JPH05251675A - Solid-state image sensor and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a small-sized solid-state image sensor by sealing its package in such a manner that the welding part extends vertically between the base and cap of the sensor. CONSTITUTION:An image sensor chip 5 is fixedly mounted on a base 1 and connected electrically with lead pins 6 through wires 7. The base 1, held in a sealing metal cylinder 2, is inserted until the upper end of the ring abuts on a positioning projection 8 in a metal cap 3. While a welding electrode is pressed against a welding part 9, the metal cap 3 is welded to the metal cylinder 2 for sealing. Since the welded part between the base and the cap extends vertically between them, a small package can be provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device and a method of manufacturing the same, and more particularly, to a solid-state image pickup device (image sensor) having a reduced outer shape by improving processing technology and mounting technology.
And a manufacturing method thereof.

[0002]

2. Description of the Related Art With the recent trend toward higher performance and higher density of image sensors, downsizing of image sensors has progressed, and cameras using them have also been downsized. In miniaturization, not only the mounting density of components must be improved, but also the outer shape of the image sensor itself must be miniaturized.

FIG. 9 is a top view and a sectional view showing the structure of a small image sensor enclosed in a conventional package, for example, in which 91 is an image sensor chip and 92 is a ceramic base. Has a two-step recess in the center, and the chip 91 is placed on the bottom of the recess, that is, the bottom of the first step, and the bottom surface of the second step, that is, the edge of the first step is the chip 91. It has the same height as the surface of the chip, where the chip 91 and the lead pin 93 are located.
And a bonding portion for establishing electrical continuity with the base 92.
A glass lid 95 is placed on the surface of the to seal the package. Reference numeral 93 denotes a lead pin for connecting to the outside. In this figure, as an example, a PGA (pin gr
id array package: shows a package with a pin grid array package structure. Reference numeral 94 is a wire for establishing conduction between the chip 91 and the lead pin 93. The base 92, lead pin 93, wire 94, glass lid 95
The package is more organized. 9 (a) is a top view and FIG. 9 (b) is a cross-sectional view. In FIG. 9 (a), the glass lid 95 is shown in a transparent manner for ease of explanation.

Next, a method of encapsulating the image sensor chip 91 in a package will be briefly described. First, the chip 91 of the image sensor is die-bonded on the bottom surface of the first-step concave portion of the ceramic base 92 using a resin or the like, and electrical continuity with the lead pin 93 is established by a wire 94, and then the glass lid 95 is formed on the base 92 using a resin or the like. The package is sealed by mounting the chip 91 on the surface and adhering the chip 91 in the package.

Diagonal length Ld of the image sensor chip 91
Must be made as small as possible in order to mount the chip 91 on the ceramic base 92 and enclose it in the package. The size of the outer shape of the image sensor is determined by the dimensions determined by the diagonal length (Ld) of the image sensor chip 91 and the bonding margin (Lpd) of the glass lid 95. Normally, the chip 91 is a rectangle, and when the vertical and horizontal directions of the chip 91 are X and Y, the diagonal length Ld is

Ld = (X ² + Y ² ) ^1/2

Therefore, the size of the image sensor, that is, the size of the package is limited by the value of Ld. Further, the adhesive margin Lpd is equal to the base 92.
In order to reliably seal the surface of the glass and the glass lid 95 with an adhesive and ensure the reliability of the airtightness of the package, a dimension of at least 1 mm or more is required.
Is a dimension obtained by adding at least 2 mm or more to the diagonal length Ld of the chip 91.

Next, another conventional example will be described. Figure 1
Reference numeral 0 is a top view and a sectional view showing a structure of a laser diode or a photodiode enclosed in a conventional package. In the figure, 101 is a ceramic base, and a metal collar 102 is previously provided on the base 101. It is fixed so as to cover the base 101. Reference numeral 103 is a metal cap, and a glass window 104 is previously adhered to the cap 103. Reference numeral 105 is a lead pin for connecting to the outside, 106 is a chip of a laser diode or a photodiode, and 107 is a wire for connecting the chip 106 and the lead pin 105. A package is composed of the base 101, the collar 102, the metal cap 103, the glass window 104, the lead pin 105, and the wire 107. 10A is a top view,
FIG. 10 (b) shows a cross-sectional view, and FIG. 10 (a) shows the glass window 104 in a see-through manner for ease of explanation.

