JPH05226522A - Epoxy resin composition for semiconductor sealing - Google Patents
Epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPH05226522A JPH05226522A JP2804592A JP2804592A JPH05226522A JP H05226522 A JPH05226522 A JP H05226522A JP 2804592 A JP2804592 A JP 2804592A JP 2804592 A JP2804592 A JP 2804592A JP H05226522 A JPH05226522 A JP H05226522A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- laser
- humidity resistance
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はレーザーマーク性、信頼
性に優れた半導体封止用エポキシ樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in laser markability and reliability.
【0002】[0002]
【従来の技術】近年、レーザー光により樹脂封止半導体
装置の表面層を破壊し、この破壊部と非破壊部のコント
ラストによって所定のマーキングを施すことが実用化さ
れている。このレーザーによるマーキングにおいて鮮明
な対比を得る為、封止用エポキシ樹脂組成物として、着
色剤としてカーボンブラック、アゾ系含金属染料又はそ
の他有機染料を含有するものが用いられている。2. Description of the Related Art In recent years, it has been put to practical use to destroy a surface layer of a resin-encapsulated semiconductor device with a laser beam and apply a predetermined marking by the contrast between the destroyed portion and the non-destructed portion. In order to obtain a clear contrast in marking with this laser, an encapsulating epoxy resin composition containing a carbon black, an azo metal-containing dye or other organic dye as a colorant is used.
【0003】[0003]
【発明が解決しようとする課題】半導体封止用エポキシ
樹脂組成物ではエポキシ樹脂の他、通常、硬化剤、硬化
促進剤、充填材、離型剤、難燃剤、シランカップリング
剤、着色剤等を含有する。これらの構成物のうち、着色
剤としてカーボンブラックを0.2〜5重量%含有する
半導体封止用エポキシ樹脂組成物を用いて、半導体素子
を被覆モールドしてなる樹脂封止半導体装置は信頼性
(耐湿性)に優れるものの、レーザーマーク性に劣り、
マーキングが明瞭に見えない。一方、着色剤としてアゾ
系含金属染料又はその他有機染料を含有する半導体封止
用エポキシ樹脂組成物を用いて、半導体素子を被覆モー
ルドしてなる樹脂封止半導体装置はレーザーマーク性に
優れるものの、信頼性(耐湿性)が低下する等の欠点を
有している。本発明は上記に鑑みてなされたものであっ
て、レーザーマーク性に優れ、且つ耐湿性、耐熱性、機
械的特性の良好な半導体封止用エポキシ樹脂組成物を提
供することを目的とする。In the epoxy resin composition for semiconductor encapsulation, in addition to the epoxy resin, a curing agent, a curing accelerator, a filler, a release agent, a flame retardant, a silane coupling agent, a coloring agent, etc. are usually used. Contains. Among these constituents, a resin-sealed semiconductor device obtained by covering and molding a semiconductor element with an epoxy resin composition for semiconductor encapsulation containing 0.2 to 5% by weight of carbon black as a coloring agent is reliable. Although excellent in (moisture resistance), inferior in laser mark property,
Marking is not clearly visible. On the other hand, using an epoxy resin composition for semiconductor encapsulation containing an azo metal-containing dye or other organic dye as a colorant, a resin-encapsulated semiconductor device obtained by coating and molding a semiconductor element has excellent laser markability, It has drawbacks such as reduced reliability (moisture resistance). The present invention has been made in view of the above, and an object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, which is excellent in laser markability and has good moisture resistance, heat resistance, and mechanical properties.
【0004】[0004]
【課題を解決するための手段】かかる目的は本発明によ
れば、着色剤として0.01%〜0.2重量%のカーボ
ンブラックのみを含有してなる半導体封止用エポキシ樹
脂組成物により解決できた。この組成物が通常の硬化
剤、硬化促進剤、充填材、その他必要に応じた添加剤を
含有することはいうまでもない。本発明に従って、エポ
キシ樹脂組成物が顔料としてカーボンブラックを0.0
1〜0.2重量%含有する時、レーザーによる破壊部分
と非破壊部分の対比が鮮明となりマーキングが明瞭とな
る。又、アゾ系含金属染料、その他有機染料を含有しな
い為、該樹脂組成物を用いて被覆モールドした半導体装
置は信頼性(耐湿性)に優れたものが得られる。According to the present invention, such an object is solved by an epoxy resin composition for semiconductor encapsulation containing only 0.01% to 0.2% by weight of carbon black as a colorant. did it. It goes without saying that this composition contains a usual curing agent, a curing accelerator, a filler, and other optional additives. According to the present invention, the epoxy resin composition contains carbon black as a pigment in an amount of 0.0
When it is contained in an amount of 1 to 0.2% by weight, the contrast between the destroyed portion and the non-destructed portion due to the laser becomes clear and the marking becomes clear. Further, since the azo metal-containing dye and other organic dyes are not contained, the semiconductor device coated and molded with the resin composition has excellent reliability (moisture resistance).
