JP3385813B2 - Chip-shaped electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a carrier tape made of a plastic sheet, and by embossing the carrier tape, a plurality of cavities for accommodating the respective chip-shaped electronic parts are formed. The present invention relates to a series of electronic components, and more particularly to improving the shape of a cavity.

[0002]

2. Description of the Related Art FIG. 7 is an enlarged sectional view showing a part of a chip-shaped electronic component train 1 which is of interest to the present invention.
Note that, in FIG. 7, the chip-shaped electronic component 2 included in the chip-shaped electronic component string 1 is not shown in cross section. The chip-shaped electronic component series 1 includes a carrier tape 5 formed by distributing a plurality of cavities 4 having an opening 3 in an upper part thereof in a longitudinal direction thereof. The carrier tape 5 is made of a plastic sheet 6, and the cavity 4 described above is formed by embossing the plastic sheet 6 as shown in FIG.

Referring to FIG. 8, first, as shown in (1), a flat plastic sheet 6 having a thickness of, for example, about 0.2 to 0.5 mm is prepared. Next, as shown in (2), a mold 8 having a concave portion 7 having a shape correlated with the cavity 4 is prepared, and the plastic sheet 6 is placed on the mold 8. In this state, the plastic sheet 6 is heated as indicated by an arrow 9 and, at the same time, vacuum suction is applied to the mold 8.
Given to the side. The plastic sheet 6 is deformed along the concave portion 7 based on such hot vacuum forming, and finally, as shown in (3), the carrier tape 5 having the cavity 4 is obtained.

The carrier tape 5 having the cavity 4 may be hot or cold pressed using a pair of molds instead of the hot vacuum forming described above.
Referring again to FIG. 7, each of the cavities 4 accommodates one chip-shaped electronic component 2 such as a monolithic ceramic capacitor. The carrier tape 5 is usually provided with a plurality of feed holes (not shown in FIG. 7) at a pitch that correlates with the formation pitch of the cavities 4. Further, the top tape 10 is bonded to the upper main surface of the carrier tape 5 so as to cover the upper opening 3 of the cavity 4. The top tape 10 is usually made of a plastic sheet and is adhered to the carrier tape 5 using a heat sealing method.

When the chip-shaped electronic component string 1 thus obtained is used to supply the chip-shaped electronic component 2, the chip-shaped electronic component string 1 is fed in its longitudinal direction using feed holes (not shown). , The top tape 10 is peeled off from the carrier tape 5, and the chip-shaped electronic component 2 is taken out from the cavity 4 in which the upper opening 3 is opened in order by, for example, a vacuum suction chuck, and a desired circuit for mounting the chip-shaped electronic component 2 is mounted. It is even supplied to substrates.

[0006]

However, in the chip-shaped electronic component series 1 of the type described above, the cavity 4 is formed by embossing the plastic sheet 6.
Due to the processing method of forming the cavity 4
A rounded portion 13 having a relatively large radius of curvature of, for example, 0.3 to 0.5 mm is formed at the ridge portion where the side wall portion 11 and the bottom wall portion 12 intersect.

The presence of the rounded portion 13 causes the following problems. The presence of the rounded portion 13 is the bottom wall portion 12
The area of the flat surface 14 formed on the substrate is reduced. On the other hand, in order to store the chip-shaped electronic component 2 in the cavity 4 in a stable posture, it must be in contact with the flat surface 14. Therefore, in order to secure the area of the flat surface 14 that ensures a stable storage state of the chip-shaped electronic component 2, the planar shape of the cavity 4, in other words, the area of the upper opening 3, is simply stored. The size of the radius portion 13 must be larger than the size required for the above.

Therefore, the chip-shaped electronic component 2 dances in the cavity 4, and in the process of supplying the chip-shaped electronic component 2, the vacuum suction chuck cannot suck the chip-shaped electronic component 2 at an appropriate position, or the chip-shaped electronic component 2 is chipped. In some cases, the electronic component 2 itself cannot be sucked. This problem becomes more remarkable when the chip-shaped electronic component 2 is particularly small.
Due to these problems, the operating rate of the supply device for the chip-shaped electronic component 2 is reduced, and thus the productivity of electronic devices produced using the chip-shaped electronic component 2 as a component is also reduced. Become.