Next, a method of enclosing the chip 106 in a package will be described. The chip 106 is fixed via the collar 102 on the ceramic base 101 with the collar 102, and the wire 107 is electrically connected to the lead pin 105.
After that, the metal cap 1 to which the glass window 104 is adhered
03, and the portion indicated by Z in the figure is fixed by welding or the like to encapsulate the chip 106 in the package. With this arrangement, the upper portion of the package has a diameter indicated by φc, but since the fixing portion has the brim 102, the package bottom portion is indicated by the dimension φd obtained by adding the width of the fixing portion, that is, the adhesion margin to φc. Diameter.

[0010]

Since the conventional solid-state image pickup device and the method for manufacturing the same are configured as described above, in order to seal the chip in the package, the package is sealed in the package. It is necessary to provide an adhesive portion such as the collar 102 as shown in the conventional example, and in order to ensure the airtightness of the package, the adhesive portion needs to have a dimension of at least 1 mm or more. In the case of the conventional example shown in FIG.
A stepped recess had to be provided. For this reason, the base shape becomes larger by that amount, and as a result, the outer shape of the package becomes larger, which is not suitable for downsizing.

The present invention has been made in order to solve the above problems, and provides a solid-state image sensor using a processing technique and a mounting technique which are highly reliable and suitable for miniaturization, and a manufacturing method thereof. The purpose is to

[0012]

A solid-state image pickup device according to the present invention has a circular base on which a chip is mounted, a cover metal covering the entire side wall of the base, and an inner side wall of a metal cap provided with the base metal. It has a projection for positioning vertically when the cap is put on, and has a package in which the coating metal and the cap are fixed by welding.

Further, the solid-state image pickup device according to the present invention has a corner-eliminating scribe line such that the portions cut off along it have similar shapes to each other, and the scribe line and each side thereof have a predetermined angle. It has a chip obtained by scribing a quadrangular chip along a scribe line for removing the corner.

Further, in the method for manufacturing a solid-state image pickup device according to the present invention, a chip separating scribe line for separating individual chips and each side of the chip are provided on a wafer attached on an elastic sheet. A scribe line for corner cutting is formed so that portions cut off along a predetermined angle have a similar shape to each other, and the wafer is quadrangular chips along the scribe line for chip separation. After that, the peripheral portion of the stretchable sheet is pulled outward to stretch the sheet, and a predetermined gap is provided between the separated chips, and a scribe for scooping the separated chips. A plurality of chips are scribed simultaneously along each of the two straight lines connecting the lines, and the four corners of each chip are rounded off.

Further, in the method for manufacturing a solid-state image pickup device according to the present invention, chip separating scribe lines for separating the individual chips are formed on the wafer, and the chip separating scribe lines intersect each other vertically. After forming a hole penetrating the wafer, the wafer is scribed along the chip separating scribe line to separate the individual chips.

Further, in the method of manufacturing a solid-state image pickup device according to the present invention, the wafer is cut along the chip separating scribe line on the wafer to separate the individual chips,
The four corners of the chip are removed by polishing or cutting with a diamond cutter.

The solid-state image pickup device according to the present invention is a solid-state image pickup device in which a base on which a chip is mounted is covered with a metal cap to fix the contact portion between the two, and the package is sealed. The above chip is a circular chip.

Further, in the method for manufacturing a solid-state image pickup device according to the present invention, a cylindrical blade is pressed against the wafer and the blade is rotated, or a jig having a circular contact portion with the wafer is used. The circular tip is cut out by applying ultrasonic waves to the.

[0019]

In the solid-state image pickup device according to the present invention, the adhesive portion between the base and the cap for enclosing the package is provided in the vertical direction of the package, so that the package can be downsized and its outer shape can be reduced.

