JPH05283820A - Printed-circuit board - Google Patents

Printed-circuit board

Info

Publication number
JPH05283820A
JPH05283820A JP4077590A JP7759092A JPH05283820A JP H05283820 A JPH05283820 A JP H05283820A JP 4077590 A JP4077590 A JP 4077590A JP 7759092 A JP7759092 A JP 7759092A JP H05283820 A JPH05283820 A JP H05283820A
Authority
JP
Japan
Prior art keywords
slit
board
printed circuit
wiring board
circuit wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4077590A
Other languages
Japanese (ja)
Inventor
Takashi Yatomi
隆 弥冨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Image Information Systems Inc
Hitachi Ltd
Original Assignee
Hitachi Image Information Systems Inc
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Image Information Systems Inc, Hitachi Ltd filed Critical Hitachi Image Information Systems Inc
Priority to JP4077590A priority Critical patent/JPH05283820A/en
Publication of JPH05283820A publication Critical patent/JPH05283820A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To realize compactness of a board, reducing the projecting portion of a protruded part from a board remaining after cutting, by making the slit ends curved closer to the part of the printed-circuit board to be used. CONSTITUTION:A shape of an end of a slit 31 is composed of two kinds of different arcs. In other words, a radius of an arc closer to the PCB part to be used is relatively smaller by making it a/4 (a: width of a slit), and the radius of an arc closer to the unused part of the PCB a/2. As a result, the shortest distance between a slit 31 and another slit 31 at the bridge 4 is made closer toward the PCB part to be used than the center line of the slit 31. Therefore, a cutting line at the bridge 4 can be made closer toward the PCB to be used. As a result, the protruding length from the board to be used can be reduced. In addition, for the same size case to be used, the component mounting area on the board can be increased.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はプリント回路配線板に関
わり、とくに切断後の形状を改善したプリント回路配線
板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit wiring board, and more particularly to a printed circuit wiring board having an improved shape after cutting.

【0002】[0002]

【従来の技術】近代科学社出版 CLYDE F.CO
OMBS,Jr.編 プリント回路ハンドブック〈全訂
第二版〉の5−14〜5−19頁にはプリント回路配線
板の切断方法が解説されている。図4は自動搭載機によ
り部品を自動搭載するためガイド穴2等を設けた従来の
プリント回路配線板の上面図である。スリット3は基板
切断用の穴であり、部品搭載後にスリット3間の結合部
4を切断して基板の非使用部分を取り除くようにしてい
た。上記スリット3間の切断においては、図5に示すよ
うに切断用持つプレス機の刃をスリット3の中央部41
の切断線41に当てて切断するようにしていたので、切
断後の基板の周辺部にはスリット3の幅aの略1/2が
突き出て突起部分を形成していた。
[Prior Art] Modern Science Publishing CLYDE F. CO
OMBS, Jr. In the printed circuit handbook (second edition), pages 5-14 to 5-19, a method for cutting a printed circuit wiring board is explained. FIG. 4 is a top view of a conventional printed circuit wiring board provided with guide holes 2 and the like for automatically mounting components by an automatic mounting machine. The slit 3 is a hole for cutting the board, and after mounting the components, the connecting portion 4 between the slits 3 is cut to remove the unused part of the board. In cutting between the slits 3, as shown in FIG.
Since the cutting was performed by hitting the cutting line 41, approximately 1/2 of the width a of the slit 3 was projected to form a protruding portion in the peripheral portion of the substrate after cutting.

【0003】[0003]

【発明が解決しようとする課題】従来のプリント回路配
線板では上記切断後に残留する上記突起部分が基板の小
型化に対する障害となっていた。上記問題の解決策とし
て、(1)スリット3の幅をaよりも小さくする、
(2)結合部4の切断位置を使用部側へ近づける、
(3)スリット3を使用部分側へ入れ込む、等の方法が
ある。
In the conventional printed circuit wiring board, the protruding portion remaining after the cutting has been an obstacle to the miniaturization of the board. As a solution to the above problem, (1) the width of the slit 3 is made smaller than a,
(2) Bring the cutting position of the connecting portion 4 closer to the used portion side,
(3) There is a method such as inserting the slit 3 into the used portion side.

