JPH05266791A - Method for forming partition of gas discharge display panel - Google Patents

Abstract

PURPOSE:To form a partition of a gas discharge display panel more finely. CONSTITUTION:A wall material 28 for forming a partition is laminated on an electrode pattern 26, of which surface layer 26b is left as it is dried, so as to contact to the electrode pattern 26. The electrode pattern 26 and the wall material 28 are made of thick film paste. Next, the wall material 28 is heated to decompose the resin included in the wall material 28 over the whole of the wall material 28. Hardness of the surface layer 26b is thereby made higher than the hardness of the wall material 28 and a difference between the hardness of them can be enlarged. Next, patterning is performed to the wall material 28 by the sand blasting method using sand blasting grains having the hardness lower than that of the surface layer 26b and higher than that of the wall material 28 to form a partition. At the time of patterning, the generation of damage of the electrode pattern 26 by the blasting grains is restricted, and while the fine patterning is performed to the wall material 28. Since the partition and the electrode 26 can be burned under the condition that they are made to contact to each other, the peeling of the partition from the electrode pattern 26 can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming barrier ribs of a gas discharge display panel.

[0002]

2. Description of the Related Art A gas discharge display panel has the advantages that it can have a wide viewing angle, a high contrast ratio, and can be manufactured to be thin.
In addition to being used as a display device for equipment A, its application to high-definition television is under consideration.

In the manufacture of gas discharge display panels, generally,
The thick film printing method is used in consideration of mass productivity.

[0004]

However, in the thick film printing method, the limit is to form five barrier ribs per 1 mm, and therefore the pixel density cannot be made higher than the limit. Particularly, in a gas discharge display panel for full color display, three display cells for emitting light of each color are required for each pixel in order to obtain three kinds of emission colors of red, blue and green for each pixel. It is desired to form finer partition walls as compared with the discharge display panel. For example, in a gas discharge display panel for full color display, the number of pixels is 640 ×
When manufacturing a 12-inch panel having 480 dots, it is necessary to form eight barrier ribs per mm. Moreover, in this case, in order to set the aperture ratio of the display cell to 50% or more, the partition wall width must be about 62.5 μm. However, such a fine partition wall cannot be formed by the thick film printing method.

Therefore, the applicant of this application examined a method for forming finer partition walls, and proposed a method suitable for forming fine partition walls in Japanese Patent Application No. Hei 2-166038. This method is a method of forming partition walls by a sandblast method, and according to this method, it is possible to form partition walls having a width of 50 μm. An example of this method will be described below with reference to the drawings.

3 to 4 are cross-sectional views of relevant parts schematically showing steps of the partition wall forming method according to the applicant. First, Fig. 3
As shown in (A), an electrode pattern such as a cathode pattern 10 is formed on the substrate 12 by a thick film printing method. Next, the cathode pattern 10 is dried and then baked.

Next, as shown in FIG. 3B, the buffer layer 14 and the buffer layer 14 having sandblast resistance.
A protective layer 16 for protecting the film from the solvent contained in the wall material is sequentially formed on the cathode pattern 10.

Next, as shown in FIG. 3C, the wall material 18
Are laminated by a thick film printing method. At this time, by repeatedly printing and drying the wall material 18, the wall material 18 is laminated to a predetermined height.

Next, as shown in FIG. 3D, a resist 20 having a sandblast resistance and a tack preventing layer 22 are provided.
Are sequentially formed on the wall member 18. When the resist 20 is patterned, if the mask is brought into close contact with the resist 20 and exposed, the resist 20 may be attached to the mask and peeled off.
To use.

Next, as shown in FIG. 4A, the resist 20 and the tack preventive layer 22 are patterned by exposing using a mask, and the pattern 20a of the resist 20 and the tack preventive layer which are patterned into a predetermined shape. 22
Pattern 22a is obtained.

Next, as shown in FIG. 4B, Al ₂ O ₃ particles for sandblast are supplied to the wall material 18 using the patterns 20a and 22a as masks to remove the wall material 18 portion not covered with the mask. It is removed to a depth reaching the tack prevention layer 16 to obtain the partition wall 18a made of the remaining portion of the wall material 18.

Next, as shown in FIG. 4C, the partition wall 18
b. By this firing, the patterns 20a and 22a, the buffer layer 14 and the protective layer 16 each made of an organic material are burned and removed.

