JPH0520329U - Mounting structure for semiconductor measuring jig - Google Patents

Abstract

(57) [Abstract] [Purpose] In the semiconductor measurement jig mounting structure, the contact resistance that can occur at the contact portion between the measurement jig body and the measurement jig mounting portion is suppressed as much as possible, and the contact resistance is stabilized to achieve the contact surface. To prevent the contact resistance from fluctuating. [Structure] In a device in which a measurement jig 7 is attached to and brought into contact with the measurement jig attachment portion 1 on the main body of the measurement device, a pogo pin 3 is provided on the measurement jig attachment portion 1 and a contact electrode portion 4 is provided on the measurement jig 7 side. It is provided, pressed, and fixed with the tightening ring 8.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a semiconductor measuring jig mounting structure, and more particularly to reducing the mutual contact resistance between a measuring jig and a measuring jig mounting portion.

[0002]

[Prior Art]

 Conventionally, as shown in a sectional view of FIG. 2, a measuring jig mounting structure in a semiconductor measuring apparatus of this type is provided with a plurality of probes 6 protruding from one surface of a substrate 15 made of a circular insulating member. The other side has a measuring jig 17 in which a connecting pin 14 is implanted.

Each of the probes 6 is connected to the pin 14 directly or through an external circuit or with necessary electronic parts such as a capacitor for preventing oscillation.

The measuring jig 17 is mechanically held and electrically connected while the pin 14 is fitted into the measuring jig fitting portion 13 provided in the measuring jig mounting portion 11 of the measuring device body (not shown). To be done. Then, it is connected to a measuring device (not shown) via the internal wiring 2.

The probe 6 comes into contact with a pad portion of a chip (not shown) formed on a semiconductor wafer (not shown) to perform measurement.

The positions where the pins 14 are installed on the measurement jig 17 are all the same, but the wiring from the pins 14 to the probe 6 differs depending on the type of semiconductor device to be measured. The measurement jig 17 is replaced every time the product type is changed, but it is simply fixed by inserting the pin 14 of the measurement jig 17 and the measurement jig attachment part, so that the pins 14 and the measurement jig can be stacked by stacking the numbers. Rattling or the like occurs between the mounting portion 11 and the measurement jig fitting portion 13.

[0007]

[Problems to be solved by the device]

 By the way, in this type of semiconductor measuring jig mounting structure, if the contact resistance value between the measuring jig and the measuring jig mounting portion varies, accurate electrical characteristics cannot be obtained, which is an important problem. When mounting by fitting the measuring jig and the measuring jig mounting part, the pins of the measuring jig and the measuring jig fitting part become loose and uneven, resulting in a difference in contact resistance value for each pin.

The present invention aims to solve the above-mentioned drawbacks.

[0009]

[Means for Solving the Problems]

 The semiconductor measurement jig mounting structure of the present invention has a pogo pin installed on the measurement jig mounting part in the mounting structure where the measurement jig is attached to and makes contact with the mounting part of the measuring jig. It is characterized by being pressed against and fixed with a tightening ring.

The pogo pin is a contact pin having a structure in which the pin is pushed by a spring from one end of a cylindrical outer unit and protrudes, and can be freely pulled inward by pressure from the outside.

[0011]

[Action]

 According to the above configuration, the pogo pin at the measurement jig mounting portion is in a spring state, and even if the dimensional accuracy is a little poor, poor contact does not occur. In addition, even if the pogo pins are slightly stiffened due to repeated attachments and detachments, there is no possibility of poor contact. Furthermore, since it is fastened with a tightening ring, there will be no mounting failure due to backlash or looseness caused by repeated mounting and removal.

[0012]

【Example】

 An embodiment according to the present invention will be described below with reference to FIG. 1 which is a sectional view. In the figure, the same parts as those in the conventional case shown in FIG. 2 are designated by the same reference numerals, and the duplicated description will be omitted.

In FIG. 1, a pogo pin 3 is provided on a measuring jig mounting portion 1 according to the present invention, and at the same time, a pogo pin contact electrode portion 4 is provided on a substrate 5 of the measuring jig 7. Fix it using the tightening ring 8. In this invention, the non-uniform force such as displacement and backlash which occurs in the conventional fitting type contact portion is eliminated, a stable contact resistance value is obtained, and accurate electrical characteristics are guaranteed.

[0014]

[Effect of the device]

 As described above, this device uses pogo pins for electrical connection between the measurement tool and the measurement jig attachment part, so that uniform force is applied to the pogo pins and the electrodes, and the contact resistance is stable and accurate electrical characteristics are obtained. can get.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a conventional vertical sectional view.

[Explanation of symbols]

 1 Measurement jig attachment part 2 Internal wiring 3 Pogo pin 5 Board 6 Probe 7 Measurement jig 8 Tightening ring

Claims (1)

[Scope of utility model registration request] 1. A pogo pin is installed on the measurement jig mounting portion of a mounting structure in which the measurement jig is mounted and brought into contact with the measurement jig mounting portion, and the pogo pin contact portion electrode of the measurement jig is pressed and fixed with a tightening ring. A mounting structure for a semiconductor measuring jig, which is characterized by: