JPH0525205Y2 - - Google Patents
Info
- Publication number
- JPH0525205Y2 JPH0525205Y2 JP683689U JP683689U JPH0525205Y2 JP H0525205 Y2 JPH0525205 Y2 JP H0525205Y2 JP 683689 U JP683689 U JP 683689U JP 683689 U JP683689 U JP 683689U JP H0525205 Y2 JPH0525205 Y2 JP H0525205Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin terminal
- coil bobbin
- heat
- pin
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000002513 implantation Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000005476 soldering Methods 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 9
- 230000005855 radiation Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP683689U JPH0525205Y2 (enExample) | 1989-01-23 | 1989-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP683689U JPH0525205Y2 (enExample) | 1989-01-23 | 1989-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0298609U JPH0298609U (enExample) | 1990-08-06 |
| JPH0525205Y2 true JPH0525205Y2 (enExample) | 1993-06-25 |
Family
ID=31211336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP683689U Expired - Lifetime JPH0525205Y2 (enExample) | 1989-01-23 | 1989-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525205Y2 (enExample) |
-
1989
- 1989-01-23 JP JP683689U patent/JPH0525205Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0298609U (enExample) | 1990-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5212345A (en) | Self leaded surface mounted coplanar header | |
| JPH07142627A (ja) | 半導体装置及びその製造方法 | |
| JPH0525205Y2 (enExample) | ||
| JPH11250868A (ja) | 基板装着用電球装置 | |
| JP2003204126A (ja) | 樹脂成形基板および樹脂成形基板ユニット | |
| JPH03163808A (ja) | インダクタンス部品 | |
| JP3951400B2 (ja) | 電子回路モジュール | |
| US5187407A (en) | Electric lamp | |
| JPS6223064Y2 (enExample) | ||
| JPH0723946Y2 (ja) | 小型コイル | |
| JP3249017U (ja) | 高架型表面実装インダクタ | |
| JPH08293401A (ja) | 電子部品用支持台及び電子部品の実装構造 | |
| JP3341708B2 (ja) | トランス | |
| JPH0543983Y2 (enExample) | ||
| JPS6339936Y2 (enExample) | ||
| JPH0514489Y2 (enExample) | ||
| JP2829858B2 (ja) | チップ形コンデンサおよびその製造方法 | |
| JPH0353464Y2 (enExample) | ||
| JPS6125217Y2 (enExample) | ||
| JP2536998Y2 (ja) | チップコイル | |
| JP2001244666A (ja) | 抵抗器の放熱構造 | |
| JPH0414900Y2 (enExample) | ||
| WO2024203356A1 (ja) | 部品実装基板及び部品実装基板の製造方法 | |
| JPH0427121Y2 (enExample) | ||
| JPS6234412Y2 (enExample) |