JPH05178363A - Taping chip part group - Google Patents

Abstract

PURPOSE:To obtain the tape mount which is easy and inexpensive to make and easy to handle and in which a series of microelectronic chip parts are receivable with a highly reliable sucking action. CONSTITUTION:A plurality of cavity holes 11 are formed by punching in the tape mount consisting of paper fiber and having a diameter of at most 30mum at predetermined intervals. A chip part 2 is received and retained separately in each of the cavity holes 11 and the upper and lower surfaces of the tape 1 are covered by cover tapes 3 and 4 by attaching thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a series of parts for taping chip parts, and more particularly to a series of parts for taping chip parts which can reduce mounting errors when the chip parts are mounted on a mounting printed circuit board. ..

[0002]

2. Description of the Related Art Recently, the shape of chip capacitors, chip resistors, etc. is 1005 type (1.0 mm × 0.5 mm)
The ultra-small chip parts that have been put to practical use have been put to practical use.

Handling such as transportation of this type of micro chip component is carried out by an automatic mounter when the micro chip component is stored in a series of taping components and the micro chip component is mounted on a mounted printed circuit board.

[0004] A general taping component series forms a cavity hole by mechanically punching a tape mount, stores and holds a chip component in the cavity hole, and further covers a tape on the upper and lower surfaces of the tape mount. I was pasting it. Then, when mounting the chip component at a predetermined position on the mounted printed circuit board, one cover tape is peeled off, the chip component in the cavity hole is taken out by the vacuum suction device, and the printed circuit board is mounted at the predetermined position.

[0005] Here, when the ultra-small chip component as described above is sucked by a vacuum suction device and mounted on a mounted printed circuit board, a paper fiber produced by mechanical punching on the end face of the cavity of the tape mount. Due to the breakage of the chips, the micro chip components may collide with or get caught, resulting in a mounting error of the micro chip components.

In order to solve such a problem, a tape mount having a cavity hole is burner-treated, or a cavity is formed in the tape mount by punching with a heated punch. Unnecessary paper fibers emerging from the end face of the cavity hole were removed.

According to this conventional technique, a tape mount having a cavity hole formed by mechanical punching is run by a propane gas burner at a speed of 200 mm / sec to eliminate unnecessary paper fibers generated on the end face of the cavity hole. It was a thing.

Further, by heating the tape mount to about 200 ° C. and punching the tape mount, the unnecessary fluffy paper fibers formed on the end faces of the cavity holes are solidified.

[0009]

However, when the burner-controlled tape mount is produced as described above, if the burner is erroneously controlled, the tape mount itself will be burned, and there will always be a danger in handling. turn into. Further, since the burner cannot be intermittently processed only in the cavity hole portion, the one main surface of the tape mount is burnt and the appearance is deteriorated. In addition, since a mechanical treatment called a burner treatment step is different from the mechanical treatment, it lacks a series in the taping production step, resulting in poor production efficiency and high cost of the tape mount.

Further, punching with a heated punch cannot be said to be good in production efficiency because it is necessary to mount a heater or the like on the punch blade in addition to mechanical punching and temperature control is difficult. ..

The present invention has been devised in view of the above-mentioned problems, and an object thereof is that the tape mount can be processed normally, and further, it is not necessary to generate the tape on the end face of the cavity hole. (EN) It is possible to prevent fluffing of paper fibers and to provide a tape component series of chip components with high suction reliability of ultra-small chip components.

[0012]

According to the present invention, a tape mount made of paper fibers having an average diameter of 30 μm or less is used, and chip parts are respectively housed in cavity holes formed at regular intervals in the tape mount. While holding
It is a taping component series of chip components formed by attaching cover tape members to the upper and lower surfaces of the tape mount.

More preferably, the porosity of the cut surface of the cavity hole is 14% or less.

[0014]

When the tape mount is mechanically cut by punching or the like in order to form the cavity holes in the tape mount, fluffiness due to minute paper fibers occurs from the cut surface. Considering the occurrence of this fluff, when the paper fibers located on the cut surface are sheared by the punching blade, the paper fibers should be pressed by the punching blade to escape into the space between the paper fibers. And Then, the paper fibers that cannot escape to this space are cut. After the cutting, when the cut surface becomes the free end surface, the escaped paper fibers are generated as fluff from the cut surface.

On the other hand, according to the present invention, the diameter is 3
It is an aggregate of fine paper fibers having a size of 0 μm or less, and as a result, the gap between the paper fibers and other paper fibers is very small. That is, the paper fibers are densely intertwined with each other.
For this reason, when mechanical punching is performed to form a cavity hole on the tape mount, the paper fiber that is located at the end face of the cavity hole and is cut is less likely to move and cut well at the cut portion. To be done.

