JP2648053B2 - Semiconductor device lead cutting method - Google Patents
Semiconductor device lead cutting methodInfo
- Publication number
- JP2648053B2 JP2648053B2 JP3186008A JP18600891A JP2648053B2 JP 2648053 B2 JP2648053 B2 JP 2648053B2 JP 3186008 A JP3186008 A JP 3186008A JP 18600891 A JP18600891 A JP 18600891A JP 2648053 B2 JP2648053 B2 JP 2648053B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- cutting method
- die
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置のリード切断
方法に関し、特に金型を交換することなく同一パッケー
ジで長さが異なるリードを切断する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting leads of a semiconductor device, and more particularly to a method of cutting leads of different lengths in the same package without replacing a mold.
【０００２】[0002]
【従来の技術】従来、ＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐ
ａｃｋａｇｅ）において、同一パッケージで長さが異な
るリードの切断方法は、図３（ａ），（ｂ）の金型の断
面図に示すように、あらかじめ決められた打抜きパンチ
２とダイ１の寸法によって、切断するリード長さが規制
される。図（ａ）はリードが長い場合、図（ｂ）は短い
場合である。そのため、図４（ａ），（ｂ）の平面図の
ように、切断するリード長が変わる度に、それぞれ図３
（ａ），（ｂ）のような専用金型を交換して用いてい
た。2. Description of the Related Art Conventionally, a QFP (Quad Flat P
In the package, a method of cutting leads having the same package but different lengths depends on predetermined dimensions of the punch 2 and the die 1 as shown in the cross-sectional views of the die shown in FIGS. The length of the lead to be cut is regulated. FIG. 7A shows a case where the lead is long, and FIG. 7B shows a case where the lead is short. Therefore, as shown in the plan views of FIGS. 4A and 4B, each time the length of the lead to be cut changes, each of FIGS.
Exclusive molds such as those shown in FIGS.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のリード
切断方法では、同一パッケージでリード長さが変わる度
に専用金型を交換し、その際、金型の位置合わせをしな
ければならず時間がかかる。また、金型を複数台作らな
ければならず、金型製作費が多くかかるという問題点が
あった。In the above-described conventional lead cutting method, the exclusive mold is replaced every time the lead length is changed in the same package, and at that time, the mold must be aligned and time is required. It takes. In addition, there is a problem in that a plurality of dies must be manufactured, and the cost for manufacturing the dies is high.
【０００４】[0004]
【課題を解決するための手段】本発明のリード切断方法
は、一台の金型を使用し同一パッケージで長さが異なる
リードの切断ができるように、打抜きパンチの先端を段
付き構造とし、この打抜きパンチの下降ストロークを可
変し、かつダイの上下ストロークを可変することによっ
てリード切断を行なう。According to the lead cutting method of the present invention, the tip of a punch has a stepped structure so that leads of different lengths can be cut in the same package using a single die. The lead is cut by varying the downward stroke of the punch and the vertical stroke of the die.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図１（ａ），（ｂ）はそれぞれ本発明の一実施例を
説明するＱＦＰタイプのリード切断金型の断面詳細図で
ある。同図（ａ），（ｂ）のように、パンチ２の先端を
段付き構造とし、またダイ１を上下動作できるように
し、パンチ２の下降ストロークとダイ１の上下ストロー
クを切換えるだけで、図４（ａ），（ｂ）のようなリー
ド４の切断長さが異なる場合でも、スイッチにより簡単
に切換えられ、図３（ａ），（ｂ）のような寸法の異な
る専用金型が不要になり、金型の位置合わせも不要にな
る。また、金型が一台で済むため、金型製作費が削減さ
れる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIGS. 1A and 1B are detailed cross-sectional views of a QFP type lead cutting die for explaining one embodiment of the present invention. As shown in FIGS. 3A and 3B, the tip of the punch 2 has a stepped structure, the die 1 can be moved up and down, and only the down stroke of the punch 2 and the up and down stroke of the die 1 are switched. Even when the cutting length of the lead 4 is different as shown in FIGS. 4A and 4B, the lead 4 can be easily switched by a switch, and a special mold having different dimensions as shown in FIGS. 3A and 3B is not required. This eliminates the need for mold positioning. In addition, since only one mold is required, the mold manufacturing cost is reduced.
