CN209929304U - Voltage type solid state relay structure - Google Patents
Voltage type solid state relay structure Download PDFInfo
- Publication number
- CN209929304U CN209929304U CN201920976722.9U CN201920976722U CN209929304U CN 209929304 U CN209929304 U CN 209929304U CN 201920976722 U CN201920976722 U CN 201920976722U CN 209929304 U CN209929304 U CN 209929304U
- Authority
- CN
- China
- Prior art keywords
- chip
- pin
- carrying table
- slide holder
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a voltage type solid-state relay structure, which comprises a relay main body and a plastic package body covering the relay main body; the relay main body comprises a mounting frame, a resistance chip, a light-emitting chip, a photosensitive receiving chip, a power chip, a first pin, a second pin, a third pin and a fourth pin; the light-emitting chip, the photosensitive receiving chip and the power chip are respectively arranged on a first chip carrying table, a second chip carrying table and a third chip carrying table of the mounting frame, and the resistance chip is arranged on a second pin. The utility model has the advantages of small volume and good heat dissipation.
Description
Technical Field
The utility model relates to a relay field especially indicates a voltage type solid state relay structure.
Background
The solid-state relay is an integrated assembly composed of electronic devices such as a light-emitting device, a light-receiving device, a power device and the like, has two input control ends and two output control ends, has amplification driving function and isolation function, is very suitable for driving a high-power switch type actuating mechanism, has higher reliability compared with an electromagnetic relay, is contactless, has long service life, high speed and small interference to the outside, and is widely applied.
In the existing solid-state relays, the solid-state relays are generally current type solid-state relays, and current is adopted to drive a light-emitting device to emit light; the current type solid-state relay needs to be changed into a voltage type solid-state relay which is convenient to use, and an external resistor connected with the light-emitting device in series needs to be connected to the input end of the solid-state relay, so that the operation is troublesome.
In addition, in the existing solid-state relay, a light emitting device, a light receiving device and a power device are generally mounted on a PCB, then the light emitting device, the light receiving device and the power device on the PCB are wrapped by a plastic shell, and epoxy resin is filled into the plastic shell. Because the power device generates a large amount of heat during operation and the heat dissipation performance of the PCB is limited, an internal or external heat sink needs to be added for this purpose, which makes the solid-state relay have a large volume and a complex manufacturing process. In addition, the light emitting device and the light receiving device of the existing solid-state relay directly adopt the optical coupler, and the optical coupler is large in size, so that the solid-state relay is large in size.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a voltage type solid state relay structure small, that dispel the heat is good.
In order to achieve the above purpose, the solution of the present invention is:
a voltage type solid relay structure comprises a plastic package body and a relay main body which is plastically packaged in the plastic package body; the relay main body comprises a mounting frame, a resistance chip, a light-emitting chip, a photosensitive receiving chip, a power chip, a first pin, a second pin, a third pin and a fourth pin; the outer ends of the first pin, the second pin, the third pin and the fourth pin all penetrate out of the plastic package body; the mounting frame comprises a first chip carrying table, a second chip carrying table and a third chip carrying table which are made of metal materials, and a resistor chip carrying table is formed at the inner end of the second pin; the first chip carrying table is connected with the first pins and electrically connected with the first pins, the light-emitting chip is installed on the first chip carrying table and electrically connected with the first chip carrying table, the resistance chip is installed on the resistance chip carrying table and electrically connected with the resistance chip carrying table, and the light-emitting chip is electrically connected with the resistance chip through a metal wire; the second slide holder is adjacent to the first slide holder, the photosensitive receiving chip is arranged on the second slide holder, and the photosensitive receiving chip and the light-emitting chip are wrapped by a light guide colloid; the area of the third slide holder is larger than that of the first slide holder and that of the second slide holder; the third wafer carrying table is connected with the fourth pin and electrically connected with the fourth pin; the power chip is installed on the third wafer carrying table and electrically connected with the third wafer carrying table, the power chip is tightly abutted against the third wafer carrying table, the power chip is electrically connected with the third pin through a metal wire, and the power chip is further electrically connected with the photosensitive receiving chip through a metal wire.
And at least three through holes are formed in the third slide holder.
