JPH05263049A - Tape for tab and its production - Google Patents

Abstract

PURPOSE:To provide a tape for TAB which is free from warpage or curling and undergoes little dimensional change during processing or mounting by forming an adhesive layer and a protective layer on a film of a polyimide obtd. by the cyclodehydration of a specific polyamic acid copolymer. CONSTITUTION:A-equivalent of a linear diamine (e.g. p-phenylenediamine), b-equivalent of at least one tetracarboxylic acid dianhydride compd. selected from the group consisting of pyromellitic dianhydride and its derivs. (e.g. pyromellitic dianhydride), c-equivalent of at least one tetracarboxylic acid dianhydride selected from compds. of formulas I, II, and III, and d-equivalent of at least one flexible diamine (e.g. 4,4'-diaminodiphenyl ether) are made to react in such an equivalent ratio as to satisfy the relations: a>b, a-b<c<=2(a-b), and a+d=b+c, giving a polyamic acid copolymer. The copolymer is cyclodehydrated to give a polyimide, which is formed into a film. An adhesive layer and a protective layer are formed on the film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention is a TAB (Tape Automated Bondi) which has attracted attention in the process of assembling semiconductor devices, in order to increase the number of pins of the device, reduce the size of the device, and mount the device at high density.
ng) method, a tape having a three-layer structure of a protective layer, an adhesive layer, and an organic insulating film (hereinafter, referred to as a TAB tape), and a manufacturing method thereof.

[0002]

2. Description of the Related Art An example of a process for mounting an LSI on a TAB tape is as follows. Punching of slits and holes and removal of a protective layer are followed by copper foil laminating and adhesive. Curing, wiring pattern formation (resist coating, copper foil etching, resist peeling), plating, LSI inner lead bonding, resin encapsulation, punching, outer lead bonding. The LSI is then mounted. Therefore, TAB
In order to mount the LSI on the tape for use, the base film needs to be a strain that supports the LSI, that is, a film having a high elastic modulus.

Further, among these steps, heat is applied in each of the steps of laminating the copper foil, curing the adhesive, inner lead bonding, resin sealing, and outer lead bonding, so that the base of the TAB tape is used. If the coefficient of thermal expansion of the film is large, inconvenience occurs. That is, if the thermal expansion coefficient of the base film is large, for example, in the processing step of inner lead bonding, the thermal expansion of the base film causes a shift in the bonding position with the LSI. Similarly, in the outer lead bonding processing step, a displacement occurs in the bonding position between the outer lead and the substrate.

Further, in the laminating process of the copper foil, the base film is heated together with the copper foil, so that if the base film shows different thermal behavior from the copper foil,
That is, having a coefficient of thermal expansion different from that of the copper foil causes warping or curling of the film obtained by laminating the base film and the copper foil.

Therefore, in the process of inner lead bonding, LSI (silicon wafer) is used.
And the thermal expansion coefficient of the base film are close to each other (the thermal expansion coefficient of the LSI is 0.4 × 10 ^-5 ° C ^-1 ). Must be close,
In the process of laminating the copper foil, the coefficient of thermal expansion of the copper foil and the base film (the coefficient of thermal expansion of the copper foil 1.6 × 1
It should be close to 0 ^-5 ° C ^-1 ).

Therefore, it is preferable that the base film used for the TAB tape has a high elastic modulus and a coefficient of thermal expansion of about 0.4 to 1.6 × 10 ^-5 ° C ^-1 . Therefore, the advent of TAB tapes using a base film having these properties has been long awaited.

[0007]

SUMMARY OF THE INVENTION The present inventors have proposed a conventional TA
TA that does not cause the above problems in B tapes
As a result of earnest studies for the purpose of providing a tape for B, the inventors have come to the idea of providing an adhesive layer and a protective layer on a predetermined polyimide film, and have reached the present invention.

