JPH0525446A - Anisotropically conductive adhesive - Google Patents

Anisotropically conductive adhesive

Info

Publication number
JPH0525446A
JPH0525446A JP20319791A JP20319791A JPH0525446A JP H0525446 A JPH0525446 A JP H0525446A JP 20319791 A JP20319791 A JP 20319791A JP 20319791 A JP20319791 A JP 20319791A JP H0525446 A JPH0525446 A JP H0525446A
Authority
JP
Japan
Prior art keywords
adhesive
particles
graphite particles
conductive adhesive
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20319791A
Other languages
Japanese (ja)
Inventor
Naoki Fujinami
直樹 藤波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP20319791A priority Critical patent/JPH0525446A/en
Publication of JPH0525446A publication Critical patent/JPH0525446A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To provide the subject adhesive which has a high reliability, maintains a state of point contact necessary for electric continuity between electrode terminals on a circuit board, and withstands external influences such as an environmental change. CONSTITUTION:The objective adhesnve is prepd. by dispersing electrically conductive graphite particles pretreated with O3 and having a particle diameter of 5-100mum in an electrically insulating adhesive.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、異方導電接着剤、特に
は2つの回路基板の電極端子間に載置し、これらの回路
基板を接着するとともに両電極端子間を電気的に接続す
る異方導電接着剤に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive, in particular, it is placed between the electrode terminals of two circuit boards to bond these circuit boards and electrically connect the two electrode terminals. The present invention relates to an anisotropic conductive adhesive.

【0002】[0002]

【従来の技術】2つの回路基板間に電気的導通を与える
手段として、絶縁性接着剤中に導電性粒子を分散した種
々の異方導電接着剤を用いるものが知られている。特に
導電性粒子としてカーボン粒子を使用する際には、絶縁
性接着剤との密着度を増し、電気的導通の主たる役割で
ある回路基板の電極端子との点接触状態を保持するた
め、粒子に対し各種カップリング剤等のプライマーによ
る処理が施されている。
2. Description of the Related Art As a means for providing electrical continuity between two circuit boards, it is known to use various anisotropic conductive adhesives in which conductive particles are dispersed in an insulating adhesive. In particular, when using carbon particles as conductive particles, the degree of adhesion with the insulating adhesive is increased, and in order to maintain the point contact state with the electrode terminals of the circuit board, which is the main role of electrical conduction, On the other hand, it is treated with a primer such as various coupling agents.

【0003】[0003]

【発明が解決しようとする課題】しかし各種カップリン
グ剤等のプライマーによる処理方法では均一な表面処理
が困難で、特に処理量が多過ぎると粒子表面に絶縁皮膜
が形成され導電性を損なう危険がある。また処理剤が接
着剤中に溶出し劣化の原因となり、特に接着剤成分が熱
硬化系の場合には可使用時間に重大な悪影響を及ぼすお
それがある。
However, it is difficult to perform a uniform surface treatment by a treating method using a primer such as various coupling agents. Particularly, when the treating amount is too large, there is a risk that an insulating film is formed on the particle surface and the conductivity is impaired. is there. Further, the treatment agent is eluted into the adhesive and causes deterioration, and particularly when the adhesive component is a thermosetting system, there is a possibility that the usable time is seriously adversely affected.

【0004】[0004]