Further, in the solid-state image pickup device and the method of manufacturing the same according to the present invention, the diagonal shape of the chip is reduced by devising the shape of the chip, so that the package can be further reduced.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a top view and a sectional view showing a mounting method of a solid-state image pickup device according to a first embodiment of the present invention, in which 1 is a circular base made of an electrical insulator such as ceramics, The image sensor chip 5 is mounted on the bottom of the recess, and the edge surface of the recess, that is, the surface of the base 1 is at the same height as the surface of the image sensor chip 5, and the chip 5 and A bonding portion is formed to establish electrical connection with the lead pin 6. 2 is a metal-made cylindrical metal ring for sealing, which is a base 1
It is designed to fit in and fit into it. A metal cap 3 is provided with a positioning projection 8 and a welding projection 9 for positioning in the vertical direction on the inner wall surface thereof, and a glass window 4 is fixed to the ceiling portion of the cap 3. Reference numeral 5 is an image sensor chip, and 6 is a lead pin for connecting to the outside.
Since the structure package is shown as an example, the lead pin 6
Are attached to the back surface of the base 1 at equal intervals vertically and in a grid pattern. Reference numeral 7 is a wire for establishing electrical connection between the image sensor chip 5 and the lead pin 6, 8 is a positioning protrusion provided on the inner wall surface of the metal cap 3 as described above, and 9 is fixed around the base 1. It is a projection for welding provided on the inner wall surface of the metal cap 3 for fixing the sealing metal cylindrical ring 2 and the metal cap 3 together. And the base 1, the sealing metal cylindrical ring 2,
A package is constituted by the metal cap 3, the glass window 4, the lead pin 6, and the wire 7. 1 (a) is a top view and FIG. 1 (b) is a cross-sectional view, but the glass window 4 is seen through in the top view for ease of explanation.

Next, a method of enclosing the image sensor chip 5 in the package will be described. In advance, the base 1 is fitted in the sealing metal cylindrical ring 2 so as to be fixed using an adhesive or the like. Further, the glass window 4 is also fixed to the ceiling portion of the metal cap 3. Furthermore, the metal cap 3 is provided with a positioning projection 8 for covering the base 1 with the metal cap 3 so that the bottoms of the metal cap 3 and the base 1 are aligned when the base 1 is covered with the metal cap 3. A welding projection 9 for fixing the base 1 and the metallic cap 3 to each other via the metallic cylindrical ring 2 is formed in advance. First,
Place the image sensor chip 5 on the base 1 and fix it,
The wire 7 connects the sensor chip 5 and the lead pin 6 to each other. Then, the base 1 fitted in the sealing metal cylindrical ring 2 is pushed until the upper end of the sealing metal cylindrical ring 2 comes into contact with the positioning projection 8 of the metal cap 3. Finally, the metal cap 3 and the sealing metal cylindrical ring 2 are welded while pressing the electrode for electric welding against the welding projection 9 to seal the package. In this way, the image sensor chip 5 is enclosed in the package.

As described above, in the above-described embodiment, in order to secure the airtightness of the package, the fixing portion for fixing the base 1 and the metal cap 3 is not provided horizontally as in the conventional example, but the base 1 is fixed. Since it is provided in a vertical direction between the metal cap 3 and the metal cap 3, the horizontal bonding margin is the thickness of the metal cap 3. Here, the thickness of the metal cap 3 is at most several hundreds of μm, and by using such a structure, the diameter φd becomes approximately the same as the diagonal length Ld of the chip 5 at both the top and bottom of the package. Therefore, the outer shape of the package can be reduced.

Next, a second embodiment of the present invention will be described. 2A and 2B are a top view and a sectional view showing a mounting method of a solid-state image sensor according to a second embodiment of the present invention.
The same reference numerals as those in FIG. 1 indicate the same or corresponding parts. In FIG. 2, 11 is solder plating provided on the inner surface of the peripheral wall of the metal cap 3, 12 is a metal coating provided on the outer peripheral wall of the base 1, and 13 is solder plating provided on the outside of the metal coating 12. .. A portion indicated by 10 is a soldering metallization portion for sealing the base 1 and the metal cap 3 with solder, and the soldering metallization portion 10 includes solder platings 11 and 13 and a metal film. 1
It is composed of two. 2 (a) is a top view, FIG. 2 (b) is a sectional view, and FIG. 2 (c) is an enlarged view of the soldering metallized portion 10 shown in FIG. 2 (b). In the top view, the glass window 4 is shown transparently for ease of explanation. In this embodiment, the case where solder is used to seal the base 1 and the metal cap 3 has been described. Only the protrusion 8 for positioning is formed on the metal cap 3, and solder plating 11 is previously formed on the portion for sealing with the base 1 as required. Further, the metal film 12 is a film formed of solder or a metal that can be connected by solder, and when the solder cannot be adhered due to the material of the base 1, the metal film 12 is formed of a metal that can be connected by solder. If the material of the base 1 can be soldered, the metal coating 12 may be formed by solder.

