JPH052720B2 - - Google Patents
Info
- Publication number
- JPH052720B2 JPH052720B2 JP60000594A JP59485A JPH052720B2 JP H052720 B2 JPH052720 B2 JP H052720B2 JP 60000594 A JP60000594 A JP 60000594A JP 59485 A JP59485 A JP 59485A JP H052720 B2 JPH052720 B2 JP H052720B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- deposits
- molding
- cleaning liquid
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 31
- 238000004140 cleaning Methods 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 150000001298 alcohols Chemical class 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 229930182556 Polyacetal Natural products 0.000 claims description 5
- 150000002596 lactones Chemical class 0.000 claims description 5
- 229920006324 polyoxymethylene Polymers 0.000 claims description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 239000004744 fabric Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- -1 γ-Capryrolactone Chemical compound 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- OOCCDEMITAIZTP-QPJJXVBHSA-N (E)-cinnamyl alcohol Chemical compound OC\C=C\C1=CC=CC=C1 OOCCDEMITAIZTP-QPJJXVBHSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- SRIFJCOBFTWCTM-UHFFFAOYSA-N 5-Dodecyldihydro-2(3H)-furanone Chemical compound CCCCCCCCCCCCC1CCC(=O)O1 SRIFJCOBFTWCTM-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229940083957 1,2-butanediol Drugs 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BTVWZWFKMIUSGS-UHFFFAOYSA-N 2-methylpropane-1,2-diol Chemical compound CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 1
- GYDWWIHJZSCRGV-UHFFFAOYSA-N 5-tetradecyloxolan-2-one Chemical compound CCCCCCCCCCCCCCC1CCC(=O)O1 GYDWWIHJZSCRGV-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- RZTOWFMDBDPERY-UHFFFAOYSA-N Delta-Hexanolactone Chemical compound CC1CCCC(=O)O1 RZTOWFMDBDPERY-UHFFFAOYSA-N 0.000 description 1
- 235000002245 Penicillium camembertii Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- OOCCDEMITAIZTP-UHFFFAOYSA-N allylic benzylic alcohol Natural products OCC=CC1=CC=CC=C1 OOCCDEMITAIZTP-UHFFFAOYSA-N 0.000 description 1
- QOTQFLOTGBBMEX-UHFFFAOYSA-N alpha-angelica lactone Chemical compound CC1=CCC(=O)O1 QOTQFLOTGBBMEX-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- BGLUXFNVVSVEET-UHFFFAOYSA-N beta-angelica lactone Chemical compound CC1OC(=O)C=C1 BGLUXFNVVSVEET-UHFFFAOYSA-N 0.000 description 1
- 125000003180 beta-lactone group Chemical group 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 125000000422 delta-lactone group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000000457 gamma-lactone group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- WGPCZPLRVAWXPW-UHFFFAOYSA-N xi-Dihydro-5-octyl-2(3H)-furanone Chemical compound CCCCCCCCC1CCC(=O)O1 WGPCZPLRVAWXPW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/58—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/095—Oxygen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Emergency Medicine (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
Description
〔産業上の利用分野〕
本発明は、熱可塑性樹脂組成物の成形によつて
金型表面に付着する金型付着物すなわち所謂モー
ルドデポジツトを極めて容易に除去することので
きる金型付着物の洗浄液並びにそれを使用する付
着物の除去方法に関する。
〔従来の技術とその問題点〕
熱可塑性樹脂組成物の形成は、通常、射出成形
あるいは押出成形によつて行われている。しかる
に成形を行うにあたつては、成形時に発生ガスが
固化し、あるいは組成物中に含まれる化合物が析
出して、これらが成形に用いられている金型の表
面へ付着するという現像が生ずる。そして、それ
が成形品の表面に転与して製品の外観や寸法精度
を損ない、或いは離型不良を起こすという問題が
あり、従来からかかる金型付着物を除去する方法
について種々の検討がなされてきたが、未だ満足
しうる方法は見出されていない。即ち、現在一般
化しているのは洗浄液を金型に塗布した後に布や
脱脂綿を用いて付着物を拭き取る方法や、洗浄液
塗布後に通常の成形条件で成形して付着物を除去
する方法等であるが、洗浄液自体が洗浄性に乏し
く、特にポリアセタール樹脂組成物の成形の場合
のパラホルムアルビテドの如き付着物に対しては
効果が少なく、拭き取りを行うことは多大の労力
の必要とするし、その拭き取りについても歯車等
の精密成形に用いられる複雑な金型などでは細部
まで完全に付着物の除去を行うことは困難であり
拭き取り時に金型を傷付ける場合もある。又、強
いアルカリ性、又は酸性、酸化性を有する成分を
含有した溶剤では付着物の除去を比較的簡単に行
うことが出来る場合もあるが、金型表面の腐食、
損傷を生じるため不適当である。
かかる一般的な金型洗浄を効率的に行う方法と
して、本発明者は、一般的な有機溶剤を用い、特
に超音波を併用することにより金型洗浄を効率的
に行う方法を見い出し、この方法については既に
特許出願している(特開昭59−202298号公報)。
しかしながら、この方法では、超音波発振装置等
の高価な装置を必要とするため、装置の設置コス
トが上昇することとなる点や、洗浄の際に、上記
超音波発振装置の設定等煩雑な操作がある点で
は、満足できる方法ではなかつた。
〔問題点を解決するための手段〕
そこで、本発明者らは、このような欠点のな
い、金型付着物を効果的に除去しうる洗浄液を得
るべく鋭意検討を重ねてきた結果、本発明に到達
したのである。
即ち、本発明は、熱可塑性樹脂組成物、例えば
ポリアセタール樹脂組成物等の成形に際し、金型
の表面に付着する金型付着物を除去する方法にお
いて、特にラクトン離とアルコール類とを含有す
る混合有機洗浄液を使用することを特徴とする金
型付着物の除去方法に係るものである。
本発明に於いて使用する洗浄液の必須成分の1
つであるラクトン類とは、エステルの官能基−
CO−O−を環内に含む環状エステル及びその誘
導体でエステル基を含む主環を構成する原子数が
4〜6の物質、即ちβ−ラクトン(4員環)、γ
−ラクトン(5員環)、δ−ラクトン(6員環)
及びそれらの誘導体である。これらの例を示せ
ば、β−プロピオラクトン、γ−ブチロラクト
ン、γ−バレロラクトン、γ−カプロラクトン、
γ−カプリロラクトン、γ−ラウロラクトン、γ
−パルミトラクトン、γ−ステアロラクトン、ク
ロトラクトン、α−アンゲリカラクトン、β−ア
ンゲリカラクトン、δ−バレロラクトン、δ−カ
プロラクトン等である。
本発明に於いて用いられるラクトン類の量は、
洗浄液全量に対し少なくとも5重量%以上、望ま
しくは10〜50重量%である。
次に、本発明に於いて用いられる他の必須成分
であるアルコール類とは、脂肪族及び芳香族の炭
化水素類、脂環式化合物等の飽和及び不飽和の一
価アルコール、二価アルコール、多価アルコール
等である。好ましい飽和脂肪族一価及び二価アル
コールのアルキル基の炭素数は1〜6で、特に1
〜4が好適である。これらの例を示せば、メタノ
ール、エタノール、プロピルアルコール、イソプ
ロピルアルコール、ブチルアルコール、イソブチ
ルアルコール、sec−ブチルアルコール、tert−
ブチルアルコール、エチレングリコール、プロピ
レングリコール、トリメチレングリコール、1,
2−ブタンジオール、1,3−ブタンジオール、
1,4−ブタンジオール、2,3−ブタンジオー
ル、イソブチレングリコール等である。芳香族化
合物のアルコール類の例を示せば、ベンジルアル
コール、シンナミルアルコール等である。脂環式
アルコール類の例を示せば、シクロペンタノー
ル、シクロヘキサノール等である。
本発明で、アルコール類は洗浄液全量に対し5
〜95重量%、特に50〜90重量%含有するのが好適
である。
又、他の溶剤として、水、エーテル類、ケトン
類、他のエステル類、芳香族炭化水素類又はその
他のハロゲン誘導体を一種又は二種以上含む混合
液として使用することができる。
本発明の洗浄液を使用して金型付着物を除去す
るための方法は、従来から知られている一般的な
方法で可能であり、例えば布片、紙片等に本発明
の洗浄液を含振させて金型表面の付着物を拭き取
る方法(この際適当な磨粉を併用してもよい)、
又、付着物の付着した金型表面に適当な方法で洗
浄液を塗布し、然る後成形を繰り返すことによつ
て付着物を成形品に転着させて金型面から取り除
く方法、或いは両者を併用する方法等、何れの方
法でも良い。又、これ以外の方法に於いても本発
明の洗浄液の使用は有効である。
〔発明の効果〕
本発明のラクトン類とアルコール類とを含有す
る混合有機洗浄液を使用する金型付着物の除去方
法は、金型を腐食、損傷することなく、一般の有
機溶剤、例えばアルコール類、エーテル類、ケト
ン類、他のエステル類、水或いはこれら2種以上
の混合液を使用する方法に比べて、付着物の除去
が容易に行われ、超音波等の特殊な手段を併用す
ることなく、例えば洗浄液を布片につけて金型表
面の付着物を拭き取り、元の清浄な表面を復元す
るに要する拭き取り回数、或いは金型付着物上に
塗布して成形による転着除去の場合の成形回数、
所要時間等を短縮することができる。又、一般に
金型付着物の除去は金型の温度が高い程上記の方
法による除去が容易であるが、金型温度を上昇さ
せることは一連の成形作業を中断する時間が長く
なり生産効率が阻害される。しかしながら本発明
の洗浄液を使用する方法によれば比較的金型が低
温でも付着物を除去でき、この点でも生産効率上