【課題を解決するための手段】本発明者は、異方導電接
着剤における接続の信頼性が、導電性粒子の材質よりも
その表面状態に起因するので、導電性粒子表面を活性化
させ、絶縁性接着剤との密着性を増せばよいことを見出
し、その処理方法、材料について種々研究した結果本発
明に到達したのであって、これは絶縁性接着剤中に導電
性粒子を分散させた異方導電接着剤において、該導電性
粒子が絶縁性接着剤と混合される以前に、O3 処理が施
された、粒径5〜100μmのグラファイト粒子である
ことを特徴とする異方導電接着剤を要旨とする。かかる
均一な表面処理を施した導電性粒子を用いることによ
り、絶縁性接着剤成分に対して悪影響を及ぼすことな
く、接着剤との密着性を増し、電気的導通の主たる役割
である回路基板の電極端子との点接触状態を保持するこ
とが可能な異方導電接着剤を提供することを得たのであ
る。
Means for Solving the Problems Since the reliability of the connection in the anisotropic conductive adhesive is due to the surface state of the conductive particles rather than the material thereof, the inventors have activated the surface of the conductive particles, It was found that the adhesiveness with the insulating adhesive should be increased, and the present invention was reached as a result of various researches on its treatment method and materials, which dispersed conductive particles in the insulating adhesive. In the anisotropic conductive adhesive, the anisotropic conductive adhesive is graphite particles having a particle size of 5 to 100 μm, which has been subjected to O 3 treatment before the conductive particles are mixed with the insulating adhesive. The main point is agents. By using the conductive particles that have been subjected to such a uniform surface treatment, the adhesiveness with the adhesive is increased without adversely affecting the insulating adhesive component, and the circuit board, which is the main role of electrical conduction, is Thus, it is possible to provide an anisotropic conductive adhesive capable of maintaining a point contact state with an electrode terminal.

【0005】本発明に用いられる導電性粒子は、長期に
わたる接続の信頼性が要求されるため、化学的に安定し
圧縮に対する強度が強いグラファイト粒子を用いるのが
望ましい。グラファイト粒子はO3 処理することにより
粒子表面にカルボキシル基等の官能基が付与されるとと
もに、表面が粗面化され、絶縁性接着剤との接触面積が
増し、ぬれ性が向上する。しかしグラファイト粒子であ
っても、粒径が5μmより小さい、特に1μmより小の
ものは、O3 処理により脆化し、十分な圧縮強度が得ら
れず、圧接時に粒子が砕けもしくは壊れ導通不良の原因
となるため1〜100μm、好ましくは5μm以上、よ
り好ましくは10μm以上100μm以下とするのがよ
い。
As the conductive particles used in the present invention, reliability of connection for a long period of time is required, and therefore it is desirable to use graphite particles which are chemically stable and have high strength against compression. By subjecting the graphite particles to O 3 treatment, a functional group such as a carboxyl group is imparted to the particle surfaces, and the surfaces are roughened to increase the contact area with the insulating adhesive and improve the wettability. However, even graphite particles having a particle size of less than 5 μm, particularly less than 1 μm, become brittle by O 3 treatment and cannot obtain sufficient compressive strength, and the particles are crushed or broken during pressure welding, causing poor conduction. Therefore, it is preferably 1 to 100 μm, preferably 5 μm or more, more preferably 10 μm or more and 100 μm or less.

【0006】このようなグラファイト粒子のO3 処理に
は、通常O3 含有ガス、例えばO3発生器からのガスを
そのままグラファイト粒子と接触させるか、あるいは溶
媒に分散したグラファイト粒子を攪拌下でO3 含有ガス
を吹き込む等の方法が用いられるが、後者の方法は処理
後の粒子の乾燥が必要となり、作業性を悪くするため、
前者の方法が好ましい。またグラファイト粒子を接着剤
と混合した後にO3 処理をすると、接続剤成分が酸化さ
れ、劣化および変質のような異常をきたすおそれがある
ため、必ず混合以前に処理を行う。
For the O 3 treatment of such graphite particles, an O 3 -containing gas, for example, a gas from an O 3 generator is usually brought into contact with the graphite particles as they are, or the graphite particles dispersed in a solvent are subjected to O 3 stirring. Although a method of blowing a 3 containing gas is used, the latter method requires drying of the particles after the treatment, which deteriorates workability,
The former method is preferred. If the graphite particles are mixed with the adhesive agent and then subjected to the O 3 treatment, the components of the connecting agent may be oxidized to cause abnormalities such as deterioration and deterioration. Therefore, the treatment is always performed before the mixing.

