JPH05291469A - Plastic sealed semiconductor device, memory card using this device and manufacture thereof - Google Patents

Abstract

PURPOSE:To make it possible to mount a plastic sealed semiconductor device on a printed board at a high density. CONSTITUTION:A memory card is provided with a plastic sealed semiconductor device 10 with leads turned both upwards and downwards that has a lead 10A turned downwards and a lead 10B turned upwards; a plastic sealed semiconductor device 11 with both leads turned downwards that has a lead 11A turned downwards and a lead 11B turned downwards ; and a plastic sealed semiconductor device 12 with leads both turned upwards and downwards that has a lead 12A turned upwards and a lead 12B turned downwards.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a resin-encapsulated semiconductor device capable of high-density mounting, a structure of a memory card in which a plurality of the resin-encapsulated semiconductor devices are incorporated into a card,
And a method of manufacturing the memory card.

[0002]

2. Description of the Related Art Currently, widely used cash cards, credit cards, etc. can be verified as to who they are by applying a magnetic stripe to a plastic card and reading the information recorded on it. It was done like this. In such a magnetic recording system, the third
Information is easily deciphered by a person, and the amount of recordable information is small.

Therefore, in recent years, a so-called IC card in which an IC having functions such as a memory and a CPU is mounted on a card-shaped substrate has been developed and put into practical use.

Further, a memory card has been proposed in which an extremely thin semiconductor device is mounted instead of the IC itself. FIG. 10 is a partially cutaway perspective view showing a conventional memory card. In the figure, 1 is a cover, 2 is a frame, 3 is a metal shutter, 4 is a printed circuit board on which a plurality of resin-sealed semiconductor devices 5 and a plurality of chip capacitors 6 are mounted, and 7 is a connection pad.

The lead 8 of the resin-encapsulated semiconductor device 5 is fixed to the printed circuit board 4 by solder 9 as shown in FIG.

The memory card having this structure has a thicker card thickness than the IC card, but since each function itself uses the resin-sealed semiconductor device 5, it is highly reliable and mechanical. It has the advantages that it has a high dynamic strength, is excellent in mass productivity because of its ease of manufacturing, and has a large amount of information.

[0007]

However, in the memory card having the above-mentioned structure, the optical card is in a situation where it is necessary to further develop the high function (high information) seen in recent years. Has a size of 54.0 mm x 85.6 mm x 3.3 mm according to the JEIDA standard.
Therefore, the resin-sealed semiconductor device with a thickness of more than 1.0 mm, which is mounted in the size of the current memory card, can be mounted only in the lateral direction as shown in FIG. There was a point.

According to the present invention, in order to eliminate the above-mentioned problem that the resin-sealed semiconductor device cannot be mounted on the memory card at a high density, the lead shape of the resin-sealed semiconductor device and the resin-sealed semiconductor device are sealed. It is an object of the present invention to provide an excellent resin-encapsulated semiconductor device and a memory card that have improved parts to enable high-density mounting of the resin-encapsulated semiconductor device.

[0009]

In a resin-sealed semiconductor device according to the present invention, one lead is formed downward or upward, and the other lead is formed downward or upward and resin-sealed. A resin-encapsulated semiconductor device with upward leads, a resin-encapsulated semiconductor device with downward / downward leads, and a resin-encapsulated semiconductor device with upward / downward leads.

In the memory card according to the present invention, the downward leads of the resin-encapsulated semiconductor device with downward / downward leads are connected to the upward leads of the resin-encapsulated semiconductor device with downward / upward leads. , Resin-encapsulated type with downward / downward leads, connecting the downward leads of the resin-encapsulated semiconductor device with downward / downward leads to the upward leads of the resin-encapsulated semiconductor device with upward / downward leads A plurality of resin-sealed semiconductor devices, which are housed in a lead groove of a resin-sealed portion of a semiconductor device and integrally connected, are fixed to a printed circuit board and housed in a case.

The method for manufacturing a resin-encapsulated semiconductor device according to the present invention comprises a first mounting step of solder-bonding the first-layer resin-encapsulated semiconductor device with downward / downward leads to a printed circuit board. Soldering the downward leads of the resin-encapsulated semiconductor device with downward / upward leads of the first layer and the downward leads of the resin-encapsulated semiconductor device with upward / downward leads of the first layer to a printed circuit board; The resin mounting type semiconductor device with upward / downward leads and the downward / upward leads corresponding to the mounting process of 2 and the downward leads of the downward / downward resin-sealed semiconductor device with downward leads. And a third mounting step of solder-joining to the leads of the resin-encapsulated semiconductor device with a cover.

[0012]

The present invention enables high-density mounting on a printed circuit board due to the lead shape and the resin-sealed portion of the resin-sealed semiconductor device.