The gist of the TAB tape according to the present invention is that it is selected from a equivalent of at least one linear diamine and b equivalent of pyromellitic dianhydride or pyromellitic dianhydride derivative. Or two or more tetracarboxylic dianhydrides and c equivalent of

[Chemical 4] Of at least one tetracarboxylic dianhydride and d equivalent of one or more flexible diamines, the corresponding amounts of formula a> b, ab <c ≦ 2 (ab ), A
That is, an adhesive layer and a protective layer are provided on a polyimide film obtained by dehydrating and ring-closing a polyamic acid copolymer obtained by satisfying + d = b + c.

Next, the gist of the method for producing a TAB tape according to the present invention is to select from at least one linear diamine a equivalent and pyromellitic dianhydride or pyromellitic dianhydride derivative. After reacting one or more tetracarboxylic acid dianhydride b equivalents, the reaction solution is converted to

[Chemical 5] The polyamic acid copolymer obtained by adding c equivalent of at least one tetracarboxylic acid dianhydride represented by and further adding one equivalent of two or more kinds of flexible diamine d is dehydrated and ring-closed. To provide an adhesive layer and a protective layer on the polyimide film.

Another aspect of the method for producing a TAB tape according to the present invention is that one or more kinds of flexible diamines d equivalent and

[Chemical 6] After reacting at least one tetracarboxylic acid dianhydride c equivalent, at least one linear diamine a equivalent is added, and then pyromellitic dianhydride or pyromellitic dianhydride is added. Providing an adhesive layer and a protective layer on a polyimide film obtained by dehydration ring closure of a polyamic acid copolymer obtained by adding one equivalent of tetracarboxylic acid dianhydride b equivalent selected from derivatives It is in.

[0011]

EXAMPLES Next, examples of the present invention will be described in detail. The TAB tape according to the present invention comprises a predetermined polyimide film provided with an adhesive layer and a protective layer. Then, this predetermined polyimide film has at least one kind of linear diamine of a equivalent and one or more kinds of tetracarboxylic acid selected from b equivalent of pyromellitic dianhydride or pyromellitic dianhydride derivative. Acid dianhydride and c equivalent chemical formula group (1)

[Chemical 7] Of at least one tetracarboxylic dianhydride and d equivalent of one or more flexible diamines, the corresponding amounts of formula a> b, ab <c ≦ 2 (ab ), A
A polyamic acid copolymer obtained by satisfying + d = b + c can be obtained by dehydration ring closure.

Here, the linear diamine used in the present invention refers to a diamine compound which does not include a bending group such as an ether bond and has a structure in which the straight line connecting two nitrogen atoms and the main chain direction of the diamine are the same. . For example,

[Chemical 8] (However, X represents F, Cl, Br, CH ₃ , CH ₃ O, CF ₃ ) and the like.

On the other hand, the flexible diamine refers to a diamine having a structure containing a flexible group such as an ether bond or a carbonyl group in the main chain, or an aromatic diamine containing a meta-position or ortho-position bond. Chemical formula 10, Chemical formula 11 and Chemical formula 1
Two

[Chemical 9]

[Chemical 10]

[Chemical 11]

[Chemical 12] Diamines such as

The tetracarboxylic dianhydride used in the present invention is one or more tetracarboxylic dianhydrides selected from pyromellitic dianhydride or pyromellitic dianhydride derivatives, At least one tetracarboxylic acid dianhydride represented by the chemical formula group (1) -Chemical formula 7 is used.

These linear and flexible diamines,
And one or more tetracarboxylic acid dianhydrides selected from pyromellitic dianhydride or pyromellitic dianhydride derivatives, and at least one tetracarboxylic acid represented by the chemical formula group (1) Chemical formula 7 The carboxylic acid dianhydrides are each reacted in a predetermined amount to obtain a polyamic acid copolymer solution which is a precursor of polyimide, and this polyamic acid copolymer solution has an acid anhydride and a diamine component as organic polarities. Obtained by polymerizing in a solvent. Examples of the organic polar solvent used in the reaction for producing the polyamic acid copolymer include sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide; formamide solvents such as N, N-dimethylformamide and N, N-diethylformamide; N, N-dimethylacetamide, N,
Acetamide-based solvent such as N-diethylacetamide,
Pyrrolidone-based solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone, phenol, o-, m
-Or p-cresol, xylenol, halogenated phenol, phenolic solvents such as catechol, hexamethylphosphoramide, γ-butyrolactone and the like can be mentioned, and it is preferable to use these alone or as a mixture, Partial use of aromatic hydrocarbons such as xylene and toluene is also possible.

