JPH05132021A - Manufacture of taping component string of chip components - Google Patents

Abstract

PURPOSE:To eliminate producing of useless fibers around edges of cavity holes, and to make aftertreatment of parts easy by a method wherein a number of cavity holes are formed on a paper mount for taping by means of heated punching and after chip components are housed in each of the cavity holes, the cavity holes are covered with covering tapes. CONSTITUTION:Cardboard paper in thickness approximately of 0.51.0mm, made of a material such as wood-free paper, is used as a paper mount 1 for taping, and such paper mount 1 for taping is fed to a punching machine. A number of cavity holes 11 are formed to the paper mount 1 for taping by reciprocation of an upper metal mold 31, whose punching edges 33 are heated with a heater 34. Useless fibers produced around edges of the cavity holes 11 during punching processes are eliminated by heat. An underside covering tape 3 is stuck to the undersurface of the paper mount 1 for taping, and after chip components 2 are housed in the cavities formed by sticking the underside covering tape 3 to the paper mount 1 for taping, an upper covering tape 4 is stuck to the surface of the paper mount for taping, and thereby a taping component string of chip components is completed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a series of parts for taping chip parts, which is capable of reducing mounting errors when mounting the chip parts on a mounting printed circuit board. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art Recently, the shape of chip capacitors, chip resistors, etc. is 1005 type (1.0 mm × 0.5 mm)
The ultra-small chip parts that have been put to practical use have been put to practical use.

Handling such as transportation of this type of micro chip component is carried out by an automatic mounter when the micro chip component is stored in a series of taping components and the micro chip component is mounted on a mounted printed circuit board.

[0004] A general taping component series forms a cavity hole by mechanically punching a tape mount, stores and holds a chip component in the cavity hole, and further covers a tape on the upper and lower surfaces of the tape mount. I was pasting it. Then, when mounting the chip component at a predetermined position on the mounted printed circuit board, one cover tape is peeled off, the chip component in the cavity hole is taken out by the vacuum suction device, and the printed circuit board is mounted at the predetermined position.

[0005] Here, when the ultra-small chip component as described above is sucked by a vacuum suction device and mounted on a mounted printed circuit board, a paper fiber produced by mechanical punching on the end face of the cavity of the tape mount. The micro chip parts will collide or get caught,
Mounting mistakes will occur for ultra-small chip parts.

In order to solve such a problem, it has been already proposed to use a burner-treated tape mount. According to this conventional technique, a tape mount having a cavity hole formed by mechanical punching is run at a speed of 200 mm / sec by a propane gas burner,
The paper fibers generated on the end faces of the cavity holes were eliminated.

By subjecting the tape mount to such a treatment, it is possible to stably suck the ultra-small chip component with the vacuum suction device.

[0008]

However, when the burner-controlled tape mount is produced as described above, if the burner is erroneously controlled, the tape mount itself will be burned, and there will always be a danger in handling. turn into. Further, since the burner cannot be intermittently processed only in the cavity hole portion, the one main surface of the tape mount is burnt and the appearance is deteriorated.

Further, since a mechanical treatment called a burner treatment step is different from the mechanical treatment, it lacks a series in the taping production step, resulting in poor production efficiency and high cost of the tape mount.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to easily and inexpensively process a tape mount, to easily handle it, and to improve suction reliability of a micro chip component. The present invention provides a method for manufacturing a series of high taping component taping components.

[0011]

[Means for Solving the Problems] In order to solve the above-mentioned problems, a first invention is to form a plurality of cavity holes by a punch heated on a tape mount, and to form each cavity hole. A method of manufacturing a series of taping parts for chip parts, which comprises a step of housing the chip parts and closing the cavity hole with a cover tape member.

A second aspect of the invention is to form a plurality of cavity holes by punching on a tape mount,
Manufacture of a series of taping parts for chip parts, which comprises a step of heat-treating each of the cavity holes with a heated punch, and a step of accommodating the chip parts in each of the cavity holes and closing the cavity holes with a cover tape member. Is the way.