Furthermore, since a tape mount made of a dense paper fiber having a porosity of 14% or less on the cut surface is used to form a taping component series of chip components, the tape is placed at the cutting position when the above-mentioned cutting is performed. There is less space for paper fibers to escape. Therefore, the number of paper fibers that can escape to the space is reduced, that is, most of the paper fibers located on the cut surface cannot escape, and it is possible to cut at the cut surface completely.
The sharpness that appears from the cut end surface during cutting is greatly reduced.

Therefore, the chip component stored and held in the cavity hole can be stably sucked by the automatic suction device.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A taping component series of chip components according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a tape component series of chip components according to the present invention, and FIG.
2 is a cross-sectional view taken along line AA of FIG.

The tape component tape assembly 10 is a tape mount 1 having cavity holes 11 ...
, And chip components 2 housed and held in the cavity holes 11 ... And cover tapes 3 and 4 attached to the upper and lower surfaces of the tape mount 1, respectively.

The tape mount 1 is a thick paper tape having a thickness of 0.5 to 1.0 mm, which is made of high-quality paper, and has a plurality of cavity holes 11 ... ing. Further, from one end of the tape mount 1, there are feed holes 12 for feeding the tape mount 1 at regular intervals by an automatic mounting machine, a chip component storage machine, or the like.
... are formed.

The lower cover tape 3 is attached to the lower surface of the tape mount 1, and at least the feed hole 12 ...
Is avoided so that the opening on the lower surface side of the cavity holes 11 ... Is closed. This allows
The cavity hole 11 ... is the chip component 2 ...
It becomes the container shape which can be stored.

The chip parts 2 ... Are chip resistors, chip capacitors, etc., and in particular have an external dimension of 1.0 mm.
It is a micro chip resistor of × 0.5 mm, and is housed in each of the cavity holes 11 ...

The upper cover tape 4 is attached to the upper surface of the tape mount 1, and at least the feed hole 12 ...
Is avoided so that the openings on the upper surface side of the cavity holes 11 ... Are closed. This allows
The chip components 2 ... Stored in the cavity holes 11 ... Are securely held in the cavity holes 11 ...

Next, a method of manufacturing the taping component series of the chip components having the above structure will be described.

In the component series for taping the chip components, cavity holes 11 ... Are formed in the tape mount 1 by a punching machine as shown in FIG. First, the tape mount 1 on which the cavity holes 11 and the feed holes 12 ... Are not formed is fed to the punching machine,
Using the upper mold 31 and the lower mold 32, the cavity holes 11 ... Are punched in the tape mount 1. Cavity holes 11 ... Are formed in the tape mount 1 by the upper die 31 having the punch blades 33. With respect to the processing speed, it is possible to process 500 cavity holes 11 ... In 1 minute.

Next, the lower cover tape 3 is attached to the lower surface of the tape mount 1 having the cavity holes 11 ... Specifically, a thermoplastic adhesive material is formed on the attaching surface of the lower cover tape 3, and the lower cover tape 3 is heated while being pressed against the lower surface of the tape mount 1 and then gradually cooled to further cool the tape mount. Attach the lower cover tape 3 to the lower surface of 1.

Next, the chip parts 2 ... Are housed in the cavity formed by the cavity holes 11 ... And the lower cover tape 3. At this time, an automatic storage device (not shown) is used to pick up the chip components 2 ... And store one chip component 2 in each cavity hole 11 ...

Finally, the upper cover tape 4 is attached to the upper surface of the tape mount 1 in which the chip parts 2 ...
Specifically, as with the lower cover tape 3, a thermoplastic adhesive is formed on the sticking surface of the cover tape 4, and the upper cover tape 4 is heated while being pressed against the upper surface of the tape mount 1, After gradually cooling, the upper cover tape 4 is attached to the upper surface of the tape mount 1. As a result, the above-described component string for taping the chip components is completed.

The taping string of the chip parts formed by such a manufacturing method has a mean diameter of 3 as a tape mount.
It is composed of innumerable intertwined paper fibers of 0 μm or less. Therefore, in the above-described manufacturing method, the paper fiber existing at the end face position of the cavity hole 11 and cut by the punch blade 33 tries to escape into the gap between the paper fibers due to the cutting stress. Almost no escape is possible and the blade is cut by the punch blade 33. Therefore,
After the cutting, the paper fibers which are flickered at the end face portion of the cavity hole 11 hardly cause a suction error in the suction device of the automatic mounting machine, and good suction is achieved.