The polyimide film having excellent mechanical properties used in the TAB tape of the present invention is obtained from a polyamic acid copolymer solution which is a precursor thereof, and the polyamic acid copolymer solution is used as an acid anhydride. It is obtained by using the diamine component in a substantially equimolar amount and satisfying the following relational expression. That is, such a polyamic acid copolymer solution contains at least one linear diamine a equivalent, and one or more tetracarboxylic dianhydrides selected from pyromellitic dianhydride or pyromellitic dianhydride derivatives. Anhydrous b
Equivalents, at least one tetracarboxylic acid dianhydride represented by Chemical Formula Group (1) Chemical formula 7 is c equivalent, and one or two or more flexible diamines are d equivalents, and each of these equivalents is represented by the relational expression a > B, a−b <c ≦ 2 (a−b), a + d =
It is obtained by satisfying b + c.

Next, four kinds of synthetic methods of the polyamic acid copolymer obtained by satisfying the above relational expressions will be shown.

Synthesis Method 1 Organic polar solvent and linear diamine 1 or 2 in a container
Take a equivalent of seeds or more and stir with cooling. Next, to this mixed solution, b equivalent of at least one tetracarboxylic acid dianhydride selected from pyromellitic dianhydride or pyromellitic dianhydride derivative is added, and the reaction is carried out by cooling and stirring for preferably 20 minutes or more. Let To this reaction solution, one or two or more tetracarboxylic acid dianhydrides selected from the chemical formula group (1) -Chem. Next, one or more flexible diamines are gradually added to this reaction solution in d equivalent amounts, and the mixture is cooled and stirred to obtain a polyamic acid copolymer solution.

Synthetic Method 2 At least one selected from an organic polar solvent and pyromellitic dianhydride or pyromellitic dianhydride derivative in a container.
Take b equivalent of seed tetracarboxylic dianhydride and stir with cooling. Next, one or more linear diamines are added to this mixed solution in an amount of a equivalent, and the mixture is reacted by cooling and stirring for preferably 20 minutes or more. The reaction solution is converted into the above chemical formula group (1) 7
The tetracarboxylic acid dianhydride selected from the above is added to one or two or more kinds of c equivalent, and the mixture is cooled and stirred for preferably 20 minutes or more. Next, one or more flexible diamines are gradually added to this reaction solution in d equivalent amounts, and the mixture is cooled and stirred to obtain a polyamic acid copolymer solution.

Synthetic Method 3 An organic polar solvent and one or more kinds of flexible diamines are d equivalent, and the mixture is cooled and stirred. Next, c equivalent of one or more tetracarboxylic acid dianhydrides selected from the chemical formula group (1) -Chemical formula 7 is added to this mixed liquid, and the mixture is reacted by cooling and stirring for preferably 20 minutes or more. One or two or more kinds of linear diamines are added to this reaction solution in an a equivalent amount, and the mixture is cooled and stirred for preferably 20 minutes or more. Then, b equivalent of at least one tetracarboxylic acid dianhydride selected from pyromellitic dianhydride or pyromellitic dianhydride derivative is gradually added to this reaction solution while cooling and stirring to obtain polyamic acid copolymer. Obtain a coalescing solution.

Synthetic Method 4 In a container, an organic polar solvent and one or more tetracarboxylic dianhydrides selected from the chemical formula group (1) -Chemical formula 7 are taken in c equivalent amounts and cooled and stirred. Next, one or two or more kinds of the flexible diamine are added to this mixed solution in a d equivalent amount, and the mixture is reacted by cooling and stirring for preferably 20 minutes or more. One or two or more kinds of linear diamines are added to this reaction solution in an a equivalent amount, and the mixture is cooled and stirred for preferably 20 minutes or more. Then, b equivalent of at least one tetracarboxylic acid dianhydride selected from pyromellitic dianhydride or pyromellitic dianhydride derivative is gradually added to this reaction liquid while cooling and stirring to obtain a polyamic acid copolymer. Get a solution.

In the above method for synthesizing the polyamic acid copolymer solution, the amount of the organic polar solvent is not particularly limited, but the polyamic acid copolymer is contained in the organic polar solvent in an amount of 5 to 40% by weight, preferably Is preferably dissolved in an amount of 10 to 30% by weight from the viewpoint of handling.

In order to obtain the polyimide film of the present invention by converting the aromatic polyamic acid copolymer dissolved in this organic polar solvent into a polyimide, a thermal method of thermal dehydration, a dehydrating agent and Any chemical method using a necessary catalyst may be used, but the chemical method is preferable because the resulting polyimide film has excellent mechanical properties such as elongation and tensile strength.

Next, an example of a method for producing a polyimide film will be described. The above polyamic acid copolymer or the solution thereof may be used in a stoichiometric amount of a dehydrating agent and a catalytic amount of
The solution to which a primary amine is added is cast or coated on a drum or an endless belt to form a film, and the film is dried at a temperature of 150 ° C. or lower for about 5 to 90 minutes to obtain a self-supporting polyamic acid film. . Next, this film is peeled off from a support such as an endless belt, and the end portion of the film is fixed. Then, the film of this polyamic acid is gradually heated to about 100 to 500 ° C. to imidize it, and after cooling, the end of the fixed film is removed to obtain the polyimide film used in the present invention.

Here, examples of the dehydrating agent include aliphatic acid anhydrides such as acetic anhydride and aromatic acid anhydrides. Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as dimethylaniline, and heterocyclic tertiary amines such as pyridine, picoline, and isoquinoline.

The thickness of the polyimide film used in the TAB tape of the present invention is about 25 to 180 μm, which is convenient for handling, film strength,
50 from the balance of thinning requirements for downsizing
˜125 μm is more preferred.

Next, as the adhesive used in the TAB tape of the present invention, for example, epoxy resin, polyamide resin, phenol resin, acrylic resin, polyimide resin, rubber resin, etc. may be used alone or in various proportions with a solvent. It is possible to use the above-mentioned products, and further to which additives such as a curing agent and a curing accelerator are added if necessary.

Any protective film may be used as a protective layer for the adhesive layer as long as it has heat resistance to the extent that it does not soften or deteriorate when the adhesive is dried. A polyester film such as polyethylene terephthalate or a polyolefin film such as polypropylene is suitable.

The TAB tape according to the present invention is manufactured by providing the above-mentioned predetermined polyimide film with an adhesive layer and a protective film serving as a protective layer. More specifically, first, an adhesive having a predetermined composition is applied on the protective film so that the final film thickness is 10
-40 μm, preferably 15-30 μm. Next, the adhesive solution is dried to bring the adhesive layer into a semi-cured state (B-staged state). Then, the polyimide film is overlaid on the adhesive layer on the protective film, and the temperature is 20 to 180 ° C. and the pressure is 0.1 kg /
The tape for TAB is obtained by pressure bonding under the condition of cm ² or more.

The obtained TAB tape was used for T
In order to manufacture AB tape, it is usually TA
After peeling off the protective film from the B tape, punching necessary slits and holes by punching, then thermocompression-bonding copper foil or the like at a predetermined position and laminating,
The copper foil is etched to form a circuit, and the TAB tape is manufactured.