有利である。
〔実施例〕
以下、実施例を挙げて本発明を更に詳細に説明
するが、本発明はこれらの実施例に限定されるも
のではない。
実施例1〜5、比較例1〜12
ポリアセタール樹脂としてポリプラスチツクス
株式会社製ジユラコンM9002を用いて、射出成形
により樹脂温度200℃、金型温度60℃にて円形
(50mmφ×3mm)の成形品を1万シヨツト成形し
たところ、金型内の入れ子に白色のモールドデポ
ジツトが付着した。その後入れ子を取り外して、
特に加熱することなく表−1に示す洗浄液を一様
に浸し5cm角の布(ネル)を四つ折にして拭き取
り操作を試みた。尚、一回の拭き取り操作は極力
同一条件になるように行い(同一の布片で金型面
を2度拭い−これを1回とする−布片を交換して
繰り返す)、金型表面が光沢等からみて元の清浄
な状態に復元するに要する拭き取り回数を比較し
た(A法)。結果を表−1のA法の欄に示す。
一方、別に前記と全く同様の条件で成形を行
い、同様の付着物のついた成形後の金型につい
て、入れ子を取い外すことなく、又特に加熱する
ことなく表−1に示す洗浄液を金型付着物に塗布
し、約1分後に成形操作を行い、金型面が光沢等
からみて元の清浄な状態に復元するまで繰り返し
た。尚、この際5シヨツトごとに新たな洗浄液を
塗布した(B法)。結果を表−1のB法の欄に示
す。
[Industrial Field of Application] The present invention provides a method for removing mold deposits that adhere to the surface of a mold by molding a thermoplastic resin composition, which can be removed very easily. The present invention relates to a cleaning liquid and a method for removing deposits using the cleaning liquid. [Prior art and its problems] Thermoplastic resin compositions are usually formed by injection molding or extrusion molding. However, when molding is performed, development occurs in which gases generated during molding solidify or compounds contained in the composition precipitate and adhere to the surface of the mold used for molding. . There is a problem that this is transferred to the surface of the molded product, impairing the appearance and dimensional accuracy of the product, or causing defective mold release, and various studies have been conducted on methods for removing such mold deposits. However, no satisfactory method has been found yet. In other words, currently common methods include applying a cleaning solution to the mold and then wiping off the deposits using a cloth or absorbent cotton, or applying the cleaning solution and then molding under normal molding conditions to remove the deposits. However, the cleaning liquid itself has poor cleaning properties, and is particularly ineffective against deposits such as paraformalbite when molding polyacetal resin compositions, and wiping them off requires a great deal of effort. Regarding wiping, it is difficult to completely remove deposits down to the smallest detail in complex molds used for precision molding of gears, etc., and the mold may be damaged during wiping. Additionally, with solvents containing strongly alkaline, acidic, or oxidizing components, it may be possible to remove deposits relatively easily, but they may cause corrosion of the mold surface,
It is unsuitable as it may cause damage. As a method for efficiently performing such general mold cleaning, the present inventor has discovered a method for efficiently performing mold cleaning using a general organic solvent, especially by using ultrasonic waves, and has developed this method. A patent application has already been filed for this (Japanese Patent Application Laid-open No. 59-202298).
