JPH05259222A - Electronic part mounting device - Google Patents

Abstract

PURPOSE:To provide an electronic part mounting device so that each inner lead part of a film carrier for mounting an electronic part can be protected enough and the occurrence of short defect due to a plating flow can be prevented and an electrical connection to the electronic part can be always performed surely by a simple construction. CONSTITUTION:Inner lead parts 13a of each lead 13 are secured on an insulating substrate 11 as a unit, and the inner lead parts 13a are electrically connected to a terminal of an electronic part 30. Further, an anisotropic conductive film 20 is integrated with a connecting part to the terminal of the electronic part 30 of at least each inner lead part 13a. By the anisotropic conductive film 20, each inner lead part 13a is electrically connected to the terminal of the electronic part 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which electronic components are mounted on a substrate film carrier for mounting electronic components, and in particular, each lead electrically connects to a conductor circuit such as another printed wiring board. The present invention relates to an electronic component mounting device connected to.

[0002]

2. Description of the Related Art Conventionally, various types of electronic component mounting devices have been proposed, but among them, a device using a so-called film carrier has been widely used because it is easy to manufacture. ing. A film carrier for constructing such an electronic component mounting apparatus is formed by using a flexible and long film-like material as an insulating base material as a main material. Therefore, in recent years,
It has been adopted in large numbers and the production volume is increasing. Then, by finally cutting the film-shaped insulating base material, it is made into an individual film carrier for mounting one or a plurality of electronic components, and various film carriers are also available. There are types.

By the way, a film carrier of this type is plated for electrical connection with electronic parts and printed wiring boards. Therefore, in order to increase the density of each lead, which should correspond to the increase in the density of electronic components, it is natural that the intervals between the pitches must be reduced. From the above facts, the higher the density of the leads on this type of film carrier, the smaller the pitch intervals.

That is, an electronic component mounting film carrier 10 that has been generally used in the past to form an electronic component mounting apparatus is formed as shown in FIG. 7, for example, and the inner lead portion 13a of each lead 13 is formed. Is floating in the device hole 12 and is not protected at all, and the outer lead portion 13b is not protected at all. Moreover, as shown in FIGS. 8 and 9, the inner lead portions 13a are those to which the terminals of the electronic component 30 are directly connected by soldering or the like, and the outer lead portions 13b are also connected to the printed wiring board 40. The electrical connection is made by the reflow soldering on the side connection portion 41. In such a case, assuming that the distance between the inner lead portions 13a is narrow and solder plating is present frequently, if the solder plating is reflowed for connection, a short circuit will occur between the inner lead portions 13a. It can happen. Therefore, it is difficult to mount a film carrier having a reduced lead interval on a printed wiring board, and defects such as a short circuit due to a plating flow are becoming more frequent. Not only that, the inner lead portion 13a of each lead 13 is
Since it is in a floating state and is not protected at all, it is in a state in which it can be easily bent by a slight impact or the like. The above is a phenomenon that tends to occur when the terminal of the electronic component 30 is directly connected to each inner lead portion 13a by soldering or the like to form an electronic component mounting apparatus. This reduces the reliability of the device.

Therefore, the inventors of the present invention ensured that the inner lead portions 13a were sufficiently protected and the electronic components 30 could be sufficiently mounted on the inner lead portions 13a at all times even if the lead density was increased. As a result of repeated studies on how to make an electronic component mounting device with high performance, and how to prevent short circuit due to plating flow when configuring an electronic component mounting device, I have completed the explanation.

[0006]

SUMMARY OF THE INVENTION The present invention has been made based on the above-mentioned background, and the problem to be solved is that a short circuit occurs due to a plating flow in a film carrier when configured as an electronic component mounting apparatus. Prevention and electronic component 30 for each inner lead portion 13a
To secure the connection reliability of.

The object of the present invention is to provide each inner lead portion 1 of a film carrier for mounting electronic parts.
To provide an electronic component mounting device having a simple structure, capable of sufficiently protecting 3a, preventing occurrence of a short circuit defect due to a plating flow, and always ensuring reliable electrical connection with the electronic component 30. Especially.

