JPH05293080A - Structure of image receiving part of electronic endoscope - Google Patents

Abstract

PURPOSE:To form the title structure with good space efficiency and to prepare easily and inexpensively a shield case by forming a solid image pickup element into square cross-sectional shape at the apex of an inserting part and forming a cylindrical shield case by bending a thin metal sheet along the contour of the solid image pickup element. CONSTITUTION:A solid image pickup element 10 is formed in such a way that ceramic head parts 10 are formed on both sides of an image pickup part 10a and the whole shape is formed into a square shape with four corners cut by 45 deg.. In addition, the solid image pickup element 10 is inserted and fitted in a metal cylindrical shield case 15 formed into the same peripheral shape as that of the solid image pickup element 10 and it is fixed by adhesion and the outer periphery of the shield case 15 is wound with a synthetic resin tape 16 with electric insulation properties. The shield case 15 is inserted in a perforated hole 17 perforated in a metal apex main body 2 positioned at the apex 1 of the inserting part and is pressed and fixed with a biss in the apex part main body 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an image receiving portion of a so-called electronic endoscope using a solid-state image pickup device.

[0002]

2. Description of the Related Art A solid-state image pickup element used in an image receiving portion of an electronic endoscope of this type is formed in an oval shape as a whole by forming header portions on both sides of a substantially square image receiving surface. Then, the solid-state imaging device is fitted and fixed in a metallic cylindrical shield case, and the shield case is fixed to the tip of the insertion portion.

A solid-state image pickup device and a shield case of such an electronic endoscope are disclosed in, for example, JP-A-63-155.
The shield case described in No. 016 and having an oval cross section has a smooth shape as a whole, and thus can be easily manufactured by drawing or the like.

[0004]

However, in such a solid-state image pickup device having an oval cross section, the area occupied by the header portion around the image pickup surface is relatively large compared to the area of the image receiving surface. When mounted in a small space such as the tip of an endoscope, space efficiency is poor.

Therefore, for example, it is advantageous in terms of space efficiency to form the solid-state image pickup device in a rectangular cross-sectional shape with chamfered four corners. However, when attempting to manufacture a shield case with a cross-sectional shape that follows such a rectangular shape by drawing, the corners of the four corners cannot be processed with high accuracy, and thus the solid-state image sensor is displaced. To do.

Therefore, for example, if electric discharge machining or wire cutter machining is used, such a shape can be obtained with relatively high accuracy, but it is not suitable for mass production because the machining takes time and is expensive.

Therefore, the present invention provides a structure of an image receiving portion of an electronic endoscope in which a solid-state image pickup device is formed in a space-efficient shape and a shield case can be easily and inexpensively manufactured. To aim.

[0008]

In order to achieve the above object, the structure of the image receiving portion of the electronic endoscope of the present invention is a solid placed at the image forming position of the objective optical system built in the tip of the insertion portion. The imaging element is formed into a rectangular cross-sectional shape with chamfered four corners, and a thin metal plate is bent into a shape along the contour of the solid-state imaging element to form a cylindrical shield case, and the solid-state imaging is performed in the shield case. It is characterized in that the element is fitted and fixed to the tip of the insertion portion.

[0009]

Embodiments will be described with reference to the drawings. FIG. 2 shows the tip of the insertion portion of the endoscope.

In the figure, reference numeral 2 denotes a metallic tip body which is disposed at the tip 1 of the insertion portion and is made of, for example, stainless steel, and the periphery thereof is covered with an insulating cover 3 made of synthetic resin having electric insulation. It has been fixed by adhesion.

Reference numeral 4 denotes a curved portion which is continuously provided on the rear end portion of the tip end portion body 2 and is bent by remote control. A frontmost node ring 5 is fitted on the outer periphery of the rear end portion of the tip end portion body 2. It is attached and is fixedly connected by screws 6.

The outer surface of the curved portion 4 is covered with a flexible and electrically insulating rubber insulating tube 7, and the insulating tube 7 is fixed to the outer periphery of the rear half of the tip body 2 by adhesion. .. Reference numeral 8 is a node ring, and 9 is a connecting shaft for rotatably connecting the node rings.

Numeral 10 is a solid-state image pickup device composed of, for example, a CCD, 10a is a substantially square image receiving portion, and 10b is a transparent image formed on its surface to prevent dust and the like from adhering to the image receiving portion. A transparent layer made of epoxy resin or the like.

An output signal from the solid-state image pickup device 10 is amplified by an amplifier circuit formed on the substrate 11 and is connected to a monitor device via a signal processing circuit at the rear side by a cord 13 passing through the shield cable 12. (Not shown).

