JPH0519701A - Production of plane display device - Google Patents

Abstract

PURPOSE:To form multilayered wirings with simple process at a low cost. CONSTITUTION:A VFD 1 is constituted by integrally forming a pair of glass substrates. A surface oxide film is formed on the front surface of the rear surface glass substrate 1b. A coupling agent is applied on this surface oxide film. polymer type conductor paste, polymer type insulating paste, polymer type conductor paste, and polymer type overcoat insulating paste are respectively printed thereon and are cured to form the multilayered wirings of conductor patterns 2 of the 1st layer, the interlayer insulating layer 3, the conductor patterns 4 of the 2nd layer, and the overcoat insulating 5. Surface packaging parts 7 are mounted in such multilayered wirings and are joined by solder reflow.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat panel display device, and more particularly to a method of manufacturing a flat panel display device in which a flat panel display portion and a driving circuit portion thereof are formed on the same substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a flat display device of this type, a method of forming an electronic circuit on a glass substrate with a polymer type Cu paste via a coupling agent is disclosed in, for example, Japanese Patent Laid-Open No. 60-68370. A method of forming an electronic circuit on the back surface side of a flat display device and mounting an electronic component has been proposed, for example, in Japanese Utility Model Laid-Open No. 63-98580.

That is, if the size of the glass substrate is large, there is no problem. For example, a VFD (dimension 48.2 × 20.5 mm) currently used for automobile timepieces.
By forming a circuit with polymer type Cu paste on the back surface of the glass substrate and arranging surface mounting electronic components such as QFP and crystal, the surface area of the electronic components alone occupies about 50%. Have difficulty.

A multi-layer circuit is conceivable as a means for solving such a problem. In recent years, ITO can be seen as a method of mounting a driving IC for an LCD on a chip-on-glass.
A thin film conductor such as Ni is plated with Ni to form an interlayer insulating layer of a resin such as polyimide, and the interlayer insulating layer is patterned by a photolithography process.
Form hole A. A method is employed in which a thin film conductor circuit such as ITO is formed on the upper portion of this by patterning, and further Ni plating is applied to this (see FIG. 4).

[0005]

However, according to such a method, since the photolithography process and the film forming process are performed three times to form the multilayer circuit, the process becomes complicated and the equipment is also required. There has been a problem that the scale becomes large and the material becomes expensive.

[0006]

In order to solve such a problem, the present invention constitutes a flat display by integrally forming a pair of glass substrates and has a surface oxide film on one surface of the glass substrate. Is formed, a coupling agent is applied on the surface oxide film, and a polymer-type conductor paste, a polymer-type insulating paste, a polymer-type conductor paste, and a polymer-type overcoat insulating paste are printed,
The multilayer wiring is formed by firing, the surface mount component is placed on the multilayer wiring, and solder reflow is performed to join them.

[0007]

In the present invention, the polymer-type conductor paste,
Since the multi-layered wiring is formed in the process of printing and curing the polymer type insulating paste, the polymer type conductor paste, and the polymer type overcoat insulating paste, the photolithography process, the film forming process, etc. are unnecessary, and a simple process is possible. To be simplified.

