JPS61134042A - Equipment for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To enable common use independently of the difference in the number of continuous connection, and to reduce the number of ascent-descent times of dies and bending bases, by a method wherein dies and bending bases are arranged each by 2N+1 pieces at equal pitches with respect to the minimum number N of continuous connection of the titled devices. CONSTITUTION:In the case of separating semiconductor devices from a lead frame with the continuous connection of the minimum number N of semiconductor devices and of bending leads, the minimum number N of the lead frame connections are stored each in two magazines 13a and 13b, and these magazines 13a and 13b are set up in front of the lower dies 11. At the time of this set-up, the lower die 11b and upper die, the lower bending die and upper bending die which are located at the center are put in the state out of use. Lead frames are taken out of each magazine 13a, 13b by operating feed pawls 15. A lead frame is positioned and fixed on the lower die, and semiconductor devices are separated from the lead frame by lowering the upper die. Then, each semiconductor device is fed onto the lower bending base by the feed pawls, and leads of the semiconductor device are bent downward by lowering the upper bending base.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to an apparatus used for separating a semiconductor device from a lead frame and bending a lead.

(Technical background of the invention and its problems) FIG. 5 is a perspective view of the lead frame 21 in the manufacturing process of a semiconductor device. Beds 22 supported by tie bars 25 are formed at predetermined intervals in the longitudinal direction of this lead frame 21, and chips 23 are mounted on each bed 22. Then, thin wires (not shown) made of gold or the like are wired between the electrodes of the chip 23 and each lead 24 for wire bonding, and then the chip and the thin wires are molded with resin to form a package. , - A plurality of semiconductor devices are arranged in series on lead frames. Therefore,
After resin molding is completed, it is necessary to cut the tie bars 25 and leads 24 to a predetermined length to separate each semiconductor device from the lead frame. For this reason, devices shown in FIGS. 3 and 4 have conventionally been used.

Figure 3 shows a device used when N (5 in the figure) semiconductor devices are connected, and Figure 4 shows a device used when 2N (10 in the figure) semiconductor devices are connected in a row. FIG. In these figures, lead frames on which semiconductor devices are connected are housed in magazines 2 and 7, and as feed claws 1 and 6 move forward with respect to magazine 2, the lead frames are moved one by one to the bottom metal. Pour onto molds 3 and 8. Then, the upper mold (not shown) descends and works together with the lower molds 3 and 8 to separate the semiconductor device from the lead frame. Bend the reed in a predetermined direction, for example, downward, on the bending table, and then
It is to be stored inside.

However, such equipment requires separate equipment with one mold stand for each number of semiconductor devices to be connected, and since these cannot be shared, the number of equipment increases and the manufacturing cost increases. There is. The number of such consecutive connections is often 2N.

In addition, since there is no commonality, when transitioning from a lead frame in which Nil leads are connected to a lead frame in which 2N lead frames are connected, the molds and blanks must be reset each time, resulting in poor work efficiency. Furthermore, there is a problem in that the mold and the mold have to be moved up and down many times, resulting in a high rate of defectives.

[Purpose of the invention]

The present invention has been made in consideration of the above-mentioned circumstances, and is capable of manufacturing a semiconductor device that can be used in common regardless of the number of semiconductor devices installed in series, and that can reduce the number of times a mold or a mold is raised and lowered. The purpose is to provide equipment.

(Summary of the Invention) In order to achieve the above object, the manufacturing apparatus according to the present invention arranges molds and molds at an equal pitch of 2N+1 for the minimum number N of the number of consecutively installed semiconductor devices. When processing a lead frame with 2N pieces installed, set two magazines without using the central mold and confession, and when processing a lead frame with 2N pieces installed, set two magazines at the right or left end. By not using molds or blanks, it is possible to work on both N-strand and 2-N lead frames.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a plan view showing a manufacturing apparatus according to an embodiment of the present invention, with an upper mold and an upper bending table omitted.

