JPH05267493A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To easily mount many types of electronic components and to suppress an increase in a cost by providing a plurality of side face through holes in the side face of a circuit board mounted with the components and fixing it by the use of a connector of a shape which is engaged with the side face through holes. CONSTITUTION:Connectors 32 each having an L-shaped terminal 51 is arranged at both ends of a circuit board 31. Board small pieces 33a, 33b for preventing flow of resin are arranged on upper and lower surface of a longitudinal end of the board 31. A flat plate 34 for absorbing a mounter is arranged on an upper part of the connector 32. Side face through holes 41 are formed at a predetermined interval on both side faces of the board 31, and solder pads 42 for soldering the pieces 33a are formed on upper surfaces of longitudinal ends of the board 31. Solder pads 42 for soldering the pieces 33b are similarly formed on the rear of both ends of the board 31 in the longitudinal direction. Conductors and resistors are formed on the board 31, and electronic component elements 35 are further mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit mounted on another large board called a motherboard.

[0002]

2. Description of the Related Art Conventionally, as this kind of hybrid integrated circuit, a module structure shown in FIG. 6 has been widely used.

Reference numeral 11 in the figure shows a substrate formed of ceramics or the like. A film integrated circuit 12 including conductors and resistance elements is formed on the surface of the substrate 11, and a capacitor chip 13 and a capacitor chip 13 are formed on the film integrated circuit 12. The semiconductor chip 14 is mounted. Further, a terminal pad (not shown) is formed on the film integrated circuit 12, and the lead terminal 15 is connected to this terminal pad to form the hybrid integrated circuit element 10. The hybrid integrated circuit element 10 is covered with a sealing material 16 made of resin or the like.

The hybrid integrated circuit shown in FIG.
5 is a SIP (Sing
(le in Package) structure.

There is also a so-called DIP (Dual in Package) structure in which lead terminals 15 are drawn out from both sides of the substrate 11.

Further, in recent years, there is a hybrid integrated circuit having a transfer mold structure which is widely used in monolithic ICs. FIG. 7 is a schematic perspective view showing a hybrid integrated circuit having a transfer mold structure. Reference numeral 20 in the drawing denotes a lead frame, and an adhesive 2 is provided on the upper surface of the lead frame 20.
The substrate 22 is fixed via the substrate 7, the conductor wiring 21 is formed on the upper surface of the substrate 22, and the semiconductor chip 23, the thin film resistor array 24, and the like are mounted on the conductor wiring 21. Further, a gold wire 25 by wire bonding is applied to electrically connect the lead frame 20, the conductor wiring 21, the semiconductor chip 23, the thin film resistor array 24, etc., and a hybrid integrated circuit element 29 is configured. To cover the outside of the hybrid integrated circuit element 29, epoxy resin 2
6 is formed by a low voltage transfer. According to the hybrid integrated circuit configured as described above, a monolithic IC
Since the package structure is the same as that of (1), automatic mounting is possible and reflow soldering is possible.

[0007]

However, when the hybrid integrated circuit having the module structure shown in FIG. 6 is mounted on a large electronic circuit board (hereinafter referred to as a mother board), a through hole corresponding to the lead terminal 15 is formed on the mother board. Then
It is necessary to insert the lead terminal 15 into the through hole for soldering. Since the work of accurately inserting the lead terminal 15 into the through hole requires high precision and automation is difficult, this process is performed manually, and there is a problem that the cost becomes high. Further, when the outside of the hybrid integrated circuit element 10 is covered with the encapsulating material 16, a method of immersing the hybrid integrated circuit element 10 in a solution of the encapsulating material 16 and taking it out has been adopted. There is also a problem that the surface of 16 becomes uneven and a flat surface is not always obtained, and there are cases where mounting by a mounter cannot be performed.

On the other hand, in the hybrid integrated circuit having the transfer mold structure shown in FIG. 7, there is no problem in automating the step of mounting on the motherboard. However, in the case of this hybrid integrated circuit, since the package shape is constant,
It has been impossible to realize high-density mounting of all electronic circuit parts, which is a feature of conventional hybrid integrated circuits, and it has been impossible to mount particularly high-profile parts such as transformers. Therefore, in order to realize high-density mounting of electronic circuit components that are not compatible with the transfer mold structure, it is necessary to make a new package, and for this purpose it is necessary to make a new mold, which increases the cost. There was a problem that it took time.

The present invention has been invented in view of the above problems, and can easily accommodate mounting of any electronic circuit component, does not cause an increase in cost, and requires time for development. It is an object of the present invention to provide a hybrid integrated circuit that can be shortened and that can be reliably mounted automatically by a mounter.

