JPH05251556A - Semiconductor chip - Google Patents

Abstract

PURPOSE:To prevent a recognition error caused by flaking of a film during a semiconductor-chip dicing step. CONSTITUTION:In a semiconductor chip 10, a dummy pattern 6 is provided between a dicing line 3 and a recognition area 2 including a recognition mark 1 and located near to the dicing line 3 so that the flaking of a film can be prevented during a dicing step. Consequently, the flaking of the film is prevented even when the film partly flakes during the dicing step, and thereby the recognition area can be protected from the flaking.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip which is die-bonded or wire-bonded by an automatic machine, and more specifically, a recognition area including a recognition mark set on the semiconductor chip and a dummy for protecting the film from peeling. The present invention relates to a patterned semiconductor chip.

[0002]

2. Description of the Related Art In an LED head mounted on, for example, a facsimile or a printer, an LED machine and an IC are wire-bonded by an automatic machine in the manufacturing process. At that time, the automatic machine is provided on the LED chip. Wire bonding is performed based on the information of the recognition mark and the recognition area.

This will be described in more detail with reference to FIG. In general, a dicing line 3 is drawn around a semiconductor chip 10 such as an LED chip that is die-bonded or wire-bonded, and individual semiconductor chips 10 are separated along the line 3 by dicing. Further, in the subsequent process, it is die-bonded on a substrate or wire-bonded to an IC or the like by an automatic machine. The recognition mark 1 and the recognition area 2 around the recognition mark 1 are used as a reference at the time of die bonding or wire bonding. The automatic machine recognizes information obtained by binarizing the recognition mark 1 and the recognition area 2 and performs die bonding or wire bonding at a predetermined position.

[0004]

As can be seen from FIG. 4, the recognition mark 1 is usually set in the vicinity of the dicing line 3 at one corner of the semiconductor chip 10. Of course, the recognition area including the recognition mark 1 is recognized. 2 also exists near the dicing line 3. However, from the edge 4 (particularly the corner of the chip 10) cut during dicing, the semiconductor chip 1
The film of 0 may peel off. When the film peeling does not reach the recognition area 2, there is no particular problem, but when the film peeling (hatched area in the figure) 5 reaches the recognition area 2 as shown in the figure, the recognition error of the automatic machine increases. .. In particular, when the film peeling 5 reaches the recognition mark 1, the probability of a recognition error is suddenly increased. It is considered that the film peeling 5 causes a recognition error because the surface state of the recognition mark 1 and the recognition area 2 is different from the normal state and the information originally possessed by the recognition mark 1 and the recognition area 2 is changed. ing.

Therefore, an object of the present invention is to reduce recognition errors caused by film peeling that occurs during dicing of semiconductor chips.

[0006]

Means for Solving the Problems The above-mentioned object is the semiconductor chip of the present invention, that is, a recognition area including a recognition mark set in the vicinity of a dicing line, and a film peeling occurring during dicing between the dicing line and the recognition area. This is achieved by a semiconductor chip on which a dummy pattern for preventing the progress to the above is formed.

In the semiconductor chip of the present invention, since the dummy pattern has a function of preventing the film peeling from entering the recognition area, even if the film peels from the edge of the chip during dicing, the film peeling is limited to the dummy pattern. Therefore, film peeling does not occur in the recognition area including the recognition mark set inside the dummy pattern, and the recognition error due to film peeling is drastically reduced.

The dummy pattern is not limited in its material and shape as long as it can prevent film peeling due to dicing, and aluminum is the most suitable material as it is easy to form a pattern. Further, the pattern shape may be one that can prevent the film peeling from reaching the recognition area,
There are no restrictions on its width and length.

[0009]

EXAMPLES A semiconductor chip of the present invention will be described below based on examples. FIG. 1 shows a partial plan view of an example thereof. However, the same components as in the related art are designated by the same reference numerals. The semiconductor chip 10 shown in the figure is separated by dicing along a preset dicing line 3, and an edge 4 is formed around the chip 10 by cutting. A predetermined recognition mark 1 and a recognition area 2 are provided in the vicinity of the dicing line 3 at one corner of the semiconductor chip 10.
Is set.

The dummy pattern 6, which is a feature of the present invention, is
It is made of aluminum, is located between the recognition area 2 and the dicing line 3, and extends along the dicing line 3 with a constant width. In particular, the two sides of the recognition area 2 near the dicing line 3 coincide with the edges of the dummy pattern 6,
The edge of the dummy pattern 6 constitutes the boundary line of the recognition area 2. In this embodiment, the dummy pattern 6 is provided around the semiconductor chip 10 along the dicing line 3, but it is not always required to be provided around the semiconductor chip 10 as long as the film peeling does not reach the recognition area 2 as described above. Good.

