JPH0528772Y2 - - Google Patents
Info
- Publication number
- JPH0528772Y2 JPH0528772Y2 JP2528887U JP2528887U JPH0528772Y2 JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2 JP 2528887 U JP2528887 U JP 2528887U JP 2528887 U JP2528887 U JP 2528887U JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding jig
- sheet holding
- outer ring
- wafer sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 56
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 56
- 238000003825 pressing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Special Conveying (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528887U JPH0528772Y2 (US06368395-20020409-C00050.png) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528887U JPH0528772Y2 (US06368395-20020409-C00050.png) | 1987-02-23 | 1987-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63134546U JPS63134546U (US06368395-20020409-C00050.png) | 1988-09-02 |
| JPH0528772Y2 true JPH0528772Y2 (US06368395-20020409-C00050.png) | 1993-07-23 |
Family
ID=30825301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2528887U Expired - Lifetime JPH0528772Y2 (US06368395-20020409-C00050.png) | 1987-02-23 | 1987-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528772Y2 (US06368395-20020409-C00050.png) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059749A (ja) * | 2010-09-06 | 2012-03-22 | Shin Etsu Polymer Co Ltd | 基板用の保持治具 |
| JP7237413B2 (ja) * | 2018-05-14 | 2023-03-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212813A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212814A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212815A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2020024990A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2020024991A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166722B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166721B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166723B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
-
1987
- 1987-02-23 JP JP2528887U patent/JPH0528772Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63134546U (US06368395-20020409-C00050.png) | 1988-09-02 |
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