JPH05206504A - Solid state relay - Google Patents

Abstract

PURPOSE:To enhance the noise absorbing effect, and to miniaturize the title solid state relay by a method wherein an electrode of chip type nose absorbing element is connected between output terminals and they are formed into an integral structure. CONSTITUTION:The title solid state relay is composed of an input-side light- emitting element 1, light driving type semiconductor elements 2 and 3, translucent resin 8, a substrate 9, non-light transmitting resin 10, which becomes a housing, a noise absorbing element 15 and the like. A wide-width part 14a, extending toward sideways, is integrally formed on the intermediate part of an output terminal, one of electrodes of the noise-absorbing element 15 is connected to the upper surface of the wide-width part 14a in an electrically stabilized state. Also, the other electrode part of the noise-absorbing element 15 is electrically connected to the extended part 13a which is bent and extending from the other output terminal 13. The noise-absorbing element 15 consists of an almost column-shaped chip-like varistor, and an Al electrode, which is connected to both surfaces of the output terminals 13 and 14, is formed. As the varistor consists of a chip component, the whole body of the title solid-state relay can be made small in size.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to solid state relays.

[0002]

2. Description of the Related Art A conventional solid state relay is composed of an input light emitting element and a light receiving element which are optically coupled by a translucent resin, an output switching element, etc. in order to prevent malfunction due to noise generated from a load that opens and closes. In particular, a noise absorbing element is generally connected between the output terminals when opening and closing a high capacity output load of an AC circuit.

As an example thereof, a varistor, a snubber circuit or the like, which is a component having a discrete structure having an external lead wire, is connected by pattern wiring on a printed circuit board on which the output terminal is mounted. In some cases, the noise absorbing element is provided for use, or in some cases, the discrete component is directly incorporated on a printed circuit board provided inside the solid state relay for use.

[0004]

When a noise absorbing element is provided outside the solid-state relay described in the conventional example, the noise of the noise absorbing element causes a sharp rising noise due to the impedance of the pattern wiring on the printed circuit board. There is a problem that it cannot be sufficiently absorbed, protection of the output switching element and the like becomes insufficient, and in some cases, malfunction or destruction occurs.

As a method of reducing the wiring impedance, a method of integrally mounting a noise absorbing element composed of discrete parts inside the solid state relay is also partially performed as described above, but in this case as well. Satisfactory noise absorption cannot be performed due to the impedance of the lead wire that the discrete component has, and because the noise absorbing element is a discrete component, other elements are composed of chip type components. Even if an attempt is made to reduce the size of the solid state relay as a whole, there is a problem in that the noise absorbing element causes the size to be increased.

The present invention has been made in view of the above problems and has been improved. An object of the present invention is to provide a small solid state relay having a high noise absorbing effect.

[0007]

According to another aspect of the solid state relay of the present invention, a chip type noise absorbing element is integrally provided between the output terminals.

According to a second aspect of the solid-state relay, the noise absorbing element is die-bonded to a wide portion formed in the middle of the output terminal.

[0009]

In the solid-state relay of the first aspect, since the electrodes of the chip-type noise absorbing element are directly connected and integrally provided between the output terminals, unnecessary lead wire portions are eliminated and the noise absorbing effect is improved. In addition, the noise absorbing element itself is small in size as a chip, so that the overall shape can be made small.

In the solid-state relay of the second aspect, the noise absorbing element is die-bonded to the wide portion formed in the middle of the output terminal, so that it is mounted when another chip-type element is incorporated. Since it can be assembled, the assembly is easy, and a special member for mounting the noise absorbing element is not required, the size can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention is shown in FIG.
A description will be given based on (b). The solid-state relay shown in the figure has an input-side light emitting element 1, light-driven semiconductor elements 2 and 3, a light-transmitting resin 8, a substrate 9, a non-light-transmitting resin 10 serving as a housing, and a noise absorbing element 15. Etc.

