JPH0517903Y2 - - Google Patents
Info
- Publication number
- JPH0517903Y2 JPH0517903Y2 JP1984130805U JP13080584U JPH0517903Y2 JP H0517903 Y2 JPH0517903 Y2 JP H0517903Y2 JP 1984130805 U JP1984130805 U JP 1984130805U JP 13080584 U JP13080584 U JP 13080584U JP H0517903 Y2 JPH0517903 Y2 JP H0517903Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- lead
- wiring board
- support part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 210000001520 comb Anatomy 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、印刷配線板に外部リード用のリード
コムを有するモジユール基板に関する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a module board having lead combs for external leads on a printed wiring board.
従来例の構成とその問題点
従来、印刷配線板に部品を挿入するための孔を
利用して、その孔に端子ピンを挿入して、モジユ
ール基板とすることが行われていた。そして、部
品が基板表面に装着するタイプに移行するのに従
つて、印刷配線板の孔が不要となり、より高密度
に部品を搭載できるモジユール基板が用いられる
ようになつた。Conventional Structure and Problems Conventionally, holes for inserting components in a printed wiring board have been utilized and terminal pins have been inserted into the holes to form a module board. With the shift to a type in which components are mounted on the surface of a board, the need for holes in printed wiring boards has become unnecessary, and modular boards have come to be used that allow components to be mounted at a higher density.
以下に、第１図に示す従来のモジユール基板の断
面図を用いて説明する。A description will be given below using a cross-sectional view of a conventional module board shown in FIG.
１は配線用の導体であり、印刷配線板２の上面
に回路結線用のパターンを形成している。印刷配
線板２の幅は基本格子（１格子寸法は2.5又は
2.54mmとする）のＮ倍であり、印刷配線板２の端
部にリードコム３が配置されており、リードコム
３の脚部は印刷配線板２の端面に沿つて直立して
いる。印刷配線板２上の導体１とリードコム３と
が半田４によつて接合されたものである。従来の
モジユール基板は以上のように構成されている。 1 is a conductor for wiring, and a pattern for circuit connection is formed on the upper surface of the printed wiring board 2. The width of the printed wiring board 2 is the basic grid (one grid size is 2.5 or
The lead comb 3 is arranged at the end of the printed wiring board 2, and the legs of the lead comb 3 stand upright along the end surface of the printed wiring board 2. A conductor 1 on a printed wiring board 2 and a lead comb 3 are joined by solder 4. A conventional module board is configured as described above.
このような構成では、印刷配線板２の幅がリー
ドコム３の間隔より小さくなり、母体となるプリ
ント基板にモジユール基板を装着する際、プリン
ト基板表面のモジユール基板に覆われた領域が他
の電子部品を装着するのに困難であるため、モジ
ユール基板とリードコムの外形寸法でプリント基
板の有効利用面積が決定され、プリント基板の面
積の利用率が高いものとならない。 In such a configuration, the width of the printed wiring board 2 is smaller than the interval between the lead combs 3, and when the module board is mounted on the base printed circuit board, the area covered by the module board on the surface of the printed circuit board is Since it is difficult to mount components, the effective usable area of the printed circuit board is determined by the external dimensions of the module board and lead comb, and the utilization rate of the printed circuit board area is not high.
考案の目的
本考案は、モジユール基板の面積をより大きく
すると共に、モジユール基板をプリント基板に装
着する際のプリント基板の利用効率を向上させ、
かつ、プリント基板のレイアウト設計を容易にす
るものである。Purpose of the invention This invention increases the area of the module board, improves the efficiency of use of the printed circuit board when mounting the module board on the printed circuit board, and
Moreover, it facilitates the layout design of the printed circuit board.
