JPH05226528A - Resin-sealed semiconductor device and manufacture thereof - Google Patents
Resin-sealed semiconductor device and manufacture thereofInfo
- Publication number
- JPH05226528A JPH05226528A JP4027588A JP2758892A JPH05226528A JP H05226528 A JPH05226528 A JP H05226528A JP 4027588 A JP4027588 A JP 4027588A JP 2758892 A JP2758892 A JP 2758892A JP H05226528 A JPH05226528 A JP H05226528A
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- resin
- cooling fin
- container
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体チップとこれに
接続したリードの接続部を樹脂封止し、該樹脂封止によ
り形成した容器の表面に突起を設け、該突起より半導体
チップで発生した熱を放散する樹脂封止半導体装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip and a lead connected to the semiconductor chip, which is sealed with a resin, and a projection is provided on the surface of a container formed by the resin sealing. The present invention relates to a resin-sealed semiconductor device that dissipates the generated heat.
【０００２】[0002]
【従来の技術】図４はこの種の樹脂封止半導体装置の従
来例を示す側断面図、図５は同斜視図であり、これは特
開昭６１−１１４５６３号に開示された技術である。図
において、１は半導体チップ、２は該半導体チップ１に
接続したリードであり、これら半導体チップ１とリード
２の接続部は樹脂封止されている。2. Description of the Related Art FIG. 4 is a side sectional view showing a conventional example of this type of resin-sealed semiconductor device, and FIG. 5 is a perspective view thereof, which is a technique disclosed in Japanese Patent Laid-Open No. 61-114563. .. In the figure, 1 is a semiconductor chip, 2 is a lead connected to the semiconductor chip 1, and a connecting portion between the semiconductor chip 1 and the lead 2 is resin-sealed.
【０００３】３はこの樹脂封止により形成した容器であ
り、該容器３の表面には突起４が設けられている。以上
の構成により、従来は以下の２通りの熱放散経路により
半導体チップ１で発生した熱を放散していた。すなわ
ち、第１の経路は、装置を構成する一要素であるリード
２を介して表面へ伝わり、さらに装置を搭載するプリン
ト基板またはソケットへ放散する。Reference numeral 3 denotes a container formed by this resin sealing, and a projection 4 is provided on the surface of the container 3. With the above configuration, conventionally, the heat generated in the semiconductor chip 1 is dissipated through the following two heat dissipation paths. That is, the first path is transmitted to the surface via the lead 2 which is one element constituting the device, and is further radiated to the printed circuit board or socket on which the device is mounted.
【０００４】また、第２の経路は容器３の樹脂材を介し
て表面に伝わり、さらにその表面から外部雰囲気内へ放
散する。この時、容器３の表面に突起４を複数個設ける
ことで、表面の面積を大きくし、容器全体から放散する
熱を大としていた。Further, the second path is transmitted to the surface through the resin material of the container 3, and further diffuses from the surface into the external atmosphere. At this time, by providing a plurality of protrusions 4 on the surface of the container 3, the surface area is increased and the heat radiated from the entire container is increased.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た構成の従来技術によれば、封止樹脂の伝熱による冷却
であるので、高発熱素子を搭載する樹脂封止半導体装置
に対しては、熱放散効率が未だ不十分で、適用できない
という問題があった。本発明は、以上の問題点に鑑み
て、突起の外殻からの冷却効率をさらに向上させる構成
を得て、放熱，冷却効果の高い樹脂封止半導体装置を実
現することを目的とする。However, according to the prior art having the above-described structure, since the cooling is performed by the heat transfer of the encapsulating resin, the resin encapsulating semiconductor device mounting the high heat generating element is not cooled by the heat. There is a problem that the emission efficiency is still insufficient and it cannot be applied. In view of the above problems, it is an object of the present invention to obtain a configuration for further improving the cooling efficiency from the outer shell of the protrusion, and to realize a resin-sealed semiconductor device having high heat dissipation and cooling effects.
