JPH0526332B2 - - Google Patents

Info

Publication number
JPH0526332B2
JPH0526332B2 JP5144683A JP5144683A JPH0526332B2 JP H0526332 B2 JPH0526332 B2 JP H0526332B2 JP 5144683 A JP5144683 A JP 5144683A JP 5144683 A JP5144683 A JP 5144683A JP H0526332 B2 JPH0526332 B2 JP H0526332B2
Authority
JP
Japan
Prior art keywords
single crystal
resist
forming
electronic device
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5144683A
Other languages
Japanese (ja)
Other versions
JPS59177932A (en
Inventor
Katsuyoshi Fukuda
Sadao Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5144683A priority Critical patent/JPS59177932A/en
Publication of JPS59177932A publication Critical patent/JPS59177932A/en
Publication of JPH0526332B2 publication Critical patent/JPH0526332B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Waveguides (AREA)

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明はLi2B4O7単結晶を用いた電子デバイス
の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a method for manufacturing an electronic device using a Li 2 B 4 O 7 single crystal.

〔従来技術とその問題点〕[Prior art and its problems]

水晶やLiTaO7単結晶等の圧電体は表面波装置
バルク波装置等の電子デバイスにすでに応用され
ている。しかし、従来の圧電材料は電子デバイス
の要求を必ずしも満たしてはいない。例えば水晶
では電気機械結合係数K2が0.01%と低く、用途が
限られる。これに対しLi2B4O7単結晶は
Electronics Lettevs Vol.17No.1(1980)P11にさ
らに特性が良いと報告され、電子デバイスの高性
能化に注目される。
Piezoelectric materials such as quartz and LiTaO 7 single crystals have already been applied to electronic devices such as surface wave devices and bulk wave devices. However, conventional piezoelectric materials do not always meet the requirements of electronic devices. For example, quartz has a low electromechanical coupling coefficient K 2 of 0.01%, which limits its uses. On the other hand, Li 2 B 4 O 7 single crystal
It was reported in Electronics Lettevs Vol. 17 No. 1 (1980) P11 that its properties were even better, and it attracted attention for improving the performance of electronic devices.

しかし、Li2B4O7単結晶は酸に侵されるため、
電子デバイス応用に不可欠な電極形成工程で、リ
ン酸系の従来のAlエツチング液を用いる方法で
は微細加工はできなかつた。このため電子デバイ
スへの応用は難しいという欠点があつた。
However, since Li 2 B 4 O 7 single crystal is attacked by acid,
In the electrode formation process, which is essential for electronic device applications, microfabrication could not be achieved using the conventional method using a phosphoric acid-based Al etching solution. Therefore, it has the disadvantage that it is difficult to apply it to electronic devices.

〔発明の目的〕[Purpose of the invention]

本発明はLi2B4O7単結晶を用いた高性能な電子
デバイスを製造する方法を提供するにある。
The present invention provides a method for manufacturing high performance electronic devices using Li 2 B 4 O 7 single crystal.

〔発明の概要〕[Summary of the invention]

本発明はLi2B4O7単結晶を用いた電子デバイス
を製造する際に該結晶と電極の密着性を向上させ
る特長を有するリフトオフを用いた電子デバイス
の製造方法である。すなわちリフトオフは塗布し
たレジストに反転像を形成し、その上から金属膜
を形成する方法として知られている。
The present invention is a method for manufacturing an electronic device using lift-off, which has the feature of improving the adhesion between the crystal and an electrode when manufacturing an electronic device using a Li 2 B 4 O 7 single crystal. That is, lift-off is known as a method of forming an inverted image on a coated resist and forming a metal film thereon.

その際Li2B4O7単結晶表面には、Li2B4O7がわ
ずかに加水分解を起し、LiOHとB2O3が形成さ
れ、親水性となつている。これらは有機溶剤等の
前処理洗浄によつては除去できず、特にLiOHは
Al等の金属膜と反応し、密着力を弱めてしまう。
そこで本発明の特徴は前処理の後に表面安定化雰
囲気中に侵すことである。例えば0.1%のフツ化
水素を溶かしたエチルアルコールの表面安定化液
中に浸すことで、 LiOH+HF→LiF+H2Oの反応によりLiOHは
フツ化リチウムに変化し、又発生した水(H2O)
はエチルアルコール中に吸収されるため表面は安
定化する。このため金属膜との密着力は増大す
る。
At this time, Li 2 B 4 O 7 undergoes slight hydrolysis on the surface of the Li 2 B 4 O 7 single crystal, forming LiOH and B 2 O 3 , making it hydrophilic. These cannot be removed by pre-cleaning with organic solvents, etc., especially LiOH.
Reacts with metal films such as Al and weakens adhesion.
Therefore, a feature of the present invention is that the surface is immersed in a surface stabilizing atmosphere after the pretreatment. For example, by immersing it in a surface stabilizing solution of ethyl alcohol containing 0.1% hydrogen fluoride, LiOH changes to lithium fluoride through the reaction of LiOH + HF → LiF + H 2 O, and the generated water (H 2 O)
is absorbed into ethyl alcohol, which stabilizes the surface. Therefore, the adhesive force with the metal film increases.

