JP3025317B2 - Method of manufacturing gas discharge type display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge type display panel (hereinafter, referred to as a display panel) which is used for a display section of a terminal device of a computer and displays information to the outside by selective light emission of discharge cells arranged in a matrix. PDP) manufacturing method,
In particular, the present invention relates to formation of barrier ribs (partitions) for forming a discharge space.

[0002]

2. Description of the Related Art Conventionally, as a technique in this kind of field, for example, there is one shown in FIG. Hereinafter, the configuration will be described. FIG. 2 is a partially cutaway view showing a configuration example of a conventional PDP.
It is a perspective view can. This PDP constitutes an information display section of the plasma display device, and has a base 10 and
And a front surface portion 20 on the display surface side . A plurality of cathodes 12 are arranged in a stripe shape on the upper surface of a glass-like rear substrate 11 on the base portion 10. Further, in order to separate the cathodes 12 into a plurality of discharge cells, barrier ribs are perpendicular to the cathodes 12. 13 are arranged. On the other hand, the front part 20
Has a glass-like front substrate 21 and the front substrate 21
On the lower surface of a plurality of anodes 22 are formed. Such a base portion 10 and a front portion 20 are formed by a cathode 12 and an anode 22.
Are combined so as to be orthogonal to each other, and a PDP is formed by replacing the inside with a gas such as Ne (neon).

Here, in order to obtain a discharge space between the cathode 12 and the anode 22, a barrier rib 1 is formed on the back substrate 11 on which the cathode 12 is formed so as to be orthogonal to the cathode 12.
3 is formed by the following glass thick film printing method.
First, after the printing plate and the barrier ribs 13 are aligned, the first printing is performed using a glass paste. After that, drying is performed (150 ° C., 10 minutes), the second printing is performed, and further drying is performed for 10 minutes. In this way, the printing and drying steps are repeated many times,
Laminate to about 200 μm. Then, firing (58
(0 ° C. , peak holding time: 10 minutes), the barrier ribs 13 are formed.

[0004]

However, in the method of manufacturing a PDP having the above-described structure, the barrier ribs 13 are formed by a glass thick film printing method, and thus have the following problems. (1) The lamination thickness by the first printing is 20 to 25 μm, and in order to obtain the barrier rib 13 having a predetermined height, 8 to
It is necessary to repeat printing ten times. Therefore, cause Re not a position in each iteration the printing can not be performed precisely pattern over two ring. Furthermore, pattern over inline or path <br/> high definition patterning Turn-down space below 100μm is difficult.

(2) The barrier ribs 13 made of a glass paste having excellent lamination properties are weak in strength.

(3) At the time of printing or firing, the glass paste adheres to the surface of the cathode 12 or the molten vitreous flows out to contaminate the cathode 12. An object of the present invention is to provide a method of manufacturing a PDP that solves the problems of the prior art that it is difficult to manufacture a precise, high-definition, and strong barrier rib and that the surface of the discharge electrode is contaminated. It is.

[0007]

To solve the previous SL problems SUMMARY OF THE INVENTION In the present invention, in the manufacturing method of the PDP, discharge to surface
A blast-resistant buffer is placed on the substrate on which the electrodes are formed.
Forming a layer, and the blast-resistant buffer
On the substrate on which the layer is formed, a plate-like plate having a predetermined thickness
Forming a barrier rib material of the barrier rib material
A part is removed by a sandblast method, and the buffer is removed.
Forming a barrier rib exposing a part of the layer;
Burn out the buffer layer exposed from the barrier ribs
Exposing the discharge electrode.
ing.

[0008]

According to the present invention, the method for manufacturing a PDP is constituted as described above.
Barrier ribs are formed by the last method as follows.
You. That is, a buffer is placed on the substrate on which the discharge electrodes are formed.
After the layer is formed, a barrier rib material is formed on the substrate.
It is. Next, a part of the barrier rib material is sandblasted
Therefore, the barrier is removed and a part of the buffer layer is exposed.
A rib is formed. After that, it is exposed from the barrier rib
Buffer layer is burned out, exposing the discharge electrode and
finish.

[0009]

FIG. 1 is a manufacturing process diagram showing a method of manufacturing a PDP according to a first embodiment of the present invention. Elements common to FIG. 2 are denoted by the same reference numerals. This PDP forms an information display section of the plasma display device and has the same structure as the conventional PDP shown in FIG. Hereinafter will be described the procedure of forming the PDP manufacturing process (A) the base portion 10, and (B) while revealing the procedure of forming the front portion 20. (A) formation procedure of the base portion 10 first, on the rear substrate 11, the cathode 12 by using a thick film printing method
(First discharge electrode) is formed. The material of the cathode 12 is , for example, a Ni thick film material (manufactured by Dupont, # 9535), dried at a temperature of 150 ° C. for 1 hour, and then fired at 580 ° C. for a peak holding time of 10 minutes. As a result, a striped cathode 12 having a predetermined pitch is formed on the rear substrate 11. Next, a barrier rib 13 is formed on the surface of the cathode 12 thus formed.
The procedure for forming the barrier ribs 13 will be described in the order of the first to third steps with reference to FIG.