However, when the partition wall 18a is fired,
Since the buffer layer 14 could not always be removed sufficiently, the adhesion between the cathode pattern 10 and the partition wall 18a was weakened, and the partition wall 18a sometimes peeled off from the cathode pattern 10. Further, when the partition wall 18a is baked, the pattern 22a of the resist 20 cannot always be sufficiently removed, and the remaining pattern 22a may deteriorate the display quality of the gas discharge display panel.

The present invention has been made in view of the above points, and an object of the present invention is to provide a gas discharge display panel capable of preventing damage to an electrode pattern even if a partition wall is formed by a sandblast method without providing a buffer layer. It is to provide a method for forming a partition wall.

[0015]

In order to achieve this object, a method for forming barrier ribs of a gas discharge display panel according to the present invention comprises:
Print the thick film paste for electrode pattern formation on the substrate,
At least a step of forming an electrode pattern in which the surface layer is kept dry, and a partition wall forming thick film paste is printed on the electrode pattern in which the surface layer is kept dry, in contact with the electrode pattern to laminate the wall material. A step of forming a body, a step of forming a resist pattern having a sandblasting resistance on the wall material laminate, and heating the wall material laminate having the resist pattern formed thereon at a temperature lower than the firing temperature. A process of decomposing the resin contained in the wall material laminate almost all over, and a wall material by the sand blast method using blast particles having a hardness lower than the surface layer of the electrode pattern and higher than the wall material laminate decomposing the resin throughout A step of patterning the laminated body to form a partition, a step of removing the resist pattern from the partition, and a step of baking at least the surface layer of the electrode pattern and the partition. Characterized in that it comprises a step of.

[0016]

According to such a partition forming method, the wall material laminate is formed on the electrode pattern in which at least the surface layer has been dried, in contact with the electrode pattern. Next, the resin contained in the wall material laminate is decomposed over the entire wall material laminate. In the electrode pattern and the wall material laminate formed using these thick film pastes, the resin contained in the wall material laminate after the wall material laminate is formed on the electrode pattern with the surface layer thus dried. By decomposing, the hardness of the electrode pattern surface layer can be made higher than the hardness of the wall material laminate and the difference in hardness between them can be increased. This can be achieved by appropriately adjusting the heating temperature and / or the heating time of the wall material laminate. Therefore, by making the hardness of the blast particles used for patterning the wall material laminate by the sand blast method lower than the hardness of the electrode pattern surface layer and higher than the hardness of the wall material laminate, the electrode pattern is prevented from being damaged by the blast particles. The wall material can be patterned while suppressing.

The reason why the hardness of the surface layer of the electrode pattern can be made higher than the hardness of the entire wall material laminate and the difference between these hardnesses can be increased is not always clear, but the main reason therefor is to dry the electrode pattern. The resin of the thick film paste remains undecomposed even after the resin of the wall material laminate is decomposed on the surface layer as it is, while the wall material laminate decomposes the resin of the thick film paste contained in it. There are two points that it becomes very brittle.

Further, the wall material laminate is formed in contact with the electrode pattern, and then the wall material laminate is patterned to form partition walls. Therefore, since these can be fired while the partition wall and the surface layer of the electrode pattern are in contact with each other, a sufficient adhesive force sufficient to prevent the partition wall from peeling off from the electrode pattern,
Obtained between the partition and the electrode pattern.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings are merely schematic representations so that the present invention can be understood, and therefore the present invention is not limited to the illustrated examples.

1 to 2 are process drawings for explaining the embodiments of the present invention. In these drawings, main processes are shown stepwise in cross-sectional views.

First, as shown in FIG. 1A, the substrate 24
A thick film paste for forming an electrode pattern is printed thereon to form an electrode pattern 26 in which at least the surface layer is left dry.

In this embodiment, the electrode pattern 26 has a two-layer structure composed of a first layer 26a and a second layer 26b. Therefore, for example, a Ni thick film paste (# 9535 manufactured by Dupont) for forming the first layer is printed on the substrate 24, and the paste is heated at a drying temperature of 150 ° C. for 1 hour to be dried, and then a baking temperature of 530. The first layer 26a which has been baked by heating at 10 ° C. for 10 minutes and having a predetermined pattern shape
To get Next, CaLa for forming the second layer is formed on the first layer 26a.
A CrO ₃ thick film paste (manufactured by Toyo Ink Co., Ltd.) is printed, and the paste is heated at a drying temperature of 135 ° C. for 10 minutes to be dried to obtain an as-dried second layer 26b having a predetermined pattern shape. .. The components of the thick film paste for forming the electrode pattern are mainly conductive particles (Ni particles or CaLa).
CrO ₃ particles), lead glass, resin and solvent, and thus the components of the printed first layer 26a and second layer 26b are mainly conductive particles (Ni particles or CaLaCrO ₃ particles), lead glass, resin and solvent. Is. The components of the dried first layer 26a and second layer 26b are mainly conductive particles, lead glass and resin. Also fired first layer 26
The component a is mainly conductive particles and lead glass, and a plurality of conductive particles are bonded by the lead glass in the fired first layer 26a.