[0010]

In order to achieve the above object, a hybrid integrated circuit according to the present invention has a plurality of side surface through holes on a side surface of a circuit board on which electronic components are mounted, and these side surface through holes are formed in the side surface through holes. It is characterized in that the connector having a fitting shape is fixed, and in the above hybrid integrated circuit, a flat plate is arranged above the circuit board.

Further, the hybrid integrated circuit described above is characterized in that a circuit board on which electronic components are mounted is filled with resin.

[0012]

According to the above construction, the side surface of the circuit board on which the electronic component is mounted has a plurality of side surface through holes, and the connector having a shape fitted into these side surface through holes is fixed. If a snap strip is formed on the connector at a constant interval and at the same interval as the interval, the snap strip serves as a cut line, and even if the size of the circuit board is changed, By breaking the connector using a snap strip, the size of the connector can be easily adjusted to the size of the circuit board.

Further, when the flat plate is arranged above the circuit board, automatic mounting by the mounter can be surely performed.

Further, when the circuit board on which the electronic parts are mounted is filled with resin, the electronic parts can be completely protected from moisture and the like, and the moisture resistance is improved.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a hybrid integrated circuit according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a surface-mounted hybrid integrated circuit according to an embodiment, and FIG. 2 is an exploded perspective view of the hybrid integrated circuit shown in FIG.

Reference numeral 31 in the drawing denotes a circuit board made of alumina ceramics, and L is provided at both end portions of the circuit board 31.
A connector 32 having character-shaped terminals 51 is provided, and resin small pieces 33a and 33b for resin flow stop are provided on the upper and lower surfaces of the end portion in the length direction of the circuit board 31. A flat plate 34 for mounting the mounter is provided between the upper portions of the connectors 32.
Are arranged.

The structure of the circuit board 31 is shown in FIGS. 3 (a) and 3 (b).
Will be described in more detail based on. Side through holes 41 are formed at regular intervals on both side surfaces of the circuit board 31, and solder pads 42 for soldering the board pieces 33a are soldered on the upper surfaces of both ends in the length direction of the circuit board 31, respectively.
Further, solder pads 42 (FIG. 2) for soldering the board pieces 33b are also formed on the back surfaces of the both ends in the length direction of the circuit board 31. Circuit board 3
A conductor and a resistor (not shown) are formed on the substrate 1 using thick film printing, and the electronic component element 35 is mounted on the upper surface of the circuit board 31.

The structure of the connector 32 is shown in FIG.
A more detailed description will be given based on (c). A semicircular resin portion 39 is formed on the inner side surface of the connector 32, and an L-shaped terminal 51 is fixed to the resin portion 39. That is, the connector 32 is configured by integrating the resin portion 39 and the terminal 51. Further, the connector 32 is usually formed by connecting a large number of resin portions 39, and snap strips 56 are formed between these resin portions 39 at the same constant intervals as the side surface through holes 41.

The terminal 51 is formed in an L-shape as described above, and when the hybrid integrated circuit is mounted on the mother board,
It can be surface-mounted without forming through holes on the motherboard. The terminal 51 is made of brass or copper, and the surface thereof is plated with Ni and Au. The horizontal portion 51a of the terminal 51 is flat enough to be soldered to the motherboard by reflow. There is.

The resin portion 39 is made of PPS (Polyphen), which is rich in electrical insulation and heat resistance enough to withstand heat during reflow.
It is formed using a resin such as ylene sulfide). On the lower surface side where the terminals 51 of the resin portion 39 are exposed, a height of several meters
m standoffs 39a are formed, and a standoff 39b having a height lower than that of the standoffs 39a is also formed on the opposite upper surface side.

When connecting the circuit board 31 and the connector 32, the thickness of the terminal 51 is set to the side surface through hole formed on the circuit board 31 so that the side through hole 41 and the terminal 51 of the connector 32 are fitted together. It is set smaller than the hole 41. Therefore, the terminals 51 of the connector 32 enter the side through holes 41, and the side edges of the circuit board 31 hit the standoffs 39a and are fixed without any clearance. Further, when the circuit board 31 on which the electronic component element 35 and the like are mounted is sealed with resin, the height of the standoff 39a is set sufficiently higher than the thickness of the circuit board 31 so as to act as a resin flow stop. Has been done. The standoff 39b is for fixing the flat plate 34 for mounting the mounter.

The structure of the substrate pieces 33a and 33b will be described with reference to FIG.

The board pieces 33a, 33b are formed by using pieces of a printed board or the like, and a copper foil 60 is formed on the lower surface or the upper surface thereof so that soldering is possible. The board pieces 33a and 33b have a role of preventing the liquid resin before being cured from flowing out when the component mounting surface of the circuit board 31 is sealed with resin in order to improve the moisture resistance. .