【0007】このような方法により得られるグラファイ
ト粒子の分散に用いられる電気絶縁性接着剤は、エチレ
ン−酢酸ビニル共重合体、カルボキシル変性エチレン−
酢酸ビニル体、エチレン−アクリレート共重合体、エチ
レン−エチルアクリレート共重合体、エチレン−イソブ
チルアクリレート共重合体、ポリアミド、ポリエステ
ル、ポリメチルメタクリレート、ポリビニルエーテル、
ポリビニルブチラール、ポリウレタン、スチレン−ブタ
ジエン−スチレン(SBS)ブロック共重合体、カルボ
キシル変性SBSブロック共重合体、スチレン−イソプ
レン−スチレン(SIS)共重合体、スチレン−エチレ
ン−ブチレン−スチレン(SEBS)共重合体、マレイ
ン酸変性SEBSブロック共重合体、ポリブタジエンゴ
ム、クロロプレンゴム(CR)、カルボキシル変性C
R、スチレン−ブタジエンゴム、イソブチレン−イソプ
レン共重合体、アクリロニトリル−ブタジエンゴム(N
BR)、カルボキシル変性NBR、エポキシ樹脂、シリ
コーンゴムなどから選ばれる一種または二種以上の組み
合わせを主剤として調製される。
The electrically insulating adhesive used for dispersing the graphite particles obtained by such a method is an ethylene-vinyl acetate copolymer, a carboxyl-modified ethylene-
Vinyl acetate, ethylene-acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-isobutyl acrylate copolymer, polyamide, polyester, polymethyl methacrylate, polyvinyl ether,
Polyvinyl butyral, polyurethane, styrene-butadiene-styrene (SBS) block copolymer, carboxyl-modified SBS block copolymer, styrene-isoprene-styrene (SIS) copolymer, styrene-ethylene-butylene-styrene (SEBS) copolymer Coalescence, maleic acid modified SEBS block copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl modified C
R, styrene-butadiene rubber, isobutylene-isoprene copolymer, acrylonitrile-butadiene rubber (N
BR), carboxyl-modified NBR, epoxy resin, silicone rubber or the like is used as a main agent.

【0008】上記主剤には、粘着付与剤として、ロジ
ン、ロジン誘導体、テルペン樹脂、テルペンフェノール
共重合体、石油樹脂、クマロンインデン樹脂、スチレン
系樹脂、イソプレン系樹脂、アルキルフェノール樹脂、
フェノール樹脂などが、一種または二種以上の組み合わ
せとして必要に応じ適宜添加される。
As the tackifier, rosin, rosin derivative, terpene resin, terpene phenol copolymer, petroleum resin, coumarone indene resin, styrene resin, isoprene resin, alkylphenol resin,
Phenolic resin and the like are appropriately added as necessary as a single type or a combination of two or more types.

【0009】また反応性助剤、架橋剤としてのフェノー
ル樹脂、ポリオール類、イソシアネート類、メラミン樹
脂、尿素樹脂、ウロトロピン類、アミン類、酸無水物、
過酸化物、金属酸化物、トリフルオロ酢酸クロム塩など
の有機酸金属塩、チタン,ジルコニア,アルミニウムの
アルコキシドなどの金属アルコキシド、ジブチルすずオ
キシドの有機金属化合物、2,2−ジエトキシアセトフ
ェノン、ベンジルなどの光開始剤、アミン類、りん化合
物、塩素化合物などの増感剤なども必要に応じて適宜選
択使用される。
Phenolic resins, polyols, isocyanates, melamine resins, urea resins, urotropins, amines, acid anhydrides as a reactive auxiliary agent and a crosslinking agent,
Peroxides, metal oxides, organic acid metal salts such as chromium trifluoroacetate, metal alkoxides such as alkoxides of titanium, zirconia and aluminum, organometallic compounds of dibutyltin oxide, 2,2-diethoxyacetophenone, benzyl, etc. The photoinitiators, sensitizers such as amines, phosphorus compounds, and chlorine compounds are appropriately selected and used as necessary.

【0010】また前記グラファイト粒子の配合量は、絶
縁性接着剤成分に対して多過ぎると確率的に平面方向に
連なって異方性を損い、少な過ぎると接続すべき電極端
子上に粒子が存在しなくなり、断線および高抵抗値化を
招くため、絶縁性接着剤成分100容量部に対して0.
1以上30容量部以下、好ましくは1以上15容量部以
下であることが好ましい。
If the amount of the graphite particles is too large with respect to the insulating adhesive component, the graphite particles stochastically connect in the planar direction to impair anisotropy, and if the amount is too small, particles are formed on the electrode terminals to be connected. Since it does not exist and leads to disconnection and increase in resistance value, it is 0.
It is preferably 1 or more and 30 parts by volume or less, more preferably 1 or more and 15 parts by volume or less.

