JPH0527489Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field The present invention relates to a vacuum evaporation apparatus employing an electron beam sliding method.

Prior Art Usually, in vacuum evaporation, an evaporation source is placed at the bottom of a evaporation tank, and a substrate is placed at the top (ceiling) for evaporation. However, in this method, since the area that can be effectively used is small, there are limits to the amount and size of substrates that can be processed in one vapor deposition. By arranging the substrate upright on the side wall of the vacuum chamber, the area within the vacuum chamber can be effectively utilized. In actual sputtering equipment, a thin film is formed by using a long target extending in the height direction and supporting and rotating the substrate in a cylindrical holder, which is called a side sputtering method.

However, in vacuum evaporation equipment, the size of the evaporation source is limited and is basically a point source, making it difficult to evaporate a thin film with a uniform thickness onto a substrate placed on the side wall of the vacuum chamber. It was hot. In particular, in the case of a resistance heating method, some measures such as using a long boat can be considered, but such measures are difficult in the case of an electron beam evaporation source.

On the other hand, as in the case of creating optical films (oxides, dielectric materials), electron beam evaporation may be required depending on the melting point of the deposited material and the required film properties.

Purpose of the invention The present invention provides an evaporation apparatus that effectively utilizes the space within the evaporation tank, has excellent productivity, and can perform electron beam evaporation with a uniform film thickness.

Composition of the Invention A vacuum evaporation apparatus employing the electron beam sliding method of the present invention includes an electron beam evaporation source and a substrate holder that supports a substrate in an upright state, and the electron beam evaporation source is arranged in the height direction of the substrate. The feature is that the vapor deposition is performed while moving along the

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 and FIG. 2 are explanatory diagrams showing a vacuum evaporation apparatus of the present invention. A cylindrical substrate holder 15 is arranged inside the vapor deposition tank 11, and this substrate holder 15 rotates on a pedestal 13 around an imaginary axis of the cylinder. A substrate 17 is supported by the substrate holder 15 .

An electron beam evaporation source 21 is provided inside the cylindrical substrate holder 15 . The electron beam evaporation source 21 can be moved vertically by a drive shaft 23, and FIG. 1 shows the electron beam evaporation source 21 at the lowest position, and FIG. 2 shows the electron beam evaporation source 21 at the highest position.

Now considering the case of FIG. 1, since the electron beam evaporation source 21 is ideally a point source, a film thickness distribution will occur on the substrate depending on the distance from the electron beam evaporation source 21 according to Lambert's law of cosines. It ends up. Specifically, more evaporated material is deposited on the lower substrate 17a than on the upper substrate 17n, resulting in a thicker film. Therefore, evaporation is performed while moving the electron beam evaporation source 21 to the upper position shown in FIG. 2, and this vertical movement is repeated as necessary to obtain a uniform evaporated film with a desired thickness.

As the electron beam evaporation source 21 moves upward, the portions where the most film is deposited are 17a, 17.
b, . . . 17n, it moves above the substrate. In addition, in the upper part 17n of the substrate, a film is deposited during the entire movement of the electron beam evaporation source 21, whereas in the lower part 17a of the substrate, when the electron beam evaporation source 21 moves upwards, no film is deposited. do not. Therefore, if the electron beam slide evaporation is performed uniformly throughout the moving process, a uniform film thickness cannot be obtained between the top and bottom of the substrate. This can be adjusted by increasing the moving speed at the upper position of the electron beam evaporation source 21 or lowering the electron beam output (power), and the former is more preferable.

As described above, by performing electron beam slide deposition, uniformity in film thickness can be obtained in the vertical direction of the substrate. Uniformity of the film thickness in the horizontal direction of the substrate can be achieved by rotating the cylindrical substrate holder 15.

Reference numeral 25 denotes an evaporation amount monitoring element, specifically a crystal oscillator is used. The evaporation amount monitoring element 25 moves together with the electron beam evaporation source 21 while maintaining a positional relationship, and detects when the evaporation amount changes from a preset value depending on the height position of the electron beam evaporation source 21. to perform feedback control. This control is performed by adjusting the moving speed of the electron beam evaporation source 21 or the electron beam output, but the latter is preferable in terms of followability.

Effects of the invention According to the invention, the board is supported in an upright state,
By performing evaporation while moving the electron beam evaporation source along the vertical direction of the substrate, the space in the evaporation tank can be used effectively and a uniform film thickness distribution can be achieved on a large number of substrates or large area substrates. Electron beam evaporation can be performed.

[Brief explanation of the drawing]

FIGS. 1 and 2 are explanatory diagrams showing the electron beam slide deposition of the present invention. 11... Vapor deposition tank, 13... Frame, 15... Substrate holder, 17... Substrate, 17a... Substrate lower part, 17n... Substrate upper part, 21... Electron beam evaporation source, 23... Drive shaft, 25... Evaporation amount monitoring element.

Claims (1)

[Scope of utility model registration request] A vacuum evaporation apparatus comprising an electron beam evaporation source and a substrate holder that supports a substrate in an upright state, the electron beam evaporation source performing vapor deposition while moving along the height direction of the substrate.