In this embodiment, the minimum number N of semiconductor devices connected to the lead frame is 5, and the lower mold 11 is 2N+
1, or 11, are installed everywhere.

Therefore, the same number of eleven upper molds (not shown) are also provided, and the semiconductor device is separated from the lead frame placed on the lower mold by lowering the upper mold. In addition, 2N+1, that is, 11 lower bending tables 12 and upper bending tables (not shown) are provided for bending the leads of the separated semiconductor devices, and the semiconductor devices are stored in the stick 14 after the processing is completed. It is supposed to be done.

A case will be described in which, using such an apparatus, a semiconductor device is separated from a lead frame in which a minimum number of N semiconductor devices are arranged in series, and the leads are bent. The two magazines 13a and 13b accommodate a minimum number of N lead frames, and these magazines 13a and 1
3b is set in front of the lower mold 11. During this setting, the lower mold 11b located in the center and the upper mold (
(not shown), the lower bending table 12b, and the upper bending table (not shown) are left unused. Then, operate the feed claw 15,
A lead frame is taken out from each magazine 13a, 13b, the lead frame is positioned and fixed on the lower mold, and the upper mold is lowered to separate the semiconductor device from the lead frame. Next, each semiconductor device is sent onto the lower convex table by the feed claw, and the lead of the semiconductor device is bent in the F direction by lowering the upper bending table and stored in the stick 14. Therefore, when the minimum number of lead frames is N, it is sufficient to set the magazine so as not to use the mold and the blank located in the center, and it is sufficient to set the magazine so that the mold and the blank located in the center are not used. The semiconductor device can be separated from the frame.

Next, FIG. 2 shows the case of processing a lead frame in which the number of semiconductors connected in series is 2N. In this case, it is sufficient to set the magazine 16 so that the lower mold 11a and upper mold located at the right end, the lower bending table 12a and the upper bending table are not used, and the post-process is the same as described above, so it is omitted. do. In this case, the magazine may be set so that the mold and the rotation located at the left end are not used, instead of the mold and the rotation located at the right end.

〔Effect of the invention〕

As explained above, according to the present invention, the molds and the ratio are set at equal pitches for the minimum IN of the number of consecutively installed semiconductor devices.
N+1 lead frames are arranged, and the leads of the semiconductor device can be separated and bent without using a mold and a mold located at the center or at the end depending on the number of lead frames installed in a row, so the number of leads can be reduced. It can be used with either N or 2N lead frames. For this reason, one device can be applied to many types of lead frames, reducing the number of devices installed, and eliminating the need to reset the mold and mold, increasing work efficiency. . Further, in the case of the minimum number of consecutive lead frames, a plurality of lead frames can be processed simultaneously, so the number of times the mold and the mold are raised and lowered is reduced, and the defective rate is reduced.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the manufacturing device according to the present invention, FIG. 2 is a plan view of the state of use when the number of connected units is different, FIGS. 3 and 4 are plan views of the conventional device, and FIG. FIG. 5 is a perspective view of an example of a lead frame. 11.11a, 11b... lower mold, 12.12a. 12b...Lower bending stand, 13.13b, 16...Magazine, 14...Stick, 15...Feed claw. Applicant's agent Inomata Figure 3 Figure 4

Claims (1)

[Claims] A magazine that stores lead frames in which semiconductor devices are arranged in series at a predetermined equal pitch, and a cutting tool provided for each semiconductor device to separate the semiconductor devices from the lead frames taken out from the magazine. In a semiconductor device manufacturing apparatus consisting of a mold and a bending table provided for each semiconductor device to bend the separated semiconductor device in a predetermined direction, for the minimum value N of semiconductor devices connected to a lead frame, The mold and the bending table are arranged at the predetermined equal pitch of 2N+1.
1. An apparatus for manufacturing a semiconductor device, characterized in that the magazine is set so that the mold and the bending stand located at the center or at the end depending on the number of semiconductor devices installed in a row are not in use.