JPH0225271B2 - - Google Patents
Info
- Publication number
- JPH0225271B2 JPH0225271B2 JP55040277A JP4027780A JPH0225271B2 JP H0225271 B2 JPH0225271 B2 JP H0225271B2 JP 55040277 A JP55040277 A JP 55040277A JP 4027780 A JP4027780 A JP 4027780A JP H0225271 B2 JPH0225271 B2 JP H0225271B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- digital
- combination
- flexible
- combination board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000007598 dipping method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は一列に並べられた複数のデジツト基板
部相互間にフレキシブル基板部を貼り付けてなる
コンビネーシヨン基板の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a combination board in which a flexible board is attached between a plurality of digital board parts arranged in a row.
従来、コンビネーシヨン基板として例えば第１
図および第２図に示すようにデジツト基板５′Ａ，
５′Ｂ，５′Ｃにフレキシブル基板４′を組合わせ
て用いるものがあつた。しかしながらこの従来品
は分割されたデジツト基板５′Ａ，５′Ｂ，５′Ｃ
を寄せ集めて位置決めを行つた後にデジツト基板
５′Ａ，５′Ｂ，５′Ｃ相互にフレキシブル基板
４′を貼り付けるものであつたため、コンビネー
シヨン基板A′を製造するのに手間がかかるとと
もにデジツト基板５′Ａ，５′Ｂ，５′Ｃを成形す
るのにそれぞれ専用の金型を必要とするのでコス
ト高になつていた。 Conventionally, as a combination board, for example, the first
As shown in the figure and FIG.
There was one in which a flexible substrate 4' was used in combination with 5'B and 5'C. However, this conventional product has divided digital boards 5'A, 5'B, 5'C.
After gathering and positioning the digital boards 5'A, 5'B, and 5'C, the flexible boards 4' were attached to each other, which made manufacturing the combination board A' time-consuming and complicated. Since dedicated molds are required for molding the digital substrates 5'A, 5'B, and 5'C, costs are high.
しかもデジツト基板５′Ａ，５′Ｂ，５′Ｃ間は
フレキシブル基板で連結されていて、この連結部
分の剛性が低く、この部分で曲がつたり捩じれた
りしてしまうため、全体として平面度が一定に保
たれない。このような不安定な状態でハンダデイ
ツプを行うと、ハンダが付着しないなどのハンダ
不良が発生する。 In addition, the digital boards 5'A, 5'B, and 5'C are connected by a flexible board, and the rigidity of this connecting part is low and can bend or twist in this part, so the flatness as a whole is low. is not kept constant. If solder dipping is performed in such an unstable condition, solder defects such as solder not adhering will occur.
本発明は上述の如き点に鑑みてなされたもので
あり、その目的とするところは、複数のデジツト
基板部の並び方向に沿つた両側に複数のデジツト
基板部を相互連結する連結片部を切離自在に形成
した絶縁基板本体の少なくとも連結片部を除く所
定箇所にフレキシブル基板を貼り付け、ハンダデ
イツプを行つた後に前記連結片部を切離すること
により、コンビネーシヨン基板自体の平面度を保
つことができ、これによりハンダデイツプ作業が
確実に行えるとともに、デイジツト基板を個々に
打抜成形しなくてもよくしてコンビネーシヨン基
板を安価に製造することができるコンビネーシヨ
ン基板の製造方法を提供することにある。 The present invention has been made in view of the above-mentioned points, and an object of the present invention is to cut the connecting piece portions that interconnect a plurality of digital substrate portions on both sides along the direction in which the plurality of digital substrate portions are arranged. The flatness of the combination board itself is maintained by pasting a flexible board on a predetermined portion of an insulating board body formed so as to be separable, excluding at least the connecting pieces, and separating the connecting pieces after soldering. To provide a method for manufacturing a combination board, which enables the solder dipping work to be carried out reliably, and also eliminates the need to individually stamp and mold the digit boards, thereby making it possible to manufacture the combination board at low cost. be.