【0005】[0005]
【実施例】実施例1〜3、比較例1、2 オクソクレゾールノボラックエポキシ樹脂(エポキシ当量200)… 13部 臭素化エポキシ樹脂(エポキシ当量285) …3.3部 フェノールノボラック樹脂(水酸基当量106) …8.1部 溶融シリカ粉末 …72〜73部 硬化促進剤(2−メチルイミダゾール) …0.3部 三酸化アンチモン …1.6部 カルナバワックス …0.5部 シランカップリング剤(信越シリコーンKBM−403) …0.5部 上記の比率(単位は重量部)で混合した原料に、表1に
示す割合で着色剤を添加し、85℃に加熱したミキシン
グロールを使用して混練を行い、冷却、粉砕して封止材
とし、得られた封止材をタブレット化し、低圧トランス
ファー成形でDiL-P14/16Pを成形した。[Examples] Examples 1 to 3, Comparative Examples 1 and 2 Oxocresol novolac epoxy resin (epoxy equivalent 200) 13 parts Brominated epoxy resin (epoxy equivalent 285) 3.3 parts Phenol novolac resin (hydroxyl equivalent 106) ... 8.1 parts Fused silica powder ... 72-73 parts Curing accelerator (2-methylimidazole) ... 0.3 parts Antimony trioxide ... 1.6 parts Carnauba wax ... 0.5 parts Silane coupling agent (Shin-Etsu Silicone KBM -403) 0.5 part To the raw materials mixed in the above ratio (unit is parts by weight), the colorant was added in the ratio shown in Table 1, and kneading was performed using a mixing roll heated to 85 ° C. The encapsulating material was cooled and pulverized to obtain an encapsulating material, and the obtained encapsulating material was tabletized to form DiL-P14 / 16P by low pressure transfer molding.
【0006】[0006]
【表1】 [Table 1]
【0007】レーザーマーク性については得られたパッ
ケージ表面に炭酸ガスレーザーで捺印し、目視でマーク
性を評価した。又、耐湿性については10μm のアルミ
配線のTEGを用いて組立を行い、121℃/2気圧で
放置して50%の累積不良率となる時間を測定した。結
果を表2に示す。Regarding the laser mark property, the obtained package surface was imprinted with a carbon dioxide gas laser, and the mark property was visually evaluated. As for the moisture resistance, the assembly was performed using TEG having an aluminum wiring of 10 μm, and the assembly was left at 121 ° C./2 atm to measure the time at which the cumulative defective rate was 50%. The results are shown in Table 2.
【0008】[0008]
【表2】 表2から明らかなように、本発明による封止材はレーザ
ーマーク性、耐湿信頼性に優れていることがわかる。[Table 2] As is clear from Table 2, the encapsulant according to the present invention is excellent in laser mark property and moisture resistance reliability.
【0009】[0009]
【発明の効果】上記説明の如く本発明によれば、レーザ
ーマーク性に優れ、且つ、信頼性(耐湿性)に優れた半
導体封止用樹脂組成物の提供が可能になった。As described above, according to the present invention, it is possible to provide a resin composition for semiconductor encapsulation which is excellent in laser mark property and excellent in reliability (moisture resistance).
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08L 63/00 (72)発明者 吉沢 秀崇 茨城県結城市大字鹿窪1772−1 日立化成 工業株式会社南結城工場内 (72)発明者 柏原 隆貴 茨城県結城市大字鹿窪1772−1 日立化成 工業株式会社南結城工場内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification number Internal reference number FI Technical indication C08L 63/00 (72) Inventor Hidetaka Yoshizawa 1772-1 Kagoku, Yuki City, Ibaraki Hitachi Chemical Co., Ltd. Company Minami Yuki Plant (72) Inventor Takaki Kashiwara 172-1 Kagoku, Yuki City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Minami Yuki Plant
Claims (1)
を主成分とするエポキシ樹脂組成物において、着色剤と
してカーボンブラックのみを0.01重量%以上0.2
重量%未満配合したことを特徴とする半導体封止用エポ
キシ樹脂組成物。1. An epoxy resin composition containing an epoxy resin, a curing agent and an inorganic filler as main components, wherein only carbon black as a coloring agent is contained in an amount of 0.01% by weight or more and 0.2 or more.
An epoxy resin composition for semiconductor encapsulation, wherein the epoxy resin composition is blended in an amount of less than wt%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2804592A JPH05226522A (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for semiconductor sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2804592A JPH05226522A (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for semiconductor sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05226522A true JPH05226522A (en) | 1993-09-03 |
Family
ID=12237780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2804592A Pending JPH05226522A (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for semiconductor sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05226522A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012182472A (en) * | 2012-04-23 | 2012-09-20 | Sharp Corp | Solar cell module and manufacturing method of the same |
-
1992
- 1992-02-14 JP JP2804592A patent/JPH05226522A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012182472A (en) * | 2012-04-23 | 2012-09-20 | Sharp Corp | Solar cell module and manufacturing method of the same |
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