JPH0518757U - Solder bath - Google Patents

Abstract

(57) [Summary] [Purpose] An adjusting device that allows a movable dam plate attached to a storage tank formed in a jet tank to move up and down, and that can move the vertical motion of the movable dam plate at a position separated from the movable dam plate. To get [Structure] A long operating plate in which a screw rod 33 is vertically attached to a base 32 attached to an outer wall surface 11a on the front side of the solder bath 11 in the traveling direction of the printed board 1 and screwed to the screw rod 33. The movable weir plate 24 fixed via the connecting plate 41 attached to the actuating plate 35 is moved up or down by raising or lowering 35 by the rotation of the screw rod 33.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solder bath provided with an adjusting device capable of operating the vertical movement of a movable dam plate attached to a reservoir for storing a solder melt at a position separated from the movable dam plate.

[0002]

[Prior Art]

 3 is a perspective view showing an example of a conventional solder bath, FIG. 4 is a cross-sectional view taken along the line I-I of FIG. 3, and FIG. 5 is a cross-sectional view showing an aspect in which the solder melt of FIG. 4 overflows. is there. In these figures, 1 is a printed circuit board, 2 is an electronic component, 3 is a lead wire, 4 is a carrier chain, and the printed circuit board 1 is held by a carrier of a soldering device (not shown) or a substrate holder of a carrier chain 4. , Run in the direction of arrow A at a rising angle θ with respect to the horizon. Reference numeral 11 is a solder bath, 12 is a solder melt, 13 is a jet tank installed in the solder bath 11, 14 is a jet port of the jet bath 13, and 15 is a melt 12 jetted from the jet port 14. The solder melt 12 jetted from the jet port 14 is stored in the storage tank for storing the flow wave 12a flowing out in the direction of the arrow B opposite to the traveling direction of the printed circuit board 1 as shown in FIG. To form. Reference numeral 16 is a side plate of the jet tank 13, 17 is a dam plate fixed to the storage tank 15, 18 is an overflow portion for overflowing the solder melt 12 in the storage tank 15 in the direction of arrow C in FIG. Is a movable dam plate, the longitudinal direction of which is provided at a right angle to the traveling direction of the printed circuit board 1 (direction of arrow A), and as shown in FIG. To form. Reference numeral 20 denotes a pair of adjusting screws as means for adjusting the overflow wave 12b by moving the movable dam plate 19 up and down by screwing with the movable dam plate 19, which are provided at both ends of the movable dam plate 19. As shown in FIG. 4, the lower end portion 20 a is loosely fitted in a through hole 21 formed in the bottom portion of the storage tank 15. 22 is a washer for preventing the adjusting screw 20 from coming out of the through hole 21. In FIG. 3, reference numeral 23 denotes a motor for forcibly circulating the solder melt 12 so that the solder melt 12 in the solder bath 11 is jetted from the jet port 14 of the jet bath 13.

The conventional solder bath 11 is configured as described above, and the rotation of the motor 23 causes the solder melt 12 to jet from the jet port 14 to enter the storage tank 15 for storage and to store the stored solder melt. 12 flows in the direction of arrow B to form a flowing wave 12a.

By adjusting the height of the movable barrier plate 19, generation of bridges, icicles or excessive build-up portions on the printed circuit board 1 is prevented.

FIG. 6 is a side cross-sectional view showing another shape of the conventional movable dam plate, and FIG. 7 is a plan view showing a mode in which the transport chain 4 is right above the adjusting screw 20. The same reference numerals denote the same parts, 24 is a plate-like movable dam plate, and 25 is a fixing screw for fixing the movable dam plate 24 at a required position after moving the movable dam plate 24 up and down. The operation is the same as in the case of FIGS.

[0006]

[Problems to be solved by the device]

 By the way, in the conventional solder bath 11, since the vertical movement of the movable dam plate 19 is adjusted by the adjusting screws 20 at both ends, it is difficult to set the movable dam plate 19 horizontally. Especially, in the case of FIG. Since the movable dam plate 24 is fixed while being adjusted horizontally by the screw 25, there is a problem that the operation is difficult. Further, in the case of the carrierless carrier chain 4, since the holding width is changed depending on the size of the printed circuit board 1, as shown in FIG. There is a problem that when it is up, it becomes difficult to adjust, and when there is a guide rail (not shown) of the transport chain 4, it may be impossible to perform the adjustment operation. Further, when the solder melt 12 in the solder bath 11 is melted, the temperature becomes high, so that it is dangerous to adjust the adjusting screw 20 and the fixing screw 25.

The present invention has been made to solve the above-mentioned problems, and the vertical movement can be easily adjusted while maintaining the horizontal position of the movable dam plate, and the adjustment can be performed at a position away from the movable dam plate. The purpose is to obtain a solder bath equipped with an adjustable device.

[0008]

[Means for Solving the Problems]

 The solder bath according to the present invention adjusts the overflow rate of the solder melt overflowing from the storage bath, so that the movable dam plate is moved up and down and an adjusting device that can be set in a horizontal position at a required height is provided. It is provided at a position separated from the movable barrier plate.

The adjusting device includes a base, a screw rod rotatably attached to the base in a vertical direction, and a screw rod rotatably attached to the base. It consists of a long operating piece that moves up and down and a connecting piece that connects both ends of this operating piece and both ends of the movable dam plate, respectively.

[0010]

[Action]

 In the present invention, both ends of the movable barrier plate can be moved up and down at the same time, and the movable barrier plate can be adjusted at a position away from the solder bath.