[0008]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view of an essential part for explaining an embodiment in which a method for manufacturing a flat panel display device according to the present invention is applied to a method for manufacturing a fluorescent display (VFD). In the figure,
First, the front surfaces of the front glass substrate 1a and the back glass substrate 1b of the pair of glass substrates constituting the VFD 1 are washed,
After drying, a SiO ₂ film is sputtered as an alkali elution preventing film from the back glass substrate 1b by sputtering or the like.
It is formed to a thickness of about 00 to 300 μm. Next, an epoxysilane coupling agent was spin-coated on the surface of the back glass substrate 1b, and then a Cu-Ag mixed polymer-type conductor paste (M-5, S-5300, manufactured by Asahi Chemical Laboratory: LS-) was used. 005P) is screen-printed, baked and cured (baking temperature 150 ° C. to 180 ° C.),
The conductor pattern 2 of the first layer as shown in FIG. 2A is formed. Next, a step of screen-printing a polymer-type insulating paste (CR-22G, manufactured by Asahi Chemical Laboratory) on the conductor pattern 2 and firing and curing at the same firing temperature as above is repeated 2 to 3 times, and FIG. An interlayer insulating layer 3 having a pattern shape as shown in (b) is formed. Next, a Cu-containing polymer-type conductor paste (Mitsui Kinzoku: S-5300) was screen-printed on the interlayer insulating layer 3 in the same manner as in the first layer, and was fired and cured at the same firing temperature as above. Two
The conductor pattern 4 of the second layer as shown in (c) is formed. In this case, it is necessary to perform the alignment accurately so as to fill all the hole portions of the interlayer insulating layer 3. Next, a polymer type insulating paste (made by Asahi Chemical Laboratory: CR-22G, CR as an overcoat film is formed on the conductor pattern 4.
-30G) is screen-printed and baked at the same baking temperature as above to be cured twice.
An overcoat insulating layer 5 having a soldering land pattern 5a as shown in is formed. Next, the cream solder 6 is attached onto the land pattern 5a of the overcoat insulating layer 5 by a printing method or a coating method, and all the surface mounting components 7 including the IC are mounted by a chip mounter and VF is applied.
The lead portion of D1 is also bent and brought into contact with the cream solder 6, and soldering is performed by batch reflow.
An integrated flat display device in which a high-density drive circuit unit is mounted on the back glass substrate 1b of 1 is manufactured.

According to such a method, the first-layer conductor pattern 2-interlayer insulating layer 3-second layer conductor pattern 4-land pattern 5 are respectively screen-printed, followed by a simple step of baking and curing. A high-density wiring circuit can be formed.

FIG. 3 is a flow chart of a method of manufacturing the flat panel display device shown in FIG.

In the embodiment described above, the VFD
I explained the flat display device equipped with
The present invention is not limited to this, and ECD, E
Even if it is applied to a flat display device having L, PDP, LCD, etc., it is needless to say that a high-density drive circuit can be formed on the back glass substrate by the same process.

[0012]

As described above, according to the present invention, the first layer polymer type conductive paste, the polymer type insulating paste, the second layer polymer type conductive paste, and the polymer type overcoat insulating paste are printed and cured. By forming the multi-layered wiring by the process described above, the process is simpler than the conventional thin film multi-layer structure including the photolithography process, and the cost of the thick film multi-layer method is improved in terms of material and equipment. The merits are great. Further, by treating all thick film materials such as conductor paste and insulating paste with polymer paste, the firing temperature of cermet conductor paste and low melting point glass paste (400 ° C.
-500 ° C), extremely low temperature (150 ° C-180 ° C)
It is possible to obtain a highly reliable, high-density packaging integrated flat display device that can be cured at (° C.) and has little thermal influence (thermal stress strain, oxidation, etc.) on the display device. Further, since the drive circuit portion is formed integrally with the display device, it is possible to obtain extremely excellent effects such as reduction in size, thickness and weight.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a main part of a VFD for explaining an embodiment of a method of manufacturing a flat panel display device according to the present invention.

FIG. 2 is a plan view showing various laminated patterns of FIG.

FIG. 3 is a diagram showing a flowchart of a method for manufacturing the flat panel display device of FIG.

FIG. 4 is a diagram showing a flowchart of a conventional method for manufacturing a flat panel display device.

[Explanation of symbols]

 1 VFD 1a Front glass substrate 1b Back glass substrate 2 Conductor pattern 3 Interlayer insulating layer 4 Conductor pattern 5 Overcoat insulating layer 5a Land pattern 6 Solder 7 Surface mount component

Claims (1)

Claim: What is claimed is: 1. A flat display device is formed by integrally forming a pair of glass substrates, a surface oxide film is formed on one surface of the glass substrate, and the surface oxide film is formed on the surface oxide film. Coupling agent is applied, and the first-layer polymer-type conductor paste, polymer-type interlayer insulation paste, second-layer polymer-type conductor paste, and polymer-overcoat insulation paste are printed and cured to form multilayer wiring. A method for manufacturing a flat display device, characterized in that a surface mount component is placed on the multilayer wiring, and solder reflow is performed for bonding.