In the step of supplying the chip-shaped electronic component 2, the chip-shaped electronic component string 1 is intermittently fed in its longitudinal direction, and therefore, the acceleration force or inertial force directed in the longitudinal direction is applied to each chip-shaped electronic component. Since the electronic component 2 is affected, the chip-shaped electronic component 2 is provided due to the presence of the rounded portion 13 described above.
Is liable to be displaced especially in the longitudinal direction of the chip-shaped electronic component series 1. Therefore, it is no exaggeration to say that the problem caused by the presence of the rounded portion 13 is caused by the positional deviation of the chip-shaped electronic component 2 in the longitudinal direction of the chip-shaped electronic component series 1.

Therefore, an object of the present invention is to provide a series of chip-shaped electronic components which can solve the above-mentioned problems.

[0011]

SUMMARY OF THE INVENTION The present invention is a carrier tape which is made of a plastic sheet and formed by embossing to have a plurality of cavities having openings upwardly distributed in the longitudinal direction. The present invention is directed to a series of chip-shaped electronic components, which includes a housed chip-shaped electronic component and a top tape bonded to a carrier tape so as to cover an upper opening of a cavity, and solves the above technical problem. Therefore, the bottom wall portion of the cavity, the flat surface is formed, the longitudinal direction of the carrier tape
Orientation, the size of the upper opening and the chip-shaped electronic part
Chip-shaped electronic components are very close to the product dimensions.
Since the flat surface is in contact with the flat surface, the flat surface extends along the side wall of the cavity so as to extend to the position where the respective longitudinal edges of the carrier tape defining the upper opening of the cavity are projected onto the bottom wall. Is characterized in that it is given a shape that bulges outward.

In the present invention, the flat surface may be formed so as to extend to a position where all the edges defining the upper opening of the cavity are projected on the bottom wall of the cavity.

[0013]

According to the present invention, the flat surface formed on the bottom wall portion of the cavity extends to a position where the edge defining the upper opening is projected onto the bottom wall portion at least in the longitudinal direction of the carrier tape. Since the width of the flat surface is formed by bulging the side wall of the cavity outward, the chip-shaped electronic component inserted in the cavity is connected to the chip-shaped electronic component. With respect to the longitudinal direction of the cavity, it can be stored in contact with a flat surface while leaving a slight clearance with respect to the side wall of the cavity.

Therefore, first, the lengthwise dimension of the upper opening of the cavity can be set to a value very close to the lengthwise dimension of the chip-shaped electronic component to be inserted from here. When the chip-shaped electronic component is supplied while being intermittently fed in the longitudinal direction, the chip-shaped electronic component hardly dances in the cavity, and therefore the vacuum suction chuck sucks the proper position of the chip-shaped electronic component. It is possible to prevent the failure or failure to suck the chip-shaped electronic component itself.
This also makes it possible to apply the invention to particularly small chip-shaped electronic components.

As described above, according to the present invention, the operating rate of the chip-shaped electronic component supply device is improved, and the productivity of electronic equipment produced using the chip-shaped electronic component as a component is also improved. be able to. The bulging portion formed on the side wall of the cavity also has a secondary effect of absorbing shock. Therefore, it is possible to make it difficult for the vibration from the chip-shaped electronic component supply device to be transmitted to the chip-shaped electronic component, and in this respect also, an effect of reducing the dance of the chip-shaped electronic component can be expected.

As described above, in the step of supplying the chip-shaped electronic component, the chip-shaped electronic component string is intermittently sent in the longitudinal direction, and therefore, the acceleration force or the inertial force directed in the longitudinal direction is individually supplied. Since the chip-shaped electronic components are affected by the chip-shaped electronic components, the chip-shaped electronic components are likely to be displaced particularly in the longitudinal direction of the chip-shaped electronic component series. Therefore, the flat surface formed on the bottom wall of the cavity is At least in the longitudinal direction, it is sufficient that the edge that defines the upper opening extends to a position where it is projected onto the bottom wall portion. However, the flat surface of the bottom wall of the cavity is formed so that not only each longitudinal edge that defines the upper opening of the cavity but also all edges are projected to the bottom wall of the cavity. For example, it is more effective in preventing the positional displacement of the chip-shaped electronic component.

[0017]

1 to 3 are views for explaining a chip-shaped electronic component string 21 according to an embodiment of the present invention. Here, FIG. 1 shows a series of chip-shaped electronic components 2.
It is a perspective view which fractures | ruptures and shows a part of 1. FIG. 2 is an enlarged sectional view taken along line II-II in FIG. FIG. 3 shows a method for obtaining the carrier tape 22 included in the chip-shaped electronic component string 21.

