JPH0528067U - Hybrid IC device for surface mounting - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The circuit board is vertically surface-mounted on the parent circuit board, and the terminal electrodes are securely soldered to the electrode lands of the parent board. [Structure] The circuit board 1 is fitted in the groove 5 of the board supporting member 4, and the projections 6, 6 of the board supporting member 4 are engaged with the recesses 7, 7 on both end surfaces of the circuit board 1. The terminal block 9 is attached to the side of the circuit board 1 where the terminals 3 are lined up, the pins 12 and 12 are inserted into the holes 8 and 8 to fix the terminal block 9 to the circuit board 1, and the terminal electrodes 3 of the circuit board 1 and The terminal portion 10 of the terminal block 9 is joined with solder. When this hybrid integrated circuit device is mounted on the parent circuit board, the wide plates 4c and 4c of the board supporting member 4 are placed on the lower side, and are made to stand on the parent circuit board, and the terminal portion 10 of the terminal block 9 is The lower surface of 10,
Solder to the electrode land on the parent circuit board.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a surface-mountable hybrid integrated circuit device that can be independently mounted on a parent circuit board.

[0002]

[Prior Art]

 Conventionally well-known hybrid integrated circuit devices consist of a circuit board with a wiring pattern formed on an insulating substrate made of ceramic or glass-epoxy resin, electronic components mounted on the circuit board, and the circuit board. It consists of the derived terminal lead. Among them, in particular, in a single in-line type (SIL type) hybrid integrated circuit device, the terminal leads are led out from one edge of the circuit board. Such a hybrid integrated circuit device may be mounted on a master circuit board that constitutes another hybrid integrated circuit device. The SIL type hybrid integrated circuit device is mounted on the parent circuit board with its terminal lead side facing down.

[0003]

[Problems that the device is trying to solve]

 When mounting various electronic components such as chip-shaped components and flat package ICs on a hybrid integrated circuit board, the so-called surface mounting method is widely used in which electronic components are mounted on the circuit board and soldered without using lead wires. Has been done. However, in the SIL type hybrid integrated circuit device as described above, since the terminal electrode is provided only on one side of the circuit board, surface mounting the terminal electrode in a flat state reduces the space area on the parent circuit board and wastes space. become. On the other hand, when the hybrid integrated circuit device is mounted vertically, it is easy to fall down and is not stable, and moreover, the soldering of the terminal electrode to the parent board tends to be uncertain. For these reasons, the current situation is that surface mounting of SIL hybrid integrated circuit devices is less likely to progress than other electronic components. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a hybrid integrated circuit device that can be vertically surface-mounted on a parent circuit board and can be reliably soldered in order to solve the above-mentioned problems.

[0004]

[Means for Solving the Problems]

 That is, in order to achieve the above object, the present invention provides a circuit board 1 having a wiring pattern formed on an insulating board, an electronic component 2 mounted on the circuit board 1, and a side portion of the circuit board 1. A hybrid integrated circuit device having a terminal electrode 3 formed on the main surface of the substrate 1 along with a groove 5 on the inner surface, and the other three sides excluding the side on which the terminal electrode 3 is formed. The board supporting member 4 having a width wider than that of the circuit board 1 in which the terminal board 3 is fitted and fixed to the circuit board 1 is fixed along the side where the terminal electrode 3 of the circuit board 1 is formed, and each terminal There is provided a hybrid integrated circuit device characterized in that it has a terminal block 9 in which a terminal portion 10 which is electrically conductively fixed to the electrode 3 is formed.

In this case, the board supporting member 4 has a projection 6 and a recess 7 that engage with each other at corresponding positions on the sides of the groove 5 and the circuit board 1 fitted into the groove 5, and further includes the projection 6 and the recess 7. It is desirable to have wide legs 4c at the tips. Further, in the terminal block 9, it is desirable that the insulating portion 11 between the terminal portions 10 is a concave portion that is recessed from the surface of the terminal portion 10.

[0006]

[Work]

 In the hybrid integrated circuit device according to the present invention, the circuit board 1 can be independently mounted on the parent circuit board by the board supporting member 4 having a width wider than that of the circuit board 1. When the terminal electrodes 3 formed on the main surface of the circuit board 1 are soldered to the electrode lands on the parent circuit board, the terminal portions 10 of the terminal blocks 9 fixed along the sides of the circuit board 1 are used. Since soldering is possible, reliable soldering is possible.

