JP3176457B2 - Processing dies for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing die for a semiconductor device used for processing such as lead forming of a semiconductor device.

[0002]

2. Description of the Related Art In a resin mold type semiconductor device,
After resin molding, processing such as dam bar cutting or lead forming is performed. These processes are performed by press working using a mold. FIG. 3 and FIG. 4 show a structure of a processing die conventionally used in these press workings. The mold shown in FIG. 3 is a commonly used mold, and the mold shown in FIG. 4 is an example of a mold for processing with high precision.

The structure of the mold shown in FIG. 3 will be described. As for the mold, an upper mold and a lower mold are installed on an upper mold set 10 and a lower mold set 12, respectively. The post 14 slide guides the upper die set 10 and determines the mutual positions of the upper die and the lower die.
The upper die includes a punch 16, a punch holder 18 for supporting the punch 16, a stripper plate 20, and a subpost 22 for guiding the vertical movement of the stripper plate 20.
Having. The lower die has a die 24 and a die holder 26 to be combined with the punch 16 and a guide plate 28 for transporting a workpiece.

In FIG. 3, only one guide post is shown for explanation, but usually four or six guide posts guide and support the upper die and the lower die. In actual processing, the entire die is set in a press device, and the upper die set 10 is pressed to perform the processing. Since this processing die is based on the guide post 14 as described above, the upper die and the lower die are mounted and aligned with each other before processing before processing.

However, when a multi-pin product is processed like a recent semiconductor device, the clearance between the punch and the die becomes extremely small, and a guide using only the guide post 14 as shown in FIG. However, there has been a problem that the accuracy of the method cannot be obtained. FIG. 4 shows a conventional mold used for processing a product requiring such high accuracy. This mold is configured to increase the device positional accuracy of the upper mold and the lower mold by providing a sub guide post 30 between the upper mold and the lower mold in addition to the guide post 14 conventionally used. .

[0006]

In the processing die shown in FIG. 4, a sub guide post 30 is erected and fixed on the punch holder 18, and sub guide bushes 32 and 34 are provided on the stripper plate 20 and the die holder 26, respectively. After the guide post 30 is supported by the guide and the mutual positional accuracy of the upper die and the lower die is finely adjusted by the sub guide bushes 32 and 34, the guide post 14 is finally positioned and set. This processing die is a sub guide post 30
As a result, the upper mold and the lower mold are positioned relative to each other, so that the positioning can be performed with higher precision, and processing with high precision can be performed.

As shown in FIG. 4, in the above processing die, when the upper die is raised to the upper position, the sub guide post 30 is detached from the lower die, but this is always in the die space. This is because if the sub guide post 30 is slid into the lower mold, it becomes difficult to handle the device. Although only one sub guide post 30 is shown in FIG. 2, a plurality of sub guide posts 30 are installed at appropriate positions in an actual processing die.
Therefore, if the outer guide post 14 and the sub guide post 30 are combined, the work becomes very difficult.

As described above, the conventional processing die has a problem that the number of guide posts is increased, so that the configuration becomes complicated and the handling becomes complicated. Therefore, the present invention has been made to solve these problems, and an object of the present invention is to simplify a mold configuration, thereby facilitating handling and making the mold compact. It is an object of the present invention to provide a processing die for a semiconductor device which can be formed.

[0009]

The present invention has the following arrangement to achieve the above object. That is, in a processing die of a semiconductor device which is set in a press device and performs processing such as lead forming of the semiconductor device, a strike is provided between a punch holder for supporting a punch and a die holder for supporting a die.
The post is fixed to the ripper plate and the
Extending so as to be always slidable on both the die and the die holder.
Characterized in that a guide post for guiding the support to align the upper and lower molds Te.

[0010]

[Action] A stripper plate is provided between a punch holder and a die holder to guide and support an upper mold and a lower mold of a mold.
Fixed to guide post provided in this guide post to
Machining the upper and lower molds guide supporting and Ri. Alignment of the upper and lower molds by providing the <br/> guide post for guiding supporting the upper and lower dies between the punch holder and the die holder can be highly accurately, the upper and lower molds respectively The dies can be made compact by eliminating the conventional upper die set and lower die set to be attached.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view showing the configuration of one embodiment of a processing die for a semiconductor device according to the present invention. The working mold of the embodiment has an upper mold and a lower mold that support the punch 16 and the die 24 in substantially the same configuration as the above-described conventional example shown in FIGS. The lower die set supporting the upper die set and the die holder 26 and the guide post connecting the upper die set and the lower die set are eliminated, and the upper die holder 18 and the lower die holder 26 are newly added. And that the guide post 40 is provided. In the drawings, the same members as those of the conventional example are denoted by the same reference numerals.

The newly provided guide post 40 corresponds to the sub guide post 30 erected on the punch holder 18 in the conventional example shown in FIG. 4, but in the processing die of the present embodiment, the punch holder 18 and the die holder 26 Since the mold is guided by providing a guide between them, it is referred to as a guide post. Although only one guide post 40 is shown in FIG. 1, the upper die and the lower die are actually supported by a plurality of guide posts. In the working die of the embodiment, three are provided on both side edges of the die, and six guides are supported.

