JPH05190308A - Multiple chip resistor - Google Patents

Abstract

PURPOSE:To allow easy production by using a conventionally used simple structure insulating board. CONSTITUTION:A plurality of resistance films 3 are formed on the top plane of a rectangular insulating board 2 and a plurality of terminal electrodes 4 and 5 connected with the resistance films 3 are formed on the facing edges of the insulating board 2. The pitch of the terminal electrodes on the facing edges of the insulating board 2 is permitted to be the almost double pitch of the wiring pattern on a wiring board on which the multiple chip resistor is to be installed, the terminal electrode on the one edge and the terminal electrode on the other edge are formed with the positional deviation of approximately the wiring pattern pitch and the terminal electrode structure on the one edge 4 is permitted to be a recessed electrode and the terminal electrode structure on the other edge 5 is permitted to be a protruding electrode.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple chip resistor having a plurality of resistive films formed on the upper surface of a rectangular insulating substrate.

[0002]

2. Description of the Related Art Conventionally, this type of multiple chip resistor is constructed, for example, as shown in FIG. This multiple chip resistor 20 includes a rectangular insulating substrate 21 made of alumina or the like.
A plurality of resistive films 22 are formed side by side on the upper surface of the insulating substrate 21, and terminal electrodes 23 and 24 connected to the resistive film 22 are formed at opposite ends of the insulating substrate 21, respectively. The pitch of the terminal electrodes 23 and 24 at the opposite end edges of the multi-chip resistor 20
The wiring pattern pitch of the wiring board on which the wiring board is attached or a value close to the wiring pattern pitch, and the terminal electrode 23 on one edge side and the terminal electrode 24 on the other edge side are the wiring pattern pitch or a value close to it. It is formed by shifting the position. Therefore, for example, when the wiring patterns 8 and 9 for connecting the terminal electrodes 23 and 24 are extended and formed in the same direction as shown in FIG. 5, adjacent wiring patterns connecting the terminal electrodes 23 on one edge side are formed. Terminal electrodes 24 on the other edge side between 8a and 8b
It becomes possible to form the wiring pattern 9a for connecting to each other. That is, the wiring patterns 8a and 9 in this case
The pitch between a, 8b and 9b is equal to or close to the wiring pattern for mounting the semiconductor IC. The wiring patterns 8a, 8b, 9a, 9 shown in FIG.
Although all b are formed so as to extend in the same direction, for example, as shown in FIG. 6, the wiring patterns 8a,
When 8b, 9a and 9b are formed so as to extend in mutually opposite directions, another wiring pattern 11a can be formed between adjacent wiring patterns 8a and 8b and between 10a and 10b. There is an advantage that the wiring pattern density of the wiring board can be increased.

Further, in the multiple chip resistor shown in FIG. 4,
Although not shown, the terminal electrodes 23 and 24 are also continuously formed on the side surface and the lower surface of the insulating substrate 21, respectively. Although not shown, a protective film made of a glaze material is provided on the upper surface of the insulating substrate 21 so as to cover the resistance film 22. It should be noted that recessed grooves 25 and 26 are formed between the terminal electrodes 23 and 23 and 24 and 24 which are adjacent to each other on opposite ends of the insulating substrate 21, respectively.
When is soldered to the wiring pattern of the wiring board, the adjacent terminal electrodes are prevented from being short-circuited by the solder.

[0004]

The multiple chip resistor 20 constructed as described above is generally manufactured by a sheet method in which a plurality of multiple chip resistors 20 are simultaneously formed on a large-sized insulating substrate. FIG. 7 is a plan view showing an arrangement of adjacent multiple chip resistors 20 and 20 'in a part of a conventional large-sized insulating substrate.