The relay main body further comprises a protection chip which is installed on the third wafer carrying table and electrically connected with the third wafer carrying table, and the protection chip is electrically connected with the third pin through a metal wire.
The protection chip is a TVS chip.
The protection chip and the power chip are positioned on the same side of the third chip carrying platform.
The resistance chip, the light-emitting chip, the photosensitive receiving chip and the power chip are positioned on the same side of the mounting frame.
The first slide holder, the second slide holder and the third slide holder are all made of copper materials.
The first pin and the first slide holder are integrally formed, and the fourth pin and the third slide holder are integrally formed.
After the scheme is adopted, the utility model has the characteristics of it is following:
1. the utility model discloses directly plastic-package relay main part in the plastic-sealed body, can effectively block the erosion of steam and other pollutants to resistance chip, luminous chip, photosensitive receiving chip, power chip, and compare current solid state relay, do not need the plastic casing, make the utility model discloses small;
2. the utility model discloses a luminous chip, photosensitive receiving chip and power chip respectively direct mount on first slide holder, second slide holder and the third slide holder of installation frame, and resistance chip installs at resistance chip slide holder, need not to set up the PCB board, helps reducing the utility model discloses a volume, and the area of third slide holder is big moreover, and heat-sinking capability is strong, can guarantee power chip's heat dissipation demand, makes the utility model discloses heat-sinking capability is good;
3. the utility model is internally provided with the resistance chip, and can easily realize a voltage type solid-state relay product without increasing the volume;
4. the third slide carrier of the utility model is provided with at least three through holes, which can strengthen the bonding strength between the third slide carrier and the plastic package body;
5. the utility model discloses a resistance chip, luminous chip, photosensitive receiving chip, power chip are in same one side of installation frame, and this can make the utility model discloses a thickness reduces, and then makes the utility model discloses it is small.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a schematic structural diagram of a relay main body according to the present invention;
FIG. 3 is a schematic view of a partial structure of the present invention;
fig. 4 is a schematic diagram of the circuit structure of the present invention;
description of reference numerals:
the plastic-sealed body 1 is provided with a plastic-sealed body,
the relay main body 2 is provided with a relay main body,
a mounting frame 20, a first stage 201, a second stage 202, a third stage 203, a through hole 2031,
a resistance chip 21, a light emitting chip 22, a photosensitive receiving chip 23, a power chip 24,
a first pin 25, a second pin 26, a resistive chip stage 261, a third pin 27, a fourth pin 28,
the chip 29 is protected in a manner that protects it,
the light-guiding colloid 3 is provided with a light-guiding colloid,
a wire 4.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
As shown in fig. 1 to 4, the present invention discloses a voltage type solid state relay structure, which includes a plastic package body 1 and a relay main body 2 plastic-packaged in the plastic package body 1; wherein the relay body 2 includes a mounting frame 20, a resistance chip 21, a light emitting chip 22, a light sensitive receiving chip 23, a power chip 24, a first pin 25, a second pin 26, a third pin 27, and a fourth pin 28.
As shown in fig. 1 and fig. 3, the outer ends of the first pin 25, the second pin 26, the third pin 27 and the fourth pin 28 all penetrate out of the plastic package body 1 to be connected with an external circuit.
As shown in fig. 2 to 4, the mounting frame 20 includes a first stage 201, a second stage 202 and a third stage 203 made of metal, the first stage 201, the second stage 202 and the third stage 203 may be made of copper, and inner ends of the second pins 26 form a chip stage 261; the first chip carrier 201 is connected and electrically connected with the first pins 25, the light-emitting chip 22 is mounted on the first chip carrier 201 and electrically connected with the first chip carrier 201, the resistance chip 21 is mounted on the resistance chip carrier 261 and electrically connected with the resistance chip carrier 261, and the light-emitting chip 22 is electrically connected with the resistance chip 21 through the metal wire 4; the second stage 202 is adjacent to the first stage 201, the photosensitive receiving chip 23 is mounted on the second stage 202, a light guide colloid 3 wraps the photosensitive receiving chip 23 and the light emitting chip 22, the light guide colloid 3 is of a transparent structure, an optical channel is formed between the photosensitive receiving chip 23 and the light emitting chip 22 through the light guide colloid 3, and thus light emitted by the light emitting chip 22 can reach the photosensitive receiving chip 23 and be received by the photosensitive receiving chip 23; the area of the third chip carrying platform 203 is larger than that of the first chip carrying platform 201 and the second chip carrying platform 202, the third chip carrying platform 203 is connected with the fourth pin 28 and electrically connected with the fourth pin, the power chip 24 is installed on the third chip carrying platform 203 and electrically connected with the third chip carrying platform 203, the power chip 24 is tightly abutted against the third chip carrying platform 203 so that the heat of the power chip 24 can be rapidly transmitted to the third chip carrying platform 203, the power chip 24 is electrically connected with the third pin 27 through the metal wire 4, and the power chip 24 is also electrically connected with the photosensitive receiving chip 23 through the metal wire 4.