[0013]

1 is a side view showing an embodiment of a resin-sealed semiconductor device according to the present invention. In the figure, 10 is the same as in FIG.
As shown in (A), the lead 10A is mounted so that the lead 10A faces downward and the lead 10B faces upward.
In addition, as shown in FIG. 2, the lead groove 1 matched to the lead shape
Resin-sealed semiconductor device with downward / upward leads having 0D formed thereon (hereinafter simply referred to as downward / upward semiconductor device), 11
As shown in FIG. 1 (B), the leads 11A are mounted so that the leads 11A face downward and the leads 11B face downward, and the resin-sealed portion 11C has leads conforming to the lead shape as shown in FIG. As shown in FIG. 1C, a resin-sealed semiconductor device with a downward / downward lead in which a groove 11D is formed (hereinafter simply referred to as a downward / downward semiconductor device) 12 has an upper side with a lead 12A. Orientation, the lead 12B is mounted facing downward, and the resin-sealed portion 12C is provided with a lead groove 12D formed to match the lead shape as shown in FIG. A semiconductor device (hereinafter, simply referred to as an upward / downward semiconductor device).

In the downward / upward semiconductor device 10 and the upward / downward semiconductor device 12 having the above structure, the leads 10A and 12A and the leads 10B and 12B are alternately arranged as shown in FIG. It is provided and its lead wiring state is referred to as A pattern lead. Further, in the downward / downward semiconductor device 11, the leads 11A and the leads 11B are alternately provided as shown in FIG. 3B, and the lead wiring state is referred to as a B pattern lead.

FIG. 4 is a side view showing an embodiment of the memory card according to the present invention, and FIG. 5 is a partially cutaway plan view of FIG. In the figure, 13 is a memory card case,
14 is a printed circuit board. As an example, a case where seven resin-sealed semiconductor devices are mounted is shown. Then, a method of fixing the seven resin-sealed semiconductor devices on the printed circuit board will be described with reference to FIGS. 6 and 7. First, position L
4 (see FIG. 6A), the downward / downward semiconductor device 11
The leads 11A and 11B (first layer) are soldered 15 to the printed board 14. Next, position L2 (see FIG.
The lead 10A of the downward / upward semiconductor device 10 (first layer) is soldered 15 to the printed board 14 (see (A)). Next, the lead 12B of the upward / downward semiconductor device 12 (first layer) is soldered 15 to the printed board 14 at the position L6 (see FIG. 6A). Next, position L7 (see FIG. 6)
The lead 12B of the upward / downward semiconductor device 12 (first layer) is soldered 15 to the printed board 14 (see (A)). Next, at a position L5 (see FIG. 6A), the leads 11A of the downward / downward semiconductor device 11 (second layer) and the downward / upward semiconductor device 10 (first layer). Lead 10B
7 are soldered to the lead groove 11D of the downward / downward semiconductor device (first layer) 11 at the already fixed position L4 (see FIG. 6A) as shown in FIG. Adhesive 1
Fix at 6. Similarly, the lead 11B at this position L5 (second layer) and the lead 12A of the above-mentioned upward / downward semiconductor device 12 (first layer) are soldered to each other, and as shown in FIG. The lead groove 1 of the downward / downward semiconductor device (first layer) at the position L4 (see FIG. 6A) which is already fixed.
Fix to OD with adhesive 16. Next, position L1 (see FIG.
(A), the leads 10A of the downward / upward semiconductor device 10 (first layer) are soldered 15 to the printed board 5. Next, at the position L3 (see FIG. 6A), the leads 11A of the downward / downward semiconductor device 11 (second layer) and the downward / upward semiconductor device 10 (first layer). As shown in FIG. 7, the lead 10B is soldered to the lead groove of the downward / upward semiconductor device (first layer) 10 at the position L2 (see FIG. 6A) which is already fixed. Adhesive 16 on 10D
Fix with. Similarly, this position L3 (see FIG. 6A)
Downward / downward semiconductor device 11 (second layer) lead 11
B and the leads 12A of the upward / downward semiconductor device 12 (first layer) are soldered to each other, and as shown in FIG.
The lead groove 10D of the downward / upward semiconductor device (first layer) 10 at the position L2 (see FIG. 6A) which is already fixed.
It is fixed with an adhesive 16.

In this way, the seven resin-sealed semiconductor devices can be stacked in two layers and fixed on the printed circuit board 14.

FIG. 8 is a side view showing another embodiment of the resin-sealed semiconductor device according to the present invention. In the figure, as shown in FIG. 8B, reference numeral 17 denotes a resin-sealed semiconductor device with horizontal / horizontal leads (hereinafter simply referred to as horizontal / horizontal semiconductor device) in which leads 17A and 17B both project horizontally.

