JPH05285830A - Electrolytic dressing electrode structure for metal bond grinding wheel - Google Patents

Electrolytic dressing electrode structure for metal bond grinding wheel

Info

Publication number
JPH05285830A
JPH05285830A JP8400092A JP8400092A JPH05285830A JP H05285830 A JPH05285830 A JP H05285830A JP 8400092 A JP8400092 A JP 8400092A JP 8400092 A JP8400092 A JP 8400092A JP H05285830 A JPH05285830 A JP H05285830A
Authority
JP
Japan
Prior art keywords
electrode
metal bond
conductive liquid
grinding wheel
weakly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8400092A
Other languages
Japanese (ja)
Inventor
Yoichi Nakazawa
洋一 中沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP8400092A priority Critical patent/JPH05285830A/en
Publication of JPH05285830A publication Critical patent/JPH05285830A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

PURPOSE:To perform high-efficient electrolytic dressing by a method wherein a weak conductive liquid delivery hole is formed in the surface, positioned facing a grinding wheel, of an electrode for electrolytic dressing, and a gap between a metal bond grinding wheel and the electrode is sufficiently filled with weak conductive liquid in any rotation area. CONSTITUTION:A weak conductive liquid delivery hole is formed in the surface, positioned facing the working end surface shape of a metal bond grinding wheel, of an electrode 1. A gap between a metal bond grinding wheel 6 and the electrode 1 is filled with weak conductive liquid 7 and a diffusion preventing plate 5 is arranged on a side on the electrode.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は研削加工におけるメタル
ボンド砥石の電解ドレッシング電極構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic dressing electrode structure for a metal bond grindstone in a grinding process.

【0002】[0002]

【従来の技術】近年除去加工としての研削加工において
超精密加工を目的としてメタルボンド微細砥粒砥石が用
いられているが、例えば特開平2−232162号公報
に提示されるがごとくメタルボンド砥石に電圧を印加し
てドレッシングすることにより、良好な鏡面平滑面を高
能率かつ高速で得ることが出来る。
2. Description of the Related Art In recent years, a metal bond fine abrasive grain grindstone has been used for the purpose of ultra-precision machining in a grinding process as a removal process. For example, as disclosed in Japanese Patent Application Laid-Open No. 2-232162, a metal bond grindstone is used. By applying a voltage and dressing, a good mirror-smooth surface can be obtained efficiently and at high speed.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、メタル
ボンド砥石と電極の間に図6に示すように電極外部より
弱電導性液体を供給すると、メタルボンド砥石の遠心力
で弱電導液体が飛散してしまいメタルボンド砥石と電極
の間に満たされなくなり電解によるドレッシング効果が
低くなり非常に時間がかかり不便であった。
However, when a weakly conductive liquid is supplied from the outside of the electrode between the metal bond grindstone and the electrode as shown in FIG. 6, the centrifugal force of the metal bond grindstone scatters the weakly conductive liquid. Since the metal bond grindstone and the electrode are not filled with each other, the dressing effect by electrolysis is lowered, which is very time-consuming and inconvenient.

【0004】また砥石使用端面形状がJIS−A型以外
の形状になった時、メタルボンド砥石回転による遠心力
によって水切り効果が発生して弱電導液体が砥石先端に
集中または側面に拡散してしまい電解ドレッシング効果
が起こり難くなった。本発明の目的は前記従来技術の欠
陥を無くして、いかなる回転域においてもメタルボンド
砥石と電極間に弱電導性液体が満たされる装置を供給す
るものである。
When the end surface of the grindstone used has a shape other than the JIS-A type, the centrifugal force generated by the rotation of the metal-bonded grindstone causes a draining effect, which causes the weakly conductive liquid to concentrate on the tip of the grindstone or diffuse to the side surface. The electrolytic dressing effect is less likely to occur. An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide a device in which a weakly conductive liquid is filled between a metal bond grindstone and an electrode in any rotation range.

