JPH0520341U - Semiconductor package - Google Patents

Abstract

(57) [Abstract] [Purpose] Deformation occurs at the terminals that electrically and mechanically connect to an external member of a semiconductor package between the time of manufacturing and processing and the time of attaching to an external member. The shape of the damaged terminal will be automatically restored at the time of installation so that it can be installed correctly. [Structure] As means for achieving this purpose, processing of terminals,
In the process of shaping, the terminal is made to remember its shape and a material that can be restored at the time of attachment is used. As an example, a shape memory alloy is used for the terminal.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an effective technique regarding a connecting portion between a semiconductor package and an external member.

[0002]

[Prior Art]

 For mechanical and electrical connection between a semiconductor package and an external member, soldering between a metal terminal of a semiconductor package and a terminal of an external member is currently generally used. At this time, if the shape of the terminals of the semiconductor package is deformed, the terminals of the external member do not match and the connection failure occurs. For this reason, in the conventional technology, the terminals of the semiconductor package are made shorter to make it difficult to be deformed, have a structure that does not bend, and the terminals are not molded by the manufacturer (Nikkei Electronics 1990 3-19 p128). I've been

[0003]

[Problems to be solved by the device]

 However, even with the above-mentioned structure that is difficult to deform, it is necessary to artificially correct the deformed terminal so that the connection can be made correctly at the time of mounting.

The present invention proposes a semiconductor package having means for automatically correcting the deformed terminal so that the terminal can be correctly mounted at the time of mounting.

[0005]

[Means for Solving the Problems]

 The following is a brief description of the outline of the typical invention disclosed in the present application.

That is, the terminal material of the semiconductor package should be a material capable of memorizing the shape.

[0007]

[Action]

 By using this means, when manufacturing and processing the terminals of the semiconductor package, the shape is stored in the material, and even if the shape of the terminal is deformed after that, the shape is automatically restored by the thermal stress at the time of mounting. It becomes possible to connect it to the terminal of the external member correctly.

[0008]

【Example】

 FIG. 1 shows an example of a semiconductor package according to the present invention. Although not particularly limited, the semiconductor package shown in the figure is formed by a known semiconductor manufacturing technique.

A semiconductor package 1 shown in FIG. 1 is provided with a terminal 2 for electrically and mechanically connecting to an external member. Here, the terminal 2 is made of a material capable of memorizing the shape, for example, but not limited to, a shape memory alloy. Therefore, the terminal 2 is subjected to processing such as heat treatment for storing its shape in the material in the step of processing and shaping the terminal portion in the semiconductor manufacturing process. After that, even if the terminal 4 is deformed like the deformed terminal 3 by the time of being attached to the external member, the terminal 4 having the original shape is formed by heat treatment such as soldering at the time of attaching to the external member 5. Can be restored.

Although the present invention has been specifically described above based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention.

For example, in the above embodiment, the material capable of memorizing the shape is the shape memory alloy, but it can be changed to the shape memory plastic.

[0012]

The effect obtained by the typical one of the inventions disclosed in the present application will be briefly described as follows.

That is, by using a material capable of memorizing the shape when the semiconductor package is manufactured and processed as the terminal material of the semiconductor package, the terminal is deformed from the time of manufacturing and processing to the time of mounting the package to an external component. However, when it is installed, it will be restored to its original shape, which has the effect of eliminating poor connections.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a semiconductor package according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor package, 2 ... Terminals with shape remembered, 3 ...
Deformed terminals, 4 ... Shape restored terminals, 5 ... External member.

Claims (1)

[Scope of utility model registration request] 1. The shape and dimensions of a semiconductor package and an external member which are mechanically and electrically connected to each other are deformed between the time of manufacturing and processing and the time of mounting. Also manufactured so that it can be connected correctly at the time of installation,
A semiconductor package characterized by having a means for memorizing the shape at the time of processing and recalling the memory at the time of attachment.