The first step (step (1) of FIG. 1)
(3)) In the step (1), a buffer layer 12a is formed on the surface of the cathode 12 using a blast-resistant organic resin in order to protect the cathode 12 and the like formed on the back substrate 11 from sandblasting. I do. At that time, apply the resin with a spinner,
Spinner condition: 500 rpm for 5 seconds
And hold for 15 seconds, and further increase the number of revolutions to 1500 rpm
And hold for 1 second, then bring to 0 rpm in 5 seconds.
As a result, a resin layer having a thickness of 15 to 20 μm is obtained. After drying (70 ° C. , 15 minutes) and exposure (15 to 20 mJ), a low-hardness blast-resistant buffer layer 12 a is completed.

Next, in step (2), a solvent resistant film 12b is formed on the surface of the buffer layer 12a. The solvent-resistant film 12b functions to protect the buffer layer 12a from the organic solvent contained in the low-melting glass 12c formed in the next step (3) and to prevent the buffer layer 12a from being dissolved in the organic solvent. Therefore, it is not always necessary to have sandblast resistance. The solvent-resistant film 12b is formed by using a spinner to a thickness of 1 to 3 μm and drying (40 ° C., 10 minutes) as in the step (1). In step (3), a low-melting glass 12c is applied on the surface of the solvent-resistant film 12b formed in step (2), and a barrier rib material 13a is further fixed thereon . Low melting glass 12c
Is to act as an adhesive to the barrier rib member 13a and the rear substrate 11 formed by sandblasting in the following step, fixing by firing. The low-melting glass 12c is applied to the low-melting glass paste by printing or the like until the low-melting glass paste has a thickness of about 5 to 20 μm, and immediately before the paste is dried, has a predetermined thickness (160 to 200 μm).
The barrier rib material 13a made of a sheet glass of m) is placed thereon, and further dried (80 ° C. , 30 minutes) to form. In addition,
The glass sheet has an expansion coefficient equivalent to that of the rear substrate 11, and strict alignment is not required when the glass sheet is placed on the low-melting glass paste.

Second step (step (4) of FIG. 1)
(6)) In the step (4), on the low-melting glass 12c formed in the first step, sandblast resistance high photoresist film (anti-sandblasting film) 13b and spin coating.
That is, a resist is applied by a spinner, and the spinner is rotated at 500 rpm for 5 seconds, held for 60 seconds, further increased to 1500 rpm, held for 1 second, and then reduced to 0 rpm for 5 seconds. As a result, the thickness becomes 15 to 20 μm, and when it is dried (70 ° C. , 10 minutes), a photoresist film 13b is formed.

In the subsequent step (5) before the exposure, a tack prevention film 13c is formed to prevent a negative film for a mask from adhering to the surface of the photoresist film 13b. This is done by using a spinner to increase the rotation speed to 1000 rpm in 5 seconds, hold for 15 seconds, and further increase the rotation speed to 1500 rpm in the same manner as the above process.
After holding for 1 second, the speed is reduced to 0 rpm in 5 seconds. As a result, the thickness becomes 1 to 3 μm, and it is kept at room temperature for 2 to 3 minutes.
dry.

The photoresist film 13b is a negative type resist film, and an exposed portion remains. Therefore, step (6)
In this example, a 1: 1 film negative for exposing a portion where the barrier rib 13 is to be formed is placed on the surface of the tack prevention film 13c, and the alignment mark provided on the back substrate 11 and the mark of the mask are aligned in advance to obtain a predetermined value. Exposure (film thickness x
Exposure at 0.7 mJ) and development. Development is 0.2wt
Performing% of sodium carbonate was injected at low pressure spray. Thereafter, when a fixing process is performed by spraying dilute hydrochloric acid (hydrochloric acid / water = 1 cc / 5000 cc), a sandblast resistant film patterned into a predetermined shape is obtained.