[0008]

Means for Solving the Problems In order to solve the above problems, the means adopting the present invention will be described with reference to the reference numerals used in the examples.
An electronic component mounting apparatus 100 configured by mounting an electronic component 30 on an electronic component mounting substrate film carrier 10 provided with a lead 13 formed in a predetermined pattern thereon.
In each of the leads 13, the inner lead portion 13 a electrically connected to the terminal of the electronic component 30 is connected to the insulating base material 11.
The anisotropic conductive film 20 is integrally fixed on the inner lead portion 13a, and at least the connection portion of each inner lead portion 13a with the terminal of the electronic component 30 is integrated with each inner lead portion 13a. 13a and electronic component 30
The electronic component mounting apparatus 100 "is characterized in that it is electrically connected to the terminal.

The anisotropic conductive film 20 used in the electronic component mounting film carrier 10 for constituting the electronic component mounting apparatus 100 needs to be as follows. That is, as shown in FIG. 6A, the anisotropic conductive film 20 has a thermoplastic or thermosetting adhesive 21 as a base material, and the conductive particles 22 do not contact each other in the adhesive 21. The leads 13 are dispersed in a state, and each lead 13 is formed with a thickness similar to that of the copper foil forming the leads 13.

As shown in FIG. 6B, this anisotropic conductive film 20 is heat-pressed to the terminal on the electronic component 30 side through the inner lead portion 13a on the electronic component mounting film carrier 10 side. At this time, the adhesive 21 that constitutes this
Flow with the conductive particles 22 left in their places, and as a result, as shown in FIG. 6C, the inner lead portion 13 on the electronic component mounting film carrier 10 side.
The conductive particles 22 are left in contact with each other between a and the terminal on the electronic component 30 side. As a result, the inner lead portion 13a on the electronic component mounting film carrier 10 side and the terminal on the electronic component 30 side are electrically connected by the remaining conductive particles 22 that are in contact with each other. In the other portion where the terminal does not exist, the conductive particles 22 remain isolated by the adhesive 21 and thus become in an insulating state. Of course, since the anisotropic conductive film 20 is composed of the base material itself of the adhesive 21, the inner lead portion 13a on the electronic component mounting film carrier 10 side and the terminal on the electronic component 30 side are bonded together. It goes without saying that you are also doing.

[0011]

The electronic component mounting apparatus 100 according to the present invention constructed as above has the following operations.

First, the anisotropic conductive film 20 itself has a thickness of about 40 μm.
The overall thickness of the electronic component mounting film carrier 10 in which 0 is integrated is not so increased, and the anisotropic conductive film 20 itself is based on the adhesive 21 as described above. Therefore, it completely follows the insulating base material 11. Therefore, the electronic component mounting film carrier 10 for constituting the electronic component mounting apparatus 100 is
The original merit for thinning, that is, the merit of being able to perform reel-to-reel work is provided as it is.

The anisotropic conductive film 20 itself has a sheet-like shape having the above-mentioned thickness as a frame shape as shown in FIG. 1, FIG. 3 or FIG. Since it may be integrated on each inner lead portion 13a, its manufacturing itself is very easy. Of course, the insulating base material 11 does not have the conventional device hole 12,
Moreover, the inner lead portion 13a of each lead 13 electrically connected to the terminal of the electronic component 30 is
Since the inner lead portions 13a are integrally fixed on the upper surface of the first substrate 1, the inner lead portions 13a are so lined by the insulating base material 11 located on the back surface thereof. Therefore, the protection of each inner lead portion 13a is sufficiently performed by the insulating base material 11.

Further, in the anisotropic conductive film 20 of the electronic component mounting apparatus 100, the conductive particles 22 are dispersed in the adhesive 21 in a state where they are not in contact with each other, unless they are heated and pressed as described above. In addition, since the adhesive 21 itself has an insulating property, the inner lead portions 13a forming the leads 13 of the electronic component mounting film carrier 10 are covered with an insulating film. The anisotropic conductive film 20 maintains the insulating state of each inner lead portion 13a when the solder plating is reflowed for mounting the electronic component 30 or the like. Therefore, the problem of short circuit in each inner lead portion 13a, which has been conventionally caused by the reflow of solder plating, does not occur.