Then, the downward / downward semiconductor device 11 is provided.
(See FIG. 8A) and this horizontal / horizontal semiconductor device 17
(See FIG. 8B), it can be mounted on the printed board 14 as shown in FIG.

The thickness of the above resin-encapsulated semiconductor device is currently about 2 mm to 1 mm, and more preferably 0.6 to 0.5 m.
It is made up to m.

Further, in the above embodiments, the case where seven resin-sealed semiconductor devices are stacked in two layers has been shown, but the present invention is not limited to this.

In the above description, the case where the resin-encapsulated semiconductor device is mounted while being sequentially mounted on the printed circuit board is shown. However, the present invention is not limited to this, and after soldering is performed in advance, the semiconductor device is mounted on the printed circuit board. Of course, you can do that.

[0022]

As described above in detail, according to the resin-encapsulated semiconductor device, the memory card using the resin-encapsulated semiconductor device, and the method for manufacturing the same according to the present invention, the resin-encapsulated semiconductor device is provided. The various lead shapes and the leads drawn out alternately to the left and right, and the lead groove formed in the resin sealing portion in accordance with the lead shapes have the effect of enabling high-density mounting on the printed circuit board.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a resin-sealed semiconductor device according to the present invention.

FIG. 2 is a partially detailed perspective view of a resin sealing portion of FIG.

FIG. 3 is a plan view of the resin-sealed semiconductor device of FIG.

FIG. 4 is a sectional side view showing an embodiment of a memory card according to the present invention.

FIG. 5 is a partially cutaway plan view of FIG.

6 is a side view and a plan view showing an exploded state of the stacked state of FIGS. 4 and 5. FIG.

FIG. 7 is a partially detailed side view of FIG.

FIG. 8 is a side view showing another embodiment of the resin-sealed semiconductor device according to the present invention.

FIG. 9 is a sectional side view showing another embodiment of the memory card of the present invention.

FIG. 10 is a partially cutaway perspective view showing a conventional memory card.

11 is a diagram showing a mounted state of the resin-sealed semiconductor device of FIG.

[Explanation of symbols]

 10 resin encapsulation type semiconductor device with downward / upward leads 11 resin encapsulation type semiconductor device with downward / downward leads 12 resin encapsulation type semiconductor device with up / down leads 13 case 14 printed circuit board 17 horizontal Resin-sealed semiconductor device with horizontal leads

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display area H01L 25/10 25/11 25/18

Claims (6)

[Claims] 1. A resin-encapsulated semiconductor device with downward / upward leads, wherein one lead is formed downward or upward, and the other lead is formed downward or upward and resin-encapsulated. Resin-sealed semiconductor device with downward lead,
A resin-encapsulated semiconductor device comprising a resin-encapsulated semiconductor device with upward and downward leads. 2. A resin-sealed semiconductor device with a horizontal / horizontal lead, wherein one lead is formed horizontally or downward and the other lead is formed horizontally or downward and resin-encapsulated. A resin-encapsulated semiconductor device comprising a resin-encapsulated semiconductor device with a downward lead. 3. The resin-encapsulated semiconductor device according to claim 1, wherein a lead groove conforming to the lead shape is formed on the surface of the resin-encapsulated portion. 4. The downward leads of the resin-encapsulated semiconductor device with downward / upward leads are connected to the downward leads of the resin-encapsulated semiconductor device with downward / downward leads. For the upward lead of resin-sealed semiconductor device,
Connected the downward leads of the resin-encapsulated semiconductor device with downward leads, housed these leads in the lead groove of the resin-encapsulated part of the resin-encapsulated semiconductor device to be connected, and connected them together. A memory card in which a sealed semiconductor device is fixedly housed in a printed circuit board. 5. A first mounting step of solder-bonding a first-layer downward / downward-lead resin-encapsulated semiconductor device to a printed circuit board, and a first-layer downward / upper-lead resin-encapsulated semiconductor. Second mounting step for solder-bonding the downward leads of the device and the downward leads of the resin-sealed semiconductor device with upward / downward leads of the first layer to the printed circuit board, and downward / downward leads of the second layer Solder to the leads of the resin-encapsulated semiconductor device with downward / upward leads and the downward / upward leads of the first layer corresponding to the downward leads of the resin-encapsulated semiconductor device A method of manufacturing a memory card, comprising a third mounting step of joining. 6. A downside / downside lead-equipped resin-encapsulated semiconductor device with one downward lead connected to one horizontal / horizontal lead-sided resin-encapsulated semiconductor device with a horizontal lead, and these leads are connected. A memory card, wherein a plurality of resin-encapsulated semiconductor devices, which are housed in a lead groove of a resin-encapsulated part of the resin-encapsulated semiconductor device and are integrally connected, are fixedly housed on a printed circuit board.