以下本発明を第３図乃至第５図に従つて説明す
る。 The present invention will be explained below with reference to FIGS. 3 to 5.
即ち、本発明を製造工程に従つて説明すると、
先ず第１工程として、１つの金型（図示せず）を
用いミシン目２，２を入れることにより絶縁基板
本体１の少なくとも左右に連結片部３，３を成形
するとともに該連結片部３，３の内側に打抜部６
を形成する。すなわち、金型による絶縁基板本体
１のプレス加工時にミシン目２，２と同時に打抜
部６が形成される。そして前記左右のミシン目
２，２の間の絶縁基板部分全体にはフレキシブル
基板４が貼着される。この状態で各デジツト基板
部５Ａ，５Ｂ，５Ｃに設けられた電気部品取付孔
（図示せず）に必要な電気部品を挿入し、次いで、
第２工程としてハンダ槽（図示せず）内に絶縁基
板本体１を浸漬することにより、前記デジツト基
板部５Ａ，５Ｂ，５Ｃについてハンダデイツプ作
業を行う。こうして得られたコンビネーシヨン基
板Ａにおいて、その両外側に設けられた連結片部
３，３をミシン目２，２において切離することで
第１図および第２図で説明した従来のものと同様
のコンビネーシヨン基板を得ることができる。絶
縁基板本体１を形成するに用いる材料としてはフ
エノール樹脂積層板、ガラス繊維又は布を基材と
してエポキシ樹脂を含浸した積層板等が用いられ
る。 That is, when the present invention is explained according to the manufacturing process,
First, as a first step, by forming perforations 2, 2 using one mold (not shown), connecting pieces 3, 3 are formed at least on the left and right sides of the insulating substrate main body 1, and the connecting pieces 3, Punching part 6 inside 3
form. That is, the punched portion 6 is formed at the same time as the perforations 2, 2 when the insulating substrate main body 1 is pressed using a mold. A flexible substrate 4 is attached to the entire insulating substrate portion between the left and right perforations 2, 2. In this state, insert the necessary electrical components into the electrical component mounting holes (not shown) provided in each digital board section 5A, 5B, and 5C, and then
As a second step, the insulating substrate main body 1 is immersed in a solder bath (not shown) to perform a solder dip operation on the digital substrate sections 5A, 5B, and 5C. In the combination board A obtained in this way, the connecting pieces 3, 3 provided on both outer sides of the combination board A are separated at the perforations 2, 2, thereby making it similar to the conventional board explained in FIGS. 1 and 2. A combination board can be obtained. As the material used to form the insulating substrate body 1, a phenol resin laminate, a laminate made of glass fiber or cloth as a base material impregnated with epoxy resin, etc. are used.
上述のように、ハンダデイツプの際、デジツト
基板部５Ａ，５Ｂ，５Ｃが１つの金型によつて切
離自在の連結片部３，３により連結された状態で
打抜成形されているため、コンビネーシヨン基板
Ａ全体の平面度が維持でき、従つてそのままハン
ダデイツプを行うことが可能であり、きわめて能
率的である。 As mentioned above, during solder dipping, the digital substrate parts 5A, 5B, and 5C are punched and formed in a state in which they are connected by the detachable connecting pieces 3, 3 using one mold, so that the combination Since the flatness of the whole substrate A can be maintained, it is possible to perform solder dipping as it is, which is extremely efficient.