[0013]

In any of the inventions, the paper fibers extending from the end surface of the cavity hole can be removed by punching or heat treating the cavity hole of the tape mount, thereby eliminating the risk of handling. Further, it is possible to provide a series of taping components for chip components, which has improved productivity without lacking the series of manufacturing.

In addition, for taping parts of chip parts,
No charring occurs and there is no loss of appearance.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a series of taping components for chip components according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a series of taping components for chip components according to the manufacturing method of the present invention, and FIG. 2 is a sectional view taken along line AA of FIG.

The tape component tape assembly 10 is a tape mount 1 having cavity holes 11 ...
, And chip components 2 housed and held in the cavity holes 11 ... And cover tapes 3 and 4 attached to the upper and lower surfaces of the tape mount 1, respectively.

The tape mount 1 is a thick paper tape having a thickness of 0.5 to 1.0 mm made of high-quality paper, and a plurality of cavity holes 11 ... Are formed in a rectangular shape having a predetermined size, for example, at a pitch of 2 mm. ing. Further, from one end of the tape mount 1, there are feed holes 12 for feeding the tape mount 1 at regular intervals by an automatic mounting machine, a chip component storage machine, or the like.
... are formed.

The lower cover tape 3 is attached to the lower surface of the tape mount 1, and at least the feed hole 12 ...
Is avoided so that the opening on the lower surface side of the cavity holes 11 ... Is closed. This allows
The cavity hole 11 ... is the chip component 2 ...
It becomes the container shape which can be stored.

The chip parts 2 ... Are chip resistors, chip capacitors, etc., and especially have an external dimension of 1.0 mm.
It is a micro chip resistor of × 0.5 mm, and is housed in each of the cavity holes 11 ...

The upper cover tape 4 is attached to the upper surface of the tape mount 1, and at least the feed hole 12 ...
Is avoided so that the openings on the upper surface side of the cavity holes 11 ... Are closed. This allows
The chip components 2 ... Stored in the cavity holes 11 ... Are securely held in the cavity holes 11 ...

Next, a method of manufacturing the taping component series of the chip components having the above structure will be described.

In the component series for taping the chip components, cavity holes 11 ... Are formed in the tape mount 1 by a chinching machine as shown in FIG. First, the tape mount 1 on which the cavity holes 11 and the feed holes 12 ... Are not formed is fed to the punching machine,
Cavity holes 11 ... Are punched in the tape mount 1 between the upper mold 31 and the lower mold 32. The upper mold 31 has a heater 34 built therein so that the punch blade 33 of the upper mold 31 can be heated.

The upper die 31 having the punch blade 33 as described above is used to form the cavity hole 11 in the tape mount 1.
At the same time as forming .., unnecessary paper fibers generated on the end faces of the cavity holes 11 ... By punching are burned off by heat. In order to burn this out, the heater 34 is set so that the punch blade 33 has a temperature of at least 150 ° C.
Need to be heated at.

In this way, the punching process for forming the cavity holes 11 and the removal of unnecessary paper fibers can be performed at the same time, and the processing speed can be 500 cavity holes 11 ... In 1 minute. ..

Next, the lower cover tape 3 is attached to the lower surface of the tape mount 1 having the cavity holes 11 ... In which unnecessary paper fibers are removed. Specifically, a thermoplastic adhesive material is formed on the attaching surface of the lower cover tape 3, and the lower cover tape 3 is heated while being pressed against the lower surface of the tape mount 1 and then gradually cooled to further cool the tape mount. Attach the lower cover tape 3 to the lower surface of 1.

Next, the chip parts 2 ... Are housed in the cavity formed by the cavity holes 11 ... And the lower cover tape 3. At this time, an automatic storage device (not shown) is used to pick up the chip components 2 ... And store one chip component 2 in each cavity hole 11 ...

Finally, the upper cover tape 4 is attached to the upper surface of the tape mount 1 in which the chip parts 2 ...
Specifically, as with the lower cover tape 3, a thermoplastic adhesive is formed on the sticking surface of the cover tape 4, and the upper cover tape 4 is heated while being pressed against the upper surface of the tape mount 1, After gradually cooling, the upper cover tape 4 is attached to the upper surface of the tape mount 1. As a result, the above-described component string for taping the chip components is completed.