In such a semiconductor chip 10, even if the film is peeled from the edge 4 during dicing, the progress is stopped by the dummy pattern 6, and the recognition mark 1 existing inside the dummy pattern 6 is of course, No film peeling occurs in the recognition area 2. Therefore, since the information of the recognition mark 1 and the recognition area 2 does not change, it is extremely unlikely that a recognition error will occur during die bonding or wire bonding by an automatic machine.

FIG. 2 is an LED showing another embodiment of the present invention.
2A is a partial plan view of the chip, FIG. 2A shows a pattern of one end of the LED chip 10, and FIG.
The pattern of the other end of the chip 10 is shown. In FIG. 2, 7 is a mask alignment, and 8 is each LED.
Pad for wire bonding. Further, an L-shaped pattern 6a is formed along the dicing line 3 on the even corner 10a of the LED chip 10 of this embodiment, and the L-shaped pattern 6a is the same as the dummy pattern 6 of FIG. It has a function. Further, the recognition mark 1a is formed inside the L-shaped pattern 6a.
The L-shaped pattern 6b and the recognition mark 1b are similarly formed on the other even corners 10b on the same end side 10c of the LED 10.

However, the L-shaped pattern 6a and the recognition mark 7a formed on the even corner 10a, and the L-shaped pattern 6b and the recognition mark 7b formed on the other even corner 10b respectively have two sides of the L-shaped pattern. The length ratio and the distance ratio from the two sides to the recognition mark are set to be different. With these, for example, when recognizing the recognition mark and subsequently performing wire bonding continuously,
It is possible to sufficiently discriminate which end the wire is to be attached, and to accurately wire bond the pad.

FIG. 3 shows a pattern example in which the L-shaped pattern of the LED chip 10 shown in FIG. 2 and the recognition mark are different. FIG. 3A shows an L-shaped pattern 6a,
The length ratio of the two sides of 6b and the distance between the L-shaped patterns 6a, 6b and the recognition marks 1a, 1b are the same, but the recognition marks 6a and 6b are rectangular, and their postures are horizontal and vertical. There is.

In FIG. 3B, the postures of the recognition marks 1a and 1b are made different, and the L-shaped patterns 6a and 6 are formed.
The distance to b is also different. Further, in FIG. 3C, the recognition marks 1a and 1b have the same attitude, but the distances to the L-shaped patterns 6a and 6b are different. In either case, when wire bonding or the like is performed by an automatic machine, the directionality can be identified by reading from which end of the LED chip 10 the difference is read.

[0016]

As described above, the semiconductor chip according to the first aspect of the present invention has the following effects because it has the dummy pattern for preventing film peeling. (1) Since the film peeling that occurs during dicing does not proceed to the recognition area including the recognition mark by the dummy pattern, the original information of the recognition mark and the recognition area does not change, and the recognition is performed during die bonding or wire bonding by an automatic machine. The number of errors is drastically reduced. (2) As a result of (1), the cost is reduced by improving the orthogonality rate in the manufacturing process and reducing the rework rate.

Further, in the semiconductor chip according to the second aspect, the relative relationship between the recognition mark and the L-shaped pattern is made different for one even angle and the other even angle. It is possible to identify the characteristics, and to perform wire bonding and the like reliably and accurately.

[Brief description of drawings]

FIG. 1 is a partial plan view of a semiconductor chip according to an embodiment of the present invention.

FIG. 2 is a partial plan view of an LED chip showing another embodiment of the present invention.

FIG. 3 is a diagram showing another mode example in which the relative relationship between the L-shaped pattern of the LED chip shown in FIG. 2 and the recognition mark is different.

FIG. 4 is a partial plan view of a semiconductor chip according to a conventional example.

[Explanation of symbols]

 1 recognition mark 2 recognition area 3 dicing line 4 edge of semiconductor chip 6 dummy pattern 10 semiconductor chip

Claims (2)

[Claims] 1. A dummy pattern for preventing film peeling, which occurs during dicing, from advancing to a recognition area between a recognition area including a recognition mark set near a dicing line and a dicing line in a semiconductor chip. A semiconductor chip characterized by being formed. 2. A semiconductor chip is formed along a dicing line including one corner of the chip and another corner forming one end of the chip by a line connecting the corner to each corner. A recognition area is formed by the L-shaped pattern and the recognition mark formed inside the L-shaped pattern, and the relative relationship between the L-shaped pattern and the recognition mark of the one even angle and the other even angle is defined. A semiconductor chip characterized by being formed differently.