KR910005008B1 - How to remove the mold attachment - Google Patents
How to remove the mold attachment Download PDFInfo
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- KR910005008B1 KR910005008B1 KR1019860000025A KR860000025A KR910005008B1 KR 910005008 B1 KR910005008 B1 KR 910005008B1 KR 1019860000025 A KR1019860000025 A KR 1019860000025A KR 860000025 A KR860000025 A KR 860000025A KR 910005008 B1 KR910005008 B1 KR 910005008B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/58—Heterocyclic compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/095—Oxygen containing compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
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- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Emergency Medicine (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
Abstract
내용 없음.No content.
Description
본 발명은 열가소성 수지 조성물의 성형의 동안에 주형의 표면에 형성된 주형 부착물(mold deposit)의 용이한 제거를 허용하는 주형 부착물 세정액에 관한 것이며, 세정액이 사용되는 이러한 부착물의 제거 방법에 관한 것이다.The present invention relates to a mold deposit cleaning liquid that allows easy removal of mold deposits formed on the surface of a mold during molding of the thermoplastic resin composition, and to a method of removing such deposits in which the cleaning liquid is used.
종전 기술을 서술하면 다음과 같다.The prior art is described as follows.
열가소성 수지 조성물의 성형은 통상 사출성형 또는 압출에 의하여 수행된다. 성형과 관련하여 경험하는 한가지 문제는 성형 조작의 동안에 발생된 기체가 고형화되거나 또는 조성물에 포함된 화합물이 분리되어 그들이 성형시 사용한 주형의 표면에 부착되는 것이다.Molding of the thermoplastic resin composition is usually carried out by injection molding or extrusion. One problem experienced with molding is that the gases generated during the molding operation either solidify or the compounds contained in the composition detach and adhere to the surfaces of the molds they used in molding.
이러한 부착물은 부품의 표면상에 이동되기가 쉬워서 종종 제품의 외관 또는 치수 정확성을 손상키시거나 주형의 부품들의 점착을 일으킨다. 이러한 성형 부착물을 제거하기 위하여 여러 가지 시도가 행해졌으나 만족스러운 방법은 아직 발견되지 않았다.These attachments are easy to move on the surface of the part and often impair the appearance or dimensional accuracy of the product or cause sticking of the parts of the mold. Various attempts have been made to remove such molding deposits, but no satisfactory method has yet been found.
현재 일반적으로 실시하는 방법은 세정액을 주형에 바른 다음 헝겊 또는 흡수성솜으로 닦아내는 방법과 세정액을 바른 후, 보통의 성형조건하에 성형을 수행한 다음 부착물을 제거하도록 하는 또다른 방법을 포함한다. 그러나, 세정액 자체는 충분한 세정특성을 갖지 못하며, 특히 폴리아세탈 조성물 성형의 경우에서와 같이 파라포름알데히드와 같은 부착물이 수반될 때, 액체는 그렇게 효과적이지 못하다.Currently common methods include applying a cleaning solution to a mold and then wiping it with a cloth or absorbent cotton and another method of applying the cleaning solution and then performing the molding under ordinary molding conditions and then removing the deposits. However, the cleaning liquid itself does not have sufficient cleaning properties, and the liquid is not so effective, especially when it is accompanied by an attachment such as paraformaldehyde as in the case of molding a polyacetal composition.
더우기, 닦는 작업은 상당한 수고를 요하며, 톱니바퀴 등을 위한 정밀세정에 사용되는 것과 같은 복합 성형의 경우에 상세한 부분에 존재하는 부착물을 충분히 제거하기가 어렵고 때때로 주형은 닦는 작업의 동안 손상될 수 있다.Moreover, wiping requires considerable effort, and in the case of complex mouldings such as those used for precision cleaning for gears, etc., it is difficult to remove enough of the deposits present in the details and sometimes the mold may be damaged during wiping. have.