When the protrusions 6 and the recesses 7 which engage with each other are formed at the corresponding positions of the groove 5 of the board supporting member 4 and the side of the circuit board 1 fitted therein, the circuit board 1 and the board supporting member 4 are formed. When they are fitted with each other, they can be accurately aligned. Further, when the wide leg portion 4c is provided at the tip of the board supporting member 4, when the circuit board 1 is mounted upright on the parent circuit board, it can be stably made to stand by itself. In addition, when the insulating portion 11 between the terminal portions 10 of the terminal block 9 is a recess depressed from the surface of the terminal portion 10, between the circuit board 1 and the insulating portion 11 and between the parent circuit board and the insulating portion 11. By forming the gap, when the electrode portion 10 is soldered to the electrode land of the parent circuit board, gas such as air easily escapes from the gap, and the adjacent terminal electrode 3 or the adjacent terminal portion 10 is soldered. Difficult to reach Therefore, the terminal portion 10 can be soldered to the electrode land of the parent circuit board without causing a short circuit between the adjacent terminal electrodes 3 and the terminal portion 10.

[0008]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the hybrid integrated circuit device of the present invention comprises a circuit board 1, a board supporting member 4 for supporting the circuit board 1, and a terminal block 9 fixed to one side of the circuit board 1. The circuit board 1 is formed, for example, by printing a thick film printing material such as a metal paste or a resistance paste on an insulating substrate made of ceramics, glass-epoxy resin, or the like, and firing it to form a predetermined wiring pattern. Is configured. The electronic component 2 is mounted on the circuit board 1 to form an electronic circuit, and the terminal electrodes 3 for input and output of the electronic circuit are formed at regular intervals along one side of the circuit board 1. Has been done. On the main surface of the circuit board 1 on which the terminal electrodes 3 are formed, holes 8 are formed at positions outside the terminal electrodes 3 at both ends. Further, recesses 7, 7 are formed on both end surfaces of the circuit board 1 near the lower side where the terminal electrodes 3 are formed.

The board supporting member 4 is formed in such a manner that the plates 4 a and 4 a are integrally extended from both sides of the plate 4 b having a width sufficiently larger than the thickness of the circuit board 1 to have a U-shape. The lower ends of the plates 4b, 4b on both sides are wide plates 4c, 4c extending in the thickness direction of the circuit board 1. A series of grooves 5 are formed on the inner surface of the board supporting member 4 over the plates 4a, 4b, 4c. The width, length and height of the bottom surface of the grooves 5 are the width, length and height of the circuit board 1. It corresponds to each. Further, protrusions 6 and 6 are formed on the wide plates 4c and 4c of the groove 5, and the positions and shapes of the protrusions 6 and 6 are the recesses 7 on the end surface of the circuit board 1. , 7 corresponding to the position and shape.

The terminal block 9 is made of a long insulating rod-shaped body having a substantially rectangular cross section as a base material, and is arranged at the same intervals as the terminal electrodes 3 formed on the circuit board 1 at a constant interval in the longitudinal direction over the entire circumference. A conductor film is formed all over, and this serves as the terminal portion 10. As shown in FIG. 4, the insulating portion 11 between the terminal portions 10 is formed to be slightly smaller in height and width than the terminal portion 10, and the insulating portion 11 is smaller than the terminal portion 10 by that amount. It is formed as a depression, and that portion becomes a depression. Pins 12 and 12 are provided so as to project from one side surface of both ends of the terminal block 9, and the interval between the pins 12 and 12 is equal to the interval between the holes 8 and 8 of the circuit board 1.

In the hybrid integrated circuit device including such elements, first, the circuit board 1 is fitted into the groove 5 of the board supporting member 4 from the state shown in FIG. 1 as shown in FIGS. At this time, as shown in FIG. 5, the protrusions 6, 6 of the board supporting member 4 engage with the recesses 7, 7 on both end surfaces of the circuit board 1. As a result, the board supporting member 4 and the circuit board 1 are in a predetermined state, that is, as shown in FIGS. 2 and 3, the side of the circuit board 1 on which the terminal electrode 3 is formed faces downward and the other 3 The entire side is completely fitted in the groove 5. In this state, the wide integrated plates 4c and 4c at both ends of the substrate supporting member 4 allow the hybrid integrated circuit device to stand on the parent substrate.