【0011】本発明の異方導電接着剤は、一般に二つの
相対向する電子・電気回路基板上の電極端子群間に介在
させ、一方の電子・電気回路基板上方から加圧し、同時
に加熱あるいは光、電子線を照射して接着剤を活性化さ
せ、二つの回路基板を接着剤により固定し、相対向する
電極端子群を導電性粒子を介して電気的に接続する。こ
の回路基板は、具体的には表示パネルなどのガラス、L
SIチップなどの金属、金属酸化物あるいはポリイミ
ド、ポリエステル樹脂をベースとしたフレキシブルプリ
ント回路基板などである。これらの表面には、−OH,
−COOH,−C=O,−COOCH3 などの極性基を
備えているため、本接着剤にはこれに相応した接着剤を
もつことが要求され、その溶解性パラメーターとして
8.5以上、特には9以上のものが望ましい。
The anisotropic conductive adhesive of the present invention is generally interposed between two electrode terminal groups on two opposing electronic / electrical circuit boards, pressed from above one of the electronic / electrical circuit boards, and simultaneously heated or exposed to light. , Irradiating an electron beam to activate the adhesive, fixing the two circuit boards with the adhesive, and electrically connecting opposite electrode terminal groups through conductive particles. This circuit board is specifically made of glass such as a display panel, L
It is a flexible printed circuit board based on metal such as SI chip, metal oxide, polyimide, or polyester resin. These surfaces have -OH,
Since this adhesive has polar groups such as —COOH, —C═O, and —COOCH 3 , it is required that the adhesive has an adhesive corresponding to this, and its solubility parameter is 8.5 or more, particularly Is preferably 9 or more.

【0012】これら溶解性パラメーターの調整に際し、
アクリル樹脂、ニトリルゴム、クロブレンゴム、酢酸ビ
ニル樹脂などを主剤とする接着剤の場合は、ベースポリ
マーだけでも高い溶解性パラメーターをもっているため
このままでもよいが、ポリイソブチレン、ポリブタジエ
ン、ポリスチレンなどの低い溶解性パラメーターをもつ
樹脂を主剤とした接着剤の場合は、前述したフェノール
系樹脂などの粘着付与剤を加えることにより極性を相応
させることが可能となる。
In adjusting these solubility parameters,
In the case of adhesives based on acrylic resin, nitrile rubber, crobrene rubber, vinyl acetate resin, etc., the base polymer alone has a high solubility parameter, so it can be used as it is, but low solubility parameters such as polyisobutylene, polybutadiene, polystyrene, etc. In the case of an adhesive containing a resin having as a main component, it is possible to make the polarity suitable by adding a tackifier such as the above-mentioned phenolic resin.

【0013】本発明の異方導電接着剤では、接着成分が
常温、無溶剤で固形状態あるいは高粘度液状の場合、こ
れを適当な溶剤に溶解し、印刷、コーティング、スプレ
ー等の公知の方法により接続すべき電極端子上に直接塗
布形成するか、セパレータ上に形成した後に、所望の寸
法にカットし、これを接続電極端子の部に転写して用い
るか、また接着剤成分が液状である場合には接続作業時
に接続電極端子上に塗布して用いることができる。これ
により導電性粒子表面の均一な粗面化および活性化が可
能となり、絶縁性接着剤との接触面積が増し、ぬれ性、
接着性が向上する。さらに絶縁性接着剤に対し全方向か
ら均一に高い密着性が得られ、外力による微視的な動き
が抑制されると同時に電気的導通の主たる役割である点
接触状態に保持することが可能となる。またO3 含有ガ
スを直接粒子に接触させるため処理効率がよく、溶媒を
用いないので処理後の乾燥が不必要となる作業上の利点
がある。
In the anisotropic conductive adhesive of the present invention, when the adhesive component is a solvent-free solid state or a high-viscosity liquid at room temperature, it is dissolved in an appropriate solvent and subjected to a known method such as printing, coating or spraying. If it is applied directly on the electrode terminal to be connected or formed on the separator, cut it to the desired size and transfer it to the connection electrode terminal part for use, or when the adhesive component is liquid Can be used by coating on the connection electrode terminals at the time of connection work. This makes it possible to uniformly roughen and activate the surface of the conductive particles, increase the contact area with the insulating adhesive, wettability,
Adhesion is improved. Furthermore, high adhesion to the insulating adhesive is obtained in all directions, and microscopic movement due to external force is suppressed, and at the same time it is possible to maintain the point contact state, which is the main role of electrical conduction. Become. Further, since the O 3 -containing gas is brought into direct contact with the particles, the treatment efficiency is good, and since no solvent is used, there is an operational advantage that drying after the treatment is unnecessary.