Further, by rotating the screw rod to raise or lower the operating piece, both ends of the movable dam plate fixed via the connecting piece can be moved up and down at the same time while maintaining the horizontal position. ..

[0012]

【Example】

 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a view showing the adjusting device of FIG. In these drawings, the same reference numerals as those in FIGS. 3 to 5 indicate the same portions, and 31 moves up and down at a position separated from the movable dam plate 24 to set the movable dam plate 24 to a required height. The entire adjusting device for adjusting the overflow flow rate of the solder melt 12 is shown. 32 is a base mounted on the outer wall surface 11a in front of the solder bath 11 in the traveling direction of the printed circuit board 1 (the direction of arrow A), and 33 is rotatable in the longitudinal direction of the base 32 in the vertical direction. Is attached to the upper part of the threaded rod 33, 35 is screwed to the threaded rod 33, and is provided in parallel with the movable dam plate 24, and is vertically moved by the rotation of the threaded rod 33. A pair of bases attached to the outer wall surface 11a of the solder bath 11 at both end portions of the operation piece 35, 37 a fixture integrally attached to the base 36, and 38 A rod fixed vertically between the base 36 and the fixture 37, a movable body 39 fitted vertically to the rod 38, and a space 40 between the base 36 and the movable body 39. Urges the movable body 39 upward with Compression springs mounted in the same direction, 41 is a connecting piece connecting both ends of the actuating piece 35 and both ends of the movable dam plate 24, and 42 is a fine adjustment screw for adjusting the distance between the dam plate 17 and the movable dam plate 24. Is.

Next, the operation will be described. The operation of soldering the printed circuit board 1 is the same as the conventional one, but in the embodiment of the present invention, when the handle 34 is turned in the direction of arrow E in FIG. As a result, the movable barrier plate 24 rises via the connecting piece 41. When the handle 34 is rotated in the direction opposite to the arrow E direction, the operating piece 35 is lowered by the rotation of the screw rod 33, so that the movable dam plate 24 is lowered via the connecting piece 41. At this time, the movable body 39 is guided by the rod 38 to move up and down. Further, since the weights of the operating piece 35, the movable body 39, the connecting piece 41 and the movable dam plate 24 are set so as to balance with the restoring force or the pressing force of each compression spring 40, the movable dam plate 24 has A small turning force is applied to the handle 34 during vertical movement. Therefore, the adjustment for setting the movable barrier plate 24 to the required height can be easily performed.

[0014]

[Effect of the device]

 As described above, according to the present invention, in order to adjust the overflow rate of the solder melt overflowing from the storage tank, the movable dam plate can be moved up and down, and the adjustment can be made in the horizontal position at the required height. Since the device is installed at a position separated from the movable weir plate, both ends of the movable weir plate can be moved up and down at the same time, so that the horizontal position of the movable weir plate can be easily set and adjusted, and it can be performed quickly. it can. In addition, since the vertical movement of the movable barrier plate can be operated at a position away from the solder melt, there are advantages such as safety.

In addition, the adjusting device includes a base, a screw rod rotatably attached to the base in a vertical direction, and a screw rod rotatably attached to the base. It consists of a long operating piece that moves up and down, and a connecting piece that connects this operating piece and a movable barrier plate, respectively, to keep the transport chain running even when the printed circuit board is being transported. Adjustments can be made without stopping. Further, even if the position of the carrier chain changes depending on the holding width of the printed circuit board, the carrier chain can be finely adjusted without disturbing it, and the height of the movable dam plate can be finely adjusted. This has the advantage that the solder melt can be properly attached to the printed circuit board and the quality of the printed circuit board can be improved by soldering.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.

2 is a diagram showing the adjusting device of FIG. 1. FIG.

FIG. 3 is a perspective view showing an example of a conventional solder bath.

4 is a cross-sectional view taken along the line II of FIG.

5 is a cross-sectional view showing an aspect in which the solder melt of FIG. 4 overflows.

FIG. 6 is a side sectional view showing another shape of the movable barrier plate shown in FIG.

FIG. 7 is a plan view showing a mode in which the transport chain is directly above the adjusting screw.

[Explanation of symbols]

 1 Printed Circuit Board 4 Transport Chain 11 Solder Tank 12 Solder Melt 12a Flow Wave 12b Overflow Wave 13 Jet Flow Tank 14 Jet Flow Port 15 Reservoir Tank 24 Movable Dam Plate 31 Adjusting Device 32 Base 33 Screw Rod 35 Operating Plate 36 Base 41 Connection Piece

Claims (2)

[Scope of utility model registration request] 1. A jet tank for jetting a solder melt is provided, and a reservoir for storing the solder melt jetted from a jet port of the jet tank is provided, and the solder melt stored in the reservoir is printed. An overflow wave is generated by flowing out in a direction opposite to the traveling direction of the board to form a flow wave, and overflowing the solder melt stored in the reservoir in the same direction as the traveling direction of the printed board. In a solder bath provided with a movable barrier plate forming the storage tank in the storage tank, in order to adjust the overflow flow rate of the solder melt overflowing from the storage tank, the movable barrier plate is moved up and down and at a required height. A solder bath, wherein an adjusting device that can be set in a horizontal position is provided at a position separated from the movable dam plate. 2. The solder bath according to claim 1, wherein the adjusting device includes a base, a screw rod rotatably attached to the base in a vertical direction, and a screw rod attached to the screw rod. A solder bath comprising a long operating piece that is screwed and moves up and down by rotation, and a connecting piece that connects the operating piece and a movable dam plate.