Referring to FIGS. 1 and 2, the chip-shaped electronic component string 21 includes a carrier tape 22 having a plurality of cavities 24 each having an opening 23 formed above and distributed in the longitudinal direction thereof. The carrier tape 22 is made of a plastic sheet 25, and the cavity 24 described above basically corresponds to the plastic sheet 25 shown in FIG.
As in the case of the cavity 4 shown in (4), it is formed by embossing.

However, the side wall portion 2 of the cavity 24
6, a bulging portion 27 provided with a shape bulging outward
Are formed. Due to the formation of the bulging portion 26, the flat surface 29 on the bottom wall portion 28 of the cavity 24 forms the longitudinal edges 30 and 31 of the carrier tape 22 defining the upper opening 23 of the cavity 24 and the lateral edge thereof. Three
2 and 33 are extended so as to extend to the position where the bottom wall portion 28 is projected (see the alternate long and short dash line 34 in FIG. 2).

Therefore, as well shown in FIG. 2, the chip-shaped electronic component 3 inserted in the cavity 24 is shown.
5 has a flat surface 29 while leaving a slight clearance with respect to the side wall portion 26 of the cavity 24.
It can be in a stored state in contact with. The cavity 24 having the bulging portion 27 described above can be molded, for example, as follows.

First, the plastic sheet 25 is embossed by the method shown in FIG. 8 to form the cavity 24 having no bulging portion as shown in FIG. 3 (1). Next, the lower portion of the side wall portion 26 of the cavity 24 and the bottom wall portion 28 are heated, as indicated by the arrow 36, and the plastic sheet 25 is softened in this portion. Next, as shown in FIG. 3 (2), the molding core 37 is inserted into the cavity 24, and in this state, the bottom wall portion 28 of the cavity 24 is moved by the trowel 38 as shown in FIG. 3 (3). It is pressed toward the molding core 37. As a result, the side wall portion 26 bulges outward in the portion close to the bottom wall portion 28, and the bulge portion 27 is formed. After that, FIG.
As shown in (4), it is naturally cooled. In this way, the carrier tape 22 having the cavity 24 having the desired shape is obtained.

Referring again to FIGS. 1 and 2, each of the cavities 24 contains one chip-shaped electronic component 35 such as a monolithic ceramic capacitor, as in the case of the chip-shaped electronic component series 1 described above. Then, the top tape 39 is bonded to the upper main surface of the carrier tape 22 so as to cover the upper opening 23 of the cavity 24. The top tape 39 is usually made of a plastic sheet and is adhered to the carrier tape 22 using a heat sealing method.
The carrier tape 22 is usually provided with a cavity 24.
A plurality of feed holes 40 are provided with a pitch that correlates to the formation pitch of the.

When supplying the chip-shaped electronic component 35 by using the chip-shaped electronic component string 21 thus obtained, the chip-shaped electronic component string 21 is fed in the longitudinal direction by using the feed holes 40. The top tape 39 is peeled off from the carrier tape 22, and the chip-shaped electronic components 35 are sequentially inserted from the cavity 24 with the upper opening 23 opened.
Are taken out by, for example, a vacuum suction chuck, and are supplied to a desired circuit board or the like to be mounted.

At this time, as described above, the chip-shaped electronic component 35 is placed in the cavity 24 while being in contact with the flat surface 29 while leaving a slight clearance with respect to the side wall portion 26 of the cavity 24. Since it is stored, the chip-shaped electronic component 35 hardly dances in the cavity 24. Therefore, the vacuum suction chuck cannot adsorb the chip-shaped electronic component 35 at an appropriate position, or the chip-shaped electronic component 35 cannot be sucked. It can be advantageously prevented that the suction of 35 itself cannot be performed.

The cavity 24 having the bulging portion 27 as described above can be formed by any method other than the method shown in FIG. For example, as shown in FIG.
Split molds 41 and 42 are used, and hot vacuum forming is applied to the plastic sheet 25 in a state where the molds 41 and 42 are combined. Mold 41
And 42 are provided with recesses 43 and 44 having a shape that correlates to the bulging portion 27, and when the plastic sheet 25 is vacuum formed, the cavity 24 is formed and the bulging portion 27 is formed. When the molding is completed in this manner, the molds 41 and 42 are separated as shown in FIG. 4, and the carrier tape 22 having a desired shape is taken out from the molds 41 and 42.