As shown in FIG. 3, the solid-state image pickup device 10 has a ceramic header portion 10c formed on both sides of an image receiving portion 10a, and is formed in a rectangular shape with four corners chamfered at 45 degrees as a whole. Has been done. However, the chamfer angle may not be 45 degrees.

Returning to FIG. 2, the solid-state image sensor 10 and the substrate 1
A tape 14 made of synthetic resin having electric insulation is wound around the outer periphery of the wire 1. Then, the solid-state image sensor 10 is fitted and fixed in a tubular cylindrical metal shield case 15 formed in the same shape as the outer shape of the solid-state image sensor 10. As shown in FIG. 1, which is a cross-sectional view, a synthetic resin tape 16 having electrical insulation is also wound around the outer periphery of the shield case 15.

As shown in FIG. 2, the shield case 15 is fitted in a through hole 17 formed in the tip body 2 and is fixed by pressing with a screw 18 in the tip body 2.

As described above, the insulating tapes 14 and 16 ensure the insulating property between the solid-state image pickup device 10, the shield case 15 and the tip portion main body 2 so that electrical conduction or leakage does not occur. ing.

As shown in FIG. 4, the shield case 15 is formed into a tubular shape by bending a thin metal plate into a rectangular shape along the contour of the solid-state image pickup device 10, and can be manufactured by press working. The bent ends 15b are butted against each other, and as shown in FIG.
The insulating tape 16 is wound and fixed in a butted state.

Returning to FIG. 2, the shield case 15 penetrates the through hole 17 and projects to the front thereof, and the shield case 1
The tip end portion 15a of 5 reaches the inside of the hole 3a formed on the back surface of the insulating cover 3, and the insulating tape 16 on the outer periphery thereof is in contact with the insulating cover 3, so that the shield case 15 and the tip end body 2 are separated from each other. It is not electrically connected.

A silicon resin filler 19 is filled in the vicinity of the end of the shielded cable 12 to completely fix and insulate each member in the vicinity thereof. The shield case 15 is grounded via the ground wire 20 of the shield cable 12 to prevent noise from entering the solid-state imaging device 10.

On the other hand, the tip body 2 is not grounded,
When the high frequency treatment tool is used, it can be electrically connected to the negative side of the high frequency generator. As shown in FIG. 5, a cutout 15c is formed at the end of the shield case 15.
By forming the above, the work of soldering the ground wire 20 can be easily performed. Such a cutout 15c is provided in the shield case 1
5. It can be processed at the same time by pressing at the time of manufacturing.

Returning to FIG. 2 again, reference numeral 21 is an objective optical system for forming an observation image on the image receiving portion 10a of the solid-state image pickup device 10, which is adhered and fixed in the lens frame 22 made of metal. The rear side portion 22a of the lens frame 22 is fitted into the shield case 15 and fixed by adhesion.

With such a structure, an observation image is formed on the image receiving portion 10a of the solid-state image pickup device 10 by the objective optical system 21, converted into an electric signal by the solid-state image pickup device 10, and the signal passes through the code 13. It is sent out of the insertion section.

[0025]

According to the structure of the image receiving portion of the electronic endoscope of the present invention, since the solid-state image pickup element is formed in a square cross-sectional shape with chamfered four corners, the solid state image pickup element is surrounded by the area surrounding the image receiving surface. The area occupied by the header can be minimized,
Space efficiency is good, and since the shield case surrounding the solid-state image sensor is formed by bending a thin metal plate, it can be mass-produced easily and inexpensively by press working.

[Brief description of drawings]

FIG. 1 is a partial front sectional view of an embodiment (II in FIG. 2)
It is a partial sectional view).

FIG. 2 is a plan sectional view of the structure of the tip of the insertion portion of the electronic endoscope of the embodiment.

FIG. 3 is a front sectional view of a solid-state image sensor according to an example.

FIG. 4 is a perspective view of a shield case of the embodiment.

FIG. 5 is a perspective view of a shield case according to a second embodiment.

[Explanation of symbols]

 1 Tip of Insertion Section 10 Solid-State Image Sensor 15 Shield Case 21 Objective Optical System

Claims (1)

[Claims] 1. A solid-state image pickup device arranged at an image-forming position of an objective optical system built in a tip of an insertion portion is formed in a rectangular cross-sectional shape with chamfered four corners, and a metal thin plate is formed on the solid-state image pickup device. An image receiving portion of an electronic endoscope, characterized in that a tubular shield case is formed by bending the shape along the contour, and the solid-state imaging device is fitted and fixed in the shield case and fixed to the tip of the insertion portion. Structure.