【０００６】さらに、本発明は、必要に応じてそれぞれ
の発熱量に合った冷却容量を持った冷却構造の装着，お
よびこれらの取り外しが自在に出来る方法を得て、発熱
量の異なる半導体チップを搭載した樹脂封止半導体装置
の容器の形状を一つに統一し、樹脂封止半導体装置の量
産性，経済性を向上することを目的とする。Further, according to the present invention, a cooling structure having a cooling capacity suitable for each heat generation amount can be attached and detached as needed, and a method for freely removing the cooling structures can be obtained, so that semiconductor chips having different heat generation amounts can be obtained. The purpose of the present invention is to unify the shapes of the containers of the mounted resin-encapsulated semiconductor devices to improve mass productivity and economy of the resin-encapsulated semiconductor devices.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、突起の面積を装置の発熱量に応じて所望
量に変化するようにする。すなわち、本発明は、半導体
チップとこれに接続したリードの接続部を樹脂封止し、
該樹脂封止により形成した容器の表面に突起を設け、該
突起より半導体チップで発生した熱を放散する樹脂封止
半導体装置において、前記突起に冷却フィンを取り付け
たこをと特徴とする。In order to achieve the above object, the present invention changes the area of the protrusion to a desired amount according to the amount of heat generated by the device. That is, the present invention, the semiconductor chip and the connection portion of the lead connected to this is resin-sealed,
In a resin-sealed semiconductor device in which a protrusion is provided on the surface of a container formed by the resin sealing and the heat generated in the semiconductor chip is dissipated from the protrusion, a cooling fin is attached to the protrusion.
【０００８】このような樹脂封止半導体装置は、前記冷
却フィンに前記突起が嵌合する凹部を形成し、これらの
嵌合により冷却フィンの取り付けを行って製造する。こ
の時、前記突起の外殻にネジ部を螺刻し、前記冷却フィ
ンの凹部に前記突起のネジ部に対応するネジ部を螺刻
し、これらの螺合により冷却フィンの取り付けてもよ
い。Such a resin-sealed semiconductor device is manufactured by forming a recess into which the projection fits in the cooling fin and mounting the cooling fin by fitting these recesses. At this time, a threaded portion may be threaded on the outer shell of the protrusion, a threaded portion corresponding to the threaded portion of the protrusion may be threaded on the recess of the cooling fin, and the cooling fin may be attached by screwing these.
【０００９】[0009]
【作用】以上の構成により、本発明は、熱放散の第１の
経路は、従来同様、装置を構成する一要素であるリード
を介して表面へ伝わり、さらに装置を搭載するプリント
基板またはソケットへ放散する。そして、第２の経路は
容器の樹脂材を介して表面に伝わり、さらにその表面か
ら突起を介して冷却フィンに伝わり、冷却フィンより外
部雰囲気内へ放散する。このような放熱フィンの着脱お
よびその大きさは、装置に搭載する発熱素子の種類によ
って選択することができる。With the above structure, according to the present invention, the first path of heat dissipation is transmitted to the surface through the lead, which is one of the elements constituting the device, and is further transferred to the printed circuit board or socket on which the device is mounted. Dissipate. Then, the second path is transmitted to the surface via the resin material of the container, is further transmitted from the surface to the cooling fin via the protrusion, and is diffused from the cooling fin into the external atmosphere. The attachment / detachment of such a radiation fin and the size thereof can be selected according to the type of the heating element mounted in the apparatus.
【００１０】このような樹脂封止半導体装置は、前記冷
却フィンに前記突起が嵌合する凹部を形成し、これらの
嵌合により冷却フィンの取り付けを行って製造すれば、
ワンタッチで装着が可能となる。この時、前記突起の外
殻にネジ部を螺刻し、前記冷却フィンの凹部に前記突起
のネジ部に対応するネジ部を螺刻し、これらの螺合によ
り冷却フィンの取り付ければ、固定および取り外し共に
容易となる。If such a resin-encapsulated semiconductor device is manufactured by forming a recess into which the projection fits in the cooling fin and mounting the cooling fin by these fittings,
It can be installed with one touch. At this time, a screw portion is screwed on the outer shell of the protrusion, a screw portion corresponding to the screw portion of the protrusion is screwed on the concave portion of the cooling fin, and if the cooling fin is attached by these screws, the fixing and Easy to remove.