만일 강알칼리성이거나 산성, 또는 산화제 성분을 포함하는 용매를 사용한다면, 부착물제거는 훨씬 용이하게 수행될 수 있으나, 이러한 용매는 주형 표면에 부식 또는 손상을 일으키기가 쉽기 때문에 사용에 부적합하다.If a solvent is used that is strongly alkaline, acidic, or contains oxidant components, deposit removal may be much easier, but such solvents are not suitable for use because they are susceptible to corrosion or damage to the mold surface.
본 발명을 요약하면 다음과 같다.In summary, the present invention is as follows.
그러므로, 본 발명자는 주형 부착물을 효과적으로 제거할 수 있는 세정액을 발견하기 위하여 광범위한 연구를 행하였으며, 그 결과 본 발명에 이르렀다.Therefore, the present inventors conducted extensive research to find a cleaning liquid that can effectively remove the mold deposits, and as a result, the present invention has been achieved.
세정액으로 열가소성 수지용 주형의 표면으로부터 부착물을 제거하는 방법에 있어서, 본 발명은 상기 세정액이 그안에 락톤 화합물을 포함하는 유기세정액이라는 진보성을 제공한다.In a method for removing deposits from the surface of a mold for thermoplastic resin with a cleaning liquid, the present invention provides an advance that the cleaning liquid is an organic cleaning liquid containing a lactone compound therein.
발명은 또한 락톤 5 내지 50중량%, 알코올 9 내지 95중량% 및 나머지는 물 또는 유기용매로 이루어지는 세정액 조성물을 제공한다.The invention also provides a cleaning liquid composition consisting of 5 to 50% by weight of lactone, 9 to 95% by weight of alcohol and the remainder consisting of water or an organic solvent.
환언하면, 본 발명은 예를들어서, 락톤, 그리고 더 구체적으로는 락톤 및 알코올을 포함하는 유기세정액을 사용하는 것으로 이루어지는 폴리아세탈 수지 조성물과 같은 열가소성 수지 조성물의 주형을 제거하는 방법에 관한 것이다.In other words, the present invention relates to a method for removing a mold of a thermoplastic resin composition such as a polyacetal resin composition comprising, for example, lactone, and more specifically, an organic cleaning solution containing lactone and an alcohol.
락톤은 여기서, 본 발명에 사용된 세정액의 필수성분인데, 그의 고리에 에스테르 -CO-O- 작용기를 포함하는 환상 에스테르 및 그의 유도체, 즉, 에스테르기를 포함하는 주고리를 구성하는 원자의 수가 4∼6인 물질, 또는 β-락톤(4-원환), γ-락톤(5-원환), 및 δ-락톤(6-원환) 및 그의 유도체를 말한다. 이들 물질의 예로는 β-프로피오락톤, γ-부티로락톤, γ-발레로락톤, γ-카프로락톤, γ-카프릴로락톤, γ-라우로락톤, γ-팔미토락톤, γ-스테아로락톤, 크로토락톤, α-엔젤리카락톤, β-엔젤리카락톤, δ-발레로락톤 및 δ-카프로락톤이다.Lactone is, here, an essential component of the cleaning liquid used in the present invention, wherein the number of atoms constituting the cyclic ester including ester-CO-O- functional group and its derivative, ie, ring containing ester group, is 4 to 4 in its ring. The substance which is 6, or (beta) -lactone (4-membered ring), (gamma) -lactone (5-membered ring), and (delta) -lactone (6-membered ring), and its derivative (s) are mentioned. Examples of these substances include β-propiolactone, γ-butyrolactone, γ-valerolactone, γ-caprolactone, γ-caprylolatone, γ-laurolactone, γ-palmitolactone, γ-stearo Lactone, crotolactone, α-angelicalactone, β-angelicalactone, δ-valerolactone and δ-caprolactone.
본 발명에 사용된 락톤의 양은 세정액 전체에 대하여 적어도 5중량%이상, 바람직하게는 10∼50중량%이다. 이러한 락톤은 다른 유기용매와 혼합하여 사용할 수 있다. 다른 유기용매로서 이러한 사용에 가장 적합한 것은 알코올이다.The amount of lactone used in the present invention is at least 5% by weight, preferably 10 to 50% by weight based on the entire cleaning liquid. Such lactones may be used in admixture with other organic solvents. Most suitable for this use as other organic solvents are alcohols.
