JPH0518045Y2 - - Google Patents
Info
- Publication number
- JPH0518045Y2 JPH0518045Y2 JP5379686U JP5379686U JPH0518045Y2 JP H0518045 Y2 JPH0518045 Y2 JP H0518045Y2 JP 5379686 U JP5379686 U JP 5379686U JP 5379686 U JP5379686 U JP 5379686U JP H0518045 Y2 JPH0518045 Y2 JP H0518045Y2
- Authority
- JP
- Japan
- Prior art keywords
- chisel
- polishing
- polished
- angle
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 20
- 239000004575 stone Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5379686U JPH0518045Y2 (US20020051482A1-20020502-M00012.png) | 1986-04-10 | 1986-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5379686U JPH0518045Y2 (US20020051482A1-20020502-M00012.png) | 1986-04-10 | 1986-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62165842U JPS62165842U (US20020051482A1-20020502-M00012.png) | 1987-10-21 |
JPH0518045Y2 true JPH0518045Y2 (US20020051482A1-20020502-M00012.png) | 1993-05-13 |
Family
ID=30880189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5379686U Expired - Lifetime JPH0518045Y2 (US20020051482A1-20020502-M00012.png) | 1986-04-10 | 1986-04-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0518045Y2 (US20020051482A1-20020502-M00012.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719707Y2 (ja) * | 1988-05-16 | 1995-05-10 | 文明 鈴木 | 鏨固定具の研磨角度調整部材 |
EP0405301B1 (en) * | 1989-06-29 | 1995-08-30 | Applied Materials, Inc. | Apparatus for handling semiconductor wafers |
-
1986
- 1986-04-10 JP JP5379686U patent/JPH0518045Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62165842U (US20020051482A1-20020502-M00012.png) | 1987-10-21 |
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