GB2172304A - A method of removing mold deposits and a cleaning composition for use therein - Google Patents
A method of removing mold deposits and a cleaning composition for use therein Download PDFInfo
- Publication number
- GB2172304A GB2172304A GB08600290A GB8600290A GB2172304A GB 2172304 A GB2172304 A GB 2172304A GB 08600290 A GB08600290 A GB 08600290A GB 8600290 A GB8600290 A GB 8600290A GB 2172304 A GB2172304 A GB 2172304A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cleaning liquid
- lactone
- mold
- deposits
- gamma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/58—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/095—Oxygen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Emergency Medicine (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
Abstract
The invention consists of a method for removing deposits from the surface of a mold for making a thermoplastic resin product, with the aid of a cleaning liquid, in which the cleaning liquid is an organic cleaning liquid containing a lactone compound, and optionally in addition one or more of an alcohol, water, or an organic solvent. The lactone may be alpha -angelica lactone, beta -propiolactone, gamma -butyrolactone, gamma - caprylolactone, gamma -laurolactone, gamma -palmitolactone, gamma -stearolactone, crotolactone gamma -valerolactone, delta - valerolactone, gamma -caprolactone and delta -caprolactone, and may be admixed with one or both of water or an organic solvent, e.g. alcohols.
Description
SPECIFICATION
A method of removing mold deposits and a cleansing composition for use therein
This invention relates to a mold-deposit cleaning method using a liquid which permits easy removal of mold deposits formed on the surface of a mold during the molding of a thermoplastic resin composition.
The molding of a thermoplastic resin composition is usually carried out by injection molding or extrusion. One trouble experienced in connection with such operations is that gases developed during the operation become solidified, or compounds contained in the composition separate out, so that they deposit on the surface of the mold. Such deposits are likely to transfer on to the surface parts of the molding, i.e. the molded product, so that they often impair the appearance or dimensional accuracy of molded products; or they cause sticking of the molded product in the mold.
Various attempts have been made in order to remove such mold deposits, but no satisfactory method has yet been found. Methods in general use at present include a method such that a cleaning liquid is applied to the mold and then the deposits are wiped off with cloth or absorbent wadding. According to another method, after a cleaning liquid is applied, molding operations are carried out under normal molding conditions, and then the deposits are removed.
However, the known cleaning liquids have insufficient cleaning quality, and more especially where such deposits as paraformaldehyde are involved, as in the case of molding a polyacetal composition, the known liquids are not very effective.
If a solvent containing a strong alkaline or acidic, or oxidising component is used, deposit removal may be performed fairly easily, but such solvent is unsuitable for use, because it is likely to cause corrosion or damage to the mold surface.
Moreover, wiping work involves considerable labour; and in the case of a complex mold, such as one used in precision molding for a toothed wheel or the like, it is difficult thoroughly to remove the deposits present in detail portions; and sometimes the mold may be damaged during wiping work.
Therefore, extensive researches have been made in order to find a cleaning liquid capable of effectively removing mold deposits, and the present invention has as its object to provide a viable and in most cases advantageous alternative to the cleaning liquids and methods known in the art.
Accordingly, in a method for removing unwanted deposits from the surface of a mold for a thermoplastic resin with a cleaning liquid, the invention provides an improvement in that the said cleaning liquid is an organic cleaning liquid containing therein a lactone compound.
The invention further provides a cleaning liquid composition for the use defined above which composition comprises 5 to 50 wt. % of a lactone, 5 to 95 wt. % of an alcohol and the balance of water or an organic solvent.
In other words, the invention relates to a method of removing from a mold deposits of a thermoplastic resin composition, such as for example a polyacetal resin composition, which method comprises using an organic cleaning liquid containing lactones and, more particularly, lactones and alcohols.
The lactones herein, which are essential components of the cleaning liquid used in this invention, are cyclic esters containing a functional group of ester CO-O- in their rings, and derivatives thereof, that is, substances in which the number of atoms constituting a main ring including an ester group is 4-6, or lactone (4-member ring), '-lactone (5-member ring), and (y- lactone (6-member ring), and their derivatives.Examples of these substances are sw-angelica lactone, fi-propiolactone, ss-angelicalactone, ;g-butyrolactone, ;g-caprylolactone, '-Iaurnlactone, ,- palmitolactone, ;t-stearolactone, crotolactone, valeroIactone, (5-valerolactone, ;s-caprolactone, and (5-caprolactone.