Since the guide post 40 always needs to guide and support the upper die and the lower die, even if the upper die rises to the upper position as shown in the figure, the guide post 40 is long so as not to come off from the lower die. Set the In the embodiment, the guide post 40 is fixed to the stripper plate 20 vertically, and the post is extended to the punch holder 18 side and the die holder 26 side, respectively. In the punch holder 18 and the die holder 26, guide holes into which the guide posts 40 enter are respectively provided so as to penetrate in the thickness direction.
2,44 are installed. This guide bush 42, 4
Reference numeral 4 also serves as an adjustment for blade-to-blade adjustment of the punch 16 and the die 24, and completely fixes each guide bush with an adhesive in a state where the punch 16 and the die 24 are completely blade-aligned. In this way, the upper and lower dies are connected to the guide post 40.
As a result, the position accuracy is ensured and the state is set appropriately.

As described above, in the processing die of the embodiment, since the upper die and the lower die are positioned only by the guide post 40, the processing die requires higher strength than the sub guide post 30 shown in FIG. For this reason, a post thicker than the sub guide post 30 is used. Since this processing die has a configuration in which the upper die and the lower die are directly guided by the guide posts 40, extremely high positional accuracy between the upper die and the lower die is obtained as in the conventional example shown in FIG. It can be suitably used for high-precision processing.

When actually assembling the processing die of the embodiment, a jig for adjusting the upper die and the lower die by actually aligning the blades is required. FIG. 2 shows a state in which a processing die is adjusted using the adjustment jig. Adjusting jig 5
Reference numeral 0 is similar to the mold structure shown in FIG. 3, and includes an upper die set portion 52, a lower die set portion 54, and a post 56 standing upright on the lower die set portion 54. Using the adjusting jig 50, the above-mentioned processing die is blade-aligned, and when the positioning is completed, all the guide posts 40 are positioned. The positioning of the guide post 40 completes the adjustment of the processing die. The processing die after the completion of the adjustment can be taken out of the adjustment jig 50 as it is, and can be appropriately set in a press device to perform the processing.

As shown in FIG. 1, by setting the guide post 40 on the upper die and the lower die, the processing die of the present embodiment eliminates the need for the upper and lower die sets conventionally used. The guide post connecting the sets can be eliminated. As a result, the structure of the die can be simplified, and the die can be reduced in size by eliminating the die set portion, thereby improving the handleability. Further, the processing die can be set with high precision due to its structure, and can be suitably used for processing with high precision.

In the above embodiment, the guide post 40 is fixed to the stripper plate 20 and the punch holder 1 is fixed.
The guide post 40 is fixed to the punch holder 18 and slid into the stripper plate 20 and the die holder 26. Alternatively, the guide post 40 is fixed to the stripper plate 20 and the die holder 26. , And slide into the stripper plate 20 and the punch holder 18, respectively.

[0018]

According to the processing die for a semiconductor device according to the present invention, as described above, the upper die and the lower die are separated by a stripper die.
By supporting the guide via the guide post fixed to the rate, the upper die and the lower die can be aligned with high accuracy, and highly accurate processing can be performed. In addition, the mold structure is simplified by eliminating guide posts for guiding and supporting between the upper die set and the lower die set without using the conventional upper die set and lower die set. This has a remarkable effect that the entire mold can be compactly formed.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a configuration of an embodiment of a processing die of a semiconductor device.

FIG. 2 is an explanatory view showing an adjustment jig for adjusting a processing die.

FIG. 3 is an explanatory view showing the configuration of a conventional processing die for a semiconductor device.

FIG. 4 is an explanatory view showing a configuration of another conventional processing die for a semiconductor device.

[Explanation of symbols]

 Reference Signs List 10 Upper die set 12 Lower die set 14 Guide post 16 Punch 18 Punch holder 20 Punch plate 22 Sub post 24 Die 26 Die holder 28 Guide plate 30 Sub guide post 32, 34 Sub guide bush 40 Guide post 42, 44 Guide bush 50 Adjustment Jig

──────────────────────────────────────────────────続 き Continuing on the front page (72) Yoshitaka Todoroki 90, Kamikatuma, Tokura-cho, Hanishina-gun, Nagano Prefecture Inside Yamada Manufacturing Co., Ltd. (72) Fujio Kanayama 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo So Inside Knee Co., Ltd. (72) Inventor Sumio Hokari 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation Inside (72) Inventor Hitoshi Shibue 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sonny (56) References Hikaru Hei 2-38191 (JP, U) (58) Fields surveyed (Int. Cl. ⁷ , DB name) H01L 23/50 B21D 5/01

Claims (1)

(57) [Claims] In a processing die for a semiconductor device which is set in a press device and performs processing such as lead forming of the semiconductor device, the die is fixed to a stripper plate between a punch holder for supporting a punch and a die holder for supporting a die. Pos
Is always on both the punch holder and the die holder.
Processing mold of the semiconductor device being characterized in that a guide post Surigo can be aligned with the upper and lower molds are extended moth <br/> id support.