Since CaLaCrO ₃ has a low work function, it is useful for reducing the discharge voltage of the gas discharge display panel. However, CaLaCrO ₃ has high resistance, so electrode pattern 2
If the whole 6 is formed from the CaLaCrO ₃ thick film paste, the wiring resistance of the electrode pattern 26 increases. Therefore, in order to reduce the wiring resistance, the first layer 26a is formed using a Ni thick film paste.

In this example, the surface layer portion on the upper surface of the electrothermal pattern 26 is the second layer 26b which is still dried, and the remaining portion of the electrode pattern 26 is the second layer 26b which has been fired, and the first layer 26a and the second layer 26b. Although the forming material of the layer 26b is different,
The present invention is not limited to this example as long as at least the surface layer is dried to form the electrode pattern 26. In addition, for example, the first and second layers 26a and 26b are formed of the same material and the first layer 26a is baked. Alternatively, the second layer 26b that has been dried may be formed, or the entire electrode pattern 26 may be composed of one layer that has been dried.

Next, as shown in FIG. 1B, the partition wall forming thick film paste is printed on the electrode pattern 26, at least the surface layer of which has been dried, in contact with the electrode pattern 26 to form a wall. The material laminated body 28 is formed.

In this embodiment, the wall material laminate 2 is replaced with the white layer 2.
A two-layer structure composed of 8a and a black layer 28b is adopted. Therefore, for example, a glass thick film paste (made by Nippon Electric Glass Co., Ltd.) for forming a white layer is solid-printed on the first layer 26a of the electrode pattern 26, and the paste is heated at a drying temperature of 135 ° C. for 10 minutes. dry. Then, printing and drying are repeated to obtain an as-dried white layer 28a having a height of 180 μm. Next, a glass thick film paste (made by Sumitomo Metal Co., Ltd.) for forming a black layer is solid-printed on the white layer 28a,
This paste is dried by heating at a drying temperature of 135 ° C. for 10 minutes to obtain an as-dried black layer 28b having a height of 20 μm. White layer 28a and black layer 28 at this time
The height of the wall material laminate made of b is 200 μm. The components of the thick film paste for forming the wall laminate are mainly lead glass, resin and solvent, and thus the printed white layer 28
The components of a and black layer 28b are mainly lead glass, resin and solvent, and dried white layer 28a and black layer 28
The components of b are mainly lead glass and resin.

Since the uppermost layer of the laminated wall material laminate 28 is the black layer 28a and the remaining portion is the white layer 28a,
In the step of forming the resist pattern on the wall material laminate 28, the resist pattern is formed on the black layer 28a. Therefore, when the resist is exposed, the wall material laminate 28
It is possible to prevent halation due to, and as a result, it is possible to form a fine resist pattern. Further, since the white layer 28a and the black layer 28b are sequentially formed on the electrode pattern, the gas discharge display panel for color or monochrome display provided with the partition wall formed by using the layers 28a and 28b is caused to emit discharge. At this time, ultraviolet rays can be reflected by the white layer portion of the partition wall to improve the luminous efficiency.
Further, when the display surface of the gas discharge display panel is viewed, the black layer portion of the partition wall becomes a black stripe, so that the display contrast can be enhanced.

In this example, the wall material laminate 28 is replaced with the white layer 28.
Although the two-layer structure composed of a and the black layer 28b is adopted, the wall material laminate 28 is not limited to this, and, for example, the wall material laminate 28 may be the black layer 28b only or the white layer 28.
Only a may be used. In the above example, the substrate 24 is used as the back plate of the discharge display panel.
When is used as the front plate, the wall material laminate 28 formed on the electrode pattern may have a structure in which a black layer as the lowermost layer, a white layer as the intermediate layer, and a black layer as the uppermost layer are sequentially laminated. In this case, the lowermost layer of the wall material laminate is the black stripe layer and the uppermost layer is the antihalation layer.

Next, as shown in FIG. 1C, a resist pattern 30 having sandblast resistance is formed on the wall material laminate 28.