It is important to note that when the electronic component mounting apparatus 100 is constructed, each terminal of the electronic component 30 is electrically connected to the inner lead portion 13a of the electronic component mounting film carrier 10. As shown in FIG. 2 or FIG. 4, a film carrier 10 for mounting electronic parts is provided.
The respective inner lead portions 13a on the side and the respective terminals on the side of the electronic component 30 are electrically connected and bonded one to one. That is, in FIG. 2 and FIG. 4, the continuous anisotropic conductive film 20 includes the inner lead portions 13 a and the electronic component 30.
Although it is interposed between the terminals on the side, the conductive particles 22 in the adhesive 21 forming the anisotropic conductive film 20 come into contact with each other only at the portions where the inner lead portions 13a and the terminals face each other. They are connected to each other to ensure continuity, and the other parts are kept insulating. Therefore, in this electronic component mounting apparatus 100, each inner lead portion 13a of the electronic component mounting film carrier 10 is arranged at a predetermined position (position accurately positioned) with respect to each terminal of the electronic component 30. Even if there is not, if there is a portion where each inner lead portion 13a and the terminal on the electronic component 30 side face each other, the conduction is sufficiently ensured.

[0016]

EXAMPLE Next, an electronic component mounting apparatus 100 according to the present invention.
Will be specifically described according to each embodiment shown in the drawings.

Embodiment 1 FIGS. 1 and 2 show partial plan views of an electronic component mounting apparatus 100 according to a first embodiment of the present invention. This electronic component mounting apparatus 100 is for mounting electronic components. The film carrier 10 is used.

This electronic component mounting film carrier 10
Is obtained by directly integrating a copper foil or the like on a film-like insulating base material 11 in which no device holes are formed, and etching the copper foil or the like in a predetermined pattern shape, so that each inner portion of a large number of leads 13 is formed. The lead portion 13a has a substantially insulating base material 11.
It is formed to face the center of. That is, the electronic component mounting film carrier 10 shown in FIG.
Does not have a so-called device hole for the electronic component 30, and is the inner lead portion 13 of each lead 13.
a is directly supported on the insulating base material 11. Then, each terminal of the electronic component 30 directly mounted on the insulating base material 11 and each inner lead portion 13a are electrically connected. In the embodiment shown in FIG. 1, an opening for "bridging" the outer lead portion 13b of each lead 13 is formed around the insulating base material 11, and the electronic component is opened through this opening. By trimming the mounting film carrier 10, the state shown in FIG. 2 (c) is obtained.

This electronic component mounting film carrier 10
In FIG. 1 and FIG. 2A, a frame-like shape is formed on the surface of the insulating base material 11 on which the leads 13 are formed so as to cover the inner lead portions 13 a of the leads 13. The anisotropic conductive film 20 is integrated. As described above, the anisotropic conductive film 20 is obtained by dispersing the conductive particles 22 made of various materials (carbon or the like) in the insulating adhesive 21 so as not to be in contact with each other. As shown in FIG. 2B, when heat and pressure are applied to the inner lead portion 13a to bring them into contact with each other, the conductive particles 22 are brought into contact with each other, and at the same time, the conductive material 22 is hardened by the conductive material 22. The contact state of the particles 22 is fixed. The electronic component mounting film carrier 10 after mounting the electronic component 30 is, as shown in FIG.
After being mounted on another printed wiring board 40, each outer lead portion 13b is electrically connected to the connection portion 41 on the printed wiring board 40.

Embodiment 2 FIGS. 3 and 4 show partial plan views of an electronic component mounting apparatus 100 according to a second embodiment of the present invention. This electronic component mounting apparatus 100 is for mounting electronic components. The film carrier 10 is used.

This electronic component mounting film carrier 10
Is also a so-called chip-on-board type. That is, the insulating base material 11 of the electronic component mounting film carrier 10 does not have a device hole, and the electronic component 30 mounted in the substantially central portion of the insulating base material 11 and each inner lead portion 13a are As shown in (b) and (c) of FIG. 4, they are electrically connected via the anisotropic conductive film 20.

This electronic component mounting film carrier 10
In the above, the outer lead portion 13b of each lead 13 is also electrically connected by the frame-shaped anisotropic conductive film 20 integrated with the surface of the insulating base material 11 on which the lead 13 is formed. .. That is, in the electronic component mounting film carrier 10 according to this embodiment, the frame-shaped anisotropic conductive film 20 is integrally formed on the inner lead portion 13a and the outer lead portion 13b of each lead 13 so as to cover the frame-shaped anisotropic conductive film 20. Is.

Embodiment 3 FIG. 5 shows a partial plan view of an electronic component mounting apparatus 100 according to a third embodiment of the present invention. The electronic component mounting apparatus 100 is a film carrier 10 for mounting electronic components. It is configured by using.