As shown in fig. 2, the resistance chip 21, the light emitting chip 22, the photosensitive receiving chip 23, and the power chip 24 can be located on the same side of the mounting frame 20, so that the thickness of the present invention can be reduced, and the size of the present invention is small; and the resistance chip 21, the light emitting chip 22, the photosensitive receiving chip 23 and the power chip 24 are located on the same side of the mounting frame 20, so that the light emitting chip 22, the photosensitive receiving chip 23 and the power chip 24 can be mounted on the first slide stage 201, the second slide stage 202 and the third slide stage 203 of the mounting frame 20 by a chip mounter, respectively.
As shown in fig. 2, the first leads 25 and the first stage 201 may be integrally formed, and the fourth leads 28 and the third stage 203 may be integrally formed. The third stage 203 may have at least three through holes 2031, and the through holes 2031 may be square holes or circular holes, so that the plastic package body 1 may form a cylinder penetrating through the through holes 2031, thereby enhancing the bonding strength between the plastic package body 1 and the third stage 203.
Further, the relay main body 1 may further include a protection chip 29 mounted on the third stage 203 and electrically connected to the third stage 203, the protection chip 29 is electrically connected to the third pin 27 through the metal wire 4, the circuit can be guaranteed to normally operate through the protection chip 29, and the protection chip 29 may be a TVS chip to implement overcurrent protection and overvoltage protection; protection chip 29 and power chip 24 are in third slide holder 203 with one on one side, can reduce like this the utility model discloses a thickness, and then reduce the utility model discloses a volume.
As shown in fig. 4, the working principle of the present invention is: when the first pin 25 and the second pin 26 input forward bias signals, the light emitting chip 22 emits light, the photosensitive receiving chip 23 receives the light emitted by the light emitting chip 22 and then outputs a starting signal to the power chip 24, and the power chip 24 is conducted, so that the third pin 27 and the fourth pin 28 are conducted; when the forward bias signal is not input to the first pin 25 and the second pin 26, the light emitting chip 22 does not emit light, the photosensitive receiving chip 23 does not output the on signal to the power chip 24, and the power chip 24 is turned off, so that the third pin 27 and the fourth pin 28 are not conducted.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.
Claims (8)
1. A voltage type solid state relay structure characterized in that: the relay comprises a plastic package body and a relay main body which is plastically packaged in the plastic package body;
the relay main body comprises a mounting frame, a resistance chip, a light-emitting chip, a photosensitive receiving chip, a power chip, a first pin, a second pin, a third pin and a fourth pin; the outer ends of the first pin, the second pin, the third pin and the fourth pin all penetrate out of the plastic package body;
the mounting frame comprises a first chip carrying table, a second chip carrying table and a third chip carrying table which are made of metal materials, and a resistor chip carrying table is formed at the inner end of the second pin; the first chip carrying table is connected with the first pins and electrically connected with the first pins, the light-emitting chip is installed on the first chip carrying table and electrically connected with the first chip carrying table, the resistance chip is installed on the resistance chip carrying table and electrically connected with the resistance chip carrying table, and the light-emitting chip is electrically connected with the resistance chip through a metal wire; the second slide holder is adjacent to the first slide holder, the photosensitive receiving chip is arranged on the second slide holder, and the photosensitive receiving chip and the light-emitting chip are wrapped by a light guide colloid; the area of the third slide holder is larger than that of the first slide holder and that of the second slide holder; the third wafer carrying table is connected with the fourth pin and electrically connected with the fourth pin; the power chip is installed on the third wafer carrying table and electrically connected with the third wafer carrying table, the power chip is tightly abutted against the third wafer carrying table, the power chip is electrically connected with the third pin through a metal wire, and the power chip is further electrically connected with the photosensitive receiving chip through a metal wire.
