JPH0521478A - Semiconductor pellet - Google Patents

Abstract

PURPOSE:To provide a semiconductor pellet having an index which can prevent an erroneous reading in the case of attaching pellets and rapidly read it. CONSTITUTION:An index 4 for designating a directivity is so formed on a surface of a semiconductor pellet 1 as to be recognized with bare eyes. The state of the index itself and the forming position of the index are so devised as to designate the directivity at the index. Accordingly, since the direction of the pellet can be easily confirmed, its operability is enhanced. Since the reading of the index can be simply performed, an erroneous reading is eliminated, and improper attaching of the pellet can be prevented. If an index confirming software is added to a semiconductor pellet attaching machine, the confirmation of the direction of the pellet can be automatically performed, and improper pellet attaching can be reduced to 0%.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor technology and a technology effectively applied to the manufacture of semiconductor devices.
More specifically, the present invention relates to a technique that is particularly effective when used to confirm the orientation of semiconductor pellets during pellet attachment (die bonding).

[0002]

2. Description of the Related Art Generally, a semiconductor pellet is formed with an index indicating a product name in a state in which it can be read from the surface side. In the process after dicing, the index is used as a clue to control the semiconductor pellet, It is being handled.

By the way, the index formed on this semiconductor pellet was formed in a step prior to the formation of the final passivation film, but at that time, it was formed in a region avoiding the final wiring layer. Since the wiring width of the final wiring layer is narrow, the size of the index is inevitably small. As a result, the index cannot be read with the naked eye, and conventionally, the index was read through a microscope.

[0004]

As described above, the conventional index is originally provided for distinguishing the type of product, but in reality, it is used for pelletizing or the like. It is also used to confirm the orientation of semiconductor pellets.

For example, in the pelletizing step performed after the dicing step, the semiconductor pellets charged in the pellet tray are adsorbed one by one by the collet of the semiconductor pelletizer, and the semiconductor pellets are mounted on the frame. In this case, since the semiconductor pellets are charged in the pellet dish while the dicing is performed, all the semiconductor pellets in the pellet dish are in the same direction. Therefore, unless the orientation of the pellet dish itself is wrong, the semiconductor pellets are mounted on the frame in the proper orientation, and therefore the operation of confirming the orientation of the semiconductor pellets is unnecessary.

However, if the operator accidentally flips over the pellet tray and spills the semiconductor pellets from the pellet tray or drops the semiconductor pellets due to a mistake in pellet adsorption, the operator must manually It is necessary to charge the semiconductor pellets in the dish in the same direction. In this case, it is the current situation that the semiconductor pellets are charged while aligning the orientation of the semiconductor pellets with the index as a clue.

However, as described above, since the index can be confirmed only through a microscope, there is a problem that its workability is poor. Also, not only does it require a lot of work such as setting and resetting to the microscope, but since the work is detailed and complicated,
The orientation of the semiconductor pellets sometimes changed due to misreading of the index or a subsequent charge error. If the orientation of the semiconductor pellets is different, the semiconductor pellets will be mounted in the frame in different orientations, and it will not be possible to output the desired characteristics. There was a problem of disappearing.

The present invention has been made in order to solve such a problem, and provides a semiconductor pellet having an index which can prevent misreading at the time of pelletizing and can be read quickly. The purpose is to do.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

The outline of the representative one of the inventions disclosed in the present application will be briefly described as follows.

A semiconductor pellet according to a first aspect of the present invention has a surface on which an index indicating directionality is formed so that it can be visually recognized.

A semiconductor pellet according to a second aspect is such that the index according to the first aspect has a form capable of indicating a direction as such.

According to a third aspect of the present invention, the semiconductor pellet according to the first or second aspect is formed at a position deviated from the center of the semiconductor pellet so that the index can be directed.

[0014]

According to the above-mentioned means, since the index for indicating the direction is formed so as to be visually recognizable, the orientation of the semiconductor pellet can be easily confirmed by observing the index with the naked eye. The nature is enhanced. In addition, since the reading of the index can be performed by a simple operation, there is no misreading and it is possible to prevent defective semiconductor pellet attachment.

If index confirmation software is added to the machine for attaching semiconductor pellets, the operation for confirming the orientation of the semiconductor pellets can be automatically performed and the defect in attaching the semiconductor pellets can be reduced to 0%.

[0016]

Embodiments of the semiconductor pellet according to the present invention will be described below with reference to the drawings.

1 and 2 are respectively a plan view and a vertical sectional view of a semiconductor pellet according to the first embodiment. A bonding pad 2 for electrically connecting to the outside is formed on the surface of the semiconductor pellet 1 of the first embodiment, and a region other than the bonding pad 2 is provided for protecting an element. Final passivation film (eg PSG, SiO ₂ , Si ₃ N ₄ ,
A protective film 3 such as PIQ) is formed. Then, in the portion corresponding to one corner of the semiconductor pellet 1 on the final passivation film 3, the region excluding the bonding pad 2 is formed of a film of the same quality as the passivation film 3, although not particularly limited thereto. Further, a right triangle-shaped index 4 having different colors is formed. The index 4 is formed in a size that can be visually recognized.