【0004】(1)の方法は紙フェノール材のような硬
度の低い基板材に対しては比較的実施容易である。しか
し、ガラス繊維基板の両面に銅箔をエポキシ樹脂で固着
したような硬度の高い基板においては刃の寿命の問題か
ら量産的に見てプレス型によりスリット3を打ちぬくこ
とが困難であるため、回転刃を移動させ切削加工する必
要があり、加工タクトが長いという問題があった。
The method (1) is relatively easy to carry out for a substrate material having a low hardness such as a paper phenol material. However, in a substrate with high hardness such as copper foil fixed on both sides of a glass fiber substrate with epoxy resin, it is difficult to punch through the slit 3 with a press die from the viewpoint of mass production because of the problem of blade life. It is necessary to move the rotary blade and perform cutting, which causes a problem of long processing tact.

【0005】さらにスリット3の幅を小さくすると、刃
径aが細くなるため加工時の横方向応力により刃が折れ
易くなので加工速度を遅めねばならなかった。例えば板
厚が1.3mmの場合、刃径φ2.0に対する加工速度
は1500mm/分であり、刃径を半分のφ1.0にす
ると加工速度は3000mm/分となり加工効率は大幅
な低下する。また、上記文献に記載のように、カッター
の入手容易性の観点から通常は径が板厚以上のカッター
を用い、板厚1.3mm以上に対しては1/8インチ径
のカッターが一般的に用いられている。
Further, if the width of the slit 3 is made smaller, the blade diameter a becomes smaller, so that the blade is likely to break due to lateral stress during processing, so that the processing speed must be slowed down. For example, when the plate thickness is 1.3 mm, the processing speed for the blade diameter φ2.0 is 1500 mm / min, and when the blade diameter is halved φ1.0, the processing speed becomes 3000 mm / min, and the processing efficiency is significantly reduced. Further, as described in the above-mentioned document, a cutter having a diameter of not less than a plate thickness is usually used from the viewpoint of availability of the cutter, and a cutter having a diameter of 1/8 inch is generally used for a plate having a thickness of 1.3 mm or more. Is used for.

【0006】また、(2)の方法では上記回転刃がスリ
ット3の円弧に沿って円弧間の最短距離部側、即ちスリ
ット3の中央部側へ逃げるため、切断面が不均一にな
り、同時に刃の寿命が低下するという問題があった。ま
た、(3)については図6に示すように、接合部4の幅
を切断機の刃幅分以上に切り欠く必要上、基板の使用部
分側面積が減って部品搭載が低下するという問題があっ
た。以上のように、従来のプリント回路配線板において
は、切断された結合部4にスリット3の幅aの約半分が
突起として残るため、この基板を収容する筐体は上記突
起幅分の余分な空間を必要とし、小型化並びに部品実装
面積確保の障害となっていた。
In the method (2), since the rotary blade escapes along the arc of the slit 3 toward the shortest distance side between the arcs, that is, the central side of the slit 3, the cut surface becomes non-uniform and at the same time. There is a problem that the life of the blade is shortened. As for (3), as shown in FIG. 6, the width of the joint portion 4 needs to be cut out in excess of the blade width of the cutting machine. there were. As described above, in the conventional printed circuit wiring board, approximately half of the width a of the slit 3 remains as a protrusion in the cut joint portion 4, so that the housing for accommodating this substrate has an extra width corresponding to the protrusion width. Space was required, which was an obstacle to miniaturization and securing the component mounting area.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するため
に、上記スリットの端部を上記プリント回路配線板の使
用部分側ではに張出した形状とする。このため上記スリ
ットの端部を直径の異なる少なくとも二つのを円弧を接
続した形状とし、上記二つのを円弧のうちの直径の小さ
い方をプリント回路配線板の使用部分側に設けるように
する。また、上記スリットをガラス繊維材の両面基板ま
たは多層基板に設けるようにする。
In order to solve the above-mentioned problems, the end portion of the slit is formed in a shape protruding toward the use portion side of the printed circuit wiring board. For this reason, the ends of the slits have a shape in which at least two arcs having different diameters are connected to each other, and one of the two arcs having the smaller diameter is provided on the side where the printed circuit wiring board is used. Further, the slits are provided in a glass fiber double-sided board or a multilayer board.

【0008】[0008]

【作用】上記スリット端部の基板の使用部分側に張出し
た部分を切断することにより、基板の切断部における突
起部の張出し幅が低減する。
By cutting the portion of the slit end portion projecting toward the used portion of the substrate, the projecting width of the protrusion in the cutting portion of the substrate is reduced.

【0009】[0009]

【実施例】本発明によるスリット31図1は本発明によ
るスリット31を設けたプリント回路配線板の平面図で
ある。図2は上記スリット31の結合部4側の形状図で
ある。本発明ではスリット31の端部の形状を2種類の
異なる円弧により構成する。すなわち、基板の使用部分
側の弧の半径をa/4とし、非使用部分側の弧の半径を
a/2として使用部分側の弧の半径を相対的に小さくす
るように。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Slit 31 according to the present invention FIG. 1 is a plan view of a printed circuit wiring board provided with a slit 31 according to the present invention. FIG. 2 is a shape diagram of the slit 31 on the coupling portion 4 side. In the present invention, the shape of the end of the slit 31 is formed by two different types of arcs. That is, the radius of the arc on the used portion side of the substrate is set to a / 4, the radius of the arc on the non-used portion side is set to a / 2, and the radius of the arc on the used portion side is made relatively small.

【0010】この結果、結合部4におけるスリット3間
の距離の最短部はスリット3の中央から使用部分側に寄
るので結合部4の切断線を使用部側に寄せることがで
き、基板からの張り出し長さを低減することができる。
図3は上記スリット31の加工方法の一例を説明する図
である。スリット幅をaとして、使用部側に寄ったX点
の位置にφa/2のドリルにより穴をあけた後、φaの
刃径のカッターを回転させスリット3を形成するように
する。
As a result, the shortest part of the distance between the slits 3 in the joint portion 4 is closer to the use portion side from the center of the slit 3, so that the cutting line of the joint portion 4 can be brought closer to the use portion side, and the protrusion from the substrate. The length can be reduced.
FIG. 3 is a diagram illustrating an example of a method of processing the slit 31. With a slit width of a, a hole with a φa / 2 drill is made at the position of the point X closer to the used portion, and then a cutter having a blade diameter of φa is rotated to form the slit 3.

【0011】このように2種類の半径によりスリット3
1の弧の部分を形成すると図3のYで示した部分が相対
的に膨らので、使用部分からa/4の距離の部分を切断
することができる。また、スリット31を長手方向に切
削する刃の逃げは問題とはならない。また、カッターの
刃径を大きくしてスリット3の加工速度を上げる場合に
おいては、複数のドリルによりスリット31の弧の部分
に予め複数の円弧を形成するようにして切断位置を任意
に設定することができる。
As described above, the slit 3 has two kinds of radii.
When the arc portion 1 is formed, the portion indicated by Y in FIG. 3 is relatively swollen, so that the portion at the distance a / 4 from the used portion can be cut. The escape of the blade that cuts the slit 31 in the longitudinal direction does not pose a problem. In addition, when the cutting diameter of the cutter is increased to increase the processing speed of the slit 3, a plurality of drills are used to previously form a plurality of arcs in the arc portion of the slit 31, and the cutting position is arbitrarily set. You can

【0012】[0012]

【発明の効果】本発明によりプリント回路配線板に設け
たスリット間の結合部における切断位置を基板の使用部
分側へ寄せることができるので、切断後に残る基板の突
起部の張り出し量を低減して基板を小型化することがで
きる。また、上記基板の小型化により基板を収容する筐
体サイズも小型化することができる。また、筐体サイズ
が同じであれば、基板の部品実装面積を広げることがで
きる。
As described above, according to the present invention, the cutting position in the connecting portion between the slits provided in the printed circuit wiring board can be brought closer to the used portion side of the substrate, so that the protrusion amount of the substrate remaining after cutting can be reduced. The substrate can be downsized. Further, the size of the housing for housing the substrate can be reduced by reducing the size of the substrate. Further, if the housing sizes are the same, the component mounting area of the board can be expanded.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるプリント回路配線板実施例の平面
図である。
FIG. 1 is a plan view of an embodiment of a printed circuit wiring board according to the present invention.

【図2】図1における結合部分の拡大図である。FIG. 2 is an enlarged view of a connecting portion in FIG.

【図3】本発明におけるプリント回路配線板上のスリッ
ト端部の加工方法を説明する図である。
FIG. 3 is a diagram illustrating a method of processing a slit end portion on a printed circuit wiring board according to the present invention.

【図4】従来のプリント回路配線板の平面図である。FIG. 4 is a plan view of a conventional printed circuit wiring board.

【図5】図3における結合部分の拡大図である。5 is an enlarged view of a connecting portion in FIG.

【図6】従来の他のプリント回路配線板の平面図であ
る。
FIG. 6 is a plan view of another conventional printed circuit wiring board.

【符号の説明】[Explanation of symbols]

1…プリント回路配線板、2…ガイド穴、3…スリッ
ト、4…結合部。
1 ... Printed circuit wiring board, 2 ... Guide hole, 3 ... Slit, 4 ... Coupling part.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 切断用のスリットを設けたプリント回路
配線板において、上記スリットの端部を上記プリント回
路配線板の使用部分側ではに張出した形状としたことを
特徴とするプリント回路配線板。
1. A printed circuit wiring board provided with a slit for cutting, wherein an end portion of the slit is formed in a shape projecting toward a use portion side of the printed circuit wiring board.
【請求項2】 請求項1において、上記スリットの端部
を直径の異なる少なくとも二つのを円弧を接続した形状
とし、上記二つのを円弧のうちの直径の小さい方をプリ
ント回路配線板の使用部分側に設けるようにしたことを
特徴とするプリント回路配線板。
2. The slit according to claim 1, wherein the slit has a shape in which at least two arcs having different diameters are connected to each other, and one of the two arcs having a smaller diameter is a used portion of the printed circuit wiring board. A printed circuit wiring board characterized by being provided on the side.
【請求項3】 請求項1または2において、上記プリン
ト回路配線板をガラス繊維材の両面基板、またはガラス
繊維材の多層基板としたことを特徴とするプリント回路
配線板。
3. The printed circuit wiring board according to claim 1, wherein the printed circuit wiring board is a glass fiber material double-sided board or a glass fiber material multilayer board.
JP4077590A 1992-03-31 1992-03-31 Printed-circuit board Pending JPH05283820A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4077590A JPH05283820A (en) 1992-03-31 1992-03-31 Printed-circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4077590A JPH05283820A (en) 1992-03-31 1992-03-31 Printed-circuit board

Publications (1)

Publication Number Publication Date
JPH05283820A true JPH05283820A (en) 1993-10-29

Family

ID=13638186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4077590A Pending JPH05283820A (en) 1992-03-31 1992-03-31 Printed-circuit board

Country Status (1)

Country Link
JP (1) JPH05283820A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815370U (en) * 1981-07-24 1983-01-31 日立電子株式会社 split board
JPS5983072U (en) * 1982-11-29 1984-06-05 日立コンデンサ株式会社 printed wiring board
JPS61177470U (en) * 1985-04-24 1986-11-05
JPH0189769U (en) * 1987-12-03 1989-06-13
JPH0262760U (en) * 1988-10-31 1990-05-10
JPH0338682U (en) * 1989-08-23 1991-04-15

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815370U (en) * 1981-07-24 1983-01-31 日立電子株式会社 split board
JPS5983072U (en) * 1982-11-29 1984-06-05 日立コンデンサ株式会社 printed wiring board
JPS61177470U (en) * 1985-04-24 1986-11-05
JPH0189769U (en) * 1987-12-03 1989-06-13
JPH0262760U (en) * 1988-10-31 1990-05-10
JPH0338682U (en) * 1989-08-23 1991-04-15

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