation Electronics Industry, Limited | Connector |
-
1992
- 1992-04-22 JP JP10151492A patent/JPH05299796A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1194020A3 (en) * | 2000-09-27 | 2004-03-31 | Matsushita Electric Industrial Co., Ltd. | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| EP1272022A2 (en) * | 2001-06-18 | 2003-01-02 | Nitto Denko Corporation | Multilayer wiring board and method of manufacturing the same |
| EP1272022A3 (en) * | 2001-06-18 | 2004-09-01 | Nitto Denko Corporation | Multilayer wiring board and method of manufacturing the same |
| US7017264B2 (en) | 2001-06-18 | 2006-03-28 | Nitto Denko Corporation | Method of manufacturing multilayer wiring board |
| WO2003005787A1 (en) * | 2001-07-02 | 2003-01-16 | Nitto Denko Corporation | Method for manufacturing multilayer wiring board |
| US7121000B2 (en) | 2001-07-02 | 2006-10-17 | Nitto Denko Corporation | Method for manufacturing multilayer wiring board |
| EP1307075A2 (en) * | 2001-10-25 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Prepreg and circuit board and method for manufacturing the same |
| EP1307075A3 (en) * | 2001-10-25 | 2004-12-29 | Matsushita Electric Industrial Co., Ltd. | Prepreg and circuit board and method for manufacturing the same |
| US7045198B2 (en) | 2001-10-25 | 2006-05-16 | Matsushita Electric Industrial Co., Ltd. | Prepreg and circuit board and method for manufacturing the same |
| US6976850B2 (en) | 2003-03-20 | 2005-12-20 | Japan Aviation Electronics Industry, Limited | Connector |
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