以上説明したように本発明によれば、前記複数
のデジツト基板部の並び方向に沿つた両側に複数
のデジツト基板部を相互連結する連結片部を切離
自在に形成した絶縁基板本体の少なくとも連結片
部を除く所定箇所にフレキシブル基板を貼り付
け、ハンダデイツプを行つた後に前記連結片部を
切離するようにしていて、複数個のデジツト基板
をフレキシブル基板に貼り付けた従来のコンビネ
ーシヨン基板に比してハンダデイツプ時点でコン
ビネーシヨン基板自在の平面度が一定に保たれる
ため、ハンダデイツプ作業が確実に行える。 As explained above, according to the present invention, at least the connection piece of the insulating substrate body is provided with removably formed connecting pieces for interconnecting the plurality of digital substrate sections on both sides along the direction in which the plurality of digital substrate sections are lined up. A flexible board is attached to a predetermined location except for one part, and after solder dipping, the connecting pieces are separated, which is compared to a conventional combination board in which multiple digital boards are attached to a flexible board. Since the flatness of the combination board is maintained constant at the time of soldering, the soldering work can be performed reliably.
また、複数個のデジツト基板を個々に打抜成形
する必要がなく、また複数個のデジツト基板部を
フレキシブル基板部を貼り付けて連結するに当た
つて１つずつ並べる必要がないため、従来に比し
て製造工程が簡単で安価にコンビネーシヨン基板
を製造することができる。 In addition, there is no need to individually stamp and form multiple digital substrates, and there is no need to line up multiple digital substrates one by one when attaching flexible substrates to connect them, so it is much easier than conventional methods. In comparison, the manufacturing process is simple and the combination board can be manufactured at low cost.
第１図は従来のコンビネーシヨン基板を示す平
面図、第２図は同じく側面図、第３図は本発明に
よるコンビネーシヨン基板の製造方法の一実施例
を示す平面図、第４図は同じく側面断面図、第５
図は同じく正面図である。
１……絶縁基板本体、２……ミシン目、３……
連結片部、４……フレキシブル基板、５Ａ，５
Ｂ，５Ｃ……デジツト基板部、６……打抜部。
FIG. 1 is a plan view showing a conventional combination board, FIG. 2 is a side view, FIG. 3 is a plan view showing an embodiment of the method for manufacturing a combination board according to the present invention, and FIG. 4 is a side view. Cross section, 5th
The figure is also a front view. 1... Insulating board body, 2... Perforation, 3...
Connection piece, 4...Flexible board, 5A, 5
B, 5C...digital board part, 6...punching part.
Claims (1)
間にフレキシブル基板部を貼り付けてなるコンビ
ネーシヨン基板の製造方法において、 前記複数のデジツト基板部の並び方向に沿つた
両側に複数のデジツト基板部を相互連結する連結
片部を切離自在に形成した絶縁基板本体の少なく
とも前記連結片部を除く所定箇所にフレキシブル
基板を貼り付け、ハンダデイツプを行つた後に前
記連結片部を切離することを特徴とするコンビネ
ーシヨン基板の製造方法。[Scope of Claims] 1. A method for manufacturing a combination board in which a flexible board is attached between a plurality of digital board parts arranged in a row, including the steps of: A flexible board is attached to a predetermined portion of an insulating substrate main body in which connection pieces for interconnecting a plurality of digital substrate parts are formed in a separable manner, at least at predetermined locations excluding the connection pieces, and after soldering, the connection pieces are cut off. A method for manufacturing a combination board, characterized in that the combination board is separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027780A JPS56137693A (en) | 1980-03-31 | 1980-03-31 | Combination board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4027780A JPS56137693A (en) | 1980-03-31 | 1980-03-31 | Combination board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56137693A JPS56137693A (en) | 1981-10-27 |
| JPH0225271B2 true JPH0225271B2 (en) | 1990-06-01 |
Family
ID=12576123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4027780A Granted JPS56137693A (en) | 1980-03-31 | 1980-03-31 | Combination board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56137693A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5625261Y2 (en) * | 1976-11-22 | 1981-06-15 | ||
| JPS53166067U (en) * | 1977-06-02 | 1978-12-26 |
-
1980
- 1980-03-31 JP JP4027780A patent/JPS56137693A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56137693A (en) | 1981-10-27 |
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