However, this method requires expensive equipment such as an ultrasonic oscillator, which increases the installation cost of the equipment, and requires complicated operations such as setting the ultrasonic oscillator during cleaning. In some respects, this was not a satisfactory method. [Means for Solving the Problems] Therefore, the present inventors have made intensive studies to obtain a cleaning liquid that does not have such drawbacks and can effectively remove mold deposits, and as a result, the present invention has been developed. It was reached. That is, the present invention provides a method for removing mold deposits that adhere to the surface of a mold during molding of a thermoplastic resin composition, such as a polyacetal resin composition, in particular, using a mixture containing lactone releaser and alcohol. The present invention relates to a method for removing mold deposits, which is characterized by using an organic cleaning liquid. One of the essential components of the cleaning liquid used in the present invention
Lactones are the functional groups of esters.
Cyclic esters containing CO-O- in the ring and their derivatives with 4 to 6 atoms constituting the main ring containing the ester group, i.e. β-lactone (4-membered ring), γ
-lactone (5-membered ring), δ-lactone (6-membered ring)
and derivatives thereof. Examples of these include β-propiolactone, γ-butyrolactone, γ-valerolactone, γ-caprolactone,
γ-Capryrolactone, γ-Laurolactone, γ
- palmitolactone, γ-stearolactone, crotolactone, α-angelicalactone, β-angelicalactone, δ-valerolactone, δ-caprolactone, etc. The amount of lactones used in the present invention is
The amount is at least 5% by weight, preferably 10 to 50% by weight, based on the total amount of the cleaning liquid. Next, alcohols, which are other essential components used in the present invention, include aliphatic and aromatic hydrocarbons, saturated and unsaturated monohydric alcohols and dihydric alcohols such as alicyclic compounds, Polyhydric alcohols, etc. The alkyl group of the preferred saturated aliphatic monohydric and dihydric alcohol has 1 to 6 carbon atoms, especially 1
-4 is suitable. Examples of these are methanol, ethanol, propyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-
Butyl alcohol, ethylene glycol, propylene glycol, trimethylene glycol, 1,
2-butanediol, 1,3-butanediol,
These include 1,4-butanediol, 2,3-butanediol, isobutylene glycol, and the like. Examples of aromatic alcohols include benzyl alcohol and cinnamyl alcohol. Examples of alicyclic alcohols include cyclopentanol and cyclohexanol. In the present invention, alcohol is added at 5% of the total amount of cleaning liquid.
The content is preferably from 50 to 90% by weight, particularly from 50 to 90% by weight. Further, as other solvents, a mixed solution containing one or more of water, ethers, ketones, other esters, aromatic hydrocarbons, or other halogen derivatives can be used. A method for removing mold deposits using the cleaning liquid of the present invention can be performed by a conventionally known general method, for example, by impregnating a piece of cloth, a piece of paper, etc. with the cleaning liquid of the present invention. wiping off the deposits on the mold surface (at this time, you may also use an appropriate polishing powder),
There is also a method of applying a cleaning liquid to the surface of the mold on which deposits have adhered by an appropriate method, and then repeating molding to transfer the deposits to the molded product and removing them from the mold surface, or a method of removing the deposits from the mold surface. Any method may be used, such as a method of using them together. Further, the use of the cleaning liquid of the present invention is also effective in other methods. [Effects of the Invention] The method for removing mold deposits using the mixed organic cleaning solution containing lactones and alcohols according to the present invention does not corrode or damage the mold, and can be used with general organic solvents such as alcohols. Compared to methods that use , ethers, ketones, other esters, water, or a mixture of two or more of these, it is easier to remove deposits, and special means such as ultrasound can be used in combination. For example, the number of times of wiping required to restore the original clean surface by applying cleaning liquid to a piece of cloth and wiping off the deposits on the mold surface, or applying it to the mold deposits to remove adhesion during molding. number of times,