Next, a method of enclosing the image sensor chip 5 in the package will be described. Similar to the first embodiment, the glass window 4 is fixed to the metal cap 3 in advance. Further, the metal cap 3 is provided with a positioning projection 8 and a solder plating 11. Further, on the outer peripheral wall surface of the base 1, a metal film 12 and a solder plating 13 are formed.
Is formed. First, the image sensor chip 5 is adhered to the base 1, the chip 5 and the lead pin 6 are electrically connected by the wire 7, and then the positioning projection 8 of the metal cap 3 is brought into contact with the solder-plated portion 13 at the upper end of the base 1. Insert up to. After that, by melting the solder plating 11 and 13 in a furnace or the like, the base 1 and the metal cap 3 are sealed, and the image sensor chip 5 is sealed in the package.

In this embodiment, since it is necessary to raise the temperature to melt the solder platings 11 and 13 at the end, for example, an image sensor having a color filter whose performance deteriorates when the temperature rises is formed. However, high melting point solder may not be applicable. At this time, sealing can be performed by using solder having a low melting point.

As described above, in the above-described embodiment, as in the case of the first embodiment, the bonding portion is provided in the vertical direction,
Further, since the sealing is also performed by using the solder, the bonded portion has the thickness of the metal cap 3. Therefore,
In this case as well, the diameter φd of the top and bottom of the package is approximately the same as the diagonal length Ld of the chip 5, so that the outer diameter of the package can be reduced.

Although the first and second embodiments have been described by taking the image sensor package as an example, they can also be applied to a photodiode or laser diode package as in the conventional example.

Although the mounting method capable of reducing the outer shape of the package has been described above, further miniaturization can be achieved by processing the shape of the chip itself. That is, the package can be made smaller by dropping the corners of the chip so that the diagonal length Ld of the chip becomes shorter.
Hereinafter, this chip shape processing method will be described as a third embodiment of the present invention.

FIG. 3 is a process diagram showing a method for processing a chip shape according to a third embodiment of the present invention. Here, scribe (dicing) for cutting out a sensor chip from a wafer.
The process is shown. In the figure, 31 is a wafer, 32 is an elastic vinyl sheet laid under the wafer 31, and 33 is a wafer 31 such as a diamond cutter.
A scribe line for chip separation when separating the wafer into individual chips, 34 is an arrow indicating a place where the wafer 31 is cut along the scribe line 33, and 35 is a scribe line for corner cut formed on each chip. It is a straight line, and the corners of each chip are removed along this straight line.

Next, the chip corner removing process will be described. First, as shown in FIG. 3 (a), the wafer 31 is attached to a vinyl sheet 32, and then the chip is moved along the chip separation scribe line 33 with a diamond cutter or the like in an arrow mark 3
Separate as shown in Fig. 4 (Fig. 3 (b)). Next, the expanding step shown in FIG. 3 (c) is entered, in which the peripheral edge portion of the vinyl sheet 32 is pulled from the outside with the same force, and the sheet 32 is stretched to attach the chips to it. In the step of opening a desired interval in the process, it is usually performed until an interval of about several mm occurs between the chips, but in the present embodiment,
The expansion is performed until a distance L determined by the chip size and the corner drop size is generated. For example, as shown in FIG. 3 (d), when expanding a chip composed of a square chip with one side a, after that, each scribe line 33 is rounded off at an angle of 45 degrees. That is, in the case where a right-angled isosceles triangle with one side being b is cut out from the four corners of the chip, the interval L widened by the expanding is given by the following equation.

L = a-2b

When the expansion is performed until the interval L determined by the above equation is generated, a right-angled isosceles triangle of one side b having the same shape can be cut out from the four corners of the chip. After performing the expanding, the scribing is performed again along the straight line 35 connecting the corner scribing lines shown in FIG. 3 (e). That is, a right-angled isosceles triangle whose one side is b is cut out from four corners in each chip. When removing the corners of the chip, it is necessary to previously form a chip layout and a scribe line for corner removal when designing the chip. FIG. 4 is a diagram for explaining a chip shape processing method according to a third embodiment of the present invention. In the figure, 41 is a chip, and 42 is a chip separating scribe for separating chips on a wafer into respective chips. Line, and the scribe line 33 for chip separation shown in FIG.
Equivalent to. Reference numeral 43 denotes a corner-eliminating scribe line, which corresponds to the straight line 35 connecting the corner-eliminating scribe lines shown in FIG. Since a square chip is used in this embodiment, the layout and scribe lines as shown in FIG. 4A are formed.