【0014】[0014]

【実施例】【Example】

(実施例)平均粒径30μmのグラファイト粒子(鐘紡
製、グラファイト粒子ベルパールC−2000)75g
を、10リットル円筒フィルター付きガス濾過装置に投
入し、O3 含有量4.5容量%のガスを55リットル/
時の割合で連続的に吹き込み、気流中で攪拌しながら約
4時間処理し、O3 処理グラファイト粒子を得た。つぎ
にアクリロニトリル−ブタジエンゴム(NBR)100
重量部に対し、アルキルフェノール系粘着付与剤45重
量部を加え、トルエンに溶解し、30重量%の接着剤溶
液とした。この接着剤溶液100重量部に対し上記O3
処理グラファイト粒子7重量部を加え本発明の異方導電
接着剤を得た。つぎに25μmのPETフィルム上に銀
ペーストにて0.4mmピッチの電極端子群を形成した
フレキシブルプリント回路基板上に、乾燥後の膜厚が3
0μmとなるように前記異方導電接着剤層を設け、異方
導電接着剤層付きフレキシブルプリント回路基板を得
た。
(Example) 75 g of graphite particles having an average particle size of 30 μm (graphite particles, Bellpearl C-2000, manufactured by Kanebo)
Was charged into a gas filter equipped with a 10-liter cylindrical filter, and 55 liters of gas having an O 3 content of 4.5% by volume was added.
O 3 -treated graphite particles were obtained by continuously blowing at a rate of time and treating for about 4 hours while stirring in an air stream. Next, acrylonitrile-butadiene rubber (NBR) 100
45 parts by weight of an alkylphenol tackifier was added to parts by weight and dissolved in toluene to obtain a 30% by weight adhesive solution. For 100 parts by weight of this adhesive solution, the O 3
7 parts by weight of the treated graphite particles were added to obtain an anisotropic conductive adhesive of the present invention. Next, a film thickness after drying was 3 on a flexible printed circuit board in which a 0.4 mm pitch electrode terminal group was formed by a silver paste on a 25 μm PET film.
The anisotropic conductive adhesive layer was provided so as to have a thickness of 0 μm to obtain a flexible printed circuit board with an anisotropic conductive adhesive layer.

【0015】(比較例)導電性粒子として、平均粒径3
0μmのO3 未処理のベルパールC−2000を用いた
他は、実施例と同様に異方導電接着剤層付きフレキシブ
ルプリント回路基板を得た。
(Comparative Example) As the conductive particles, the average particle size is 3
A flexible printed circuit board with an anisotropic conductive adhesive layer was obtained in the same manner as in Example except that 0 μm O 3 untreated Belpearl C-2000 was used.

