JPH05220660A - Semi-automatic polishing method and device - Google Patents

Abstract

PURPOSE:To efficiently perform polishing without flawing a work nor damaging the work by the dust penetrated between the work and work fixing board. CONSTITUTION:In a semi-automatic polishing method, a work is moved in the state stuck onto a work fixing board by holding only the fixing board without separating the work, and polishing is conducted by the method of adding a load by a ball pair. A semi-automatic polishing device has a work carrying line 1, a work moving machine 11, a primary polishing rotating table 7, a secondary polishing rotating table 8 and a polishing arm oscillated by an oscillating machine 14 for practicing this method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method and a polishing apparatus for polishing a glass plate, a ceramics plate, a semiconductor substrate, etc., and in particular, the problem that the work is easily scratched during the work handling, which is a drawback of the Oscar type. To prevent.

[0002]

2. Description of the Related Art Conventionally, relatively thin glass plates, ceramics plates, substrates for semiconductors, etc. have been polished by an Oscar-type single-side polishing machine or double-side polishing machine.

[0003]

However, in the above-mentioned conventional polishing method, when the work is moved between the transportation line, the polishing rotary table, etc., the work is removed from the work surface plate and the work surface plate is manually moved after the movement. It is pasted using. Therefore, it takes time and manpower, and scratches increase the polishing cost.When attaching and detaching the work to and from the work surface plate, dust enters between the work surface plate and the work surface. The polished surface was often damaged.

The present invention has been made in view of the above circumstances, and provides a semi-automatic polishing method and apparatus in which dust or the like does not enter the polishing surface when a work is moved, and the polishing pressure is high and the polishing efficiency is high. The purpose is to do.

[0005]

In the semi-automatic polishing method and apparatus according to the present invention, a semi-automatic polishing method for polishing a work by moving a work between a work conveying line and a polishing rotary table and between polishing rotary tables is provided. Therefore, the work is affixed to the work surface plate and moves only in contact with the work surface plate, and at the time of polishing, semi-automatic polishing that applies a load with a ball pair centered on the center of gravity of the work surface plate. Method.

Alternatively, the work transport line and the work surface plate on which the work to be transported by the work transportation line is attached are brought into contact with only the surface plate to form a primary polishing rotary table, a secondary polishing rotary table, and a work transport line. A work moving machine for sequentially moving, a polishing arm provided at the tip with a load means for applying a load to the work on the primary and secondary polishing rotary tables by a ball pair centering on the center of gravity of the work surface plate, and the tip of this polishing arm A semi-automatic polishing apparatus having an oscillating machine for oscillating the was used as means for solving the problem.

[0007]

Since the semi-automatic polishing method and apparatus of the present invention has the above-mentioned structure, the work is transported by adhering the work to the work surface plate and contacting only the work surface plate without contacting the work surface. Work is hardly scratched when moving. Further, since the work and the work surface plate are not separated from each other during the movement or polishing, there is no chance that dust enters between the work and the work surface plate, and the yield reduction due to damage during operation is prevented. In addition, since a load is applied by the sphere pair during polishing, efficient polishing is performed.

[0008]

The method of the present invention uses a work surface plate on which a work is attached, and touches only the work surface plate without touching the work and separating the work and the surface plate. It is a method of preventing damage to the surface and enabling efficient polishing.

FIGS. 1 and 2 show an embodiment of a semi-automatic polishing apparatus for efficiently carrying out the above method. In FIG. 1, reference numeral 1 is a work surface plate 3 to which a work 2 such as a glass thin plate is attached (hereinafter referred to as work attachment). It is a work transportation line for transporting the board 4. A large number of rollers 5 that are driven to rotate are attached to the work conveying line 1, and by the rotation thereof, the work-equipped surface plate 4 placed on these rollers 5 ... Is conveyed so as to come into contact with. That is, the roller 5 is composed of a large diameter portion at both ends thereof and a small diameter portion at the center thereof so that the work 2 attached to the lower surface of the work surface plate 3 does not come into contact with anything during transportation. Then, the work-equipped surface plate 4 is stopped at a predetermined position by the rotation of the rollers 5.

When the stopping position 6 of the work-equipped surface plate 4 of the work transporting line 1 is one vertex of an equilateral triangle, a primary polishing rotary table 7 and a secondary polishing rotary table 8 are provided at the other two vertex positions. It is provided. A vertical rotation shaft 9 and three arms 10 are provided on the side of the work transportation line 1.
And the work moving machine 11 is arranged. The vertical rotation shaft 9 of the work moving machine 11 is arranged at the center of gravity of the virtual regular triangle. A base end of the arm 10 is fixed to the vertical rotation shaft 9, and a fixture 10a for fixing the work-equipped surface plate 4 is attached to the tip end thereof. The tip ends of each of the three arms 10 ... The intervals are determined so as to be located at the stop position 6 and the primary and secondary polishing rotary tables 7 and 8, respectively.