【０００６】図２（ａ），（ｂ）はそれぞれ本発明の応
用例を説明するＳＯＰ（ＳｍａｌｌＯｕｔｌｉｎｅ Ｐ
ａｃｋａｇｅ）タイプ半導体装置の平面図である。一台
の金型で同図（ａ），（ｂ）のようなリード４の長さが
異なる場合でも切断できるため、ＱＦＰタイプのリード
切断と同様の効果が得られる。FIGS. 2A and 2B are SOPs (SmallOutline P) for explaining an application example of the present invention.
FIG. 2 is a plan view of an (a package) type semiconductor device. Since cutting can be performed even when the length of the lead 4 is different as shown in FIGS. 7A and 7B with one mold, the same effect as the QFP type lead cutting can be obtained.
【０００７】[0007]
【発明の効果】以上説明したように本発明は、一台の金
型を使用し、同一パッケージで長さが異なるリードの切
断が行えるので、専用金型が不要になり、また金型交換
時の位置合わせが不要になって作業時間が短縮され、さ
らに金型製作費も削減できるという効果がある。As described above, according to the present invention, a single die can be used, and leads having different lengths can be cut in the same package. This eliminates the need for positioning, thereby shortening the working time, and further reducing the die manufacturing cost.
【図１】本発明の一実施例を説明する図で、同図
（ａ），（ｂ）はそれぞれＱＦＰタイプ半導体装置のリ
ード切断金型の断面図である。FIGS. 1A and 1B are cross-sectional views of a lead cutting die of a QFP type semiconductor device, respectively, for explaining one embodiment of the present invention; FIGS.
【図２】本発明の応用例を示す図で、同図（ａ），
（ｂ）はそれぞれＳＯＰタイプ半導体装置のリード切断
後のリードフレーム正面図である。FIG. 2 is a diagram showing an application example of the present invention.
(B) is a front view of the lead frame after cutting the lead of the SOP type semiconductor device.
【図３】従来のリード切断方法を説明する図で、同図
（ａ），（ｂ）はそれぞれＱＦＰタイプ半導体装置の専
用リード切断金型の断面図である。3 (a) and 3 (b) are cross-sectional views of a dedicated lead cutting die of a QFP type semiconductor device.
【図４】従来のＱＦＰタイプ半導体装置を示す図で、同
図（ａ），（ｂ）はそれぞれリード切断後のリードフレ
ーム正面図である。FIGS. 4A and 4B are views showing a conventional QFP type semiconductor device, and FIGS. 4A and 4B are front views of the lead frame after cutting the leads, respectively.
１ ダイ ２ パンチ ３ パッケージ ４ リード 1 Die 2 Punch 3 Package 4 Lead
Claims (1)
なる半導体装置のリード切断方法において、打抜きパン
チ先端を段付き構造とし、この打抜きパンチの下降スト
ロークを可変し、かつダイの上下ストロークを可変する
ことによって、同一金型でリード長さの異なるパッケー
ジのリード切断を行なうことを特徴とする半導体装置の
リード切断方法。1. A lead cutting method for a semiconductor device having the same package dimensions and different lead lengths, wherein the tip of a punch has a stepped structure, the descending stroke of the punch is variable, and the vertical stroke of a die is variable. A lead cutting method for a semiconductor device, wherein leads of packages having different lead lengths are cut with the same mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186008A JP2648053B2 (en) | 1991-07-25 | 1991-07-25 | Semiconductor device lead cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186008A JP2648053B2 (en) | 1991-07-25 | 1991-07-25 | Semiconductor device lead cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0523753A JPH0523753A (en) | 1993-02-02 |
| JP2648053B2 true JP2648053B2 (en) | 1997-08-27 |
Family
ID=16180761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3186008A Expired - Lifetime JP2648053B2 (en) | 1991-07-25 | 1991-07-25 | Semiconductor device lead cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2648053B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08215775A (en) * | 1995-02-20 | 1996-08-27 | Nec Shizuoka Ltd | Punching dies |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02143551A (en) * | 1988-11-25 | 1990-06-01 | Toshiba Corp | Manufacture of semiconductor device |
-
1991
- 1991-07-25 JP JP3186008A patent/JP2648053B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0523753A (en) | 1993-02-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970401 |