Next, examples of the present invention will be described in detail. Example 1 DMF (dimethylformamide) as an organic polar solvent and 2 equivalents of p-PDA (paraphenylenediamine) as a linear diamine were placed in a 2-liter separable flask and mixed well at room temperature until the diamino compound was completely dissolved. Then, the mixture was stirred while cooling with ice. Next, PM
One equivalent of DA (pyromellitic dianhydride) was added, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of BTDA (benzophenone tetracarboxylic acid dianhydride) was added all at once, and the mixture was cooled and stirred for 40 minutes. Furthermore, ODA (4,
1 equivalent of 4'-diaminodiphenyl ether) was dissolved in DMF, the ODA solution was gradually added to the above reaction solution, and then the mixture was cooled and stirred for 1 hour to obtain a DMF solution of polyamic acid. The amount of DMF used was such that the monomer charge concentration of the diamino compound and the aromatic tetracarboxylic acid compound was 18% by weight. Further, the added amount of p-PDA or the like satisfied the above relational expression.

Next, the obtained polyamic acid solution was cast-coated on a glass plate and dried at about 100 ° C. for about 30 minutes, then the polyamic acid coating film was peeled off from the glass plate, and the coating film was supported on a supporting frame. Then, it is heated at about 100 ° C. for about 30 minutes, at about 200 ° C. for about 60 minutes, and at about 300 ° C. for about 60 minutes in order, dehydrated and ring-closed to be converted into polyimide, and then dried to form a polyimide film of about 75 μm Obtained. Table 1 shows the physical properties of the obtained polyimide film.

Next, on a protective polyethylene terephthalate (PET) film having a surface treated with a release agent, 50 parts of a bisphenol A type epoxy resin (E1001 / made by Yuka Shell Epoxy Co.) and a cresol novolac type epoxy resin (180H65 / oil). Shell made by Epoxy) 1
An adhesive consisting of 0 part, 40 parts of polyamide resin (M1276 / manufactured by Nippon Rilsan Co., Ltd.), 7 parts of diaminodiphenyl sulfone, 2 parts of dicyandiamide, 35 parts of toluene, and 15 parts of isopropyl alcohol was applied to a thickness of about 20 μm after drying, It was dried at 150 ° C. for 10 minutes. This PET film with an adhesive was slit to a width of 27 mm, and this PET film was pressure-bonded to the above polyimide film slit to a width of 35 mm at 40 ° C. to obtain a TAB tape.

After removing the PET tape from the TAB tape, the adhesive surface and the copper foil (Low-pr manufactured by Mitsui Kinzoku Co., Ltd.
After laying an electrolytic electrolytic copper foil VLP-3EC) at 120 ° C. and observing the appearance in this state, the dimensional change rate after etching was measured according to the following method. That is, after laminating a copper foil on a base polyimide film, heating and curing it, two marking holes a and b for measuring the dimensional change rate are punched in the MD direction (machine manufacturing direction). Initial value L between a and b of
₁ was measured. Next, after the entire surface of the copper foil is etched,
L ₂ between −b was measured, and the dimensional change rate before and after etching was calculated based on the following calculation formula. Dimensional change rate = (L ₁ −L ₂ ) / L ₁ × 100% The results are shown in Table 1.

[Table 1]

Example 2 DMF and 4 equivalents of p-PDA as a linear diamine were placed in a 2 liter separable flask, mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. did. Next, 2 equivalents of PMDA were added, and the mixture was cooled and stirred for 40 minutes. Then, add BP to this reaction solution.
3 equivalents of DA (biphenyltetracarboxylic dianhydride) were added all at once, and the mixture was cooled and stirred for 40 minutes. Then, 1 equivalent of BAPB (4,4′-bis (aminophenoxyphenyl) biphenyl) as a flexible diamine was dissolved in DMF,
This was gradually added to the above reaction solution and then cooled and stirred for 1 hour to obtain a DMF solution of polyamic acid. Then, it was baked in the same manner as in Example 1 to obtain a 75 μm polyimide film. Table 1 shows the physical properties of the obtained polyimide film.
Shown in.

Using this polyimide film, a TAB tape was obtained in the same manner as in Example 1 and then laminated with a copper foil to observe the appearance and measure the dimensional change. The results are shown in Table 1.

