JPH05226522A - Epoxy resin composition for semiconductor sealing - Google Patents

Abstract

PURPOSE:To improve a laser markability and the reliability of a semiconductor device by a method wherein a specified amount of a carbon black only is blended in an epoxy resin composition for semiconductor sealing use as a coloring agent. CONSTITUTION:An epoxy resin composition for semiconductor sealing use is formed containing 0.01wt.% or higher and less than 0.2wt.% of a carbon black only as a pigment. Thereby, the contrast between a destructed part and a non-destructive part due to a laser becomes clear and a marking becomes clear. As the composition does not contain an azo-containing metal dye and other organic dye, a semiconductor device covered and molded with the resin composition is obtained as one having a superior reliability (a humidity resistance). It is obvious hat this composition containes a normal curing agent, a curing promotor, a filler and other additive according to the need. In respect to a laser mark property a marking is put on the surface of an obtained package with carbonic acid gas to evaluate the laser markability by visual observation and in respect to the humidity resistance a TEG of an aluminium wiring of 10mum is assembled, is left to stand at two atmospheric pressures at 121 deg.C and the humidity resistance is estimated in a time at the time when the TEG reaches 50% of a cumulative defective fraction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in laser markability and reliability.

[0002]

2. Description of the Related Art In recent years, it has been put to practical use to destroy a surface layer of a resin-encapsulated semiconductor device with a laser beam and apply a predetermined marking by the contrast between the destroyed portion and the non-destructed portion. In order to obtain a clear contrast in marking with this laser, an encapsulating epoxy resin composition containing a carbon black, an azo metal-containing dye or other organic dye as a colorant is used.

[0003]

In the epoxy resin composition for semiconductor encapsulation, in addition to the epoxy resin, a curing agent, a curing accelerator, a filler, a release agent, a flame retardant, a silane coupling agent, a coloring agent, etc. are usually used. Contains. Among these constituents, a resin-sealed semiconductor device obtained by covering and molding a semiconductor element with an epoxy resin composition for semiconductor encapsulation containing 0.2 to 5% by weight of carbon black as a coloring agent is reliable. Although excellent in (moisture resistance), inferior in laser mark property,
Marking is not clearly visible. On the other hand, using an epoxy resin composition for semiconductor encapsulation containing an azo metal-containing dye or other organic dye as a colorant, a resin-encapsulated semiconductor device obtained by coating and molding a semiconductor element has excellent laser markability, It has drawbacks such as reduced reliability (moisture resistance). The present invention has been made in view of the above, and an object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, which is excellent in laser markability and has good moisture resistance, heat resistance, and mechanical properties.

[0004]

According to the present invention, such an object is solved by an epoxy resin composition for semiconductor encapsulation containing only 0.01% to 0.2% by weight of carbon black as a colorant. did it. It goes without saying that this composition contains a usual curing agent, a curing accelerator, a filler, and other optional additives. According to the present invention, the epoxy resin composition contains carbon black as a pigment in an amount of 0.0
When it is contained in an amount of 1 to 0.2% by weight, the contrast between the destroyed portion and the non-destructed portion due to the laser becomes clear and the marking becomes clear. Further, since the azo metal-containing dye and other organic dyes are not contained, the semiconductor device coated and molded with the resin composition has excellent reliability (moisture resistance).

[0005]

[Examples] Examples 1 to 3, Comparative Examples 1 and 2 Oxocresol novolac epoxy resin (epoxy equivalent 200) 13 parts Brominated epoxy resin (epoxy equivalent 285) 3.3 parts Phenol novolac resin (hydroxyl equivalent 106) ... 8.1 parts Fused silica powder ... 72-73 parts Curing accelerator (2-methylimidazole) ... 0.3 parts Antimony trioxide ... 1.6 parts Carnauba wax ... 0.5 parts Silane coupling agent (Shin-Etsu Silicone KBM -403) 0.5 part To the raw materials mixed in the above ratio (unit is parts by weight), the colorant was added in the ratio shown in Table 1, and kneading was performed using a mixing roll heated to 85 ° C. The encapsulating material was cooled and pulverized to obtain an encapsulating material, and the obtained encapsulating material was tabletized to form DiL-P14 / 16P by low pressure transfer molding.

[0006]

[Table 1]

Regarding the laser mark property, the obtained package surface was imprinted with a carbon dioxide gas laser, and the mark property was visually evaluated. As for the moisture resistance, the assembly was performed using TEG having an aluminum wiring of 10 μm, and the assembly was left at 121 ° C./2 atm to measure the time at which the cumulative defective rate was 50%. The results are shown in Table 2.

[0008]

[Table 2] As is clear from Table 2, the encapsulant according to the present invention is excellent in laser mark property and moisture resistance reliability.

[0009]

As described above, according to the present invention, it is possible to provide a resin composition for semiconductor encapsulation which is excellent in laser mark property and excellent in reliability (moisture resistance).

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification number Internal reference number FI Technical indication C08L 63/00 (72) Inventor Hidetaka Yoshizawa 1772-1 Kagoku, Yuki City, Ibaraki Hitachi Chemical Co., Ltd. Company Minami Yuki Plant (72) Inventor Takaki Kashiwara 172-1 Kagoku, Yuki City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Minami Yuki Plant

Claims (1)

[Claims] 1. An epoxy resin composition containing an epoxy resin, a curing agent and an inorganic filler as main components, wherein only carbon black as a coloring agent is contained in an amount of 0.01% by weight or more and 0.2 or more.
An epoxy resin composition for semiconductor encapsulation, wherein the epoxy resin composition is blended in an amount of less than wt%.