When such a method is adopted, the terminal electrodes 23 and 24 are formed so as to be offset from each other, and in order to maximize the number to be taken in one insulating substrate and improve the productivity, the concave grooves 25 and 26 are provided. The groove 2 of the multiple chip resistors 20 'adjacent to each other
Must be placed in common with 5 ', 26'. In this case, the terminal electrodes 23 and 23 'or 24 and 24' are arranged so as to be adjacent to each other, and when the resistance values of the plurality of resistance films 22 between 23 and 24 are simultaneously corrected, the resistance values on the terminal electrodes 23 and 24 are usually adjusted. Set up the meter for measurement, and after correction, move the meter to the W dimension side stepwise.
Correct 2 ', but if you simply move step 2
The meter that was in contact with 4 cannot contact 23 ', so it is necessary to make mechanical correction. Further, the electrodes of the multiple chip resistors 20 and 20 'are arranged in line symmetry, which limits the directionality of the completed resistance value measurement and mounting, which is inconvenient.

If the meter reading is simply moved in steps when the resistance value is corrected, multiple chip resistors 20 and 20 'are arranged as shown in FIG. 8 and a portion 27 for connecting them is provided. Therefore, although the number of insulating substrates to be taken is small, the number of processing of the substrate for providing the concave grooves 25 and 26 increases, which causes a problem of high production cost.

The present invention solves such a problem, and can be easily manufactured by using an insulating substrate having a structure conventionally used for a multiple chip resistor. The purpose is to provide a vessel.

[0008]

In order to achieve such an object, the multiple chip resistor of the present invention has a plurality of resistive films formed on the upper surface of a rectangular insulating substrate, and the insulating substrate It is configured by forming a plurality of terminal electrodes respectively connected to the resistance film on the opposite end edges, and the pitch of the terminal electrodes on the opposite end edges of the insulating substrate is set to the wiring board to which this multiple chip resistor is attached. The wiring pattern pitch is set to be twice the wiring pattern pitch or a value close to the wiring pattern pitch, and the terminal electrodes on one edge side and the terminal electrodes on the other edge side are formed so as to be displaced from each other by the wiring pattern pitch or a value close thereto. In addition, the terminal electrode structure on one edge side is formed as a concave electrode, and the terminal electrode structure on the other edge side is formed as a convex electrode.

[0009]

It is possible to manufacture an insulating substrate having a structure which has been conventionally used for a multiple chip resistor without changing the conventional method of correcting the resistance value. for that reason,
The multiple chip resistors can be easily formed at low cost.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a multiple chip resistor according to an embodiment of the present invention, and FIG. 2 is a sectional side view thereof.

In these figures, multiple chip resistors 1
Is a plurality of resistance films 3 formed on the upper surface of a rectangular insulating substrate 2 made of alumina or the like, and connected to the resistance film 3.
The insulating substrate 2 is composed of a plurality of terminal electrodes 4 and 5 formed on opposite edges of the insulating substrate 2. These terminal electrodes 4 and 5 are formed by printing an electrode paste of Ag, Ag-Pd, Cu or the like and firing them. The pitch P between adjacent terminal electrodes 4, 4 and 5, 5 is The wiring pattern pitch formed on the wiring board to which the multiple chip resistor 1 is attached is set to a value twice or close to the wiring pattern pitch. In addition, the terminal electrode 4 on one edge side
The terminal electrodes 5 on the other edge side are formed such that their positions are displaced by the wiring pattern pitch or a value close thereto. That is, the terminal electrode 4 on one edge side
Is positioned between the adjacent terminal electrodes 5 and 5 on the other edge side, and the terminal electrode 5 on the other edge side is positioned between the adjacent terminal electrodes 4 and 4 on the one edge side. Further, the respective terminal electrodes 4, 5 are continuously formed on the side surface and the lower surface of the insulating substrate 2, and the tip portions on the upper surface side thereof are formed in an L shape so that the terminal electrodes 4, 5 forming a pair are connected to each other. It is shaped so as to face each other. For the resistance film 3, for example, a cermet resistance paste such as ruthenium oxide is used for the terminal electrodes 4,
It is formed by printing across the tip portions of 5 and firing. Of the terminal electrodes on both edges of the insulating substrate 2, the terminal electrode 4 portion is a concave electrode formed by a through-hole electrode and has convex portions 6 on both sides thereof, and the terminal electrode 5 portion is a convex electrode having concave grooves 7 on both sides thereof. Has been formed. Further, although not shown, a protective film made of a glaze material or the like is formed on the upper surface of the insulating substrate 2 so as to cover the resistive film 3.