2. A voltage type solid state relay structure as claimed in claim 1, wherein: and at least three through holes are formed in the third slide holder.
3. A voltage type solid state relay structure as claimed in claim 1, wherein: the relay main body further comprises a protection chip which is installed on the third wafer carrying table and electrically connected with the third wafer carrying table, and the protection chip is electrically connected with the third pin through a metal wire.
4. A voltage mode solid state relay structure according to claim 3, wherein: the protection chip is a TVS chip.
5. A voltage mode solid state relay structure according to claim 3, wherein: the protection chip and the power chip are positioned on the same side of the third chip carrying platform.
6. A voltage type solid state relay structure according to claim 1 or 5, wherein: the resistance chip, the light-emitting chip, the photosensitive receiving chip and the power chip are positioned on the same side of the mounting frame.
7. A voltage type solid state relay structure as claimed in claim 1, wherein: the first slide holder, the second slide holder and the third slide holder are all made of copper materials.
8. A voltage type solid state relay structure according to claim 1 or 7, wherein: the first pin and the first slide holder are integrally formed, and the fourth pin and the third slide holder are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920976722.9U CN209929304U (en) | 2019-06-26 | 2019-06-26 | Voltage type solid state relay structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920976722.9U CN209929304U (en) | 2019-06-26 | 2019-06-26 | Voltage type solid state relay structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209929304U true CN209929304U (en) | 2020-01-10 |
Family
ID=69093325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920976722.9U Active CN209929304U (en) | 2019-06-26 | 2019-06-26 | Voltage type solid state relay structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209929304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115148709A (en) * | 2022-06-28 | 2022-10-04 | 爱微(江苏)电力电子有限公司 | Power module for electronic initial charging of battery pack and method for manufacturing same |
-
2019
- 2019-06-26 CN CN201920976722.9U patent/CN209929304U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115148709A (en) * | 2022-06-28 | 2022-10-04 | 爱微(江苏)电力电子有限公司 | Power module for electronic initial charging of battery pack and method for manufacturing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100855065B1 (en) | Light emitting diode package | |
| US20070194422A1 (en) | Light emitting diode package and fabricating method thereof | |
| KR100650191B1 (en) | High brightness led with protective function of electrostatic discharge damage | |
| CN101916809B (en) | Semiconductor light-emitting device | |
| JP6018187B2 (en) | Diode lighting configuration | |
| EP2120271A1 (en) | Led device and illuminating apparatus | |
| US20090267104A1 (en) | Light-emitting diode package | |
| KR100769720B1 (en) | High brightness led with protective function of electrostatic discharge damage | |
| KR20070103883A (en) | Led package with high efficiency | |
| GB2406969A (en) | Circuit element | |
| KR20110106775A (en) | The semiconductor device | |
| CN209929304U (en) | Voltage type solid state relay structure | |
| JP2011525702A (en) | Light emitting device package | |
| JP4330742B2 (en) | Structure and drive circuit of surface mount infrared communication module | |
| US20170223805A1 (en) | Vehicle lighting device and vehicle lamp | |
| KR100674708B1 (en) | Vertically structured gan type light emitting diode device and method of manufacturing the same | |
| US7439532B2 (en) | Solid state relay, electronic device, and method for manufacturing solid state relays having a first control terminal, a first output terminal and a second output terminal as lead terminals | |
| KR100748241B1 (en) | High brightness led with protective function of electrostatic discharge damage and method of manufacturing the same | |
| KR100747642B1 (en) | Side view type led package | |
| JP3554657B2 (en) | Optical semiconductor device | |
| CN207573326U (en) | A kind of high light coupling relay of isolation | |
| US7095055B2 (en) | Optical transmitter module | |
| US20070241339A1 (en) | Light-emitting diode with low thermal resistance | |
| KR20090102209A (en) | Printed circuit board for mounting led there on | |
| CN101256964A (en) | Method for manufacturing a plurality of surface adhering type LED structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |