JPH0519956Y2 - - Google Patents
Info
- Publication number
- JPH0519956Y2 JPH0519956Y2 JP1986166391U JP16639186U JPH0519956Y2 JP H0519956 Y2 JPH0519956 Y2 JP H0519956Y2 JP 1986166391 U JP1986166391 U JP 1986166391U JP 16639186 U JP16639186 U JP 16639186U JP H0519956 Y2 JPH0519956 Y2 JP H0519956Y2
- Authority
- JP
- Japan
- Prior art keywords
- outer lead
- base film
- circuit board
- chip
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000000926 separation method Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986166391U JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986166391U JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370150U JPS6370150U (US06826419-20041130-M00005.png) | 1988-05-11 |
| JPH0519956Y2 true JPH0519956Y2 (US06826419-20041130-M00005.png) | 1993-05-25 |
Family
ID=31097319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986166391U Expired - Lifetime JPH0519956Y2 (US06826419-20041130-M00005.png) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519956Y2 (US06826419-20041130-M00005.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS6384990A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 携帯可能媒体 |
-
1986
- 1986-10-28 JP JP1986166391U patent/JPH0519956Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS6384990A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 携帯可能媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6370150U (US06826419-20041130-M00005.png) | 1988-05-11 |
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