JPS6112677Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a semiconductor device molding device equipped with a positioning structure for a molding die.

Conventionally, in semiconductor devices, a semiconductor element formed by die bonding is wire-bonded onto a lead frame, and the outside of the semiconductor element is molded with resin in order to electrically and mechanically protect the semiconductor element from the outside air. ing. The outline is shown in Figure 1. In the figure, 1 is a lead frame, and 2 is a molding resin for a semiconductor element.

Next, a conventionally considered apparatus for carrying out the above resin molding will be explained based on FIGS. 2 and 3. In Fig. 2, numeral 3 denotes a molding press, which has four guide columns 4, an upper platen 5 fixed to the upper part of the guide columns 4, and a molding press that can move up and down along the guide columns 4 with respect to the upper platen 5. It consists of a lower platen 6 provided, a cylinder device 7 for resin injection fixed to the upper part of the upper platen 5, and a plunger 8 (see FIG. 3) that is supported by a piston rod of the cylinder 7 and moves up and down. 9
A molding die is composed of an upper mold 10 and a lower mold 11.
As shown in FIG. 3, the upper mold 10 and the lower mold 11 are removably screwed to the lower surface of the upper platen 5 and the upper surface of the lower platen 6 with bolts 12 and 13, respectively. 14 is a cylinder member fixed to the upper mold 10, and the lower part of this cylinder member 14 is fixed to the upper mold 10.
It opens into a cavity 15 formed between the upper mold 11 and the lower mold 11, and its upper part loosely fits into a through hole 16 provided in the upper platen 5 and projects above the upper platen 5. 1
7 is a guide bush provided on the upper mold 10; 18;
A guide post is provided on the lower die 11, and the upper die 10 and the lower die 11 are positioned by fitting the guide posts 17 and 18 together. The lower mold 11 has an air flow groove 19 provided on its lower surface, and an air supply port 20 that supplies air to the air flow groove 19.
(Figure 2).

In the above configuration, the molding die 9 is first set on the lower platen 6 as shown in FIG.
placed on top. At this time, as shown in FIG. 3, the upper mold 10 is positioned on the lower mold 11 by the guide bush 17 and the guide post 18. Further, the plunger 8 is in a state of being pulled out upward from the cylinder member 14. Then, as the lower platen 6 rises, the upper part of the cylinder member 14 enters the through hole 16 of the upper platen 5.
In this fitted state, the molding die 9, that is, the cylinder member 14 is aligned with the plunger 8. Next, upper mold 10, lower mold 1
1 is fixed to the upper platen 5 and lower platen 6 by bolts 12 and 13, respectively. From this, after loading the lead frame 1 shown in FIG. 1 between the upper mold 10 and the lower mold 11 and clamping the molds, and supplying the mold resin 2 into the cylinder member 14, the plunger 8 is inserted into the cylinder member 14. The mold resin 2 is injected into the cavity 15. As a result, the outside of the semiconductor element (not shown) set on the lead frame 1 is molded with resin.

The desired mold is made as described above, but
In the above-mentioned conventional configuration, it took a very long time to set up the molding die 9 on the molding press 3. That is, as shown in FIG. 3, it is necessary to set up the molding die 9 so that the plunger 8 can be smoothly moved in and out of the cylinder member 14 attached to the upper die 10. In this case, since the plunger 8 is supported or positioned by the cylinder device 14 fixed to the upper platen 5 of the press, the cylinder member 14 attached to the molding die 9 can be set up to be directly below the plunger 8. There is a need to. That is, the cylinder member 14 and plunger 8 must be centered.

Conventionally, in order to perform this centering, the dimensions from the guide column 4 of the molding press 3 to the molding die 9 are measured, the approximate center is set out, and then the plunger 8 is lowered to find the actual center. If the centers are not aligned, the mold 9 is moved again, which requires a lot of time to center. On the other hand, although it is sufficient to center the mold once, when the mold 9 is removed from the molding press 3 for replacement or maintenance, it is necessary to perform the same centering each time. It was very tedious and could only be done by a skilled worker.

This idea was made to eliminate the above-mentioned drawbacks, and by simply attaching a locating pin, the plunger and cylinder member can be centered, making it easy to mold without requiring any skill. It is an object of the present invention to provide a semiconductor element molding apparatus in which the mold can be replaced.

An embodiment of this invention will be described below based on the drawings.

As shown in FIGS. 4 and 5, a semiconductor device molding apparatus according to an embodiment of this invention includes a cavity 15 between an upper mold 10 and a lower mold 11 of a molding die 9.
Cylinder member 14 for injecting mold resin 2
are provided protruding from the upper part of the upper mold 10, and the upper mold 10 is removably screwed to the upper platen 5 of the molding press 3 and the lower mold 11 to the lower platen 6 which can be raised and lowered with respect to the upper platen 5. The cylinder member 14 is connected to the through hole 1 provided in the upper platen 5.
A plunger 8 for resin injection is detachably fitted into the cylinder member 14 from above the upper platen 5 by being loosely fitted into the lower mold 1 .
Positioning holes 22 and 23 that coincide with each other are provided in the bracket 21 and the lower platen 6 of No. 1, and positioning pins 24 are removably inserted into the positioning holes 22 and 29 to position the lower mold 11 on the lower platen 6. It is composed of Further, the lower mold 11 is provided with an air flow groove 19 on its lower surface,
An air supply port 20 for supplying air to the air flow groove 19 is provided on the side, and the air flow groove 19, except for the air supply port 20, is sealed by the lower mold 11 and the lower platen 6. There is. Note that the positioning hole 22 on the lower mold 11 side is
1 can be provided directly. Furthermore, in the lower mold 11 in FIG. 5, the cavity 1 shown in FIG.
5 is omitted.

In the above configuration, the pair of positioning holes 22, 2
3 are designed to correspond to each other when the centers of the plunger 8 and the cylinder member 14 coincide with each other. That is, when the lower mold 11 of the molding die 9 is placed on the lower platen 6 and the positioning pins 24 are inserted into the positioning holes 22 and 23, the cylinder member 14 corresponds concentrically to the plunger 8 and both 8 , 14 centers coincide with each other. As a result, the lower mold 11 is immediately screwed to the slide table 6, and the upper mold 10 with the lower platen 6 raised.
can be immediately screwed onto the upper platen 5, and the molding die 9 can be easily replaced.

In addition, when aligning the positioning hole 22 on the lower mold 11 side with the positioning hole 23 on the slide table 6 side, the molding die 9 with air supplied from the air supply port 20 to the air flow groove 19 is floated, and the positioning pin 24 is attached. make it easy to do.

As described above, according to the semiconductor device molding apparatus of this invention, it is possible to center the plunger and the cylinder member simply by installing the positioning pin, and the positioning pin can also be installed easily. Because it requires no skill,
Molding molds can be easily replaced.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view of a semiconductor device, Fig. 2 is a perspective view showing a conventionally considered semiconductor element molding device, and Fig. 3 is an example of a molding die of the molding device shown in Fig. 2. FIG. 4 is a partially cutaway side view of a semiconductor device molding device according to an embodiment of the invention, and FIG. 5 is a partially cutaway perspective view of the molding device shown in FIG. 4. . 2...Mold resin, 3...Molding press, 5...
...Upper platen, 6...Lower platen, 8...Plunger, 9...Molding die, 10...Upper mold, 11...
Lower mold, 14... Cylinder member, 15... Cavity, 16... Through hole, 19... Air flow groove, 20
...Air supply port, 22, 23...Positioning hole, 2
4...Positioning pin. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] A cylinder member for injecting mold resin into a cavity between an upper mold and a lower mold of a molding die is provided to protrude from the upper part of the upper mold, and the upper mold can be moved up and down on the upper platen of the molding press with respect to the upper platen. The lower molds are each removably fixed to a lower platen, the cylinder member is loosely fitted into a through hole provided in the upper platen, and a plunger for resin injection is attached to and removed from above the upper platen. In a molding device for a semiconductor element that can be freely inserted, positioning holes that are provided in the lower mold and the lower platen and coincide with each other, and positioning that is removably inserted into the positioning holes and that positions the lower mold on the lower platen. The lower mold includes an air flow groove provided on the lower surface thereof, and an air supply port for supplying air from the outside to the air flow groove, and the air flow groove includes the air flow groove other than the air supply port. 1. A semiconductor device molding device, characterized in that the device is sealed by a lower mold and the lower platen.