【0016】実施例および比較例で得た異方導電接着剤
層付きフレキシブルプリント回路基板と面積抵抗率30
ΩのITOベタガラス基板とを140℃、20kg/c
2、10secの条件でヒートシール接続し、熱衝撃
試験(−30℃、30分と85℃、30分の条件を交互
に1000回繰り返す)および常温環境下50cmの高
さからの落下試験を行い、各フレキシブルプリント回路
基板とITOベタガラス基板の電極端子間の抵抗値を測
定し、その結果を表1、2に示す。
Flexible printed circuit boards with anisotropic conductive adhesive layers obtained in Examples and Comparative Examples and area resistivity 30
Ω ITO solid glass substrate at 140 ℃, 20kg / c
m 2, was heat sealed connection conditions of 10 sec, thermal shock test (-30 ° C., 30 minutes 85 ° C., repeated 1000 times alternately 30 min conditions) and the drop test from a height of a normal temperature environment 50cm Then, the resistance value between the electrode terminals of each flexible printed circuit board and the ITO solid glass substrate was measured, and the results are shown in Tables 1 and 2.

【0017】[0017]

【表1】 [Table 1]

【0018】[0018]

【表2】 [Table 2]

【0019】[0019]

【発明の効果】本発明の異方導電接着剤を用いれば、O
3 処理により表面が均一に粗面化および活性化された導
電性グラファイト粒子が、全方向から均一、強固に絶縁
性接着剤に接着され、回路基板の電極端子間の電気的導
通に必要な点接触状態が保持され、環境変化等の外力に
よる影響にも耐え得る信頼性の高い電気、電子部品を提
供できる。
When the anisotropic conductive adhesive of the present invention is used, O
3 The conductive graphite particles whose surface has been uniformly roughened and activated by the treatment are uniformly and firmly adhered to the insulating adhesive from all directions, and are necessary for electrical conduction between the electrode terminals of the circuit board. It is possible to provide a highly reliable electric or electronic component that maintains a contact state and can withstand the influence of external force such as environmental change.

Claims (1)

【特許請求の範囲】 【請求項1】 絶縁性接着剤中に導電性粒子を分散させ
た異方導電接着剤において、該導電性粒子が絶縁性接着
剤と混合される以前に、O3 処理が施された、粒径1〜
100μmのグラファイト粒子であることを特徴とする
異方導電接着剤。
Claim: What is claimed is: 1. An anisotropic conductive adhesive having conductive particles dispersed in an insulating adhesive, wherein an O 3 treatment is performed before the conductive particles are mixed with the insulating adhesive. Particle size 1
An anisotropic conductive adhesive characterized by being 100 μm graphite particles.
JP20319791A 1991-07-19 1991-07-19 Anisotropically conductive adhesive Pending JPH0525446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20319791A JPH0525446A (en) 1991-07-19 1991-07-19 Anisotropically conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20319791A JPH0525446A (en) 1991-07-19 1991-07-19 Anisotropically conductive adhesive

Publications (1)

Publication Number Publication Date
JPH0525446A true JPH0525446A (en) 1993-02-02

Family

ID=16470075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20319791A Pending JPH0525446A (en) 1991-07-19 1991-07-19 Anisotropically conductive adhesive

Country Status (1)

Country Link
JP (1) JPH0525446A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504138A (en) * 1985-05-31 1996-04-02 Jacobs; Richard Circuit board devices with superconducting bonds and lines
DE102011100716A1 (en) 2010-07-29 2012-03-22 Tokai Rubber Industries, Ltd. Cabling element connector assembly
CN111057485A (en) * 2019-12-31 2020-04-24 深圳市撒比斯科技有限公司 Hollow conductive particles for anisotropic conductive adhesive film and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279986A (en) * 1988-05-06 1989-11-10 Asahi Chem Ind Co Ltd Highly conductive adhesive

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279986A (en) * 1988-05-06 1989-11-10 Asahi Chem Ind Co Ltd Highly conductive adhesive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504138A (en) * 1985-05-31 1996-04-02 Jacobs; Richard Circuit board devices with superconducting bonds and lines
DE102011100716A1 (en) 2010-07-29 2012-03-22 Tokai Rubber Industries, Ltd. Cabling element connector assembly
US9040839B2 (en) 2010-07-29 2015-05-26 Sumitomo Riko Company Limited Wiring body connection structure
DE102011100716B4 (en) 2010-07-29 2022-10-06 Sumitomo Riko Company Limited Wiring element connection setup
CN111057485A (en) * 2019-12-31 2020-04-24 深圳市撒比斯科技有限公司 Hollow conductive particles for anisotropic conductive adhesive film and preparation method thereof

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