考案の構成
本考案は、対向する端面の距離が基本格子の定
める格子ピツチのＮ（Ｎは３〜10）倍に設定され、
上面に配線用導体を有する長方形の印刷配線板、
前記端面を抱き込むように装着されたコの字状の
基板支持部と、前記印刷配線板の下面の前記基板
支持部の先端が前記下面と直角に延伸された脚部
を有し、前記コの字状の基板支持部の内部寸法と
前記印刷配線板の厚みとの間に半田を抱き込む寸
法マージンを有するリードコムを備え、対向する
端面に装着された２つの前記リードコムの脚部の
間隙が格子ピツチの（Ｎ−２）倍に設定されたこ
とを特徴とするモジユール基板であり、これによ
り、隣接する電子部品と立体交差する状態でプリ
ント基板上に高密度の実装ができ、同様のモジユ
ール基板や半導体集積回路等の集積装置のリード
ピツチが統一化されるため、レイアウト設計が機
械的にできる。Structure of the invention In this invention, the distance between opposing end faces is set to N times the grid pitch defined by the basic grid (N is 3 to 10),
a rectangular printed wiring board with wiring conductors on the top surface;
a U-shaped board support part mounted so as to embrace the end surface; and a leg part extending perpendicularly to the bottom surface of the board support part on the bottom surface of the printed wiring board; A lead comb is provided with a dimensional margin for enclosing solder between the internal dimensions of the board support portion in the shape of a square and the thickness of the printed wiring board, and the legs of the two lead combs are attached to opposing end surfaces. This is a modular board characterized by the gap being set to (N-2) times the grid pitch, which allows for high-density mounting on a printed circuit board with three-dimensional intersections with adjacent electronic components. Because the lead pitch of integrated devices such as module boards and semiconductor integrated circuits is unified, layout design can be done mechanically.
実施例の説明
本考案のモジユール基板にかかる一実施例につ
いて第２図を用いて説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the module board of the present invention will be described with reference to FIG. 2.
第２図は、本考案のモジユール基板をプリント
基板に実装した際の断面図である。第２図におい
て、モジユール基板は、上面に配線用の導体１を
有する印刷配線板２の対向した端面にリードコム
３が装着されている。そして、印刷配線板２は、
対向する端面の距離が基本格子の定める格子ピツ
チのＮ倍に設定された長方形の印刷配線板であ
る。Ｎは３〜10の範囲であり、利用しやすいのは
５ないし６である。また、リードコム３は、印刷
配線板２の端面を抱き込むように装着されるコの
字状の基板支持部と、印刷配線板２の下面の基本
支持部の先端が下面と直角に折曲げられて延伸さ
れた脚部から構成され、コの字状の基板支持部の
内部寸法と印刷配線板２の厚みとの間に半田４を
抱き込む寸法マージンを有しており、半田４によ
つて印刷配線板２の端面にリードコム３が固定さ
れる。 FIG. 2 is a sectional view of the module board of the present invention mounted on a printed circuit board. In FIG. 2, the module board includes a printed wiring board 2 having a wiring conductor 1 on its upper surface, and a lead comb 3 mounted on the opposite end surface. Then, the printed wiring board 2 is
This is a rectangular printed wiring board in which the distance between opposing end faces is set to N times the grid pitch defined by the basic grid. N ranges from 3 to 10, with 5 to 6 being easy to use. In addition, the lead com 3 has a U-shaped board support part that is attached so as to hug the end surface of the printed wiring board 2, and a basic support part on the bottom surface of the printed wiring board 2. The tip of the basic support part is bent at right angles to the bottom surface. It has a dimensional margin between the internal dimensions of the U-shaped board support part and the thickness of the printed wiring board 2 to accommodate the solder 4. A lead comb 3 is fixed to the end face of the printed wiring board 2.
このように構成されたモジユール基板は、プリ
ント基板５の所定箇所に開口されたリード穴にリ
ードコム３の脚部を挿入し、半田付けによつてプ
リント基板５との回路接続を行う。この時、他の
モジユール基板や半導体集積回路等の電子部品６
が隣接して配置されるが、本考案のモジユール基
板と電子部品６が立体交差するように配置できる
ため、プリント基板上に高密度で実装される。 In the module board configured in this way, the legs of the lead combs 3 are inserted into lead holes opened at predetermined locations on the printed circuit board 5, and the circuit is connected to the printed circuit board 5 by soldering. At this time, other electronic components such as module boards and semiconductor integrated circuits 6
are arranged adjacent to each other, but since the module board of the present invention and the electronic component 6 can be arranged in a three-dimensionally intersecting manner, they can be mounted on the printed circuit board with high density.
