JPH05192952A - Mold apparatus - Google Patents

Abstract

PURPOSE:To easily perform the alignment of a plunger and a pot within a short time when a mold is replaced in a fixed state by arranging a moving means to the fixed part of a transfer with a stand. CONSTITUTION:A lower mold 5, an upper mold 7, the pot 7b provided to the upper mold 7 in order to introduce a resin into the mold part between two molds and a transfer 9 having the plunger 10 capable of being inserted in the pot 7b are respectively provided and the plunger 10 has access to the pot 7b at every one molding. The X-Y table 11 capable of freely moving the plunger 10 in a horizontal direction is provided between a pedestal 8 and the transfer 9 so as to make it possible to perform mold register without moving the mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a resin molding technique,
In particular, the present invention relates to a technique effectively used for resin encapsulation in the manufacture of semiconductor devices.

[0002]

2. Description of the Related Art When manufacturing a semiconductor device of a type in which a semiconductor pellet is sealed with a synthetic resin (resin) such as an epoxy resin, that is, a so-called resin-sealed semiconductor device, a transfer mold device is used, for example. FIG. 2 shows an example of this molding apparatus.

FIG. 2 is a front view showing an example of a conventional molding apparatus (however, a mold is shown in a sectional view).

As shown in FIG. 2, in the conventional molding apparatus, a hydraulic mechanism 1 including a cylinder is installed at the lowermost part, and a control panel 2 is provided on the upper part of the hydraulic mechanism 1. A lower platen 3 is installed on the control board 2, and four posts 4 are erected from each of the four corners of the lower platen 3.
Further, a lower mold 5 (not shown in the figure, but several tens of irregularities corresponding to the outer shape of the semiconductor device are actually formed) is installed at the center of the lower platen 3. The lower platen 3 and the lower mold 5 are configured so that they can be moved up and down by driving the hydraulic mechanism 1 using the posts 4 as guides.

An upper platen 6 is fixedly installed on the upper end of the post 4, and an upper mold 7 is attached to the lower surface of the upper platen 6.

The upper mold 7 is formed with a recess 7a for introducing resin at the center of the upper part, and a pot 7b communicating with the mold of the lower mold 5 is formed at the lower end of the recess 7a. .. A pedestal 8 is attached to the upper part of the upper platen 6, and a transfer 9 that operates by hydraulic pressure is attached to the center of the pedestal 8. Transfer 9
A plunger 10 that can be fitted into the pot 7b is connected to the lower end of the movable portion of the.

In such a structure, when molding is performed, first, a semiconductor pellet (not shown) to which leads are connected is placed at a predetermined position on the lower die 5, and then the lower platen 3 is raised. The lower die 5 is tightened to the upper die 7 with a strong pressure by the above, and the molten resin is injected into the concave portion 7a in this state, and the transfer 9 is driven when the molten resin is filled in the die. The plunger 10 is inserted into a pot provided in a mold, and then pushed down to perform molding.

In order to finish the mold into a clean shape, it is important to align the lower mold 5 and the upper mold 7.
In this mold matching, first, the lower mold 5 is set on the lower platen 3, and the upper mold 7 placed on the lower mold 5 is set on the plunger 1.
It is performed by slightly moving in the XY directions so as to match 0.
Whether or not this mold matching is appropriate is determined, for example, by inserting a pressure-sensitive paper and judging from the traces left on the pressure-sensitive paper. If this alignment is bad, the plunger 10 and the pot 7b of the upper mold 7 are abnormally worn. Therefore, the position of the lower die 5, the upper die 7 and the plunger 10 is 1/100 m each time the die is replaced.
You have to match up to m orders.

Regarding the technique relating to this type of resin-encapsulated semiconductor device, for example, Realize Co., Ltd. 1
Published on September 5, 986, "VLSI factory latest technology compilation, second edition, latest process and automation" is described in P272.

[0010]

According to the study by the present inventor, since the position of the transfer plunger and the pot of the molding die are aligned by moving the position of the molding die, a heavy die is used. There is a problem in that the alignment must be performed by manually moving the alignment, which takes time to reduce the productivity.

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique capable of easily aligning a plunger and a pot when replacing a mold die in a short time.

The above objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

In the present application, a typical one of the disclosed inventions will be briefly described as follows.

That is, a molding apparatus comprising a mold having a pot for introducing resin into the mold and a transfer having a plunger capable of being fitted into the pot, wherein the plunger moves into and out of the pot for each mold. A moving means for freely moving the plunger in the horizontal direction is provided.

[0015]

According to the above-mentioned means, the moving means arranged at the fixed portion of the transfer base can move only the plunger to an arbitrary horizontal position while the die is fixed. A plunger can be fitted to the pot. As a result, the mold dies can be easily and quickly aligned.

[0016]

1 is a front sectional view showing an embodiment of a molding apparatus according to the present invention. In addition, in FIG.
The same reference numerals have been used for the same elements as those, so that the duplicate description will be omitted here.

In this embodiment, an XY table 11 is arranged above the pedestal 8 in the configuration shown in FIG.
Another feature is that the plunger 10 is allowed to freely move in the X-Y directions. The XY table 11 is an electric type that uses a motor as a power source, and can be finely moved according to the rotation amount of an operation knob provided on the panel of the apparatus, but the XY table 11 is not used. You can also do it. In this case, X
It may be installed in place of the -Y table 11 and may be manually fed by a mechanism that combines a rack and a pinion (in this case, the XY table 11 is fixed by bolting after alignment). However, when it is installed in a narrow space, it is often impossible for the hand to enter, so it is desirable to use the electric type.

In setting the lower mold 5 and the upper mold 7 in such a structure, first, the lower mold 5 is aligned and fixed to the lower platen 3, and then the lower mold 5 is fixed. The upper die 7 is placed on the upper surface. After that, the lower platen 3 is raised by the hydraulic mechanism 1, the upper mold 7 is brought into close contact with the lower surface of the upper platen 6, and then the upper platen 6 and the upper mold 7 are fixed. Then, the lower platen 3 is lowered. Then, while slightly moving the transfer 9 in the XY direction, the pot 7b of the upper die 7 and the plunger 10 of the transfer 9 are moved.
Align with.

At this time, since the transfer 9 is installed on the XY table 11, the pot 7b and the lower die 5 are aligned with each other without moving the die at all.
It can be done easily. For example, the mold alignment, which required several hours in the conventional apparatus, can be completed in about 10 minutes in the present invention.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the embodiments and can be variously modified without departing from the scope of the invention. Needless to say.

Further, in the above description, the case where the invention made by the present inventor is mainly applied to the mold of the semiconductor device which is the application field thereof has been described, but the present invention is not limited to this, and the mold of the semiconductor device is not limited thereto. It is applicable to all of the one-pot type mold press devices other than the above.

[0022]

Among the inventions disclosed in the present application,
The effects obtained by the representative ones are briefly described as follows.

That is, a molding apparatus comprising a mold having a pot for introducing a resin into the mold and a transfer having a plunger capable of being fitted in the pot, wherein the plunger enters and leaves the pot for each mold. Since the moving means for freely moving the plunger in the horizontal direction is provided, the mold dies can be easily and quickly aligned.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a molding apparatus according to the present invention.

FIG. 2 is a front view showing an example of a conventional molding apparatus.

[Explanation of symbols]

 1 Hydraulic Mechanism 2 Control Panel 3 Lower Platen 4 Post 5 Lower Mold 6 Upper Platen 7 Upper Mold 7a Recess 7b Pot 8 Pedestal 9 Transfer 10 Plunger 11 XY Table

Claims (3)

[Claims] 1. A molding apparatus comprising a mold having a pot for introducing a resin into the mold and a transfer having a plunger capable of being fitted into the pot, wherein the plunger moves the pot into and out of each mold. A molding apparatus comprising a moving means for freely moving the plunger in a horizontal direction. 2. The molding apparatus according to claim 1, wherein the moving means is an XY table that moves by driving a power machine. 3. The table according to claim 1, wherein the moving means is a table that can be manually moved in the horizontal direction.
The described molding device.