On the other hand, FIG. 4B and FIG. 4C show the layout of chips and the state of scribe lines when the chips are rectangular. Even in this case, it is possible to perform the shape processing by chipping the corner, but the rectangular chip requires the corner scribing line 43 having an angle different from 45 degrees with respect to the chip separating scribing line 42. For example, the dimension of the short side (vertical side in the figure) of the rectangular chip 41 shown in the figure is c, and the dimension of the long side (horizontal side in the figure) is e, and the angle with the horizontal scribe line 42 is defined. The chip 41 is separated by θ ₁ and is separated from the vertical scribe line 42 by an angle θ _2.
When a triangle is cut out from the four corners of which the horizontal side is d and the vertical side is f, the horizontal expanding amount L ₁ and the vertical expanding amount L ₂ are respectively given by the following equations. ..

L ₁ = c / tan θ ₁ -2d L ₂ = e / tan θ ₂ -2f

When expansion is performed until the intervals L ₁ and L ₂ determined by the above equation are produced, four rectangular chips are obtained.
Triangles of the same shape can be cut out from the corners.

As described above, in the above embodiment, the chip size is reduced by removing the corners of the chip. Therefore, it is possible to use a package corresponding to the chip having a small size. It becomes possible to do.

In the third embodiment described above, the corner removal at the stage of scribing the chip has been described, but it is also possible to perform the corner removal in advance in a wafer state. Hereinafter, this processing method will be described as a fourth embodiment of the present invention.

FIGS. 5 and 6 are views for explaining a chip shape processing method according to a fourth embodiment of the present invention. In the drawings, 51 and 61 are wafers and 52 and 62 are wafers 51 and 61, respectively. Chip separating scribe lines for separating the above chips, 53 and 63 are circular holes formed at the intersections of the chip separating scribe lines 52 and 62 intersecting vertically and square holes rotated at 45 degrees. is there. Here, a circular hole 53 or a square hole 63 is opened in a wafer state before separating each chip in a portion where corner cutting for reducing each chip size is required. The circular hole 53 can be formed by mechanical processing using a rotating body such as a drill. On the other hand, the square hole 63 is formed by photolithography at the final stage of the wafer process.
A method is conceivable in which a portion other than the portion where 3 is formed is covered with a resist and then etched. Also, after the wafer process is completed,
A method in which a jig having the same shape as the rectangular hole 63 is pressed against the wafer 61 and ultrasonic waves are applied to form a hole having the same shape as the jig is also possible. Although other processing methods are conceivable, as in the present embodiment, by cutting out the corner-removed portions as holes in the wafer state in advance, even if only the normal scribing process is performed, four corners of each chip are processed. Since the corners of the chip have been removed, the diagonal length of the chip can be shortened to reduce the outer shape.

If the chip is cut out from the wafer in a circular shape and the shape is a circle, the chip size can be further reduced. This method will be described below. FIG. 7 is a diagram for explaining a chip shape processing method according to a fifth embodiment of the present invention, in which 71 is a wafer and 7 is a wafer.
Reference numeral 2 is a circular diamond cutter blade, and 73 is an ultrasonic wave transmission jig. FIG. 7 (a) illustrates a method of mechanically cutting out a circular chip. Here, by bringing the blade 72 of the annular diamond cutter into contact with the wafer 71 and rotating it, it becomes possible to cut out a circular chip having the same diameter as the inner diameter of the annular diamond cutter blade.

FIG. 7B illustrates a method of cutting out a circular chip using ultrasonic waves. The ultrasonic transmission jig 73 used here has a circular cross section as shown in FIG. 7 (c) up to a predetermined depth in the lower part, and its bottom view is shown in FIG. 7 (d). There is. When the jig 73 for transmitting ultrasonic waves is pressed against the wafer 71, the ultrasonic waves are guided by the jig 73, and the ultrasonic waves are applied to the wafer 71. This allows
The wafer 71 is excavated in the same shape as the bottom surface of the ultrasonic wave transmission jig 73, and finally a circular chip can be cut out. In this way, by cutting a circular chip directly from the wafer, a chip of a desired size can be easily obtained, and when the chip has a circular shape, the package has a circular shape. The outer shape can be further miniaturized.