モジユール基板のリードコム３の脚部について
は、Ｎが５または６の標準的な例では、基板の両
端面間の距離と、両端面の装着されたリードコム
３の脚部の間隙との相対関係はＮ：Ｎ−２が適当
であり、Ｎ−３の条件では多少不均衡となり、Ｎ
−４の条件になると印刷配線板２を支持する間隔
が狭くなり、リードコム３の脚部の長さによつて
は、重心が高くなり不安定である。このように、
リードコム３の脚部の間隙をＮ−２とすると、プ
リント基板５に装着する際に、２階建構造の２階
用として安定な構造であると共に、隣接する電子
部品６と立体交差するように配置され、プリント
基板５に高密度の実装が実現できる。 Regarding the legs of the lead com 3 on the module board, in a standard example where N is 5 or 6, the distance between both end faces of the board and the gap between the legs of the lead comb 3 attached to both end faces is The appropriate relationship is N:N-2; under the condition of N-3, there will be some imbalance, and N
When the condition -4 is reached, the interval for supporting the printed wiring board 2 becomes narrower, and depending on the length of the legs of the lead comb 3, the center of gravity becomes higher and becomes unstable. in this way,
If the gap between the legs of the lead com 3 is set to N-2, when it is attached to the printed circuit board 5, it will have a stable structure for the second floor of a two-story structure, and will also have a three-dimensional intersection with the adjacent electronic component 6. It is possible to realize high-density mounting on the printed circuit board 5.
考案の効果
本考案は、印刷配線板の対向する端面の距離を
基本格子ピツチのＮ倍に設定し、リードコムの脚
部の間隙を（Ｎ−２）倍に設定することで、プリ
ント基板に実装する構造が２階建構造の２階用と
して安定であり、隣接する電子部品と立体交差す
る状態で高密度の実装が実現でき、同様のモジユ
ール基板や半導体集積回路等の集積装置の複数を
同一のプリント基板に装着する際、リードピツチ
が統一化できるため、レイアウト設計が容易にで
きる。Effects of the invention This invention sets the distance between the opposing end faces of the printed circuit board to N times the basic grid pitch, and sets the gap between the legs of the lead comb to (N-2) times. The mounting structure is stable for the second floor of a two-story structure, and high-density mounting can be achieved with three-dimensional intersections with adjacent electronic components. When mounting on the same printed circuit board, the lead pitch can be unified, making layout design easier.
第１図は従来例の要部断面図、第２図は本考案
のモジユール基板にかかる一実施例の要部断面図
である。
１……導体、２……印刷配線板、３……リード
コム、４……半田、５……プリント基板、６……
電子部品。
FIG. 1 is a sectional view of a main part of a conventional example, and FIG. 2 is a sectional view of a main part of an embodiment of a module board of the present invention. 1... Conductor, 2... Printed wiring board, 3... Lead com, 4... Solder, 5... Printed circuit board, 6...
electronic components.
Claims (1)
ツチのＮ（Ｎは３〜10）倍に設定され、上面に配
線用導体を有する長方形の印刷配線板、 前記端面を抱き込むように装着されたコの字状
の基板支持部と、前記印刷配線板の下面の前記基
板支持部の先端が前記下面と直角に延伸された脚
部を有し、前記コの字状の基板支持部の内部寸法
と前記印刷配線板の厚みとの間に半田を抱き込む
寸法マージンを有するリードコムを備え、 対向する端面に装着された２つの前記リードコ
ムの脚部の間隙が格子ピツチの（Ｎ−２）倍に設
定されたことを特徴とするモジユール基板。[Scope of Claim for Utility Model Registration] A rectangular printed wiring board in which the distance between opposing end faces is set to N (N is 3 to 10) times the grid pitch defined by the basic grid, and has a wiring conductor on the top surface, a U-shaped board support part mounted so as to be hugged; and a leg part extending at a right angle to the bottom surface at the tip of the board support part on the lower surface of the printed wiring board; a lead comb having a dimensional margin for enclosing solder between the internal dimensions of the board support part and the thickness of the printed wiring board, and the gap between the legs of the two lead combs attached to opposing end surfaces is a grid. A module board characterized in that the pitch is set to (N-2) times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984130805U JPS6144868U (en) | 1984-08-28 | 1984-08-28 | module board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984130805U JPS6144868U (en) | 1984-08-28 | 1984-08-28 | module board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144868U JPS6144868U (en) | 1986-03-25 |
| JPH0517903Y2 true JPH0517903Y2 (en) | 1993-05-13 |
Family
ID=30689400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984130805U Granted JPS6144868U (en) | 1984-08-28 | 1984-08-28 | module board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144868U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0682907B2 (en) * | 1988-12-28 | 1994-10-19 | 太陽誘電株式会社 | Method for manufacturing double structure hybrid integrated circuit device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5126058U (en) * | 1974-08-17 | 1976-02-26 |
-
1984
- 1984-08-28 JP JP1984130805U patent/JPS6144868U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5126058U (en) * | 1974-08-17 | 1976-02-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144868U (en) | 1986-03-25 |
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