【0005】[0005]

【課題を解決するための手段】本発明によるメタルボン
ド砥石の電解ドレッシング方法及びその装置においてメ
タルボンド砥石使用端面形状に相対する電極側の面に弱
電導性液体の吐出穴を設けて、メタルボンド砥石と電極
間に弱電導性液体を満たし、電極側側面に拡散防止板を
つける事によって側面からの弱電導性液体の拡散を防ぐ
構成を特徴とする。
In the method and apparatus for electrolytically dressing a metal bond grindstone according to the present invention, a discharge hole for a weakly conductive liquid is provided on the surface of the electrode side opposite to the end face shape of the metal bond grindstone, and a metal bond is formed. The structure is characterized in that a weakly conductive liquid is filled between the grindstone and the electrode, and a diffusion prevention plate is attached to the side surface on the electrode side to prevent the weakly conductive liquid from diffusing from the side surface.

【0006】[0006]

【実施例】以下、本発明によるメタルボンド砥石の電解
ドレッシング方法について図面を参照しながら説明す
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electrolytic dressing method for a metal bond grindstone according to the present invention will be described below with reference to the drawings.

【0007】図1は本発明による電解用電極を示す。1
は電極、2は弱電導性液体通路、3は弱電導性液体吐出
穴で本実施例では3箇所設けた。4はメタルボンド砥石
との相対する電解作用面である。弱電導性液体吐出穴2
の位置は電極中央設け砥石の回転方向が変わっても十分
弱電導性液体が流れるような位置とした。電極1の大き
さによって弱電導性液体吐出穴2の数量・穴径を決める
ことが重要である。当然ながら弱電導性液体吐出穴2は
円径とは限らず弱電導性液体が電界作用面4に十分行き
渡るような形状も含まれる。図2は本発明による電解用
電極構造を示す。5は拡散防止板で電極1の電解作用面
に対して直角に取り付けた。図3に示すように弱電導性
液体吐出穴3より吐出した弱電導性液体は電極側面に逃
げ易い。拡散防止板5を取り付けることによって側面へ
の拡散を防ぐことができる。以下電解ドレッシングの過
程を述べる。
FIG. 1 shows an electrode for electrolysis according to the present invention. 1
Is an electrode, 2 is a weakly conductive liquid passage, and 3 is a weakly conductive liquid discharge hole, which is provided at three places in this embodiment. Reference numeral 4 is an electrolytically acting surface facing the metal bond grindstone. Weakly conductive liquid discharge hole 2
The position was set at the center of the electrode so that the weakly conductive liquid could flow sufficiently even if the rotation direction of the grindstone changed. It is important to determine the number and hole diameter of the weakly conductive liquid discharge holes 2 depending on the size of the electrode 1. As a matter of course, the weakly conductive liquid discharge hole 2 is not limited to have a circular diameter, and includes a shape in which the weakly conductive liquid is sufficiently spread over the electric field acting surface 4. FIG. 2 shows an electrode structure for electrolysis according to the present invention. Reference numeral 5 is a diffusion prevention plate, which was attached at a right angle to the electrolysis surface of the electrode 1. As shown in FIG. 3, the weakly conductive liquid discharged from the weakly conductive liquid discharge hole 3 easily escapes to the side surface of the electrode. By attaching the diffusion prevention plate 5, it is possible to prevent diffusion to the side surface. The process of electrolytic dressing will be described below.

【0008】図3のように電極1はメタルボンド砥石6
と最適な電解効果が得られる距離(0.01mmから1
0mm)に保持されて、弱電導性液体7が弱電導性液体
通路2を通って電極1とメタルボンド砥石6の間に供給
される。電極1とメタルボンド砥石6へは弱電導性液体
7を通して電解用電源8によって電圧を印加することに
より電解効果によってメタルボンド砥石6をドレッシン
グする事ができ、良好な鏡面を得ることができる。
As shown in FIG. 3, the electrode 1 is a metal bond grindstone 6
And the distance to obtain the optimum electrolysis effect (0.01 mm to 1
0 mm), the weakly conductive liquid 7 is supplied between the electrode 1 and the metal bond grindstone 6 through the weakly conductive liquid passage 2. By applying a voltage to the electrode 1 and the metal bond grindstone 6 from the electroconductive power source 8 through the weakly conductive liquid 7, the metal bond grindstone 6 can be dressed by the electrolytic effect, and a good mirror surface can be obtained.

【0009】図4はメタルボンド砥石と電極間に流れる
電流の時間における変化を周速別に示したものである。
周速が早くなれば弱電導性液体7が十分行き渡らなくな
り電解効果が少なくなる。メタルボンド砥石表面に不導
体皮膜ができにくくなり、電流値が下がらなくなる。メ
タルボンド砥石をドレッシングするときは周速を低くし
て行うが、加工物を実際に研削加工するときは周速が1
000m/min以上と高くなる。加工中には電解ドレ
ッシングが起こりにくい事を示す。
FIG. 4 shows changes in current flowing between the metal bond grindstone and the electrode with respect to time according to peripheral speed.
If the peripheral speed becomes faster, the weakly conductive liquid 7 will not be sufficiently spread, and the electrolytic effect will decrease. It becomes difficult to form a non-conductive film on the surface of the metal bond grindstone, and the current value does not decrease. The peripheral speed is low when dressing a metal bond grindstone, but the peripheral speed is 1 when actually grinding a workpiece.
Higher than 000 m / min. It shows that electrolytic dressing is less likely to occur during processing.

【0010】図5は前記図4の周速1200m/min
のデーターと本発明による電極を使用したときの周速1
200m/minのメタルボンド砥石と電極間に流れる
電流の時間における変化を示したものである。研削加工
中にも電解ドレッシングが充分行える事を示している。
FIG. 5 shows a peripheral speed of 1200 m / min in FIG.
Data and the peripheral speed when using the electrode according to the present invention 1
It shows the change over time of the current flowing between the metal bond grindstone of 200 m / min and the electrode. It shows that electrolytic dressing can be sufficiently performed even during the grinding process.

【0011】[0011]

【発明の効果】以上のように、本発明は電極作用面に弱
電導性液体吐出穴、拡散防止板を設けることによってい
かなる回転域においてもメタルボンド砥石と電極間に弱
電導性液体が満たし研削中においても有効に電解ドレッ
シングを行えると言う効果を有するものである。
As described above, according to the present invention, by providing a weakly conductive liquid discharge hole and a diffusion preventive plate on the electrode working surface, the weakly conductive liquid is filled and ground between the metal bond grindstone and the electrode in any rotation range. It has an effect that electrolytic dressing can be effectively performed even in the inside.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による電解用電極図である。FIG. 1 is an electrode diagram for electrolysis according to the present invention.

【図2】本発明による拡散防止板を取り付けた電極構造
図である。
FIG. 2 is an electrode structure diagram to which a diffusion prevention plate according to the present invention is attached.

【図3】本発明によるメタルボンド砥石の電解ドレッシ
ングの概念図である。
FIG. 3 is a conceptual diagram of electrolytic dressing of a metal bond grindstone according to the present invention.

【図4】従来技術によるメタルボンド砥石と電極間に流
れる電流の時間における変化を周速別に示した電解ドレ
ッシング電流特性図である。
FIG. 4 is a characteristic diagram of electrolytic dressing current showing a change in current flowing between a metal bond grindstone and an electrode according to a conventional technique for each peripheral speed.

【図5】メタルボンド砥石と電極間に流れる電流の時間
における変化を示した電解ドレッシング電流特性の従来
技術と本発明の比較図である。
FIG. 5 is a comparison diagram of the conventional technique of the electrolytic dressing current characteristic and the present invention, which shows the change over time of the current flowing between the metal bond grindstone and the electrode.

【図6】従来技術による弱電導性液体の供給方法図であ
る。
FIG. 6 is a diagram showing a method of supplying a weakly conductive liquid according to a conventional technique.