As described above, in the above-described embodiment, when forming the cavity holes 11 ... In the tape mount 1, unnecessary paper fibers extending from the end faces of the cavity holes 11 ... Can be removed at the same time. Therefore, it is possible to manufacture without adding a step to the conventional method of manufacturing a series of parts for taping chip parts, and when the chip parts are taken out from the parts series 10 for taping of the chip parts by suction using an automatic mounter. Paper fiber and chip parts 2
.. can be stably mounted on a predetermined printed circuit board without being caught.

In the taped component series using the tape mount 1 of the present invention, the occurrence rate of the mounting error of the chip components 2 ... Was 0 in 10000 chip components.

In the above-described embodiment, the tape is first formed with the cavity holes 11 ... At the same time, unnecessary paper fibers on the end faces of the cavity holes 11 ... Are removed, but as shown in FIG. The punching process for forming the cavity holes 11 ... and the process for removing unnecessary paper fibers on the end faces of the cavity holes 11 ... may be performed in different steps.

The punching device for the tape mount 1 used in this embodiment is composed of a first punching section 41 and a second punching section 42. The punch units 41 and 42 have upper dies 41a and 4 having punch blades 41c and 42c, respectively.
2a and lower dies 41b and 42b, and the second punch section 42 is a punch blade 42c of the upper die 42a.
The heater 43 is built in so that it can be heated.

Using such a punching device, first, the tape mount 1 on which the cavity holes 11 ... Are not formed is fed from the left side of the drawing. Then, the first punch portion 41 forms the cavity holes 11 ... On the tape mount 1 at predetermined intervals. In this state, unnecessary paper fibers X are generated on the end faces of the cavity holes 11 ... As in the conventional case. Next, the second punch unit 42
, And the inside of the cavity holes 11 ... Is picked up again by the punch blade 42c of the second punch section 42. At this time, punch blade 42c
Since the paper is heated, unnecessary paper fibers are burned out. Further, even if the unnecessary paper fibers in the cavity holes 11 ... Can not be sufficiently burned down, the end face of the cavity holes 11 ... Is slid by the punch blade 42c of the second punch section 42. As a result, unnecessary paper fibers can be pressed against the end faces of the cavity holes 11 ..., and the suction should not be obstructed when the chip components 2 ... Are mounted by an automatic mounting machine. You can

According to the present embodiment, it is sufficient to add the second punch portion to the conventional series of assembling steps, and the production consistency is not impaired. It is possible to process 500 cavities.

In any of the embodiments, since the unnecessary paper fibers extending from the end faces of the cavity holes 11 ... Can be removed by punching the cavity holes 11 ... There is no danger of handling such as the above, and it is possible to form a series of taping parts of chip parts with improved productivity without impairing the series of manufacturing.

Also, a taping component string 10 for chip components is used.
In addition, there is no burning and there is no loss of appearance.

[0036]

As described above, according to the present invention, there is provided a method for manufacturing a series of taping parts for chip parts, in which the tape mount can be easily molded, the handling is easy, and the suction reliability of the ultra-small chip parts is high.

[Brief description of drawings]

FIG. 1 is a plan view of a taping component series of chip components according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a schematic view of a punching device that forms a cavity hole on a tape mount.

FIG. 4 is a schematic view of another punching device that forms a cavity hole on a tape mount.

[Explanation of symbols]

 10 ・ ・ Taping parts of chip parts 1 ・ ・ ・ Tape mount 11 ・ ・ ・ ・ Cavity hole 2 ・ ・ ・ Chip parts 3 ・ ・ ・ Lower carver tape 4 ・ ・ ・..Upper carver tape

Claims (2)

[Claims] 1. A step of forming a plurality of cavity holes by a punch punched on a tape mount, and a step of accommodating chip parts in each of the cavity holes and closing the cavity holes with a cover tape member. Method for manufacturing a series of taping components for chip components. 2. A step of forming a plurality of cavity holes by punching on a tape mount, a step of heat-treating each of the cavity holes with a heated punch, and storing a chip component in each of the cavity holes, And a step of closing the cavity hole with a cover tape member.