The amount of lactones used in the invention is at least 5% by weight or more, preferably
10-50% by weight, relative to the cleaning liquid as a whole.
Such lactones may be used mixed with other organic solvents. Most suitable for use as such other organic solvents are alcohols. The alcohols herein referred to may be monohydric, dihydric, and polyhydric alcohols, both saturated and unsaturated, or aliphatic and aromatic hydrocarbons, alicyclic compounds and the like. Preferred saturated aliphatic monohydric and dihydric alcohols, in their alkyl groups, have 1-6 carbon atoms, more preferably 1-4 carbon atoms. Examples of these alcohols are methanol, ethanol, propyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, ethylene glycol, propylene glycol, trimethylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, and isobutylene glycol.
Examples of alcohols of aromatic compounds are benzyl alcohol and cinnamyl alcohol. Examples of alicyclic alcohols are cyclopentanol and cyclohexanol.
Further, the lactones may be used in the form of a mixed liquid containing one or more kinds of other solvents, such as water, ethers, ketones, other esters, aromatic hydrocarbons, or other halogen derivatives. The cleaning liquid is effective especially where it contains both lactones and alcohols, in which case the proportion of alcohols is 5-95% by weight, preferably 50-90% by weight, relative to the cleaning liquid as a whole.
To remove mold deposits by using the cleaning liquid according to the invention, any known procedure in general practice may be employed. For example, the deposits present on the mold may be wiped off with a piece of cloth, paper, or the like moistened with the cleaning liquid of the invention (in which connection some suitable polishing powder may be used in combination with the liquid); or the cleaning liquid is applied to the mold surface on which deposits are present, and then molding is repeated to transfer the deposits on to the molded part so that the deposits may be removed from the mold surface; or above said both procedures may be used in combination. In any other removal procedure, the cleaning liquid of the invention may be effectively used as well.
The method of removing mold deposits by using the organic cleaning liquid containing lactones in accordance with the invention involves no possibility of corrosion or damage being caused to the mold and permits easier removal of deposits, as compared with the conventional method in which ordinary organic solvents containing no lactone, such as alcohols, ethers, ketones, other esters, water, or a mixture of two or more kinds of them, are used. For example, where deposits on the mold surface are wiped off with a piece of cloth moistened with the cleaning liquid, the number of wiping times required until the original clean surface is restored can be reduced; or where the liquid is applied on the mold deposits and then molding is repeated to transfer the deposits on to the mold for deposit removal, the number of molding cycles and time required can be reduced.Generally, removal of mold deposits according to the conventional method can be made easier the higher the mold temperature is, but increasing the mold temperature involves longer interruptions of production molding operations, so that production efficiency is affected. However, according to the method of the invention in which the cleaning liquid of the invention is used, mold deposits can be removed even if the mold temperature is relatively low; therefore, the method of the invention is advantageous in terms of production efficiency as well.
The following examples are given to further illustrate the invention; however, it is understood that the invention is not limited by these examples.
Examples 1-7, and Comparative Examples 1-10:
Ten thousand shots of circular moldings (50 mmPX3 mm) were molded from a polyacetal resin, Duracon M 9002 produced by Polyplastics Co., by injection molding under conditions of resin temperature 200 C and mold temperature 60 > C, and it was found that a white mold deposit was present on an insert in the mold. The insert was then removed, and with no particular heating, wipe-off tests were made using 5 cm square pieces of cloth (flannel) evenly wetted respectively with the cleaning liquids shown in Table 1, and fourfolded.Tests were made in such a way that every one-time wiping operation was carried out under same conditions as far as possible (that is, the mold surface was wiped twice with same piece of cloth-which was counted as one time-and same operation was repeated by changing the cloth each time), and comparison was made with respect to the number of wiping times required until the mold surface was restored to its original clean condition in terms of luster or the like factor (Method
A). The results are shown in Table 1, under Method-A column.