〔発明の実施例〕[Embodiments of the invention]

本発明の実施例を図面を参照しながら説明す
る。第1図〜第7図は本発明のLi2B4O7単結晶を
用いた電子デバイスの一つである。例えば弾性表
面波装置の製造方法を示すものである。
Embodiments of the present invention will be described with reference to the drawings. 1 to 7 show one of the electronic devices using the Li 2 B 4 O 7 single crystal of the present invention. For example, it shows a method of manufacturing a surface acoustic wave device.

先ず作成結晶から切出した約0.5mmの薄い板1
の片面を鏡面に研磨する。次に前処理として表面
の汚れ、油脂等を取るため、加熱トリクレン中に
浸し、アルコールに置換し、回転乾燥を行なう
(第1図)。
First, create a thin plate 1 of about 0.5 mm cut from the crystal.
Polish one side to a mirror surface. Next, as a pretreatment to remove dirt, oil, etc. from the surface, it is immersed in heated trichloromethane, replaced with alcohol, and then rotary dried (Figure 1).

次に0.1重量%のフツ化水素を混入したエチル
アルコール中に1分間浸し、純エチルアルコール
に置換し、回転乾燥を行ない表面安定化(その表
面状態を2として表わす)を行なう(第2図)。
Next, it is immersed in ethyl alcohol mixed with 0.1% by weight of hydrogen fluoride for 1 minute, replaced with pure ethyl alcohol, and then dried by rotation to stabilize the surface (the surface condition is expressed as 2) (Figure 2). .

この後、レジスト3例えばAZ1350Jを回転数
5000rpm30秒の条件で塗布し、85℃で30分間乾燥
する(第3図)。
After this, rotate resist 3 for example AZ1350J
Apply at 5000 rpm for 30 seconds and dry at 85°C for 30 minutes (Figure 3).

次に表面硬化剤モノクロロベンゼン中に10分間
浸し、回転乾燥を行ない表面だけ硬化4する(第
4図)。
Next, it is immersed in the surface hardening agent monochlorobenzene for 10 minutes and then rotary dried to harden only the surface (Fig. 4).

そして反転マスクを用いて、露光を行ない、現
像液で現像する(第5図)。
Then, exposure is performed using a reversal mask, and development is performed with a developer (FIG. 5).

この後結晶温度が85℃より大にならないように
真空蒸着装置中でAl層5を例えば5000A形成する
(第6図)。
Thereafter, an Al layer 5 of, for example, 5000 A is formed in a vacuum evaporation apparatus so that the crystal temperature does not exceed 85° C. (FIG. 6).

次いで得られたウエハを取出して、アセトン又
はエチルアルコール中に浸してリフトオフを行な
い、回転乾燥を行なう(第7図)。
The obtained wafer is then taken out, immersed in acetone or ethyl alcohol for lift-off, and then rotary dried (FIG. 7).

最後に第8図に示す如くチツプ化にする。 Finally, it is made into chips as shown in FIG.

〔発明の他の実施例〕[Other embodiments of the invention]

なお上記実施例において、Li2B4O7単結晶の圧
電体についての電子デバイスの製造方法における
表面安定化雰囲気は、上記の0.1重量%フツ化水
素を含むエチルアルコールとしたが1重量%濃度
までは表面粗れがなくて充分であつた。またエチ
ルアルコールでなくても、メチルアルコールでも
充分効果があつた。さらに表面安定化雰囲気は上
記以外でLi2B4O7単結晶の表面を安定化させるも
のは何でも良い。なお、上述の実施例において
は、表面安定化雰囲気の作用により金属膜の密着
力が大幅に向上したため、2μm以下までの微細
加工ができるという副次的効果も得られた。ま
た、第7図に示す工程時には、Al形成温度が85
℃より大きい場合には、レジストがはがれず、リ
フトオフができない場合もあつた。
In the above example, the surface stabilizing atmosphere in the method for manufacturing an electronic device for a Li 2 B 4 O 7 single crystal piezoelectric material was ethyl alcohol containing 0.1% by weight of hydrogen fluoride, but the concentration was 1% by weight. The results were satisfactory with no surface roughness. In addition, methyl alcohol was also sufficiently effective in place of ethyl alcohol. Further, the surface stabilizing atmosphere may be any atmosphere other than those mentioned above that stabilizes the surface of the Li 2 B 4 O 7 single crystal. In the above-mentioned example, the adhesion of the metal film was greatly improved due to the effect of the surface stabilizing atmosphere, so a secondary effect was obtained in that microfabrication of down to 2 μm or less was possible. Also, during the process shown in Figure 7, the Al formation temperature was 85
When the temperature was higher than ℃, the resist could not be peeled off and lift-off could not be performed in some cases.

〔発明の効果〕〔Effect of the invention〕

本発明のLi2B4O7単結晶を用いたリフトオフ法
による電子デバイスの製造方法によれば、従来リ
フトオフ法では例えばAl等の金属膜の密着力が
低かつた(25μmφのAl線のボンデング強度は0
〜3g)のが大巾に向上(同強度は10g以上)し
た。これは表面安定化雰囲気の作用により金属膜
の密着力が大巾に向上したためである。このこと
により、該結晶の電子デバイス化が加速され、電
気、通信等工業上大きな寄与となる。
According to the method of manufacturing an electronic device by the lift-off method using a Li 2 B 4 O 7 single crystal of the present invention, the adhesion of metal films such as Al was low in the conventional lift-off method (bonding of Al wire with a diameter of 25 μm). Strength is 0
~3g) has been greatly improved (the same strength is over 10g). This is because the adhesion of the metal film was greatly improved by the effect of the surface stabilizing atmosphere. This accelerates the use of the crystal as an electronic device, making a major contribution to industries such as electricity and communications.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第8図は本発明によるLi2B4O7単結晶
を用いた電子デバイスの製造方法を示す工程断面
図である。 1……Li2B4O7単結晶の薄い板、2……表面安
定化層、3……レジスト、4……レジストの表面
硬化層、5……Al等の金属膜。
1 to 8 are process cross-sectional views showing a method of manufacturing an electronic device using Li 2 B 4 O 7 single crystal according to the present invention. 1... Thin plate of Li 2 B 4 O 7 single crystal, 2... Surface stabilizing layer, 3... Resist, 4... Surface hardening layer of resist, 5... Metal film such as Al.

Claims (1)

【特許請求の範囲】 1 Li2B4O7単結晶からなる圧電体表面を洗浄す
る第1の工程と、 この圧電体を表面安定化雰囲気中に浸す第2の
工程と、 前記圧電体表面にレジストを塗布し、このレジ
ストに電極の反転像を形成した上から金属層を形
成する第3の工程と、 リフトオフを行なうことにより前記金属層より
電極を形成する第4の工程とを備えたことを特徴
とするLi2B4O7単結晶を用いた電子デバイスの製
造方法。 2 前記第2の工程は、前記圧電体を1重量%以
下のフツ化水素を含むエチルアルコール又はメチ
ルアルコールである前記表面安定化雰囲気中に浸
す工程であることを特徴とする特許請求の範囲第
1項記載のLi2B4O7単結晶を用いた電子デバイス
の製造方法。 3 前記第3の工程は、前記圧電体表面にレジス
トを塗布し、このレジストに電極の反転像を形成
した上から85℃以下の温度で金属層を形成する工
程であることを特徴とする特許請求の範囲第1項
記載のLi2B4O7単結晶を用いた電子デバイスの製
造方法。
[Claims] 1. A first step of cleaning the surface of a piezoelectric body made of Li 2 B 4 O 7 single crystal, a second step of immersing the piezoelectric body in a surface stabilizing atmosphere, and a surface of the piezoelectric body. a third step of applying a resist to the resist, forming an inverted image of the electrode on the resist, and forming a metal layer thereon; and a fourth step of forming an electrode from the metal layer by performing lift-off. A method for manufacturing an electronic device using a Li 2 B 4 O 7 single crystal, characterized in that: 2. The second step is a step of immersing the piezoelectric body in the surface stabilizing atmosphere which is ethyl alcohol or methyl alcohol containing 1% by weight or less of hydrogen fluoride. A method for manufacturing an electronic device using the Li 2 B 4 O 7 single crystal according to item 1. 3. A patent characterized in that the third step is a step of applying a resist to the surface of the piezoelectric body, forming an inverted image of the electrode on the resist, and then forming a metal layer at a temperature of 85° C. or lower. A method for manufacturing an electronic device using the Li 2 B 4 O 7 single crystal according to claim 1.
JP5144683A 1983-03-29 1983-03-29 Manufacture of electronic device using li2b4o7 single crystal Granted JPS59177932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5144683A JPS59177932A (en) 1983-03-29 1983-03-29 Manufacture of electronic device using li2b4o7 single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5144683A JPS59177932A (en) 1983-03-29 1983-03-29 Manufacture of electronic device using li2b4o7 single crystal

Publications (2)

Publication Number Publication Date
JPS59177932A JPS59177932A (en) 1984-10-08
JPH0526332B2 true JPH0526332B2 (en) 1993-04-15

Family

ID=12887154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5144683A Granted JPS59177932A (en) 1983-03-29 1983-03-29 Manufacture of electronic device using li2b4o7 single crystal

Country Status (1)

Country Link
JP (1) JPS59177932A (en)

Also Published As

Publication number Publication date
JPS59177932A (en) 1984-10-08

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