여기서 알코올은 지방족 및 방향족 탄화수소의 포화 및 불포화, 1가, 2가 및 다가 알코올, 지환족 화합물등을 말한다.Here, alcohol refers to saturated and unsaturated aliphatic and aromatic hydrocarbons, monovalent, divalent and polyhydric alcohols, alicyclic compounds and the like.
바람직한 포화 지방족 1가 및 2가 알코올은 그의 알킬기에, 1∼6 탄소원자, 더바람직하기는 1∼4탄소원자를 갖는다. 이들 알코올의 예들은 메탄올, 에탄올, 플로필알코올, 이소프로필알코올, 부틸알코올, 이소부틸알코올, sec-부틸알코올, tert-부틸알코올, 에틸렌글리콜, 프로필렌글리콜, 트리메틸렌글리콜, 1,2-부탄디올, 1,3-부탄디올, 1,4-부탄디올, 2,3-부탄디올 및 이소부틸렌 글리콜이다. 방향족 알코올 화합물의 예들은 벤질 및 신나밀 알코올이다. 지환족 알코올의 예들은 시클로펜탄올 및 시클로헥산올이다.Preferred saturated aliphatic monohydric and dihydric alcohols have 1 to 6 carbon atoms and more preferably 1 to 4 carbon atoms in their alkyl group. Examples of these alcohols are methanol, ethanol, floppy alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, ethylene glycol, propylene glycol, trimethylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol and isobutylene glycol. Examples of aromatic alcohol compounds are benzyl and cinnamil alcohols. Examples of cycloaliphatic alcohols are cyclopentanol and cyclohexanol.
또한, 락톤은 물, 에테르, 케톤, 다른 에스테르, 방향족 탄화수소, 또는 다른 할로겐 유도체와 같은 하나 또는 그 이상의 다른 용매를 포함하는 혼합액의 형태로 사용될 수 있다. 세정액은 락톤과 알코올을 모두 포함할 경우에 특히 효과적인데, 이 경우에 세정액 전체에 대하여 알코올의 비율은 5∼95중량%, 바람직하게는 50∼90중량%이다.In addition, lactones may be used in the form of a mixture comprising one or more other solvents such as water, ethers, ketones, other esters, aromatic hydrocarbons, or other halogen derivatives. The cleaning solution is particularly effective when it contains both lactone and alcohol, in which case the proportion of alcohol is 5 to 95% by weight, preferably 50 to 90% by weight, based on the entire cleaning solution.
본 발명에 따라 세정액을 사용함으로써 주형 부착물을 제거하기 위하여, 어떠한 공지의 일반적인 실시방법도 사용할 수 있다. 예를들면, 주형에 존재하는 부착물은 발명 세정액으로 축인 헝겊, 종이 등으로 닦아낼 수 있고(이와 관련하여 어떠한 알맞는 광택제분말을 액체와 조합하여 사용할 수도 있다.), 또는 부착물이 존재하는 주형 표면에 세정액을 바른 다음 성형을 반복하여 성형된 부품상에서 부착물을 이동시키므로 부착물을 주형 표면에서 제거시킬 수 있으며 또는 상기 두 방법을 합해서 사용할 수도 있다.In order to remove the mold deposit by using the cleaning liquid according to the present invention, any known general practice can be used. For example, the adherent present in the mold can be wiped off with a cloth, paper, etc., moistened with the inventive cleaning solution (in this regard, any suitable varnish powder can be used in combination with the liquid), or the mold surface on which the adherent is present. After applying the cleaning solution to the mold, the molding is repeated to move the deposit on the molded part so that the deposit can be removed from the mold surface or the above two methods can be used in combination.
어떠한 다른 제거방법으로도, 발명 세정액을 또한 효과적으로 사용할 수 있다.With any other removal method, the inventive cleaning liquid can also be used effectively.