The light emitting element 1 is composed of an element such as a light emitting diode. One side of the electrode is electrically connected to one end of the input terminal 11 in a stable state, and the other input terminal 12 is connected to the other electrode by the gold wire 1a. It is connected to the. The input terminals 11 and 12 are provided in parallel on one side of the substrate 9 with the middle part bent, and the other ends of the input terminals 11 and 12 are opaque resin 10.
From the outside.

The light-driven semiconductor elements 2 and 3 integrally include a light receiving element (not shown) optically coupled to the light emitting element 1 and an output element circuit for opening and closing a load therein. The light-emitting element 1 is disposed on both sides, and the outside of the light-emitting element 1 is potted with a light-transmitting resin 8 such as epoxy resin. The elements 2 and 3 are connected to the pair of output terminals 13 through the aluminum wire wires 4 to 7 from the respective electrodes.
14 are electrically and stably connected to each other. The two elements 2 and 3 are connected so as to be in antiparallel with each other when viewed from the output terminals 13 and 14.

The output terminals 13 and 14 are the input terminals 1
They are positioned and arranged on the substrate 9 in a state of being substantially parallel to each other in the direction opposite to 1 and 12, and one ends thereof extend in the same direction as the input terminals 11 and 12, respectively, and project from the opaque resin 10. A wide portion 14a extending laterally is integrally formed at an intermediate portion of the output terminal 14, and one electrode of the noise absorbing element 15 is electrically connected to the upper surface of the wide portion 14a. .. In addition, the noise absorbing element 1
The electrode portion of the other surface of 5 is electrically connected to the extending portion 13a that is bent and extends from the other output terminal 13.

The noise absorbing element 15 comprises a chip-shaped varistor having a substantially columnar shape, and has output terminals 13 on both sides.
The Al electrode connected to 14 is formed. Since the varistor is composed of chip parts, it can be mounted in the same way as the other elements described above, and as compared with the conventional case where it is composed of discrete parts, it can be easily assembled and manufactured, and the size of the whole solid state relay is small. Can be promoted.

The elements 1 to 15 and the terminals 11 to 1
After being arranged at predetermined positions on the substrate 9, the resin 4 is potted with the light-transmissive resin 8 and then the outer surface is covered with the light-transmissive resin 10 serving as a housing to stabilize optical coupling between input and output. At the same time, the internal insulation and environmental resistance are improved.

[0017]

According to the solid state relay of the first aspect,
Since the electrodes of the chip type noise absorbing element are connected and provided integrally between the output terminals, unnecessary lead wire portions are eliminated, the noise absorbing effect can be enhanced, and the noise absorbing element is similar to other chips. Since it is a small chip itself, the overall shape can be made smaller.

In the solid-state relay of the second aspect, the noise absorbing element is die-bonded to the wide portion formed in the middle of the output terminal, so that it is mounted when another chip-type element is incorporated. Since it does not require a special member for mounting the noise absorbing element, it can be miniaturized.

[Brief description of drawings]

FIG. 1 (a) is an internal sectional view showing an embodiment of the present invention, and FIG. 1 (b) is a right side sectional view of the same.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Light emitting element 2, 3 Light-driven semiconductor element (light receiving element and output switching element) 8 Light-transmitting resin 9 Non-light-transmitting resin 11, 12 Input terminal 13, 14 Output terminal 15 Noise absorbing element

Claims (3)

[Claims] 1. A chip type light emitting element connected between a pair of input terminals, a chip type light receiving element optically coupled to the light emitting element by a light-transmitting resin, and a pair of opening and closing a load according to an input signal. A solid-state relay comprising a chip-type output switching element connected between output terminals and an opaque resin covering each element, wherein a chip-type noise absorbing element is connected between the output terminals. Solid-state relay featuring. 2. The noise absorbing element is die-bonded to a wide portion formed in the middle of the output terminal.
Solid state relay. 3. The solid state relay according to claim 1, wherein the noise absorbing element is a chip varistor.