Further, as shown in FIGS. 2 and 3, the terminal block 9 is attached to the side of the circuit board 1 where the terminals 3 are lined up, and the pins 12 and 12 are inserted into the holes 8 and 8 to insert the terminal block. Fix the board 9 to the circuit board 1. FIG. 4 shows a state in which the pin 12 of the terminal block 9 is inserted into the hole 8 of the circuit board 1. In this state, the positions of the terminal electrode 3 of the circuit board 1 and the terminal portion 10 of the terminal block 9 are matched, and the terminal electrode 3 and the terminal portion 10 are joined by soldering. By assembling in this way, the hybrid integrated circuit device according to the present invention is completed.

When this hybrid integrated circuit device is mounted on the parent circuit board, the wide plates 4c and 4c of the substrate supporting member 4 are placed on the lower side and self-supported on the parent circuit board. Further, the lower surface of the terminal portion 10 of the terminal block 9 is soldered to the electrode land on the parent circuit board.

It is needless to say that the hybrid integrated circuit described with reference to the above drawings shows an embodiment of the present invention, and the configuration thereof can be appropriately changed. For example, when the section where the terminal electrode 3 of the circuit board 1 is formed is long, the terminal block 9 may be divided into a plurality of sections instead of one. Further, the board support member 4, the projection 6 and the recess 7 of the circuit board 1 are opposite to each other, as the recess is provided on the board support member 4 side and the projection 6 is provided on the circuit board 1 side. May be. Furthermore, when there is no risk of a short circuit due to solder between the adjacent terminal portions 10, the insulating portion 11 between the terminal portions 10 does not necessarily need to be recessed, and the terminal portion 10 and the insulating portion 11 are almost on the same surface. It is also possible to form it.

[0015]

[Effect of the device]

 As described above, according to the present invention, the circuit board can be mounted upright on the parent circuit board, and the terminal electrodes can be reliably soldered to the electrode lands, resulting in high mounting density on the parent circuit board. A highly reliable hybrid integrated circuit device can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a basic element of a hybrid integrated circuit device according to an embodiment of the present invention in a disassembled state.

FIG. 2 is a perspective view showing a state in which basic elements of a hybrid integrated circuit device according to an embodiment of the present invention are assembled.

FIG. 3 is a vertical cross-sectional side view showing a state in which basic elements of a hybrid integrated circuit device according to an embodiment of the present invention are assembled.

FIG. 4 is an enlarged vertical cross-sectional side view of essential parts of a basic integrated element of a hybrid integrated circuit device according to an embodiment of the present invention in an assembled state.

FIG. 5 is an enlarged front view of essential parts of a basic integrated element of a hybrid integrated circuit device showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 circuit board 3 terminal electrode of circuit board 4 board supporting member 5 groove of board supporting member 6 projection of board supporting member 7 recess of circuit board 8 hole of circuit board 9 terminal block 10 terminal block terminal section 12 terminal block pin

Claims (4)

[Reference number] 0030353-01 [Claims for utility model registration] 1. A circuit board (1) having a wiring pattern formed on an insulating board, an electronic component (2) mounted on the circuit board (1), and one side portion of the circuit board (1). A hybrid integrated circuit device having a terminal electrode (3) formed on the main surface of the substrate (1) along with a groove (5) on the inner surface, wherein the terminal electrode (3) is provided in the groove (5). The U-shaped board supporting member (4) having a width wider than that of the circuit board (1) holding the circuit board (1) by fitting the other three sides except the formed side, and the circuit board (1). A terminal block (9) having terminal portions (10) fixed to the terminal electrodes (3) and being electrically conductively fixed to the respective terminal electrodes (3). And a hybrid integrated circuit device. 2. The board supporting member (4) according to claim 1 of the utility model registration, wherein the groove (5) and the side of the circuit board 1 fitted into the groove (5) are engaged with each other at a corresponding position. A hybrid integrated circuit device having a portion (6) and a recess (7). 3. The hybrid integrated circuit device according to claim 1 or 2, wherein the substrate support member (4) has wide legs (4c) at its tip. . 4. The terminal block (9) according to any one of claims 1 to 3, wherein the insulating portion (11) between the terminal portions (10) is the terminal portion (10). ) Is a recessed portion which is recessed from the surface of the hybrid integrated circuit device.