The required time etc. can be shortened. Additionally, in general, the higher the mold temperature, the easier it is to remove mold deposits using the above method, but raising the mold temperature increases the time required to interrupt a series of molding operations, which reduces production efficiency. inhibited. However, according to the method using the cleaning liquid of the present invention, deposits can be removed even when the mold is at a relatively low temperature, which is also advantageous in terms of production efficiency. [Examples] Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples. Examples 1 to 5, Comparative Examples 1 to 12 A circular (50 mmφ x 3 mm) molded product was made by injection molding at a resin temperature of 200°C and a mold temperature of 60°C using Diuracon M9002 manufactured by Polyplastics Co., Ltd. as a polyacetal resin. When 10,000 shots of the material were molded, white mold deposits adhered to the nest inside the mold. Then remove the nest and
A 5 cm square piece of cloth (flannel) was soaked uniformly in the cleaning solution shown in Table 1 without any particular heating, and then a cloth (flannel) was folded into four and a wiping operation was attempted. In addition, each wiping operation should be performed under the same conditions as much as possible (wipe the mold surface twice with the same piece of cloth - count this as one time - change the cloth and repeat), so that the mold surface is The number of times of wiping required to restore the original clean state in terms of gloss etc. was compared (Method A). The results are shown in the column of Method A in Table 1. On the other hand, molding was carried out under exactly the same conditions as above, and the cleaning solution shown in Table 1 was applied to the mold with the same deposits without removing the insert or heating it. It was applied to the deposits on the mold, and after about 1 minute, the molding operation was repeated until the mold surface was restored to its original clean state in terms of gloss and the like. At this time, a new cleaning solution was applied every 5 shots (Method B). The results are shown in the column of Method B in Table 1.
【表】
実施例6〜7、比較例13〜16
ポリアセタール樹脂として旭化成工業株式会社
製テナツク−4010を使用し、成型条件を若千変更
して(樹脂温度210℃、金型温度80℃)射出成型
を行い、表−2に示す洗浄液で前記実施例及び比
較例と全く同様の試験を行つた。結果を表−2に
示す。[Table] Examples 6-7, Comparative Examples 13-16 Injection using Tenatsuku-4010 manufactured by Asahi Kasei Industries, Ltd. as the polyacetal resin and changing the molding conditions (resin temperature 210°C, mold temperature 80°C) After molding, the same tests as in the above Examples and Comparative Examples were conducted using the cleaning liquid shown in Table 2. The results are shown in Table-2.
【表】
実施例8、比較例17〜19
難燃性ポリエステル樹脂としてポリプラスチツ
クス株式会社性ジユラネツクス3370を用いて、射
出成形により樹脂温度250℃、金型温度60℃にて
円形(50mmφ×3mm)の成形品を2万シヨツト成
形したところ、金型に白色物質とキヤビテイ外に
僅かにタール状物質が付着した。この金型を特に
加熱することなく、実施例1〜5のA法に準じて
拭き取りを試みた。結果を表−3に示す。[Table] Example 8, Comparative Examples 17 to 19 Using Diuranetx 3370 manufactured by Polyplastics Co., Ltd. as a flame-retardant polyester resin, injection molding was performed at a resin temperature of 250°C and a mold temperature of 60°C to form a circular shape (50 mmφ ) When 20,000 shots of the molded product were molded, a white substance adhered to the mold and a slight tar-like substance adhered to the outside of the cavity. Wiping was attempted according to Method A of Examples 1 to 5 without particularly heating this mold. The results are shown in Table-3.