In this embodiment, in order to strengthen the adhesion between the resist pattern 30 and the wall material laminate 28, the wall material laminate 2
A rough surface is formed on the surface layer of No. 8 (black layer 28a in this example). Therefore, the wall material laminate 28 is heated at a temperature lower than the firing temperature to decompose the resin in the surface layer of the wall material laminate 28 so as not to decompose the resin in the portion other than the surface layer of the wall material laminate 28. By appropriately adjusting the heating temperature and / or the heating time of the wall material laminate 28, the wall material laminate without decomposing the resin of the portion other than the surface layer of the wall material laminate 28 and the second layer 26b of the electrode pattern 26. The resin on the surface layer of the body 28 can be decomposed. For example, the wall material laminate 28 is heated at 145 ° C. for 2
It may be heated (pre-baked) for 0 minutes. The resin is, for example, ethyl cellulose resin. The ethyl cellulose resin usually has a molecular chain of about 1 million, and when heated at a temperature of 150 ° C. or higher, the molecular chain has a molecular weight of 10,000 to 100.
It changes to about 0 and therefore the decomposition of the ethylcellulose resin occurs. By the decomposition of the resin, the surface layer of the wall material laminate 28 becomes brittle and a rough surface is formed on the surface layer. When the resin is decomposed over the entire wall material laminate 28, the wall material laminate 28 becomes brittle and easily collapses. Therefore, the resist pattern 30 is formed on the wall material laminate 28.
Is difficult to form. Therefore, it is preferable not to decompose the resin other than the surface layer of the wall material laminate 28. Next, a resist (ORDYL BF-200 dry film type manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 50 μm is applied onto the wall material laminate 28 having a rough surface, and the resist is developed, exposed and patterned by a photolithography process. A resist pattern 30 is obtained. The resist pattern 30 has a width of 5
It is a stripe pattern of 0 μm. A plurality of resist patterns 30 are arranged in parallel, and the portion of the wall material laminate 28 where the partition walls are to be formed is covered with the resist pattern 30 to expose the other portions of the wall material laminate 28.

In this example, a rough surface is formed on the surface layer of the wall material laminate 28, and the resist pattern is formed on this rough surface. However, the invention is not limited to this and, for example, a wall material laminate. The resist pattern 30 may be formed without forming a rough surface on the surface layer of the body 28.

Next, the wall material laminate 28 on which the resist pattern 30 is formed is heated at a temperature lower than the firing temperature to decompose the resin contained in the wall material laminate 28 over substantially the entire wall material laminate 28.

In this embodiment, for example, the heating temperature is 150 ° C.
By heating (post-baking) the wall material laminate 28 for 30 minutes, the entire wall material laminate 28 is covered with the wall material laminate 2
8. Decompose the resin of 8. By appropriately and appropriately adjusting the heating temperature and / or the heating time of the wall material laminate 28, the resin of the entire wall material laminate 28 is decomposed while allowing the resin of the second layer 26b of the electrode pattern 26 to remain without being decomposed. You can As described above, the wall material laminate 2 is obtained by the decomposition of the resin.
8 becomes very brittle and the second layer 26 of the electrode pattern 26
It is considered that the hardness of the second layer 26b of the electrode pattern 26 can be made higher than the hardness of the entire wall material laminate 28 and the difference in hardness between them can be increased by leaving the resin of b left. Be done.

Next, as shown in FIG. 2 (A), the surface layer of the electrode pattern 26, in this example, has a hardness lower than that of the second layer 26b and a blast having a hardness higher than that of the wall material laminate 28 obtained by decomposing the resin throughout. The wall material laminated body 28 is patterned by the sandblast method using particles to form the partition walls 32.

In this embodiment, as the blast particles, A
Low hardness blast particles having a hardness lower than that of l ₂ O ₃ particles (Mohs hardness 12), for example, Fuji Random S-
2 (Mohs hardness 2) is used. Then, the low-hardness blast particles are subjected to sandblasting machine (manufactured by Fuji Manufacturing Co., Ltd.) to form a resist pattern 30 on the wall material laminate 28.
And the wall material laminated body 28 is patterned to obtain a plurality of partition walls 32 arranged in parallel in stripes. Partition wall 32
Comprises a patterned white layer 28a and a patterned black layer 28b.