The third step (step (7) in FIG. 1),
(8)) Burrs in the sandblast resistant film obtained in the above steps
Alib 13ofIn the step (7), the
Blast machine (for example, fine powder type SC-3),
Alumina powder (No. 400 or
Blast (No. 600)
Ex). At this time, the injection conditions include, for example, air
Injection pressure 5kg / cm^Two, Injection distance 20cm, injection nose
7mmφ, 90 ° injection angle (perpendicular to rear substrate 11)
And Then, the remaining surface adhering to the surface of the back substrate 11
After washing the abrasive with an air gun, in step (8)
The surface substrate 11 is baked at 530 ° C. in the air to form a photoresist film 1
3b, the buffer layer 12a, the solvent resistant film 12b, etc.
And melt the low melting point glass 12c,
A burr 11 is formed as a barrier rib 13 into a predetermined shape.
The rib material 13a is fixed. Thus, the width 50
Barrier rib 13 having a height of 80 to 80 μm and a height of 160 to 200 μm
Is formed.

(B) Procedure for Forming Front Part 20 An anode 22 (second discharge electrode) is formed on the surface of the front substrate 21.
As a transparent conductive film (hereinafter referred to as ITO; ITO; In)
After depositing (Din Tin Oxide) by vapor deposition or sputtering, patterning into an arbitrary shape is performed by photolithography.

[0017] These cathodes 12 a front substrate 21 and rear substrate 11 and the anode 22 are pairs towards and combined so as to be perpendicular to each other, followed by drying by applying a lead glass paste PDP outer peripheral portion, a peak of about 460 ° C. The sealing is performed by firing for 20 minutes. After that, exhaust air from an exhaust pipe not shown
After the degree of vacuum reaches 10 ^-5 to 10 ^-7 torr, the PDP is filled with a Penning mixed gas of Ne and a small amount of Ar (argon), and after reaching a predetermined discharge gas pressure, the exhaust port is sealed. Stop and the PDP is completed. PDP thus completed, the predetermined anode 2 2 and the cathode 12 by a driving circuit (not shown) or the like
Is selected, and the discharge in the gas space at the intersection creates a plasma state, which becomes a bright point and dot display is performed.

[0018] In this embodiment, plate-shaped barrier rib member 13a
Is patterned into a predetermined shape, and by sandblasting ,
Unnecessary portions such as the buffer layer 12a are removed by burning to form the barrier ribs 13. Therefore, it is not necessary to print and laminate the barrier rib material 13a or to sinter and solidify the barrier ribs 13 as in the related art . Thereby, a precise, high-definition and strong barrier rib 13 can be formed.
Note that the present invention is not limited to the illustrated embodiment, and various modifications are possible . As a variation of that, for example, in the above embodiment, the first discharge electrode and a cathode 12, a second discharge electrode was the anode 22, a first discharge electrode of the opposite anode 22, the The second discharge electrode may be the cathode 12.
In addition, any conditions such as spinner conditions can be modified as long as they are in line with the gist of the present invention.

[0019]

As described above in detail, according to the present invention , sandblasting is performed on a substrate on which discharge electrodes are formed.
The barrier ribs are formed by the method. That is,
When blasting, the substrate and discharge electrode are not blasted
In order for the material to be sandblasted with the substrate,
A buffer layer is formed between the barrier rib material
You. However, simply forming a buffer layer does not
The electrode cannot be exposed to the discharge space.
In the invention, after blasting the barrier rib material, the buffer
The buffer layer is easily burned out,
And it can be removed reliably. This eliminates the necessity of printing and laminating barrier rib materials as in the past, or firing and solidifying the entire barrier ribs.This makes it possible to manufacture precise, high-definition, and strong barrier ribs. No contamination of the surface. Follow
Te, can be expected to improve the display quality of the PDP.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram showing a PDP manufacturing method according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view showing one configuration example of a conventional PDP.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Base part 11 Back substrate 12 Cathode 13 Barrier rib 12a Buffer layer 12b Solvent-resistant film 12c Low-melting glass 13a Barrier rib material 13b Photoresist film 13c Tack prevention film 20 Front part 21 Front substrate 22 Anode

Continuation of the front page (72) Inventor Kensuke Sasaki 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (56) References JP-A-2-2977837 (JP, A) JP-A-2-2 301934 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01J 9/02 H01J 9/24 H01J 11/02 H01J 17/49

Claims (1)

(57) [Claims] 1. A substrate having a discharge electrode formed on a surface thereof,
Forming a blast-resistant buffer layer; and the substrate having the blast-resistant buffer layer formed thereon.
On the top, a plate-shaped barrier rib material having a predetermined thickness is formed.
And that step, is removed by sandblasting a portion of the barrier rib material
Forming a barrier rib that exposes a part of the buffer layer.
And baking the buffer layer exposed from the barrier ribs.
And exposing the discharge electrodes to the gas discharge display panel.
Law.