According to this semiconductor pellet 1, since the index 4 is formed at one corner corresponding portion of the semiconductor pellet 1, the direction of the semiconductor pellet 1 can be known from the formation position. Further, since this index 4 is formed so as to be recognizable with the naked eye (in terms of size and color),
The orientation of the semiconductor pellet 1 can be easily confirmed, and the throughput in the confirmation work is improved. Further, since the index can be read easily, there is no misreading and it is possible to prevent defective semiconductor pellet attachment.

In the first embodiment, since the index 4 has the shape of a right triangle, the shape of the semiconductor pellet 1 (even if the index 4 is formed at the center of the semiconductor pellet 4) is the same. Although it can be recognized with the naked eye, the index 4 is small, but it is not practical unless the shape is special (for example, the shape of the index 4 is elongated). Absent.

Further, according to the semiconductor pellet 1 of the first embodiment, if the index confirmation software is added to the machine for attaching the semiconductor pellet, the operation of confirming the orientation of the semiconductor pellet 1 can be automatically performed and the reading error can be made. Therefore, it is possible to reduce the defective semiconductor pellet attachment to 0%.

In addition to the index showing the product name usually provided on the semiconductor pellet 1, the index 4 of the first embodiment is provided, and if the color of the index 4 is different for each product group of the same type, Errors in reading the index indicating the product name will also be reduced.

FIG. 3 (longitudinal sectional view) shows a second embodiment of the semiconductor pellet according to the present invention.

The semiconductor pellet 11 of the second embodiment is different from the first semiconductor pellet 1 in that the index 4 is provided separately from the final passivation film 3 in the first embodiment. In this embodiment, a part of the final passivation film 13 is used as the index 14 by making the film thickness of the final passivation film 13 different. In this case, since the color of the thick portion of the final passivation film 14 is different from that of the thin portion thereof, one of them is indexed.
4 may be used. Also in this embodiment, the same effect as in the first embodiment can be obtained.

FIG. 4 (plan view) and FIG. 5 (longitudinal section) show a third embodiment of the semiconductor pellet according to the present invention.

The semiconductor pellet 21 of the third embodiment is different from the first semiconductor pellet 1 in that in the first embodiment, by forming a film of different colors on the final passivation film 3, the index 4 is provided, the index 24 is provided on the final passivation film 23 by potting in this embodiment. Also in this embodiment, the same effect as in the first embodiment can be obtained.

Although the invention made by the present inventor has been concretely explained based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the semiconductor pellets of the first and third embodiments, an index is formed on the final passivation film has been described, but an index may be provided between the final passivation film and the final wiring layer. Good.

In the semiconductor pellet of the second embodiment, the index is formed by partially changing the final passivation film thickness. However, the final passivation film itself has a constant thickness.
The passivation film itself may be formed so that only the colors are partially different.

[0029]

The effects obtained by the typical ones of the inventions disclosed in this application will be described below. According to the present invention, since the index that indicates the directionality is formed so as to be recognizable with the naked eye, the orientation of the semiconductor pellet can be easily confirmed by observing the index with the naked eye, so that the workability is improved. In addition, since the reading of the index can be performed by a simple operation, there is no misreading and it is possible to prevent defective semiconductor pellet attachment.

If index confirmation software is added to the machine for attaching the semiconductor pellets, the operation for confirming the orientation of the semiconductor pellets can be automatically performed, and the defect in attaching the semiconductor pellets can be reduced to 0%.

[Brief description of drawings]

FIG. 1 is a plan view of a semiconductor pellet according to a first embodiment.

FIG. 2 is a vertical cross-sectional view of the semiconductor pellet of the first embodiment.

FIG. 3 is a vertical sectional view of a semiconductor pellet according to a second embodiment.

FIG. 4 is a plan view of a semiconductor pellet according to a third embodiment.

FIG. 5 is a vertical sectional view of a semiconductor pellet according to a third embodiment.

[Explanation of symbols]

1,11,21 Semiconductor pellet 3,13,23 Final passivation film 4,14,24 Index

Claims (3)

[Claims] 1. A semiconductor pellet, wherein an index indicating directionality is formed on the surface of the semiconductor pellet so as to be visually recognizable. 2. The semiconductor pellet according to claim 1, wherein the index has a shape capable of indicating a direction by itself. 3. The semiconductor pellet according to claim 1, wherein the index is formed at a position deviated from the center of the semiconductor pellet so that directionality can be indicated.