The workpiece moving machine 11 holds the surface plate 3 of the surface plate 4 with the work by the fixing tools 10a at the respective tips and hangs it upward, and in this state, it rotates in one direction to rotate the primary surface and the secondary surface, respectively. The polishing rotary tables 7 and 8 and the workpiece transport line are moved to the stop position 6 and then lowered. Next, the arm 10 is reversed by the amount of movement required to separate the work moving machine 11 from the work-equipped surface plate, and separated from the advanced work surface plate.

Next, the pressure member 1 at the tip of the polishing arm 15
2 is lowered by the cylinder 13 and polishing is performed by applying a processing pressure by a sphere pair centering on the center of mass of the work surface plate. The polishing is performed by the rotational movement of the primary and secondary polishing rotary tables 7 and 8 and the swinging movement of the polishing arm 15 that holds the work surface plate on these polishing rotary tables 7 and 8 by the swinger 14.

The movement of the work-equipped surface plate 4 between the primary-polishing rotary table 7 and the secondary-polishing rotary table 8 is similarly carried out by the rotary movement of the workpiece moving machine 11.

When the work-equipped surface plate 4 is moved from the primary polishing rotary table 7 to the secondary polishing rotary table,
It is desirable to provide a cleaning process between them. By providing the cleaning step, it is possible to properly use the abrasive grains of the primary and secondary polishing rotary tables and obtain a more precise polishing surface.

[0015]

As described above, according to the method of the present invention, the work is attached to the work surface plate, and the operation is performed by contacting only the work surface plate without separating the work surface. It does not get stuck or get damaged by dust entering between the work and the surface plate. Further, since the load is applied by the ball pair, the polishing pressure is high and the polishing is efficient.

In the apparatus for carrying out the above method, the arm tip of the work moving machine is located at the apex position of the equilateral triangle, and at each apex position, the stop position in the work conveying line of the platen with the work, the primary and secondary polishing rotary tables. By locating, the work-equipped surface plate at the stop position of the work transport line is sequentially transported and polished by the work moving machine, and is returned to the work transport line again.

Therefore, in the conventional Oscar type one-side polishing machine, the total of the detaching time for detaching the workpiece from the workpiece surface plate and the moving time for moving the workpiece is 1.
In contrast to 5 minutes / sheet, and one person was in charge of the work of about 5 polishing machines, the present invention reduces the work attachment / detachment frequency and mechanization of the work attachment / detachment, thereby removing the work attachment / detachment time and the work movement. The total time is shortened to 1.0 minutes / sheet and 0.5 minutes, which improves the operating rate of the processing machine.

Further, in the present invention, by arranging the polishing machines in parallel with the work conveying line, it becomes possible to perform polishing by only two persons, one at the inlet of the polishing line and one at the outlet of the polishing line. Although it was 2 people / vehicle, it was able to decrease to 0.1 people / vehicle. Further, the conventional method of removing and attaching the work pieces is often damaged, resulting in a yield of 5%.
%, But this study reduced the frequency of desorption,
Yield decrease due to mechanized work movement is 2
% And the yield can be improved by 3%.

[Brief description of drawings]

FIG. 1 is a schematic configuration plan view showing an apparatus and an embodiment of the present invention.

FIG. 2 is a side view taken along the line II-II of FIG.

[Explanation of symbols]

 1 Work transportation line 2 Work 3 Work surface plate (surface plate) 4 Surface plate with work 5 Roller 6 Stop position of surface plate with work 7 Primary polishing rotary table 8 Secondary polishing rotary table 9 Fixed shaft 10 Arm 10a Fixture 11 Work Moving machine 12 Pressure element 13 Cylinder 14 Oscillating machine 15 Polishing arm

Claims (2)

[Claims] 1. A semi-automatic polishing method for polishing a work by moving it between a work transfer line and a polishing rotary table, and optionally between the polishing rotary tables, and the work is attached to a work surface plate. In this state, the work surface is brought into contact only with the work surface, and at the time of polishing,
A semi-automatic polishing method characterized by applying a load by a sphere pair centered on the center of gravity of the work surface plate. 2. A work transportation line and a work surface plate on which a work transported by this work transportation line is attached are brought into contact with only the surface plate to make a primary polishing rotary table, a secondary polishing rotary table, and a work transportation line. And a work moving machine which sequentially moves, and a polishing arm provided with a load means for applying a load to the work on the primary and secondary polishing rotary tables by a ball pair centering on the center of gravity of the work surface plate,
A semi-automatic polishing apparatus comprising: a rocker that rocks the tip of the polishing arm.