The shape of the bulging portion 27 formed on the side wall portion 26 of the cavity 24 can also be changed. For example, like the carrier tape 22a shown in FIG. 5, a bulging portion 27a that gives a relatively gentle rounded surface may be formed on the side wall portion 26a of the cavity 24a.

Further, like the carrier tape 22b shown in FIG. 6, a side wall portion 26b of the cavity 24b is provided with a corrugated cross section, and a part of the corrugated portion is bulged 27.
b may be given. 5 and 6, elements corresponding to, for example, the elements shown in FIG. 2 are designated by the same reference numerals, and duplicated description will be omitted.

Although the present invention has been described above with reference to the illustrated embodiments, within the scope of the present invention, other
Various embodiments are possible. For example, in the illustrated embodiment, the flat surface 29 of the bottom wall 28 defines all edges 30, 31, 32 that define the upper opening 23 of the cavity 24.
And 33 are formed so as to extend to a position where they are projected onto the bottom wall portion 28 of the cavity 24. However, in the process of supplying the chip-shaped electronic component 35, the chip-shaped electronic component string 21 is intermittently fed in its longitudinal direction, and therefore, the acceleration force or inertial force directed in the longitudinal direction is mainly the individual chip-shaped electronic components. 35, the chip-shaped electronic component 35 is likely to be displaced in the longitudinal direction of the chip-shaped electronic component string 21. Therefore, even if the flat surface formed on the bottom wall portion of the cavity is formed so as to extend to the position where the edge defining the upper opening is projected onto the bottom wall portion only in the longitudinal direction of the carrier tape,
The effect of preventing the positional displacement of the chip-shaped electronic component in the cavity can be expected.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing a chip-shaped electronic component string 21 according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along the line II-II in FIG.

FIG. 3 is a chip-shaped electronic component string 2 shown in FIGS. 1 and 2;
FIG. 3 is a schematic cross-sectional view sequentially showing some steps included in the method of molding the cavity 24 of the carrier tape 22 provided in FIG.

FIG. 4 is a view of the chip-shaped electronic component string 2 shown in FIGS. 1 and 2;
FIG. 6 is a schematic cross-sectional view showing another example of the method for molding the cavity 24 of the carrier tape 22 provided in No. 1.

FIG. 5 is a sectional view showing a carrier tape 22a included in a series of chip-shaped electronic components according to another embodiment of the present invention.

FIG. 6 is a sectional view showing a carrier tape 22b included in a series of chip-shaped electronic components according to still another embodiment of the present invention.

FIG. 7 is an enlarged sectional view corresponding to FIG. 2, showing a conventional chip-shaped electronic component string 1 which is of interest to the present invention.

8 is a schematic sectional view sequentially showing some steps included in the method for molding the carrier tape 5 shown in FIG.

[Explanation of symbols]

21 Chip electronic parts 22,22a, 22b Carrier tape 23 Upper opening 24, 24a, 24b cavity 25 plastic sheets 26, 26a, 26b Side wall part 27, 27a, 27b Swelling portion 28 Bottom wall 29 flat surface 30, 31 Longitudinal edge 32,33 width edge 34 dash-dotted line showing projection 35 Chip-shaped electronic components 39 top tape

Claims (2)

(57) [Claims] 1. A carrier tape made of a plastic sheet and formed by embossing to have a plurality of cavities having openings upwardly distributed in the longitudinal direction, and a chip-shaped electronic component housed in each of the cavities. When, and a top tape which is adhered to the carrier tape so as to cover the upper opening of the cavity, the chip-like electronic component series, the bottom wall of the cavity, a flat surface is formed, the
Above the above in the dimension of the carrier tape in the longitudinal direction
The size of the opening and the size of the chip-shaped electronic component are very close to each other.
While touching the chip-shaped electronic component with the flat surface,
In order to bring it into a state where the flat surface extends to the position where each end in the longitudinal direction of the carrier tape defining the upper opening is projected onto the bottom wall, the side wall of the cavity is A series of chip-shaped electronic components, characterized by being provided with a shape that bulges outward. 2. The series of chip-shaped electronic components according to claim 1, wherein the flat surface is formed so as to extend to a position where all end edges defining the upper opening are projected on the bottom wall portion.