발명의 이점은 다음과 같다.Advantages of the invention are as follows.
발명에 따라 락톤을 포함하는 유기 세정액을 사용함으로써 주형 부착물을 제거하는 방법은 주형에 일어날 부식 또는 손상의 가능성을 수반하지 않으며, 알코올, 에테르, 케톤, 다른 에스테르, 물, 또는 두종류 이상의 이들의 혼합물과 같은 락톤을 포함하지 않는 통상의 유기용매를 사용하는 종래의 방법과 비교하여 더 용이한 부착물의 제거를 허용한다.The method of removing mold deposits by using an organic cleaning solution comprising lactones according to the invention does not involve the possibility of corrosion or damage to the mold, and may be alcohols, ethers, ketones, other esters, water, or mixtures of two or more thereof. This allows for easier removal of deposits compared to conventional methods using conventional organic solvents that do not contain lactones such as.
예를들면, 주형 표면상의 부착물을 세정액으로 축인 헝겊 조각으로 닦아낼 때 본래의 깨끗한 표면이 회복될 때까지 요구되는 닦는 회수가 감소될 수 있으며, 또는 부착물 제거를 위하여 주형 부착물상에 액체를 바른 다음 성형을 반복하여 주형상에서 부착물을 이동시킬 때 요구되는 성형회수 및 시간을 감소시킬 수 있다.For example, when wiping a deposit on the mold surface with a patch moistened with a cleaning solution, the required number of wipes may be reduced until the original clean surface is restored, or the liquid is applied onto the mold attachment to remove the deposit. The molding can be repeated to reduce the number of moldings and the time required when moving the deposits on the mold.
일반적으로, 종래의 방법에 따르는 주형 부착물의 제거는 성형온도가 높아질수록 더 용이할 수 있으나 성형온도를 증가시키는 것은 일련의 성형조작을 중지시키는데 더 긴 시간을 요하여 생산효율에 영향을 미친다.In general, the removal of mold deposits according to conventional methods may be easier with higher molding temperatures, but increasing the molding temperature requires longer time to stop a series of molding operations, affecting production efficiency.
그러나, 발명 세정액을 사용하는 본 발명 방법에 따르면 성형온도가 매우 낮을지라도, 주형 부착물이 제거될 수 있다. 그러므로, 본 발명 방법은 생산효율에 있어서도 또한 유리하다.However, according to the method of the present invention using the inventive cleaning solution, even if the molding temperature is very low, the mold deposit can be removed. Therefore, the method of the present invention is also advantageous in production efficiency.
[실시예]EXAMPLE
다음의 실시예는 발명을 더 예시하기 위해 제공되나 본 발명이 이들 실시예로 제한되지 않음을 이해하여야 한다.The following examples are provided to further illustrate the invention, but it should be understood that the invention is not limited to these examples.
[실시예 1∼7 및 비교실시예 1∼10][Examples 1 to 7 and Comparative Examples 1 to 10]
수지온도 200℃와 성형온도 60℃의 조건하에 사출성형에 의하여 폴리아세탈수지(Duracon M 9002 폴리플라스틱사 제품)로부터 환형 성형(50mmø×3mm) 1만 쇼우트를 성형하였으며 백색주형 부착물이 주형의 인서어트상에 존재함을 발견하였다.Ten thousand shots were formed from polyacetal resin (Duracon M 9002 Polyplastics) by injection molding under conditions of a resin temperature of 200 ° C and a molding temperature of 60 ° C. It was found on the att.
다음에 인서어트를 제거하고 특별한 가열을 하지 않고 표 1에 나타낸 세정액으로 각각 고르게 적시고 네 번 접은 가로 세로 5cm의 헝겊(플란넬)을 사용하여 닦아내기 시험을 하였다.Next, the insert was removed and wiped off using a cloth (flannel) of 5 cm width and 4 times, evenly moistened with the cleaning solution shown in Table 1 without special heating.
시험은 한번 닦은 작업을 가능한한 매번 같은 조건하에서 수행하도록 하는 방법으로 행하였고(즉, 주형 표면을 같은 헝겊조각으로 2회 닦는데, 이것을 한번으로 치고 매번 헝겊을 바꾸어서 같은 조작을 반복하였다) 주형 표면이 광택등의 인자에 대하여 본래의 깨끗한 조건으로 회복될 때까지 요구되는 닦는 회수에 관하여 비교하였다(방법A).The test was carried out in such a way that the one wiping operation was carried out under the same conditions every time as possible (ie, the mold surface was wiped twice with the same piece of cloth, and this was repeated once and the cloth was changed each time and the same operation was repeated). This glossiness factor was compared with respect to the required number of wiping cycles until the original clean condition was restored (method A).
결과를 표 1의 방법-A난에 나타내었다.The results are shown in Method-A column of Table 1.
전술한 바 이외에 상기한 바와 같은 조건하에서 성형을 수행하고 유사한 부착물이 존재하는 후성형 주형에 관하여 인서어트를 제거하지 않고 특별한 가열을 하지 않고, 각 시험을 위한 주형 부착물상에 표 1에 나타낸 세정액중 한가지를 바르고 1분후 성형 조작을 수행함으로써 세정시험을 행하였는데, 성형 표면이 광택등의 인자에 대하여 본래의 깨끗한 조건으로 회복될때까지 반복하였다.In the cleaning liquids shown in Table 1 on the mold deposits for each test, the molding is carried out under the conditions as described above and without removal of the insert and without special heating with respect to the post-molding molds in which similar deposits are present. One minute and one minute afterwards, the cleaning test was performed by performing the molding operation, and the molding surface was repeated until the molding surface was restored to the original clean condition for factors such as gloss.
이 시험 방법에서는 매 5번 쇼우트마다 새로 발랐다(방법 B).In this test method, a new coat is applied every five shots (Method B).
결과를 표 1의 방법-B난에 나타내었다.The results are shown in Method-B column of Table 1.
[표 1]TABLE 1
[실시예 8∼9, 비교실시예 11∼14][Examples 8 to 9 and Comparative Examples 11 to 14]
폴리아세탈수지, Tenac-4010(아사이 케미칼 인더스트리 Co., Ltd. 제품)를 사용하여 약간 수정된 성형조건(수지온도 210℃, 성형온도 80℃)하에서 사출성형을 수행하였다.Injection molding was performed using polyacetal resin, Tenac-4010 (manufactured by Asai Chemical Industries Co., Ltd.) under slightly modified molding conditions (resin temperature 210 ° C, molding temperature 80 ° C).
표 2에 나타낸 세정조건을 사용함으로써 전술한 실시예 및 비교실시예에서와 정확히 같은 방법으로 시험을 행하였다.The test was carried out in exactly the same manner as in the above-described Examples and Comparative Examples by using the cleaning conditions shown in Table 2.
결과를 표 2에 나타내었다.The results are shown in Table 2.
[표 2]TABLE 2
[실시예 10∼11, 비교실시예 15∼17][Examples 10 to 11 and Comparative Examples 15 to 17]
수지온도 250℃와 성형온도 60℃의 조건하에서 사출성형에 의하여 난연제 폴리에스테르수지 Duraned 3370(폴리플라스틱 제품)로부터 환형 성형 2만 쇼우트를 성형하였으며, 간극밖에 약간의 타르질의 부착물로서 주형 표면에 백색 주형 부착물이 존재함을 발견하였다. 주형을 특별히 가열하지 않고 실시예 1∼7의 방법 A와 유사한 방법으로 닦아내기 시험을 하였다. 결과를 표 3에 나타내었다.20,000 shots were formed from flame retardant polyester resin Duraned 3370 (polyplastic product) by injection molding under the conditions of resin temperature of 250 ° C and molding temperature of 60 ° C. It was found that there was a mold attachment. The wiping test was carried out in a similar manner to Method A of Examples 1 to 7 without heating the mold in particular. The results are shown in Table 3.
