JPH05259333A - Manufacture of resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a resin-sealed semiconductor device suited to mass production. CONSTITUTION:A metal lead frame 1 includes leads 1a and 1b, and protrusions extending from part of the lead frame and opposed to the leads. After devices 4, including the protrusions, are molded, they are pushed to break the protrusions, so that the individual devices are separated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resin-sealed semiconductor device suitable for manufacturing a large number of semiconductor elements on a lead frame at the same time.

[0002]

2. Description of the Related Art FIGS. 1 (A) to 1 (G) are manufacturing process diagrams showing a conventional manufacturing method. First, as shown in FIG. 1 (A), a thin metal plate 1 is punched to face a lead frame (1a,
An electrode plate in which b) is provided in a comb shape is formed.

Next, as shown in FIGS. 1B and 1C, one electrode of the semiconductor element 2 is fixed to the tip of one of the opposing lead frames 1a, or the other electrode of the semiconductor element 2 and the lead frame. The tip of 1b is fixed by the connector 3. In addition, this step is simultaneously formed in an electric furnace or the like through a jig.

Next, as shown in FIGS. 1D and 1E, the semiconductor element 2 connector 3 and the lead frames 1a and 1b are resin-sealed by a molding method or the like using a mold or the like not shown. Thereafter, as shown in FIGS. 1F and 1G, the individual semiconductor devices S are formed by cutting the base portions (e) of the lead frames 1a and 1b.

[0005]

[Problems of Prior Art] Although the above-mentioned prior art is a method suitable for mass production, on the other hand, a characteristic check is required for each individual device, and the individual characteristic check operation of this mass-produced product hinders the productivity. It was a factor.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a semiconductor device with improved productivity.

[0007]

The present invention provides a method by which characteristic checks can be made without the need to separate individual products.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 2A to 2D are process diagrams for explaining an embodiment of the present invention, and the same reference numerals as those in the conventional example show the same parts.

According to the present invention, first, as shown in FIG. 2 (A), when the electrode plate is formed, the metal plate 1 is punched, and the metal plate 1 is clawed in the direction of the lead frames 1a, 1b at the portion (C) which becomes a void. Forming parts (a), (b) and then FIG.
As shown in (B), the claw portions (a) and (b) are simultaneously sealed during resin molding. Next, as shown in FIG. 2C, the base portions e of the lead frames 1a and 1b are cut.

In the above method, in the state of FIG. 2 (C), the semiconductor element S is not divided into individual pieces, but is held together through the claw portions (a) and (b). Moreover, since the individual elements are kept in an insulating relationship with each other, characteristic check can be performed between the lead terminals.

After that, when the resin portion 4 is pressed by a press or the like after the characteristic check is completed throughout, the pawl portion C can easily be separated into individual devices because the portion where the nail portion C bites into the resin is small. It should be noted that in FIG. 2D, (d) is a resin concave portion formed by a claw portion.

[0012]

According to the present invention, there is a great advantage that the productivity of a resin-encapsulated semiconductor device which is highly producible in mass production can be improved.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram showing a conventional manufacturing method.

FIG. 2 is a manufacturing process chart showing the manufacturing method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal plate 1a, 1b Lead frame 2 Semiconductor element 3 Connector 4 Resin part a, b Claw part c Void d Recessed part

Claims (1)

[Claims] 1. A step of punching out a metal plate to form an electrode plate having a comb-shaped lead frame portion facing each other; a step of fixing a semiconductor element across the opposite lead frames; In a method of manufacturing a resin-sealed semiconductor device, which comprises a step of resin-sealing and a step of cutting one end of the lead frame to form an individual semiconductor device, a direction of the lead frame in a void portion of the electrode plate. A method of manufacturing a resin-encapsulated semiconductor device, wherein a protruding claw portion is provided, and the claw portion is resin-sealed at the time of the resin sealing.