Example 3 DMF and 1 equivalent of ODA as a flexible diamine were placed in a 2 liter separable flask, mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice. Next, add 2 equivalents of BTDA to 4
The mixture was cooled and stirred for 0 minutes. Then, PMDA1 is added to this reaction solution.
The equivalent weight was added all at once, and the mixture was cooled and stirred for 40 minutes. Then, 2 equivalents of p-PDA as a linear diamine was dissolved in DMF, this was gradually added to the above reaction solution, and then the mixture was cooled and stirred for 1 hour to obtain a DMF solution of polyamic acid. afterwards,
Firing was performed in the same manner as in Example 1 to obtain a 75 μm polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

Using this polyimide film, a TAB tape was obtained in the same manner as in Example 1, and then laminated with a copper foil to observe the appearance and measure the dimensional change. The results are shown in Table 1.

Comparative Example 1 PMDA and ODA were prepared in the same manner as in Example 1 above.
To obtain a 75 μm polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

Using this polyimide film, a TAB tape was obtained in the same manner as in Example 1, laminated with a copper foil, and the appearance was observed and the dimensional change was measured. The results are shown in Table 1.

Comparative Example 2 DMF and 1 equivalent of ODA were placed in a 2-liter separable flask and mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice.
Next, 2 equivalents of PMDA were added, and the mixture was cooled and stirred for 40 minutes.
Then, 1 equivalent of p-PDA was dissolved in DMF, this was gradually added to the reaction solution, and then the mixture was cooled and stirred for 1 hour to obtain a DMF solution of polyamic acid. Then, it was baked in the same manner as in Example 1 to obtain a 75 μm polyimide film. Table 1 shows the physical properties of the obtained polyimide film.

Using this polyimide film, a TAB tape was obtained in the same manner as in Example 1, laminated with a copper foil, and the appearance was observed and the dimensional change was measured. The results are shown in Table 1.

[0043]

According to the present invention,

[Chemical 13] By using at least one tetracarboxylic acid dianhydride and pyromellitic dianhydride or a derivative thereof selected from the chemical formula group represented by, and a linear diamine and a flexible diamine in a specific ratio, It is possible to obtain a polyimide film having a coefficient of expansion that is not significantly different from that of a metal such as copper foil or glass, and having a uniquely high elastic modulus. Therefore, by forming a TAB tape using this polyimide film as a base film, warping and curling do not occur, and the dimensional change during processing and mounting is small, so a tape carrier package with a multi-pin / high-density pattern. It is a suitable material for.

Claims (3)

[Claims] 1. An a-equivalent of at least one linear diamine and a b-equivalent of one or more tetracarboxylic dianhydrides selected from pyromellitic dianhydride or pyromellitic dianhydride derivatives. And c equivalent formula 1 Of at least one tetracarboxylic dianhydride and d equivalent of one or more flexible diamines, the corresponding amounts of formula a> b, ab <c ≦ 2 (ab ), A
A TAB comprising an adhesive layer and a protective layer provided on a polyimide film obtained by dehydration ring closure of a polyamic acid copolymer obtained by satisfying + d = b + c.
Tape. 2. The method for producing a TAB tape according to claim 1, wherein at least one linear diamine a equivalent and one selected from pyromellitic dianhydride or pyromellitic dianhydride derivative or After reacting two or more tetracarboxylic dianhydride b equivalents, the reaction solution is converted into The polyamic acid copolymer obtained by adding c equivalent of at least one tetracarboxylic acid dianhydride represented by and further adding one equivalent of two or more kinds of flexible diamine d is dehydrated and ring-closed. TA characterized by providing an adhesive layer and a protective layer on a polyimide film
Method for manufacturing B tape. 3. The method for producing a TAB tape according to claim 1, wherein one or more kinds of flexible diamine d equivalents and After reacting at least one tetracarboxylic acid dianhydride c equivalent, at least one linear diamine a equivalent is added, and then pyromellitic dianhydride or pyromellitic dianhydride is added. Providing an adhesive layer and a protective layer on a polyimide film obtained by dehydration ring closure of a polyamic acid copolymer obtained by adding one equivalent of tetracarboxylic acid dianhydride b equivalent selected from derivatives A method for manufacturing a TAB tape, comprising: