JPH0526756Y2 - - Google Patents
Info
- Publication number
- JPH0526756Y2 JPH0526756Y2 JP1986113088U JP11308886U JPH0526756Y2 JP H0526756 Y2 JPH0526756 Y2 JP H0526756Y2 JP 1986113088 U JP1986113088 U JP 1986113088U JP 11308886 U JP11308886 U JP 11308886U JP H0526756 Y2 JPH0526756 Y2 JP H0526756Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- layer
- metal plate
- coating layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 67
- 239000002184 metal Substances 0.000 claims description 67
- 239000010410 layer Substances 0.000 claims description 47
- 239000011247 coating layer Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011521 glass Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 239000005394 sealing glass Substances 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001120 nichrome Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000007743 anodising Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- -1 iron plate Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986113088U JPH0526756Y2 (ko) | 1986-07-22 | 1986-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986113088U JPH0526756Y2 (ko) | 1986-07-22 | 1986-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6318846U JPS6318846U (ko) | 1988-02-08 |
| JPH0526756Y2 true JPH0526756Y2 (ko) | 1993-07-07 |
Family
ID=30994555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986113088U Expired - Lifetime JPH0526756Y2 (ko) | 1986-07-22 | 1986-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526756Y2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0724290B2 (ja) * | 1987-03-23 | 1995-03-15 | 住友金属工業株式会社 | 集積回路容器の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59224146A (ja) * | 1983-06-03 | 1984-12-17 | Oki Electric Ind Co Ltd | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6023975Y2 (ja) * | 1979-10-15 | 1985-07-17 | 富士通株式会社 | セラミツクコ−ト金属コア−パツケ−ジ |
-
1986
- 1986-07-22 JP JP1986113088U patent/JPH0526756Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59224146A (ja) * | 1983-06-03 | 1984-12-17 | Oki Electric Ind Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6318846U (ko) | 1988-02-08 |
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