In the above-described embodiments, an example in which the corner of the chip is cut before the sensor chip is separated from the wafer has been described, but as another embodiment, a method of cutting the corner after cutting a square chip from the wafer is also used. Thought,
This method will be described below. FIG. 8 is a diagram for explaining an example of a chip shape processing method according to a sixth embodiment of the present invention. In the figure, 81 and 83 are jigs for holding chips, and FIG. (b) shows the top view and cross-sectional view, respectively. Reference numeral 82 is a chip cut into a square, 84 is a blade of a diamond cutter, and 85 is a grindstone.

Next, the method of removing corners will be described. First, a plurality of sensor chips 82 are stacked on the chip holding jig 81. This state is shown in Fig. 8 (c).
Reference numeral 2 indicates that the four corners of the jig 81 are projected from the chip holding jig 81. This is pressed from above by the other chip holding jig 83 (FIGS. 8 (d) and 8 (e)). As shown in the figure, the chip 82 is fixed with its four corners protruding from the chip holding jigs 81 and 83. Next, a corner is removed from the protruding corner. FIG. 8 (f) shows the case of cutting off with a rotating diamond cutter blade 84, and FIG. 8 (g) shows an example of polishing a corner while pressing a rotating polishing grindstone 85 from the side surface of the tip 82. Shows. In this way, the corners can be removed from the four corners of the chip, which makes it possible to reduce the chip size and the package outline.

[0044]

As described above, according to the solid-state image pickup device of the present invention, since the adhesive portion between the base and the cap for encapsulating the package is provided in the vertical direction of the package, the outer shape of the package is the chip size. Since it can be made as small as the above, there is an effect that the outer shape can be further miniaturized.

Further, according to the solid-state image pickup device and the method of manufacturing the same according to the present invention, since the diagonal shape of the chip is reduced by devising the shape of the chip, a package corresponding to the chip having a small size is used. Because you can
Further, there is an effect that the outer shape can be reduced.

Further, according to the method for manufacturing a solid-state image pickup device of the present invention, when the corners of a quadrangular chip are removed, a stretchable sheet having individually separated chips thereon is expanded. After that, since the chips were scribed at the same time by scribing the chips along each of the two straight lines that connect the scribe lines for corner removal, the chips were efficiently edged,
Moreover, the corners can be easily removed to obtain a small-sized chip, which has the effect of efficiently obtaining a solid-state imaging device having a small outer shape.

Further, according to the method for manufacturing a solid-state image pickup device of the present invention, chip corners are removed during the wafer-state manufacturing process. Therefore, in the subsequent scribing process for separating each chip, Since the corners of the chip are dropped just by scribing, there is an effect that a solid-state image pickup device having a small outer shape can be easily obtained without complicated work.

Further, according to the method of manufacturing a solid-state image pickup device according to the present invention, after the corner drop of the chip is separated into individual chips, the four corners are cut by polishing or a diamond cutter. It is possible to obtain a solid-state image sensor which can be mechanically processed and has a small size with good efficiency and reproducibility in manufacturing.

Further, according to the solid-state image pickup device of the present invention, since the chip mounted on the base is a circular chip, the diagonal line is minimized, and the solid-state image pickup device having a smaller outer shape can be obtained.

Further, according to the method of manufacturing a solid-state image sensor according to the present invention, the circular chip is cut out by pressing a cylindrical blade against the wafer and rotating the blade, or by ultrasonic waves. There is an effect that a circular chip capable of reducing the outer shape of the solid-state imaging device can be easily obtained with good reproducibility.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of a package of a solid-state image sensor according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a structure of a package of a solid-state image pickup device according to a second embodiment of the present invention.

FIG. 3 is a diagram for explaining a method of processing the chip shape of a solid-state image sensor according to the third embodiment of the present invention.

FIG. 4 is a diagram showing a chip layout of a solid-state image sensor according to a third embodiment of the present invention.

FIG. 5 is a diagram for explaining a method of processing the chip shape of a solid-state image sensor according to the fourth embodiment of the present invention.

FIG. 6 is a diagram for explaining a method of processing a chip shape of a solid-state image sensor according to the fourth embodiment of the present invention.

FIG. 7 is a diagram for explaining a method of processing the chip shape of the solid-state image pickup device according to the fifth embodiment of the present invention.