Next, a method of manufacturing the hybrid integrated circuit having the above structure will be described.

First, a circuit board 31 having side through-holes 41 formed at regular intervals by punching using a laser or a metal mold or a combination of both is produced, and solder pads 42 are formed on the circuit board 31.
The circuit board 31 has the electronic component element 35 and the dam substrate piece 3
3a and 33b are soldered by reflow, and the terminals 51 of the L-shaped connector 32 are fitted to the side surface through holes 41 of the circuit board 31 and soldered. After that, the entire component mounting surface is sealed with epoxy resin or the like, and then the flat plate 34 is attached to the standoff 39b portion above the connector 32 using an adhesive.

The electronic component element 35 may be mounted on the circuit board 31 on either one side or both sides, and since the whole is resin-sealed, Ag / P, which is widely used in the past, is used.
A thick film substrate having a conductor formed of d or Ag / Pt may be used. The circuit board 31 is a ceramic board, a resin board,
It may be a thick film multilayer substrate, a metal substrate or the like.

In the hybrid integrated circuit according to the above embodiment, the side surface through holes 4 are formed on the side surface of the circuit board 31 at regular intervals.
1 is formed and the snap strips 56 are formed in the connector 32 at the same intervals as described above, so that the connector 32 can be freely sized along the snap strips 56 according to the size of the circuit board 31. You can break it. Therefore, the size of the connector 32 can be easily and freely adjusted to the size of the circuit board 31.
All electronic parts can be mounted on the circuit board 3
Even if the electronic component mounted on the No. 1 is changed, it is not necessary to manufacture a new package as in the conventional case, and it is possible to prevent a significant increase in cost for manufacturing a new mold. Moreover, it does not require a long time for development.

Further, a flat plate 34 is provided above the circuit board 31.
Since it is provided, the automatic mounting by the mounter can be surely performed. Therefore, in combination with the shape of the terminal 51, automatic soldering to the mother board by reflow becomes easy.

Furthermore, since the circuit board 31 on which the electronic component element 35 is mounted is filled with resin, the electronic component element 35 can be protected and the moisture resistance can be improved.

[0030]

As described above in detail, in the hybrid integrated circuit according to the present invention, the side surface of the circuit board on which the electronic parts are mounted has a plurality of side surface through holes, and the shape fits into these side surface through holes. Connector is fixed, the through holes are formed at regular intervals, and if snap strips are formed on the connector at the same intervals as the above intervals, the snap strips serve as cut lines and the circuit is formed. Even if there is a change in the electronic components mounted on the board and the size of the circuit board changes, by breaking the connector using the snap strip,
The size of the connector can be easily matched with the size of the circuit board. Therefore, it is possible to easily mount various electronic components. Therefore, it is not necessary to manufacture a new package as in the conventional case, the cost is not increased, and the development period of a new product can be significantly shortened.

Further, when the flat plate is arranged above the circuit board, the automatic mounting by the mounter can be surely performed, and the automatic soldering to the mother board by the reflow becomes easy.

Further, when the resin is filled on the circuit board on which the electronic parts are mounted, the electronic parts can be completely protected from moisture and the durability can be improved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a hybrid integrated circuit according to the present invention.

FIG. 2 is a schematic exploded perspective view of the hybrid integrated circuit shown in FIG. 1 viewed from the back surface side.

FIG. 3A is a schematic plan view showing a circuit board,
(B) is a typical perspective view showing a circuit board.

4A is a schematic perspective view showing a basic unit of a connector, FIG. 4B is a schematic perspective view showing a connector to which basic units are connected, and FIG. 4C is a connector 32 to which basic units are connected.
It is a schematic plan view showing.

FIG. 5 is a schematic perspective view showing a dam substrate piece.

FIG. 6 is a schematic partial cross-sectional perspective view showing a conventional hybrid integrated circuit.

FIG. 7 is a schematic cross-sectional view showing another conventional hybrid integrated circuit.

[Explanation of symbols]

 31 Circuit Board 32 Connector 34 Flat Plate 35 Electronic Component Element 41 Side Through Hole

Claims (3)

[Claims] 1. A hybrid integrated circuit having a plurality of side surface through holes on a side surface of a circuit board on which electronic components are mounted, and a connector having a shape fitted into the side surface through holes is fixed. 2. The hybrid integrated circuit according to claim 1, wherein a flat plate is provided above the circuit board. 3. The hybrid integrated circuit according to claim 1, wherein resin is filled on a circuit board on which electronic components are mounted.