【００１１】[0011]
【実施例】以下図面に従って実施例を説明する。図１
は、本発明の第１の実施例を示す側断面図、図２は同実
施例の斜視図である。図において、１は半導体チップ、
２は該半導体チップ１に接続したリードであり、これら
半導体チップ１とリード２の接続部は樹脂封止されてい
る。Embodiments Embodiments will be described below with reference to the drawings. Figure 1
2 is a side sectional view showing a first embodiment of the present invention, and FIG. 2 is a perspective view of the same embodiment. In the figure, 1 is a semiconductor chip,
Reference numeral 2 is a lead connected to the semiconductor chip 1, and a connecting portion between the semiconductor chip 1 and the lead 2 is resin-sealed.
【００１２】３はこの樹脂封止により形成した容器であ
り、該容器３の表面には突起１０が設けられている。該
突起１０の外殻は円柱形状であり、該突起１０の外殻に
は、所定のピッチまたはネジ山の種類にてネジ部１１が
螺刻してある。なお、突起１０の外殻は挿抜可能な形状
であれば良いので、先端が窄まった円錐形でも良い。１
２は前記突起１０に取り付ける冷却フィンであり、該冷
却フィン１２には前記突起１０が嵌合する凹部１３が形
成してあり、さらにこの凹部１３には前記突起１０のネ
ジ部１１に対応するネジ部１４が螺刻してある。Reference numeral 3 denotes a container formed by this resin sealing, and a projection 10 is provided on the surface of the container 3. The outer shell of the projection 10 has a cylindrical shape, and the outer shell of the projection 10 is threaded with a threaded portion 11 at a predetermined pitch or type of thread. The outer shell of the protrusion 10 may have a conical shape with a narrowed tip, as long as it can be inserted and removed. 1
Reference numeral 2 denotes a cooling fin attached to the protrusion 10, and a recess 13 into which the protrusion 10 is fitted is formed in the cooling fin 12, and the recess 13 has a screw corresponding to the screw portion 11 of the protrusion 10. The part 14 is threaded.
【００１３】冷却フィン１２はアルミ合金素材が一般的
に好んで使用されているが、熱伝性において良好な特性
を持った素材であれば、金属，セラミックス等の素材に
関係なく用いることができる。１５は、伝熱を効率的に
行うことを目的に、冷却フィン１２の凹部１３の天部に
収納した柔軟性を有する熱伝部材であり、該熱伝部材１
５は、冷却フィン１２の装着時に突起１０の先端と凹部
１３の天部間に発生する間隙を吸収する。このような熱
伝部材１５は、シリコン樹脂等にアルミナ，カーボン，
金属または金属の酸化物等を混入させて伝熱性を向上さ
せた部材等が提案されるが、例示した部材に限定され
ず、伝熱性の良好で間隙の発生を防止する部材であれば
よい。Aluminum alloy materials are generally preferred and used for the cooling fins 12, but any material having good heat conductivity can be used regardless of the material such as metal or ceramics. .. Reference numeral 15 denotes a flexible heat transfer member housed in the top of the recess 13 of the cooling fin 12 for the purpose of efficiently performing heat transfer.
5 absorbs a gap generated between the tip of the protrusion 10 and the top of the recess 13 when the cooling fin 12 is attached. The heat transfer member 15 is made of silicon resin, alumina, carbon,
A member or the like in which a metal or a metal oxide is mixed to improve the heat transfer property is proposed, but the member is not limited to the illustrated member, and any member having a good heat transfer property and preventing a gap from being generated may be used.