Claims (1)
の表面に付着する金型付着物を除去する方法に於
いて、ラクトン類とアルコール類とを含有する混
合有機洗浄液を使用することを特徴とする金型付
着物の除去方法。 2 熱可塑性樹脂が特にポリアセタール樹脂であ
る特許請求の範囲第1項記載の金型付着物の除去
方法。[Claims] 1. In a method for removing mold deposits adhering to the surface of a mold used for molding a thermoplastic resin composition, a mixed organic cleaning liquid containing lactones and alcohols is used. A method for removing mold deposits, characterized by: 2. The method for removing mold deposits according to claim 1, wherein the thermoplastic resin is particularly a polyacetal resin.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60000594A JPS61159499A (en) | 1985-01-07 | 1985-01-07 | Removal of metal dehered substance |
GB08600290A GB2172304B (en) | 1985-01-07 | 1986-01-07 | A method of removing mold deposits and a cleansing composition for use therein |
KR1019860000025A KR910005008B1 (en) | 1985-01-07 | 1986-01-07 | How to remove the mold attachment |
HK552/89A HK55289A (en) | 1985-01-07 | 1989-07-13 | A method of removing mold deposits and a cleansing composition for use therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60000594A JPS61159499A (en) | 1985-01-07 | 1985-01-07 | Removal of metal dehered substance |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61159499A JPS61159499A (en) | 1986-07-19 |
JPH052720B2 true JPH052720B2 (en) | 1993-01-13 |
Family
ID=11478060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60000594A Granted JPS61159499A (en) | 1985-01-07 | 1985-01-07 | Removal of metal dehered substance |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS61159499A (en) |
KR (1) | KR910005008B1 (en) |
GB (1) | GB2172304B (en) |
HK (1) | HK55289A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1988005813A1 (en) * | 1987-02-05 | 1988-08-11 | Macdermid, Incorporated | Photoresist stripper composition |
DE3713702C1 (en) * | 1987-04-24 | 1988-05-11 | Freudenberg Carl Fa | Means for cleaning processing plants for reactive isocyanate-containing multi-component mixtures |
JPH0785898B2 (en) * | 1989-11-21 | 1995-09-20 | 一方社油脂工業株式会社 | Mold cleaning composition |
WO1992019710A1 (en) * | 1991-05-09 | 1992-11-12 | E.I. Du Pont De Nemours And Company | Solvent composition |
JPH05104539A (en) * | 1991-10-16 | 1993-04-27 | Kanegafuchi Chem Ind Co Ltd | Washing agent of die for molding resin |
WO1993018101A1 (en) * | 1992-03-06 | 1993-09-16 | Minnesota Mining And Manufacturing Company | Composition containing lactone and ester for removing coatings |
DE4228461C1 (en) * | 1992-08-27 | 1994-01-20 | Chemie X 2000 Schrupstock Gmbh | Cleaning medium composition |
JP2002178339A (en) * | 2000-12-13 | 2002-06-26 | Asahi Kasei Corp | Removing agent for bonding material of mold and method for removing the same |
WO2003067631A2 (en) | 2002-02-06 | 2003-08-14 | Arch Specialty Chemicals, Inc. | Improved semiconductor stress buffer coating edge bead removal compositions and method for their use |
FR2868705B1 (en) * | 2004-04-13 | 2008-09-12 | Essilor Int | COMPOSITION FOR CLEANING SOIL ARTICLES, IN PARTICULAR OPTICAL ARTICLE AND METHOD FOR CLEANING SUCH ARTICLES. |
JP2006160859A (en) * | 2004-12-06 | 2006-06-22 | Tokyo Ohka Kogyo Co Ltd | Cleaning solvent for semiconductor production apparatus |
JP2006160897A (en) * | 2004-12-08 | 2006-06-22 | Tokuyama Corp | Detergent |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59202298A (en) * | 1983-05-02 | 1984-11-16 | ポリプラスチックス株式会社 | Method of removing metal mold adherent |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1304775A (en) * | 1960-11-17 | 1962-09-28 | Metal & Thermit Corp | Process for cleaning lead anodes and composition for its implementation |
US3475217A (en) * | 1967-10-09 | 1969-10-28 | Goodyear Tire & Rubber | Method of rejuvenating a substrate surface having deposits thereon |
JPS4963671A (en) * | 1972-10-20 | 1974-06-20 |
-
1985
- 1985-01-07 JP JP60000594A patent/JPS61159499A/en active Granted
-
1986
- 1986-01-07 KR KR1019860000025A patent/KR910005008B1/en not_active IP Right Cessation
- 1986-01-07 GB GB08600290A patent/GB2172304B/en not_active Expired
-
1989
- 1989-07-13 HK HK552/89A patent/HK55289A/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59202298A (en) * | 1983-05-02 | 1984-11-16 | ポリプラスチックス株式会社 | Method of removing metal mold adherent |
Also Published As
Publication number | Publication date |
---|---|
GB2172304A (en) | 1986-09-17 |
GB2172304B (en) | 1988-09-21 |
HK55289A (en) | 1989-07-21 |
KR860005877A (en) | 1986-08-13 |
GB8600290D0 (en) | 1986-02-12 |
KR910005008B1 (en) | 1991-07-20 |
JPS61159499A (en) | 1986-07-19 |
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