JPH05206177A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To greatly reduce the personnel by realizing composite of a manufacturing line. CONSTITUTION:Some magazine cases 10 for containing a lead frame are mounted. A loader device 1 which can be separated one by one, a die bonding device 2 for die-attaching a pellet, a paste cure device 3 for curing paste, a wire bonding device 4 for performing metal wiring, an encapsulating device 5 for sealing the pellet with resin and an enclosing cure device 6 for curing resin are connected through a buffer 9. Five processes are unified to one process in this way.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus which combines five manufacturing steps from a die bonding step to a mold encapsulation step.

[0002]

2. Description of the Related Art Conventionally, in this type of manufacturing line, a single facility is provided for each function on the floor, and each line is manufactured by a different operator. Also, there is a system in which each device is partially connected, but since the process of curing the encapsulating resin takes 8 hours each time, the index balance with the previous process did not match and it was only connected from the die bonding to the encapsulation process. .

[0003]

In recent years, production equipment has become more complex (multifunctional equipment that enables connection between processes), and the reduction of workers, that is, the reduction of personnel costs, is actively promoted. In the conventional method, since the time for each resin sealing step is as long as 8 hours, it is very difficult to connect the steps in terms of index balance. For this reason, the two-step connection such as the combination of die bonding and wire bonding is
It was easy to implement, but it was extremely difficult to connect further.

Taking an encapsulating device and an encapsulating cure as an example, the number of elements mounted on the lead frame is about 40 in terms of IC, and the case for accommodating the lead frame is standard with 40 sheets and the total number of elements. Is 1,600.
Standard encapsulation index per lead frame is 10
Since it is 0 second / cycle, the time required for one case is slightly over 1 hour. On the other hand, if the encapsulated cure was just connected for 8 hours in one case, there was a drawback that a large amount of product would stay between the devices and the production capacity would decrease.

Taking an IC as an example, considering the complication of the process, the number of wires for element wiring is large. Therefore, one die bonding apparatus has six wire bonding apparatuses (in the case of 20 PIN IC), and the floor is low in price. There are still problems with space. It is difficult to combine the devices in the conventional oven method for the enclosed cure. There were problems such as the above, and the integrated production system was not built.

[0006]

According to the present invention, there are provided a magazine case for accommodating strip lead frames, a loading device for cutting out the strip lead frames one by one, and a die bonding device for mounting an element on the lead frame. , A curing device that heats and cures a paste that bonds the element and the lead frame after mounting the element, a wire bonding device that wires the element and the lead portion of the lead frame, and a sealing device that seals the element,
A semiconductor manufacturing apparatus having a mold curing device that cures the resin after sealing and a buffer unit that connects these devices is obtained.

Further, according to the present invention, as the mold curing apparatus, the above-mentioned semiconductor manufacturing apparatus using a thermostatic chamber in which elements are continuously fed and sequentially fed can be obtained.

Furthermore, according to the present invention, a semiconductor manufacturing apparatus having a tie bar cutting device in addition to the above-mentioned semiconductor manufacturing apparatus can be obtained.

[0009]

The present invention will be described below with reference to the drawings.

FIG. 1 is a model diagram showing an embodiment of the present invention. A magazine case 10 accommodating strip lead frames is mounted on the loader device 1, and the strip lead frames are supplied to the die bonding device 2 one by one. The element is die-bonded onto the strip lead frame through a paste machine and sent to the paste cure device 3 to cure the paste.

After that, it is sent to the wire bonding device 4 through the buffer 9 and metal wiring is applied thereto. Further, it is sent to the enclosing device 5 via the buffer 9 and packaged. The sealed lead frame is accommodated in the magazine case 7 in a predetermined amount, and is sequentially sent to the encapsulated curing device 6 via the buffer 9 at regular time intervals to cure the resin.

These operations are sequentially repeated to form a lot for each magazine case 7 and the lot is sent to the next step.

Here, although a tie bar cutting device 8 for cutting the tie bar of the element lead portion is added to promote further compounding, it may be a separate process.

[0014]

As described above, according to the present invention, it is possible to make 5 steps of manufacturing a semiconductor device as one process, and it is possible to significantly reduce the number of personnel. The number of workers that previously required 9 people / 3 shifts can be reduced to 3 people / 3 shifts. Further, there is an advantage that a product, especially a wire-bonded product carried by an operator becomes unnecessary, and manufacturing defects such as deformation of a gold wire can be reduced. Even if the production quantity increases and the number of lines increases, it is possible to have a large number of workers, and the result will double.

[Brief description of drawings]

FIG. 1 is a model diagram showing an embodiment of the present invention.

[Explanation of reference numerals] 1 loader device 2 die bonding device 3 paste curing device 4 wire bonding device 5 encapsulating device 6 encapsulating curing device 7 magan case 8 tie bar cutting device 9 buffer unit 10 (for loader) magazine case

Claims (3)

[Claims] 1. A magazine case for accommodating a plurality of lead frames, a loading device capable of cutting out the lead frames one by one, a die bonding device for mounting an element on the lead frame, an element and a lead frame after mounting the element. A curing device that heats and cures a paste that adheres to, a wire bonding device that wires a wire to the lead portion of the element and the lead frame, a sealing device that seals the element, and a resin after sealing is cured. A semiconductor manufacturing apparatus characterized by having a mold curing apparatus for making it possible and a buffer unit connecting these apparatuses. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the mold cure apparatus is a thermostatic chamber in which the elements are intermittently fed and sequentially fed. 3. The semiconductor manufacturing apparatus according to claim 1, further comprising a tie cutting device in the semiconductor manufacturing apparatus.