Incidentally, it is desirable that the dimension W between the opposite edges of the insulating substrate 2 is set to the pitch P between the terminal electrodes 4 and 5 in relation to the mounting on the wiring substrate.

The multiple chip resistor 1 thus constructed
Is composed of an insulating substrate having concave grooves 7 with an equal pitch and a terminal electrode 4 of a concave electrode, which are generally used in a conventional multiple chip resistor. Therefore, in the resistance value correction process, a meter for resistance value measurement is set up on the terminal electrodes 5 and 6, and after correction, simply step-moves to the W dimension side to correct the resistance value of the multiple chip resistors arranged next to each other. It becomes possible to do so, and it is not necessary to make a mechanical correction. However, at this time, it is necessary that the terminal electrode 5 of the convex electrode and the terminal electrode 4 of the concave electrode of the adjacent multiple chip resistors are not electrically connected at the time of printing formation.

The multiple chip resistor of the present invention is not limited to that of the above-described embodiment, but may have the structure shown in FIG. 3, for example.

The multiple chip resistor 11 shown in FIG.
Terminal electrodes 4 at both ends in the central longitudinal direction on the upper surface of the insulating substrate 2
The common electrode 12 connected between the electrodes 5 is formed, and the resistance film 3 is formed so as to extend over the terminal electrodes 4 and 5 and the common electrode 13.

Furthermore, there are various other modes of connection between the resistance film 3 and the terminal electrodes 4 and 5, and the multiple chip resistor of the present invention includes all of them.

[0018]

As is apparent from the above description, according to the present invention, the terminal electrode structure on one edge side of the terminal electrodes on opposite edges of the insulating substrate is a concave electrode and the terminal electrode structure on the other edge side. By using as the convex electrode, the structure of the insulating substrate is simplified, and the resistance value correction process can be easily performed.

[Brief description of drawings]

FIG. 1 is a plan view of a multiple chip resistor according to an embodiment of the present invention.

FIG. 2 is a sectional side view of a multiple chip resistor according to an embodiment of the present invention.

FIG. 3 is a plan view of a multiple chip resistor according to another embodiment of the present invention.

FIG. 4 is a plan view of a conventional multiple chip resistor.

FIG. 5 is a wiring pattern diagram of a wiring board to which the multiple chip resistor according to the present invention is attached.

FIG. 6 is a wiring pattern diagram of a wiring board to which the multiple chip resistor according to the present invention is attached.

FIG. 7 is a plan view showing the arrangement of conventional multiple chip resistors adjacent to each other.

FIG. 8 is a plan view showing an arrangement of conventional adjacent multiple chip resistors.

[Explanation of symbols]

 1 Multiple Chip Resistors 2 Insulating Substrate 3 Resistive Film 4 Terminal Electrode of Recessed Electrode with Through Hole Electrode 5 Terminal Electrode with Convex Electrode 6 Convex 7 Recessed Groove

Claims (1)

[Claims] 1. A rectangular insulating substrate is formed with a plurality of resistive films on the upper surface thereof, and a plurality of terminal electrodes connected to the resistive films are formed on opposite end edges of the insulating substrate, respectively. And, the pitch of the terminal electrodes on both opposite edges of the insulating substrate is set to a value twice or close to the wiring pattern pitch of the wiring board on which the multiple chip resistor is mounted, and the terminal electrodes on one edge side And the terminal electrode on the other edge side are formed with their positions shifted by the wiring pattern pitch or a value close thereto, and the terminal electrode structure on one edge side is a concave electrode and the terminal electrode structure on the other edge side is a convex shape. A multiple chip resistor characterized by using electrodes.