[표 3]TABLE 3
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60000594A JPS61159499A (en) | 1985-01-07 | 1985-01-07 | Removal of metal dehered substance |
JP60-594 | 1985-01-07 |
Publications (2)
Publication Number | Publication Date |
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KR860005877A KR860005877A (en) | 1986-08-13 |
KR910005008B1 true KR910005008B1 (en) | 1991-07-20 |
Family
ID=11478060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019860000025A KR910005008B1 (en) | 1985-01-07 | 1986-01-07 | How to remove the mold attachment |
Country Status (4)
Country | Link |
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JP (1) | JPS61159499A (en) |
KR (1) | KR910005008B1 (en) |
GB (1) | GB2172304B (en) |
HK (1) | HK55289A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1988005813A1 (en) * | 1987-02-05 | 1988-08-11 | Macdermid, Incorporated | Photoresist stripper composition |
DE3713702C1 (en) * | 1987-04-24 | 1988-05-11 | Freudenberg Carl Fa | Means for cleaning processing plants for reactive isocyanate-containing multi-component mixtures |
JPH0785898B2 (en) * | 1989-11-21 | 1995-09-20 | 一方社油脂工業株式会社 | Mold cleaning composition |
WO1992019710A1 (en) * | 1991-05-09 | 1992-11-12 | E.I. Du Pont De Nemours And Company | Solvent composition |
JPH05104539A (en) * | 1991-10-16 | 1993-04-27 | Kanegafuchi Chem Ind Co Ltd | Washing agent of die for molding resin |
WO1993018101A1 (en) * | 1992-03-06 | 1993-09-16 | Minnesota Mining And Manufacturing Company | Composition containing lactone and ester for removing coatings |
DE4228461C1 (en) * | 1992-08-27 | 1994-01-20 | Chemie X 2000 Schrupstock Gmbh | Cleaning medium composition |
JP2002178339A (en) * | 2000-12-13 | 2002-06-26 | Asahi Kasei Corp | Removing agent for bonding material of mold and method for removing the same |
WO2003067631A2 (en) | 2002-02-06 | 2003-08-14 | Arch Specialty Chemicals, Inc. | Improved semiconductor stress buffer coating edge bead removal compositions and method for their use |
FR2868705B1 (en) * | 2004-04-13 | 2008-09-12 | Essilor Int | COMPOSITION FOR CLEANING SOIL ARTICLES, IN PARTICULAR OPTICAL ARTICLE AND METHOD FOR CLEANING SUCH ARTICLES. |
JP2006160859A (en) * | 2004-12-06 | 2006-06-22 | Tokyo Ohka Kogyo Co Ltd | Cleaning solvent for semiconductor production apparatus |
JP2006160897A (en) * | 2004-12-08 | 2006-06-22 | Tokuyama Corp | Detergent |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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FR1304775A (en) * | 1960-11-17 | 1962-09-28 | Metal & Thermit Corp | Process for cleaning lead anodes and composition for its implementation |
US3475217A (en) * | 1967-10-09 | 1969-10-28 | Goodyear Tire & Rubber | Method of rejuvenating a substrate surface having deposits thereon |
JPS4963671A (en) * | 1972-10-20 | 1974-06-20 | ||
JPS59202298A (en) * | 1983-05-02 | 1984-11-16 | ポリプラスチックス株式会社 | Method of removing metal mold adherent |
-
1985
- 1985-01-07 JP JP60000594A patent/JPS61159499A/en active Granted
-
1986
- 1986-01-07 KR KR1019860000025A patent/KR910005008B1/en not_active IP Right Cessation
- 1986-01-07 GB GB08600290A patent/GB2172304B/en not_active Expired
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1989
- 1989-07-13 HK HK552/89A patent/HK55289A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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GB2172304A (en) | 1986-09-17 |
GB2172304B (en) | 1988-09-21 |
HK55289A (en) | 1989-07-21 |
KR860005877A (en) | 1986-08-13 |
GB8600290D0 (en) | 1986-02-12 |
JPS61159499A (en) | 1986-07-19 |
JPH052720B2 (en) | 1993-01-13 |
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