The upper limit of the average diameter of the paper fibers is set to 30 μm, because the tape mount of the paper fibers having an average diameter larger than this causes the suction error occurrence rate to increase by one digit or more.

The lower limit of the average diameter of the paper fibers is not particularly limited, but the smaller the average diameter of the paper fibers, the more the occurrence rate of suction error can be reduced.

Further, preferably, the average diameter is 30 μm.
The following minute paper fibers having minute diameters are intertwined with each other innumerably, and the porosity of the cut surface is 14% or less.
In this way, when the porosity of the cut surface is set to 14%, the paper fibers that try to escape due to the cutting stress are restricted in the escape space, so that the paper fibers that become fluffy from the end surface portion of the cavity hole 11 after cutting are It can be extremely reduced.

FIG. 4 is a copy of a SEM photograph of 40 times the tape mount of the present invention, which is made of paper fibers having an average diameter of 30 μm or less, and FIG. 5 is a conventional tape mount (50 to 80).
It is the figure which imitated the 40 times SEM photograph of (it consists of paper fiber about (micrometer)). In FIGS. 4 and 5, X is a paper fiber.

FIG. 6 shows a cavity hole 11 of a tape mount made of paper fibers having an average diameter of 30 μm or less according to the present invention.
FIG. 7 is a copy of an SEM photograph of the end face portion of FIG. 7, and FIG.
It is the figure which copied the EM photograph. In addition, X is a cross section of the paper fiber, and Y is a hole.

As is clear from FIG. 4, in the tape mount 1 of the present invention, the diameters of the paper fibers are thin, and at the same time, there is almost no space between the respective paper fibers, and they are intertwined in a dense state. In such a tape mount 1, no unnecessary paper fiber fluff is observed on the end face of the cavity hole 11, and the chip components are sucked from the taping component series of the chip components to be printed on a printed circuit board (not shown). When the occurrence rate of suction mistakes that occurred when mounting was measured, the occurrence rate of suction mistakes was 0.01% (one occurred for every 10,000 pieces). In the conventional product shown in FIG. 5, fluffs equivalent to 15% of the cut end face are uniformly generated on the end face of the cavity hole, and the suction error occurrence rate is
0.2% (20 out of 10,000 total)
Met.

X is a cross section of the paper fiber and Y is a hole.

When the porosity of the cut surface is 14% or more, even if the average diameter of the paper fibers is 30 μm or less, the cutting stress may cause the fibers to escape to the pores of the cut surface.
It is difficult to achieve a series of tape parts having a suction error occurrence rate of 0.1% or less. Therefore, when the porosity of the cut surface is 14% or less, the suction generation error can be extremely reduced, and stable mounting can be performed.

According to the above embodiment, a series of assembly steps,
That is, the tape mount 1 having the cavity holes 11 can be formed only by a mechanical punching operation, and the production of 500 cavities can be performed per minute without impairing the consistency of production.

[0039]

As described above, according to the present invention, since the diameter of the paper fiber is 30 μm or less, the tape mount can be easily molded,
It becomes a series of taping parts that are easy to handle and have high suction reliability for ultra-small chip parts.

[Brief description of drawings]

FIG. 1 is a plan view of a taping component series of chip components according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a schematic view of a punching device that forms a cavity hole on a tape mount.

FIG. 4 is a copy of an SEM photograph of a tape mount according to the present invention.

FIG. 5 is a copy of an SEM photograph of a conventional tape mount.

FIG. 6 is a copy of a cross-sectional SEM photograph of the tape mount according to the present invention.

FIG. 7 is a copy of a cross-sectional SEM photograph of a conventional tape mount.

[Explanation of symbols]

 10 ・ ・ Taping parts of chip parts 1 ・ ・ ・ Tape mount 11 ・ ・ ・ ・ Cavity hole 2 ・ ・ ・ Chip parts 3 ・ ・ ・ Lower carver tape 4 ・ ・ ・..Upper carver tape

Claims (2)

[Claims] 1. A tape mount made of paper fibers having an average diameter of 30 μm or less is used, and chip parts are respectively housed and held in cavity holes formed at regular intervals in the tape mount, and on the tape mount. A series of taping parts for chip parts made by attaching a cover tape member to the bottom surface. 2. The tape component series of chip components according to claim 1, wherein the porosity of the cut surface of the cavity hole formed in the tape mount is 14% or less.