Besides the foregoing, molding was carried out under same conditions as above, and with respect to the post-molding mold on which similar deposits were present, cleaning tests were made, without removing the insert and with no particular heating, by applying one of the cleaning liquids shown in Table 1 on to the mold deposit for each test, and carrying out molding operation one minute thereafter, which procedures were repeated until the mold surface was restored to its original clean condition in terms of luster or the like factor. In this process of testing, the cleaning liquid was applied anew every five shots (Method-B). The results are shown in Table 1, under Method-B column.
Examples 8-9, and Comparative Examples 11-14:
Injection molding was carried out using a polyacetal resin, Tenac-4010 produced by Asahi
Chemical Industry Co., Ltd., and under slightly modified molding conditions (resin temperture 210 C, mold temperatures 80 C). Tests were made by using the cleaning liquids shown in Table 2 and in exactly the same manner as in the foregoing Examples and Comparative Examples. The results are shown in Table 2.
Examples 10-11, and Comparative Examples 15-17:
Twenty thousand shots of circular moldings (50 mm diameterX3 mm) were molded from a flame retardant polyester resin. Duraned 3370 produced by Polyplastics Co., by injection molding under conditions of resin temperature 2500C and mold temperature 60 C, and it was found that a white mold deposit was present on the mold surface, with some tarry deposit outside the cavity. With no particular heating of the mold, wipe-off tests were made in manner similar to
Method A in Examples 1-7. The results are shown in Table 3.
Table 1
Method A Method B Cleaning Liquid No. of wiping times required in) No. of shots required in Test No. ( ) wt: restoring original condition restoring original condition) 1 y-butyrolactone (10) - isopropyl alcohol (90) 6 10 2 y-butyrolacetone (30) - isopropyl alcohol (70) 4 7 3 y-caprolactone (30) - isopropyl alcohol (70) 5 8 4 y-butyrolacetone (30) - butanol (70) 5 8 5 y-butyrolacetone (30) - trichloroethylene (70) 5 7 6 y-butyrolacetone (30) - ethyl acetate (70) 7 12 7 y-butyrolacetone (30) - ethyl acetate (70) 8 12 1 isopropyl alcohol (100) 20 > 20 (mot completely restored) 2 butanol (100) > 20 (not completely restored) > 20 (not completely restored) 3 benzene (100) > 20 (not completely restored) > 20 (not completely restored) 4 benzyl alcohol (100) > 20 (not completely restored) > 20 (not completely restored) 5 ethyl acetate (100) > 20 (not completely restored) > 20 (not completely restored) 6 trichloroethylene (100) 20 20 7 isopropyl alcohol (70) - butanol (30) 20 > 20 (not completely restored) 8 isopropyl alcohol (70) - benzyl alcohol (30) 10 14 9 isopropyl alcohol (70) - ethyl acetate (30) > 20 (not completely restored) > 20 (not completely restored) 10 isopropyl alcohol (70) - trichloroethylene (30) 15 16 Table 2
Method A Method B Cleaning Liquid No. of wiping times required in) No. of shots required in Test No. ( ) wt: restoring original condition restoring original condition) 8 y-butylrolacetone (30)-isopropyl alcohol (70) 5 8 9 y-butylrolacetate (30)-benzyl alcohol (70) 5 7 11 isopropyl alcohol (100) > 20 (not completely restored) > 20 (not completely restored) 12 trichloroethylene (100) > 20 (not completely restored) > 20 (not completely restored) 13 isopropyl alcohol (70)-benzyl alcohol (30) 8 12 14 isopropyl alcohol (70)-trichlorethylene (30) 16 18 Table 3
Method A Cleaning Liquid No. of wiping times required in) Test No. ( ) wt: restoring original condition 10 y-butyrolacetone (30)-isopropyl alcohol (70) 3 11 y-butyrolacetone (30)-methylethyl ketone(70) 3 15 isopropyl alcohol (100) 5 16 methylethyl ketone (100) 8 17 benzene (100) 10
Claims (8)
1. A method for removing from the surface of a mold deposits of a thermoplastic resin, the method comprising the use of a cleaning liquid, and wherein said cleaning liquid is an organic cleaning liquid incorporating a lactone or derivative thereof.
2. A method as claimed in Claim 1, in which said cleaning liquid comprises an alcohol and a lactone.
3. A method as claimed in Claim 1, in which said thermoplastic resin is a polyacetal.
4. A method as claimed in Claim 1, in which said cleaning liquid comprises 5% to 50 wt. % of a lactone, 5% to 95 wt. % of an alcohol and optionally, in addition, one or both of water, or an organic solvent.
5. A cleaning liquid for use in the middle defined in claim 1, and wherein said cleaning liquid is an organic cleaning liquid incorporating a lactone or derivative thereof.
6. A liquid according to claim 5 wherein, said liquid includes one or more of cyclic esters containing a functional group of ester -CO-O- in their rings, and derivatives thereof, that is, substances in which the number of atoms constituting a main ring including an ester group is 4-6, or lactone (4-member ring), ,-lactone (5-member ring), and (5lactone (6 member ring), and their derivatives such as; a-angelica lactone, ss-propiolactone, ss-angelicalactone, y-butyrolac- tone, '-caprylolactone, -laurnlactone, ,-palmitolactone, pstearolactone, crotolactone, y-valerolac- tone, Gvalerolactone, y-caprnlactone, and (5-caprolactone.
7. A cleaning liquid for use in the method defined in claim 1, and substantially as hereinbefore described.
8. A method for removing from the surface of a mold deposits of a thermoplastic resin, according to claim 1, and substantially as hereinbefore described.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60000594A JPS61159499A (en) | 1985-01-07 | 1985-01-07 | Removal of metal dehered substance |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8600290D0 GB8600290D0 (en) | 1986-02-12 |
GB2172304A true GB2172304A (en) | 1986-09-17 |
GB2172304B GB2172304B (en) | 1988-09-21 |
Family
ID=11478060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08600290A Expired GB2172304B (en) | 1985-01-07 | 1986-01-07 | A method of removing mold deposits and a cleansing composition for use therein |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS61159499A (en) |
KR (1) | KR910005008B1 (en) |
GB (1) | GB2172304B (en) |
HK (1) | HK55289A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4799967A (en) * | 1987-04-24 | 1989-01-24 | Firma Carl Freudenberg | Method for cleaning apparatus for fabricating reactive multiple-component mixtures containing isocyanate |
EP0301044A1 (en) * | 1987-02-05 | 1989-02-01 | Macdermid Incorporated | Photoresist stripper composition |
WO1992019710A1 (en) * | 1991-05-09 | 1992-11-12 | E.I. Du Pont De Nemours And Company | Solvent composition |
EP0537736A2 (en) * | 1991-10-16 | 1993-04-21 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Detergent for resin-molding mold |
WO1993018101A1 (en) * | 1992-03-06 | 1993-09-16 | Minnesota Mining And Manufacturing Company | Composition containing lactone and ester for removing coatings |
WO1994005765A1 (en) * | 1992-08-27 | 1994-03-17 | Chemie X 2000 Schrupstock Gmbh & Co. Kg | Cleaning-fluid composition |
FR2868705A1 (en) * | 2004-04-13 | 2005-10-14 | Essilor Int | COMPOSITION FOR CLEANING SOIL ARTICLES, IN PARTICULAR OPTICAL ARTICLE AND METHOD FOR CLEANING SUCH ARTICLES. |
US7335319B2 (en) | 2002-02-06 | 2008-02-26 | Arch Specialty Chemicals, Inc. | Semiconductor stress buffer coating edge bead removal compositions and method for their use |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0785898B2 (en) * | 1989-11-21 | 1995-09-20 | 一方社油脂工業株式会社 | Mold cleaning composition |
JP2002178339A (en) * | 2000-12-13 | 2002-06-26 | Asahi Kasei Corp | Removing agent for bonding material of mold and method for removing the same |