FIG. 8 is a diagram for explaining a method of processing the chip shape of a solid-state image pickup device according to the sixth embodiment of the present invention.

FIG. 9 is a diagram showing a structure of a conventional solid-state imaging device package.

FIG. 10 is a diagram showing a structure of a conventional laser diode or photodiode package.

[Explanation of symbols]

 1 Base 2 Sealing Metal Cylindrical Ring 3 Metal Cap 4 Glass Window 5 Image Sensor Chip 6 Lead Pin 7 Wire 8 Positioning Protrusion 9 Welding Protrusion 10 Solder Sealing Metallized Part 11 Solder Plating 12 Metallic Film 13 Solder Plating 31 Wafer 32 Vinyl sheet 33 Chip separation scribe line 34 Arrow 35 Straight line connecting scribe lines for corner removal 41 Chip 42 Scribe line for chip separation 43 Corner scribe line 51 Wafer 52 Chip scribe line 53 Circular hole 61 Wafer 62 Chip separation scribe line 63 Square hole 71 Wafer 72 Circular diamond cutter blade 73 Ultrasonic wave transmission jig 81 Chip holding jig 83 Chip holding jig 84 Diamond cutter 85 Wheels

Front page continuation (72) Hidekazu Yamamoto 4-1-1 Mizuhara, Itami City, Hyogo Prefecture Mitsubishi Electric Corporation LSI Research Center

Claims (8)

[Claims] 1. A solid-state imaging device comprising a circular base on which a chip is mounted and a metal cap covering the contacting portions of the two so as to fix and package the package. The base covers the entire side wall. The cap has a metal, and the cap has a protrusion for positioning in the vertical direction when the cap is put on the base on the inner wall of the cap, and has a package in which the coating metal and the cap are fixed by welding. Characteristic solid-state image sensor. 2. The solid-state image sensor according to claim 1, wherein the coating metal is solder. 3. A solid-state imaging device in which a base on which a chip is mounted is covered with a metal cap, and contact portions between the both are fixed and the package is sealed. In the solid-state imaging device, the chip is cut off along the portion. Are scribed along the scribe line for corner removal, and a quadrilateral chip having a scribe line for corner removal that has a predetermined angle between each scribe line and each side. A solid-state image sensor characterized in that 4. A method for manufacturing a solid-state imaging device comprising a base on which a chip is mounted and a metal cap being covered on the base to fix the contact parts of the both, and package-sealing. A chip separation scribe line for separating individual chips on the attached wafer, and corner cutting so that the parts cut along each side of the chip have a predetermined angle and are cut into a similar shape. And a step of separating the wafer into quadrangular chips along the chip separating scribe line, and pulling the peripheral portion of the elastic sheet outward to obtain the sheet. And extending a predetermined distance between the separated chips, and two straight lines connecting the scribe lines for corner removal of the separated chips. Along simultaneously perform scribing of a plurality of chips, a method for manufacturing a solid-state imaging device, characterized in that a step of performing a chamfered four corners of the respective chip. 5. A method for manufacturing a solid-state imaging device, comprising: covering a base on which a chip is mounted with a metal cap, fixing a contact portion between the two, and sealing the package; A step of forming a chip separation scribe line for separation on the wafer, a step of forming a hole penetrating the wafer at an intersection point where the chip separation scribe lines intersect each other perpendicularly, and a step of forming the chip separation scribe line on the wafer. And a step of separating the wafer into individual chips by scribed along the wafer. 6. A method for manufacturing a solid-state imaging device, comprising a base on which a chip is mounted on which a metal cap is covered, a contact portion between the both is fixed, and a package is sealed, for separating a chip on a wafer. A solid-state imaging device comprising a step of cutting the wafer along a scribe line to separate the chips into individual chips, and then cutting or cutting off the four corners of the chips by polishing or a diamond cutter. Manufacturing method. 7. A solid-state imaging device in which a base on which a chip is mounted is covered with a metal cap to fix a contact portion between the both, and the package is sealed, wherein the chip is a circular chip. Solid-state image sensor. 8. The method for manufacturing a solid-state imaging device according to claim 7, wherein a cylindrical blade is pressed against the wafer and the blade is rotated, or a jig having a circular contact portion with the wafer is used. A method for manufacturing a solid-state imaging device, comprising a step of cutting out the circular chip by applying ultrasonic waves to the wafer.