This film carrier 10 for mounting electronic parts
Is also a so-called chip-on-board type. That is, the insulating base material 11 of the electronic component mounting film carrier 10 does not have a device hole, and a copper foil or the like is directly integrated on the film-like insulating base material 11 to form a copper foil or the like. The inner lead portions 13a of the large number of leads 13 are formed so as to face substantially the center of the insulating base material 11 by performing etching in a predetermined pattern shape.

The anisotropic conductive film 20 having a width corresponding to substantially the entire width of the insulating base material 11 is directly provided on the insulating base material 11 on which the leads 13 are integrally formed. The electronic component mounting film carrier 10 is covered and integrated so that the inner lead portion 13a and the outer lead portion 13b of each lead 13 are electrically connected to each terminal of the electronic component 30 and the printed wiring. The connection portion 41 on the plate 40 side can be individually connected.

As described above, in any of the electronic component mounting apparatuses 100, the electronic component mounting film carrier 10 forming the same is one in which the anisotropic conductive film 20 is integrated with the side surface of the lead 13 of the insulating base material 11. As an example, each lead 1
3 and the pads electrically connected to each other by through holes are formed on the surface of the insulating base material 11 opposite to the leads 13, and these pads and the like are covered with the anisotropic conductive film 20. Is also good.

[0027]

As described above in detail, in the present invention,
As illustrated in each of the above-described examples, "the film-shaped insulating base material 11 and the leads 1 formed on the insulating base material 11 in a predetermined pattern are formed.
Substrate film carrier 10 for mounting electronic parts, which comprises
In the electronic component mounting apparatus 100 configured by mounting the electronic component 30, the inner lead portions 13 a of each lead 13 electrically connected to the terminals of the electronic component 30 are integrally fixed on the insulating base material 11. At the same time, the anisotropic conductive film 20 is integrated at least at the connection portion of each inner lead portion 13a with the terminal of the electronic component 30, and the anisotropic conductive film 20 allows the inner lead portion 13a and the electronic component 30 to be connected. The fact that it is electrically connected to the terminals "has a feature in its configuration, which allows the inner lead portions 13a of the electronic component mounting film carrier to be sufficiently protected and causes a short circuit failure due to the plating flow. To provide an electronic component mounting apparatus having a simple structure, which can prevent the above-mentioned problems and which is always reliable in electrical connection with the electronic component 30. Than is possible.

[Brief description of drawings]

FIG. 1 is a partially enlarged plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing, step by step, a process of manufacturing a film carrier for mounting an electronic component and a step of mounting an electronic component on the film carrier for configuring the electronic component mounting apparatus.

FIG. 3 is a partially enlarged plan view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing, step by step, a process of manufacturing a film carrier for mounting an electronic component and a step of mounting an electronic component on the film carrier for configuring the electronic component mounting apparatus.

FIG. 5 is a partially enlarged plan view of an electronic component mounting apparatus according to a third embodiment of the present invention.

FIG. 6 is a partial enlarged cross-sectional view showing the structure and action of the anisotropic conductive film.

FIG. 7 is a partially enlarged plan view of an electronic component mounting film carrier that constitutes a conventional electronic component mounting apparatus.

FIG. 8 is a partially enlarged cross-sectional view showing a state in which an electronic component is mounted on a conventional electronic component mounting film carrier.

9 is a partially enlarged cross-sectional view of a state in which the electronic component mounting apparatus shown in FIG. 8 is mounted on another printed wiring board.

[Explanation of symbols]

 100 Electronic Component Mounting Device 10 Electronic Component Mounting Film Carrier 11 Insulating Base Material 12 Device Hole 13a Inner Lead Part 13b Outer Lead Part 20 Anisotropic Conductive Film 21 Adhesive 22 Conductive Particles 40 Printed Wiring Board 41 Connection Part

Claims (1)

[Claims] 1. An electronic component mounting apparatus in which an electronic component is mounted on a film carrier for mounting an electronic component, which comprises a film-shaped insulating base material and leads formed in a predetermined pattern on the insulating base material. An inner lead portion of each lead electrically connected to a terminal of an electronic component is integrally fixed on the insulating base material, and at least a connection portion of each inner lead portion with a terminal of the electronic component An electronic component mounting apparatus, characterized in that an anisotropic conductive film is integrated with the above, and the inner lead portions are electrically connected to the terminals of the electronic component by the anisotropic conductive film.