CN212380418U

CN212380418U - Lead frame of integrated circuit

Info

Publication number: CN212380418U
Application number: CN202022505885.4U
Authority: CN
Inventors: 黎超丰; 冯小龙; 章新立; 林渊杰; 林杰
Original assignee: Ningbo Kangqiang Electronics Co ltd
Current assignee: Ningbo Kangqiang Electronics Co ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-01-19
Anticipated expiration: 2030-11-03

Abstract

The utility model provides an integrated circuit lead frame relates to integrated circuit lead frame technical field. The utility model provides an integrated circuit lead frame, the interval is provided with a plurality of bases island and a plurality of shearing parts, and every shearing part includes two pins and a cutting street, the cutting street both ends respectively with two pins link to each other, two pins and cutting street enclose into first recess, first recess opening sets up the bottom of shearing part, the cutting street has first arch, first arch sets up in the first recess that corresponds. The utility model discloses integrated circuit lead frame is owing to increased first arch, when cuting, the pin deformation degree of shearing department annex can reduce by a wide margin to promote the yield of product.

Description

Lead frame of integrated circuit

Technical Field

The utility model belongs to the technical field of the semiconductor lead frame, concretely relates to integrated circuit lead frame.

Background

Integrated circuit leadframes are the basic component for the manufacture of integrated circuit semiconductor elements. The chip carrier is a key structural member which realizes the electrical connection between the leading-out end of the internal circuit of the chip and an external lead by means of a gold bonding wire to form an electrical loop and plays a role of a bridge connected with an external lead. The substrate is typically punched through by a stamping process or etched through by a chemical etching process, then the chip is mounted, the leads are soldered, and finally the package is formed to form an integral semiconductor device.

Each product unit in the lead frame typically includes a base island, pins, and dicing lanes. In order to reduce the volume of a semiconductor element, the thickness of a lead frame is thinner and thinner, when the conventional lead frame is sheared, pins of a sheared part accessory deform, and once the deformation is too large, the product unit fails, so that the deformation of the lead frame during shearing needs to be controlled.

Disclosure of Invention

The utility model aims at the above-mentioned problem that exists among the prior art, provide an integrated circuit lead frame of pin deformation when reducing to cut.

The purpose of the utility model can be realized by the following technical proposal: the utility model provides an integrated circuit lead frame, the interval is provided with a plurality of bases island and a plurality of shearing parts, and every shearing part includes two pins and a cutting street, the cutting street both ends respectively with two pins link to each other, two pins and cutting street enclose into first recess, first recess opening sets up the bottom of shearing part, the cutting street has first arch, first arch sets up in the first recess that corresponds.

As a further improvement of the present invention, the first protrusion divides the corresponding first groove into two parts.

As a further improvement of the present invention, the width of the first protrusion is smaller than the width of the cutting path.

As a further improvement of the present invention, the ratio of the width of the first protrusion to the width of the first groove is 0.25 to 0.5.

As a further improvement of the present invention, the height of the first protrusion is smaller than the height of the pin.

As a further improvement of the present invention, the ratio of the height of the first protrusion to the depth of the first groove is 0.25 to 1.

As a further improvement of the present invention, the first groove is divided into two parts having the same shape by the corresponding first protrusion.

Based on the technical scheme, the embodiment of the utility model provides a can produce following technological effect at least:

1. the utility model discloses integrated circuit lead frame is owing to increased first arch, when cuting, the pin deformation degree of shearing department annex can reduce by a wide margin to promote the yield of product.

2. The first groove is divided into two parts with the same shape by the first protrusion, so that the stress of the pin is more uniform during shearing.

3. The size of the first protrusion relative to the first groove is limited, so that the material is saved and the cost is reduced on the premise of meeting the production requirement.

Drawings

Fig. 1 is a cross-sectional view of a base island and a pin in an embodiment of an integrated circuit lead frame according to the present invention.

In the figure, 10, base island; 20. a pin; 21. a first groove; 30. cutting a channel; 31. a first protrusion.

Detailed Description

The following is a specific embodiment of the present invention, and the technical solution of the present invention is further described with reference to fig. 1, but the present invention is not limited to this embodiment.

As shown in fig. 1, the utility model provides an integrated circuit lead frame that pin warp when reducing the shearing, this integrated circuit lead frame interval is provided with a plurality of bases 10 and a plurality of shearing parts, and every shearing part includes two pins 20 and a cutting way 30, cutting way 30 sets up between two pins 20 that correspond, cutting way 30 both ends respectively with two pins 20 link to each other, and this integrated circuit lead frame includes a plurality of functional unit, and the part between the dot-dash line in the figure is a functional unit. The two pins 20 and the cutting street 30 enclose a first groove 21, the opening of the first groove 21 is arranged at the bottom of the cutting part, the cutting street 30 is provided with a first protrusion 31, and the first protrusion 31 is arranged in the corresponding first groove 21. By arranging the first protrusion 31 in the first groove 21, the deformation of the pins 20 of the attachment at the cutting position is smaller when the integrated circuit lead frame is cut, so that the yield of functional unit production is improved.

Further, the first projection 31 divides the first groove 21 into two parts. The first groove 21 is divided into two parts, which means that the first protrusion 31 is not connected to the lead 20, and the influence on the lead 20 is reduced when the cutting street 30 is cut.

Further, the width of the first protrusion 31 is smaller than the width of the cutting street 30. The width a of the first protrusion 31 is not too large, which wastes more material.

Further, the ratio of the width of the first protrusion 31 to the width of the first groove 21 is 0.25 to 0.5. The ratio of the width a of the first protrusion 31 to the width a of the first groove 21 is not too large or too small, too large wastes more material, too small does not play a role in reinforcement, 0.25-0.5 is a reasonable value obtained by the inventor through multiple tests, in this embodiment, the width a of the first groove 21 is 0.18mm, and the width a of the first protrusion 31 is 0.06 mm.

Further, the height of the first protrusion 31 is smaller than the height of the pin 20. This is so arranged as to be compatible with the manufacturing process of the lead frame of the integrated circuit, the first groove 21 and the first protrusion 31 in this embodiment are both generated after etching, the original scribe line and the leads 20 have the same height before etching, and the shape of the scribe line 30 is obtained after etching the original scribe line.

Further, the ratio of the height of the first protrusion 31 to the depth of the first groove 21 is 0.25 to 1. The ratio of the height of the first protrusion 31 to the depth of the first groove 21 is not too large or too small, too large will waste more material, too small will not play a role in reinforcement, 0.25-1 is a reasonable value obtained by the inventor through many tests, and this value is about 0.5 in this embodiment.

Further, the two parts of the first groove 21 divided by the corresponding first protrusion 31 have the same shape. The first protrusion 31 divides the first groove 21 into two parts with the same shape, so that the pin 20 is stressed more uniformly when being sheared.

The embodiment of the utility model provides a can produce following technological effect at least: as the first bulge 31 is added to the integrated circuit lead frame, the deformation degree of the pins 20 of the shearing part accessory can be greatly reduced during shearing, thereby improving the yield of products; the first protrusion 31 divides the first groove 21 into two parts with the same shape, so that the stress of the pin 20 is more uniform during shearing; the size of the first protrusion 31 relative to the first groove 21 is limited, so that the material can be saved and the cost can be reduced on the premise of meeting the production requirement.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides an integrated circuit lead frame, its characterized in that, the interval is provided with a plurality of bases and a plurality of shearing parts, and every shearing part includes two pins and a cutting street, the cutting street both ends respectively with two pins link to each other, two pins and cutting street enclose into first recess, first recess opening sets up the bottom of shearing part, the cutting street has first arch, first arch sets up in the first recess that corresponds.

2. The integrated circuit lead frame of claim 1, wherein the first bump divides the corresponding first recess into two portions.

3. The integrated circuit lead frame of claim 2, wherein the width of the first bump is less than the width of the scribe line.

4. The lead frame according to claim 3, wherein the ratio of the width of the first protrusion to the width of the first groove is 0.25-0.5.

5. The integrated circuit lead frame of claim 2, wherein the height of said first bump is less than the height of said lead.

6. The lead frame according to claim 5, wherein the ratio of the height of the first protrusion to the depth of the first recess is 0.25-1.

7. The integrated circuit lead frame according to claim 2, wherein the two portions of the first recess divided by the corresponding first bump are identical in shape.