FIG. 5 is a diagram showing the concept of selective sandblasting which is a key point in the present invention. The selective sandblasting property will be described below with reference to FIG. In this embodiment, the height of the partition wall (the thickness of the wall material laminate 28 including the white layer 28a and the black layer 28b) is set to 200 μm.
m, CaLaCrO ₃ thick film paste layer (electrode pattern 2
(Corresponding to the second layer 26b of 6) is 20 μm. As shown in FIG. 5, the wall material laminate 28 (white layer 28a
The layer thickness ratio of the CaLaCrO ₃ thick film paste layer 26b and the laminated body of the thick film paste layer A that constitutes the black layer 28b and the thick film paste layer B that constitutes the black layer 28b is 10 times,
In order to leave the CaLaCrO ₃ thick film paste layer 26b and completely remove the wall material laminate 28, a cutting speed ratio of 10 times or more is required. This is because the abrasive 36 discharged from the nozzle 34 of the sandblasting machine is sprayed over a wide range, so that the area to be blasted is CaLaCr.
This is because there is a possibility that a part where the O ₃ thick film paste layer 26b has already been exposed (cutting end part) and a part where the wall material laminate 28 is still completely left (uncut part) are mixed. .. In order to satisfy the above conditions, it is necessary to make the wall material laminate 28 easy to cut and make the CaLaCrO ₃ thick film paste layer 26b hard to cut. Therefore, the cutting speed is 1
The wall material laminate 28 and CaLaCrO ₃ that affect the cutting speed in order to achieve 0 times or more (selective sandblasting)
An experiment was conducted on the heat treatment temperature of the thick film paste layer 26b and the hardness of the abrasive. According to the experiments by the inventors of this application, 1
After drying at 35 ° C. for 30 minutes, the CaLaCrO ₃ thick film paste layer 26b and the wall material laminated body 28 are made of alumina powder for 1 k.
When cut with a blast pressure of g / cm ² , CaLaC
The cutting speed of the rO ₃ thick film paste 26b is the wall material laminate 28.
Was faster than. However, as a result of performing heat treatment at 150 ° C. for 30 minutes after drying at 135 ° C. and cutting under the same blast conditions, the cutting speeds of the CaLaCrO ₃ thick film paste layer 26b and the wall material laminated body 28 are reversed, and the wall material laminated body is laminated. The cutting speed of the body 28 is faster. However,
The cutting speed ratio could not be increased 10 times or more only by heat treatment.

Therefore, paying attention to the hardness of the abrasive, alumina (Al ₂ O ₃ ) particles or low hardness blast particles (Fujirandom S-2: manufactured by Fuji Seisakusho Co., Ltd.) are used as the blast particles, and the heating temperature is 150 ° C. And CaLaCrO ₃
The cutting speed and the ratio of the thick film paste layer 26b and the wall material laminate 28 were measured. The Mohs hardness is 12 for Al ₂ O _{3 and 2 for} Fujirandom S-2. Blast pressure is 1kg / c
m ² . The results are shown in Table 1.

[0038]

[Table 1]

As a result, when Al ₂ O ₃ is used, C
aLaCrO ₃ thick film paste layer 26b and wall material laminated body 28
Cutting speed of 7.8μm / sec and 41.5μ, respectively
The cutting speed ratio was 5.3 at m / sec. On the other hand, when Fujirandom S-2 was used, each was 0.5 μm / s.
ec, 16.2 μm / sec and the cutting speed ratio is 32.
It was possible to set to 4, and it was possible to realize selective sandblasting.

Therefore, when the wall material laminate 28 is subjected to heat treatment such as pre-baking and post-baking under the conditions of this embodiment as described above, by using low hardness blast particles having a Mohs hardness of 2, for example, wall material lamination is performed. The cutting rate of the body 28 can be 30 times or more that of the second layer 26b of the electrode pattern 26, and as a result, the wall material laminate 28 can be patterned with almost no damage to the second layer 26b.

Next, as shown in FIG. 2B, the resist pattern 30 is removed from the partition wall 32. In this embodiment, the resist pattern 30 is removed using an organic alkaline resist remover. The resist pattern 30 is usually made of an organic material, and by using an organic alkaline resist stripping agent, the resist pattern 30 can be sufficiently removed so as not to deteriorate the display characteristics of the gas discharge display panel. Moreover, the organic alkaline resist remover hardly damages the electrode pattern 26 and the partition 28.

Next, at least the surface layer of the electrode pattern 26 and the partition wall 32 are fired. In this embodiment, the portion of the electrode pattern 26 that has not been fired (in this example, the second layer 26
b) and the partition wall 32 are fired at a firing temperature of 530 ° C. for 10 minutes. Since the firing is performed in a state where the electrode pattern 26 and the partition wall 32 are in contact with each other, a strong adhesion force between the electrode pattern 26 and the partition wall 32 that prevents the partition wall 32 from peeling off from the electrode pattern 26 is obtained. The component of the fired partition wall 32 is mainly lead glass.