【符号の説明】[Explanation of symbols]

1 電極 2 弱電導性液体通路 3 弱電導性液体吐出穴 4 メタルボンド砥石との相対する電解作用面 5 拡散防止板 6 メタルボンド砥石 7 弱電導性液体 8 電解用電源 DESCRIPTION OF SYMBOLS 1 Electrode 2 Weakly conductive liquid passage 3 Weakly conductive liquid discharge hole 4 Electrolytic action surface facing metal bond grindstone 5 Diffusion prevention plate 6 Metal bond grindstone 7 Weakly conductive liquid 8 Power supply for electrolysis

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 メタルボンド砥石を使用する工作機械に
おいて、工作機械に設けられた電解ドレッシング装置
で、砥石作用面と相対する電極面に電解用弱電導性液体
の吐出穴が設けられていることを特徴とするメタルボン
ド砥石の電解ドレッシング電極構造。
1. In a machine tool using a metal bond grindstone, an electrolytic dressing device provided in the machine tool is provided with a discharge hole for a weakly conductive liquid for electrolysis provided on an electrode surface facing a grindstone working surface. Electrode dressing electrode structure of metal bond grindstone.
【請求項2】 請求項1記載の電極の側面に電解用弱電
導性液体の側面への拡散防止板を設けたことを特徴とす
るメタルボンド砥石の電解ドレッシング電極構造。
2. An electrolytic dressing electrode structure for a metal bond grindstone, characterized in that a diffusion prevention plate for spreading the weakly conductive liquid for electrolysis to the side surface is provided on the side surface of the electrode according to claim 1.
JP8400092A 1992-04-06 1992-04-06 Electrolytic dressing electrode structure for metal bond grinding wheel Pending JPH05285830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8400092A JPH05285830A (en) 1992-04-06 1992-04-06 Electrolytic dressing electrode structure for metal bond grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8400092A JPH05285830A (en) 1992-04-06 1992-04-06 Electrolytic dressing electrode structure for metal bond grinding wheel

Publications (1)

Publication Number Publication Date
JPH05285830A true JPH05285830A (en) 1993-11-02

Family

ID=13818267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8400092A Pending JPH05285830A (en) 1992-04-06 1992-04-06 Electrolytic dressing electrode structure for metal bond grinding wheel

Country Status (1)

Country Link
JP (1) JPH05285830A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009172707A (en) * 2008-01-23 2009-08-06 Fujifilm Corp Grinding device, and grinding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009172707A (en) * 2008-01-23 2009-08-06 Fujifilm Corp Grinding device, and grinding method

Similar Documents

Publication Publication Date Title
US8101060B2 (en) Methods and apparatuses for electrochemical-mechanical polishing
JP2893012B2 (en) Method and apparatus for planarizing a workpiece
KR100441624B1 (en) Electrode generating hydro-dynamic pressure
JPH05285830A (en) Electrolytic dressing electrode structure for metal bond grinding wheel
JP3530562B2 (en) Lens grinding method
JP3106274B2 (en) Dressing equipment
JP2976164B2 (en) Dressing equipment
JP3274592B2 (en) Electrolytic in-process dressing grinding method and apparatus
JPH06114733A (en) Grinding wheel shaping method by on-machine discharge truing method
JP3169631B2 (en) Method and apparatus for electrolytic dressing with semiconductor contact electrode
JPH04201073A (en) On board electric discharging trueing/dressing method and device thereof
JPH0615568A (en) Electrolytic in-process dressing method and device therefor
JP3636913B2 (en) Electrolytic in-process dressing grinding method and electrolytic in-process dressing grinding apparatus
JPH06134671A (en) Grinding wheel dressing and device therefor
JPH05277937A (en) Mounting type discharge truing/dressing
JPH0635110B2 (en) Electrolytic dressing device
JPH05212673A (en) Electro-discharge machining method of super abrasive grain grinding wheel and device thereof
JP3194621B2 (en) Method and apparatus for generating spherical surface
JPH079338A (en) Dressing device
JPH0752040A (en) Electrolytic dressing method and device therefor
JPH0569295A (en) Both sides grinding method using electrolytic dressing and its device
JPH05277939A (en) Specular machineing and its device using mounting type discharge truing/dressing and nonconductor film by electrolysis
JPH0635109B2 (en) Electrolytic dressing device
JPH0632902B2 (en) Grooving / cutting device
JPH0739076B2 (en) Truing / dressing equipment