【００１４】上記構成の本実施例の作用を以下に説明す
る。すなわち、熱放散の第１の経路は、従来同様、装置
を構成する一要素であるリード２を介して表面へ伝わ
り、さらに装置を搭載するプリント基板またはソケット
へ放散する。そして、第２の経路は容器３の樹脂材を介
して表面に伝わり、さらにその容器３から突起１０を介
して冷却フィン１２に伝わり、冷却フィン１２より外部
雰囲気内へ放散する。The operation of this embodiment having the above structure will be described below. That is, the first path of heat dissipation is transmitted to the surface through the lead 2 which is one element that constitutes the device, and is further dissipated to the printed circuit board or socket on which the device is mounted, as in the conventional case. Then, the second path is transmitted to the surface via the resin material of the container 3, is further transmitted from the container 3 to the cooling fin 12 via the protrusion 10, and is diffused from the cooling fin 12 into the external atmosphere.
【００１５】このような冷却フィン１２の着脱およびそ
の大きさは、装置に搭載する発熱素子の種類によって選
択する。図３は本発明の第２の実施例を示す側断面図で
ある。第２の実施例においては、突起１０と冷却フィン
１２にネジ部を形成せず、冷却フィン１２は嵌合により
取り付けてある。この時、熱伝部材１５に両面テープ状
の接着性のある部材を用いると、冷却フィン１２の固定
化において好適である。また、突起１０の外殻にて接着
しても良い。The attachment / detachment of the cooling fin 12 and the size thereof are selected depending on the type of the heating element mounted in the apparatus. FIG. 3 is a side sectional view showing a second embodiment of the present invention. In the second embodiment, the projection 10 and the cooling fin 12 are not formed with a threaded portion, and the cooling fin 12 is attached by fitting. At this time, it is preferable to fix the cooling fins 12 by using a double-sided tape-shaped adhesive member as the heat transfer member 15. Alternatively, the outer shell of the protrusion 10 may be used for adhesion.
【００１６】なお、突起１０の外殻は挿抜可能な形状で
あれば良いので、円柱形や，四角錐または四角柱でも良
い。上記第２の実施例における熱放散の作用は、第１の
実施例と同様である。The outer shell of the protrusion 10 may have a shape that allows it to be inserted and removed, and may have a cylindrical shape, a quadrangular pyramid, or a quadrangular prism. The action of heat dissipation in the second embodiment is similar to that in the first embodiment.
【００１７】[0017]
【発明の効果】以上詳細に説明した如く本発明によれ
ば、半導体チップとこれに接続したリードの接続部を樹
脂封止し、該樹脂封止により形成した容器の表面に突起
を設け、該突起より半導体チップで発生した熱を放散す
る樹脂封止半導体装置において、前記突起に冷却フィン
を取り付けたので、突起の面積を装置の発熱量に応じて
所望量に変化することができる。As described in detail above, according to the present invention, the connecting portion of the semiconductor chip and the lead connected thereto is resin-sealed, and a protrusion is provided on the surface of the container formed by the resin sealing. In the resin-sealed semiconductor device that dissipates the heat generated in the semiconductor chip from the protrusion, since the cooling fin is attached to the protrusion, the area of the protrusion can be changed to a desired amount according to the heat generation amount of the device.
【００１８】これにより、突起の外殻からの冷却効率を
さらに向上させることが可能となり、放熱，冷却効果の
高い樹脂封止半導体装置を実現するという効果がある。
さらに、本発明は、半導体チップとこれに接続したリー
ドの接続部を樹脂封止し、該樹脂封止により形成した容
器の表面に突起を設け、該突起に冷却フィンを取り付け
る樹脂封止半導体装置の製造方法において、前記突起の
外殻を円錐もしくは円柱形状とし、前記冷却フィンに前
記突起が嵌合する凹部を形成し、これらの嵌合により冷
却フィンを取り付けたので、必要に応じてそれぞれの発
熱量に合った冷却容量を持った冷却構造の装着，および
これらの取り外しがワンタッチで自在に出来る。したが
って、発熱量の異なる半導体チップを搭載した樹脂封止
半導体装置の容器の形状を一つに統一することが可能と
なり、樹脂封止半導体装置の量産性，経済性を向上する
という効果がある。As a result, it is possible to further improve the cooling efficiency from the outer shell of the protrusion, and it is possible to realize a resin-sealed semiconductor device having high heat dissipation and cooling effects.