In this example, the resist pattern 30 is removed by using an organic alkaline resist remover, and then the electrode pattern 26 and the partition wall 32 are fired. However, the present invention is not limited to this. The electrode pattern 26 and the partition wall 32 may be baked without removing the resist pattern 30, and the resist pattern 30 may be burned and removed by this baking.

The present invention is not limited to the above-mentioned embodiments, and therefore, the forming materials, shapes, and
Arrangement position, numerical conditions (for example, size, temperature, time) and others can be arbitrarily changed.

[0045]

As is clear from the above description, according to the barrier rib forming method of the gas discharge display panel of the present invention,
At least on the electrode pattern with the surface layer dried,
The wall material laminated body is formed in contact with the electrode pattern.
Next, the resin contained in the wall material laminate is decomposed over the entire wall material laminate. In this way, by forming the wall material laminate on the electrode pattern with the surface layer being dried and then decomposing the resin contained in the wall material laminate, the hardness of the electrode pattern surface layer is made higher than the hardness of the wall material laminate. The hardness can be increased and the difference between these hardnesses can be increased. Therefore, by making the hardness of the blast particles used for patterning the wall material laminate by the sand blast method lower than the hardness of the electrode pattern surface layer and higher than the hardness of the wall material laminate, the electrode pattern is prevented from being damaged by the blast particles. The wall material can be patterned while suppressing.

Further, the wall material laminate is formed in contact with the electrode pattern, and then the wall material laminate is patterned to form partition walls. Therefore, since these can be fired while the partition wall and the surface layer of the electrode pattern are in contact with each other, a sufficient adhesive force sufficient to prevent the partition wall from peeling off from the electrode pattern,
Obtained between the partition and the electrode pattern.

[Brief description of drawings]

1 (A) to 1 (C) are sectional views for explaining an embodiment of the present invention.

2 (A) and 2 (B) are cross-sectional views for explaining an embodiment of the present invention.

3A to 3D are cross-sectional views for explaining a method of forming barrier ribs of a gas discharge display panel according to the applicant.

4A to 4C are cross-sectional views provided for explaining a method of forming barrier ribs of a gas discharge display panel according to the applicant.

FIG. 5 is a conceptual diagram for explaining the selective sandblasting property of the embodiment of the present invention.

[Explanation of symbols]

 24 substrate 26 electrode pattern 28 wall material laminate 30 resist pattern 32 partition wall

Claims (5)

[Claims] 1. A method for forming barrier ribs of a gas discharge display panel, in which a thick film paste for forming an electrode pattern is printed on a substrate,
At least a step of forming an electrode pattern in which the surface layer is left dry, and a partition wall forming thick film paste is printed on the electrode pattern in which the surface layer is left dry to be in contact with the electrode pattern to laminate the wall material. A step of forming a body, a step of forming a resist pattern having a sandblast resistance on the wall material laminate, and a step of heating the wall material laminate having the resist pattern at a temperature lower than the firing temperature. The process of decomposing the resin contained in the wall material laminate almost all over, and the sand blasting method using blast particles, which has a hardness lower than the surface layer of the electrode pattern and a hardness higher than the wall material laminate in which the resin is decomposed entirely Patterning the laminate to form partition walls; removing the resist pattern from the partition walls; and at least the surface layer of the electrode pattern and Partition walls forming method for a gas discharge display panel, which comprises a step of firing the wall. 2. The resin of the surface layer of the wall material laminate is decomposed by heating the wall material laminate at a temperature lower than the firing temperature so as not to decompose the resin of the portion other than the surface layer of the wall material laminate, and the surface layer. The resist pattern is formed on the upper surface of the substrate.
A method for forming barrier ribs of the gas discharge display panel according to [4]. 3. The method of manufacturing a gas discharge display panel according to claim 2, wherein the partition wall and the electrode pattern are baked after the resist pattern is removed by using an organic alkaline resist stripping agent. 4. The gas discharge display panel according to claim 1, wherein the uppermost layer of the laminated wall material laminate is a black layer and the remaining layers of the wall material laminate are white layers. Manufacturing method. 5. The method according to claim 1, wherein both the uppermost layer and the lowermost layer of the laminated wall material laminate are black layers, and the remaining layers of the wall material laminate are white layers. Of manufacturing gas discharge display panel of.