JP2006160859A (en) * | 2004-12-06 | 2006-06-22 | Tokyo Ohka Kogyo Co Ltd | Cleaning solvent for semiconductor production apparatus |
JP2006160897A (en) * | 2004-12-08 | 2006-06-22 | Tokuyama Corp | Detergent |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB958410A (en) * | 1960-11-17 | 1964-05-21 | Metal & Thermit Corp | Improvements in or relating to descaling lead anodes |
GB1227868A (en) * | 1967-10-09 | 1971-04-07 | ||
US3909438A (en) * | 1972-10-20 | 1975-09-30 | Kao Corp | Bleaching composition |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59202298A (en) * | 1983-05-02 | 1984-11-16 | ポリプラスチックス株式会社 | Method of removing metal mold adherent |
-
1985
- 1985-01-07 JP JP60000594A patent/JPS61159499A/en active Granted
-
1986
- 1986-01-07 GB GB08600290A patent/GB2172304B/en not_active Expired
- 1986-01-07 KR KR1019860000025A patent/KR910005008B1/en not_active IP Right Cessation
-
1989
- 1989-07-13 HK HK552/89A patent/HK55289A/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB958410A (en) * | 1960-11-17 | 1964-05-21 | Metal & Thermit Corp | Improvements in or relating to descaling lead anodes |
GB1227868A (en) * | 1967-10-09 | 1971-04-07 | ||
US3909438A (en) * | 1972-10-20 | 1975-09-30 | Kao Corp | Bleaching composition |
Non-Patent Citations (1)
Title |
---|
CRC HANDBOOK OF CHEMISTRY AND PHYSICS, 60TH EDN. (PUB 1979-1980, CRC PRESS INC FLORIDA U.S.A.); PAGES C-225 AND C-456 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0301044A1 (en) * | 1987-02-05 | 1989-02-01 | Macdermid Incorporated | Photoresist stripper composition |
EP0301044A4 (en) * | 1987-02-05 | 1989-03-29 | Macdermid Inc | Photoresist stripper composition. |
US4799967A (en) * | 1987-04-24 | 1989-01-24 | Firma Carl Freudenberg | Method for cleaning apparatus for fabricating reactive multiple-component mixtures containing isocyanate |
WO1992019710A1 (en) * | 1991-05-09 | 1992-11-12 | E.I. Du Pont De Nemours And Company | Solvent composition |
EP0537736A3 (en) * | 1991-10-16 | 1993-09-22 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Detergent for resin-molding mold |
EP0537736A2 (en) * | 1991-10-16 | 1993-04-21 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Detergent for resin-molding mold |
WO1993018101A1 (en) * | 1992-03-06 | 1993-09-16 | Minnesota Mining And Manufacturing Company | Composition containing lactone and ester for removing coatings |
US5413729A (en) * | 1992-03-06 | 1995-05-09 | Minnesota Mining And Manufacturing Company | Composition containing lactone and ester for removing coatings |
WO1994005765A1 (en) * | 1992-08-27 | 1994-03-17 | Chemie X 2000 Schrupstock Gmbh & Co. Kg | Cleaning-fluid composition |
US7335319B2 (en) | 2002-02-06 | 2008-02-26 | Arch Specialty Chemicals, Inc. | Semiconductor stress buffer coating edge bead removal compositions and method for their use |
FR2868705A1 (en) * | 2004-04-13 | 2005-10-14 | Essilor Int | COMPOSITION FOR CLEANING SOIL ARTICLES, IN PARTICULAR OPTICAL ARTICLE AND METHOD FOR CLEANING SUCH ARTICLES. |
WO2005102644A1 (en) * | 2004-04-13 | 2005-11-03 | Essilor International (Compagnie Generale D'optique) | Composition for cleaning soiled items, namely optical items, and method for cleaning said items |
US7638472B2 (en) | 2004-04-13 | 2009-12-29 | Essilor International Compagnie Generale D'optique | Composition for cleaning soiled items, namely optical items, and method for cleaning said items |
Also Published As
Publication number | Publication date |
---|---|
GB8600290D0 (en) | 1986-02-12 |
JPH052720B2 (en) | 1993-01-13 |
GB2172304B (en) | 1988-09-21 |
KR910005008B1 (en) | 1991-07-20 |
HK55289A (en) | 1989-07-21 |
JPS61159499A (en) | 1986-07-19 |
KR860005877A (en) | 1986-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970107 |