Furthermore, the present invention is a resin-sealed semiconductor device in which a semiconductor chip and a connecting portion of a lead connected to the semiconductor chip are resin-sealed, a protrusion is provided on a surface of a container formed by the resin sealing, and a cooling fin is attached to the protrusion. In the manufacturing method of (1), the outer shell of the protrusion is formed into a conical or columnar shape, and the cooling fin is provided with a recess into which the protrusion is fitted, and the cooling fin is attached by these fittings. You can easily attach and remove a cooling structure with a cooling capacity that matches the heat generation amount and remove these with one touch. Therefore, it is possible to unify the shapes of the containers of the resin-encapsulated semiconductor device on which the semiconductor chips having different heat generations are mounted, and to improve the mass productivity and the economical efficiency of the resin-encapsulated semiconductor device.
【００１９】この時、前記突起の外殻にネジ部を螺刻
し、前記冷却フィンの凹部に前記突起のネジ部に対応す
るネジ部を螺刻し、これらの螺合により冷却フィンの取
り付ければ、固定および取り外し共にさらに容易とな
る。At this time, a screw portion is screwed on the outer shell of the protrusion, a screw portion corresponding to the screw portion of the protrusion is screwed on the concave portion of the cooling fin, and the cooling fin is attached by screwing them together. It becomes easier to fix and remove.
【図１】本発明の第１の実施例を示す側断面図である。FIG. 1 is a side sectional view showing a first embodiment of the present invention.
【図２】本発明の第１の実施例を示す斜視図である。FIG. 2 is a perspective view showing a first embodiment of the present invention.
【図３】本発明の第２の実施例を示す側断面図である。FIG. 3 is a side sectional view showing a second embodiment of the present invention.
【図４】従来例を示す側断面図である。FIG. 4 is a side sectional view showing a conventional example.
【図５】従来例を示す斜視図である。FIG. 5 is a perspective view showing a conventional example.
１ 半導体チップ ２ リード ３ 容器 １０ 突起 １１ ネジ部 １２ 冷却フィン １３ 凹部 １４ ネジ部 １５ 熱伝部材 1 Semiconductor Chip 2 Lead 3 Container 10 Protrusion 11 Screw Part 12 Cooling Fin 13 Recess 14 Screw Part 15 Heat Transfer Member
Claims (3)
接続部を樹脂封止し、該樹脂封止により形成した容器の
表面に突起を設け、該突起より半導体チップで発生した
熱を放散する樹脂封止半導体装置において、 前記突起に冷却フィンを取り付けたことを特徴とする樹
脂封止半導体装置。1. A resin for sealing a connecting portion between a semiconductor chip and a lead connected to the semiconductor chip, providing a protrusion on a surface of a container formed by the resin sealing, and dissipating heat generated by the semiconductor chip from the protrusion. A resin-encapsulated semiconductor device, wherein a cooling fin is attached to the protrusion in the encapsulated semiconductor device.
接続部を樹脂封止し、該樹脂封止により形成した容器の
表面に突起を設け、該突起に冷却フィンを取り付ける樹
脂封止半導体装置の製造方法において、 前記冷却フィンに前記突起が嵌合する凹部を形成し、こ
れらの嵌合により冷却フィンの取り付けを行うことを特
徴とする樹脂封止半導体装置の製造方法。2. A resin-sealed semiconductor device in which a semiconductor chip and a connecting portion of a lead connected to the semiconductor chip are resin-sealed, a protrusion is provided on a surface of a container formed by the resin sealing, and a cooling fin is attached to the protrusion. The method for manufacturing a resin-sealed semiconductor device according to the manufacturing method, wherein a concave portion into which the protrusion is fitted is formed in the cooling fin, and the cooling fin is attached by these fittings.
ジ部を螺刻し、 これらの螺合により冷却フィンの取り付けを行うことを
特徴とする請求項２項記載の樹脂封止半導体装置の製造
方法。3. A threaded portion is threaded on the outer shell of the protrusion, a threaded portion corresponding to the threaded portion of the protrusion is threaded on the recess of the cooling fin, and the cooling fin is attached by these threads. The method for manufacturing a resin-encapsulated semiconductor device according to claim 2, wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027588A JPH05226528A (en) | 1992-02-14 | 1992-02-14 | Resin-sealed semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027588A JPH05226528A (en) | 1992-02-14 | 1992-02-14 | Resin-sealed semiconductor device and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05226528A true JPH05226528A (en) | 1993-09-03 |
Family
ID=12225115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4027588A Pending JPH05226528A (en) | 1992-02-14 | 1992-02-14 | Resin-sealed semiconductor device and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05226528A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0922299A1 (en) * | 1997-06-30 | 1999-06-16 | Sun Microsystems, Inc. | Post mounted heat sink method and apparatus |
| JP2014045136A (en) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | Junction material between heating element and heat radiator |
| JP2015062183A (en) * | 2010-03-24 | 2015-04-02 | 三菱エンジニアリングプラスチックス株式会社 | Heat dissipating member and heat dissipating structure of exothermic body |
-
1992
- 1992-02-14 JP JP4027588A patent/JPH05226528A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0922299A1 (en) * | 1997-06-30 | 1999-06-16 | Sun Microsystems, Inc. | Post mounted heat sink method and apparatus |
| EP0922299A4 (en) * | 1997-06-30 | 2005-08-10 | Sun Microsystems Inc | Post mounted heat sink method and apparatus |
| JP2015062183A (en) * | 2010-03-24 | 2015-04-02 | 三菱エンジニアリングプラスチックス株式会社 | Heat dissipating member and heat dissipating structure of exothermic body |
| JP2014045136A (en) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | Junction material between heating element and heat radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2902531B2 (en) | Heat dissipation device for semiconductor device | |
| US5200809A (en) | Exposed die-attach heatsink package | |
| US6005771A (en) | Electronics cooling technique for spacecraft modules | |
| US20020018338A1 (en) | Insert molded heat sink assembly | |
| JPH05226528A (en) | Resin-sealed semiconductor device and manufacture thereof | |
| US20190189532A1 (en) | Integrated circuit package and fastener | |
| JPH04291750A (en) | Head radiating fin and semiconductor integrated circuit device | |
| JPH1168360A (en) | Cooling structure for semiconductor element | |
| JPH0982883A (en) | Semiconductor device | |
| JPS6063952A (en) | Mounting method for resin-sealed type semiconductor device | |
| JPH07112029B2 (en) | Electronic component cooling device | |
| JPH025578Y2 (en) | ||
| JPH06125024A (en) | Semiconductor device and its cooling method | |
| JPS6111469B2 (en) | ||
| JPH0448740A (en) | Tab semiconductor device | |
| JPH0521666A (en) | Semiconductor package provided with heat sink | |
| JPS61114563A (en) | Integrated circuit package | |
| JPH0412555A (en) | Semiconductor device | |
| JPH04323856A (en) | Semiconductor device with heat sink | |
| JPH0451549A (en) | High heat dissipation type semiconductor device | |
| JPH04252059A (en) | Integrated circuit device | |
| JPS63289847A (en) | Heat dissipation structure of lsi package | |
| JPH06268121A (en) | Semiconductor device | |
| JPS6050948A (en) | Heat sink unit of electronic circuit | |
| KR0163311B1 (en) | High heat dispersion semiconductor package |