JPH05175126A - Member for preventing adhesion to generated film in film generating apparatus - Google Patents

Abstract

PURPOSE:To prevent metallic members for preventing adhesions to generated films from melting even when removing metallic adhering grains, and to suppress the labor relative to recycling at a minimum, and further, to enable the metallic members to be recycled in a semipermanent way. CONSTITUTION:Whole surfaces of first and second members 3, 4 for preventing adhesions to generated films are coated with acid-proof protective films 5. Since the surface states of the protective films 5 are coarse copying the coarse surface states of the first and second members 3, 4, metallic grains are easy to adhere to the protective films 5 when generating films. Also, even if an acid based solvent is used when removing the metallic grains adhering to the protective films 5, the first and second members 3, 4 are prevented from melting since they are protected by the acid-proof protective films 5. Thereby, the recyclings of the members 3, 4 can be performed simply.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a formed film adhesion preventing member used in a film forming apparatus such as a sputtering apparatus, and in particular, even if metal fine particles separating from a metal target adhere, they are removed semi-permanently. It has been improved so that it can be reused.

[0002]

2. Description of the Related Art Conventionally, for example, in a film forming apparatus such as a sputtering apparatus, a semiconductor wafer supporting base,
Equipment such as a film thickness monitor and a gold trap is provided, and metal particles (neutral molecules called radicals) that separate from the metal target easily adhere to those located behind the semiconductor wafer. .. If the material of these fixtures is made of stainless steel, etc., that has a smooth surface, the metal particles that adhere to the equipment may later come off and scatter in the chamber, or cause electrical short-circuit failure. It can happen.

Therefore, conventionally, as shown in FIG. 3, for example, the first and first portions are provided around the semiconductor wafer 50 supported by a support (not shown) or between the front side of the semiconductor wafer 50 and the metal target 51. 2, the generated film adhesion preventing member 52,
By providing 53, the metal fine particles separating from the metal target are not attached to the equipment in the chamber.

The first generated film adhesion preventing member 52 is a rectangular plate having a window 52a close to the outer shape of the semiconductor wafer 50 in the center, and the second generated film adhesion preventing member 53 has a through hole 53a in the center. It consists of a cone having. These generated film adhesion preventing members 52 and 53 are mainly formed of aluminum or stainless steel because they generate less gas even when used in a high temperature and vacuum atmosphere and are easy to process.

Then, these generated film adhesion preventing members 52,
On the surface of 53 facing the metal target 51 side,
The surface condition is set to be rough with minute unevenness,
The unevenness facilitates attachment of the metal fine particles and increases the attachment area of the metal fine particles.

By the way, when the amount of adhered metal fine particles increases with the lapse of use, the metal fine particles adhered and formed into a film form are removed by using, for example, an acid solvent,
The first and second generated film adhesion preventing members 52 and 53 are reused.

[0007]

However, since the acid-based solvent is used to remove the metal fine particles adhering to both the produced film adhesion preventing members 52 and 53, the produced film adhesion preventing member 52 made of metal is used. The surfaces of the and 53 are also melted, and the irregularities formed on the surfaces tend to be smooth. In this case, the metal fine particles are less likely to adhere, and cannot be reused as they are.

Therefore, in order to reuse the formed film adhesion preventing members 52 and 53, the unevenness must be formed again.
It takes time and effort. Moreover, the generated film adhesion preventing members 52, 53
However, there is a limit to how much it can be reused because it melts and is consumed over time.

The present invention was devised to solve such a problem, and prevents the generated film adhesion preventing member from melting even when the adhered metal fine particles are removed, and minimizes the labor for reuse. In addition, the purpose is to enable semi-permanent reuse.

[0010]

In order to achieve such an object, the present invention is used in a film forming apparatus for a semiconductor substrate, wherein metal is used for the equipment in the film forming chamber of the film forming apparatus. The generated film adhesion preventing member that prevents the metal fine particles separated from the target from adhering has the following configuration.

The produced film adhesion preventing member for a film producing apparatus of the present invention is characterized in that at least the surface facing the metal target is formed roughly and the surface is coated with an acid resistant protective film. Have. The main body of the generated film adhesion preventing member may be provided with a hole or a protrusion that exposes the interface between the main body and the protective film. Also,
The protective film is preferably made of a silicon ladder polymer resin such as PPSQ (polyphenylsilsesquioxane) resin.

[0012]

The acid-resistant protective film coated on the product film adhesion preventing member has a rough surface condition following the rough surface condition of the product film adhesion preventing member. Therefore, the metal fine particles separated from the metal target are likely to adhere to the protective film coating the product film adhesion preventing member.

When the metal fine particles that adhere to form a film are removed, the product film adhesion preventing member is protected by an acid-resistant protective film even if an acid solvent is used. Does not melt.

[0014]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. In the figure, 1 is a semiconductor wafer, 2 is a metal target, and 3 and 4 are first and second generated film adhesion preventing members.

The first and second generated film adhesion preventing members 3,
4 is provided around the semiconductor wafer 1 supported by a support (not shown) or between the front side of the front surface of the semiconductor wafer 1 and the metal target 2. Then, the first generated film adhesion preventing member 3 is a rectangular plate having a window 3a close to the outer shape of the semiconductor wafer 1 in the center, and the second generated film adhesion preventing member 4 has a through hole 4a in the center. It consists of a cone. These generated film adhesion preventing members 3 and 4 are mainly formed of aluminum or stainless steel because they do not generate gas even when used in a high temperature and vacuum atmosphere and are easy to process.

Then, these generated film adhesion preventing members 3, 4
The entire surface is provided with minute irregularities so that the surface state is set to be rough, and the irregularities facilitate the attachment of the metal fine particles and increase the attachment area of the metal fine particles. The unevenness can be formed by, for example, dry etching.

In this embodiment, the structure different from the conventional example is that the entire surface of the first and second product film adhesion preventing members 3 and 4 is coated with an acid resistant protective film 5.

As the acid resistant protective film 5, for example, P
Silicone ladder polymer resins such as PSQ (polyphenyl silsesquioxane) resins are selected. And
The protective film 5 includes the first and second generated film adhesion preventing members 3,
By simply coating the surface of the member 3, the surface of the member 3, 4 becomes rough, following the rough surface condition of the member 3, 4.

Here, for example, when a metal film is deposited on the semiconductor wafer 1 by a film forming apparatus such as a sputtering apparatus,
First and second generated film adhesion preventing members 3, 4 as described above
The metal fine particles that fly out of the metal target 2 adhere to the surface of the semiconductor wafer 1, and some metal fine particles that fly out of the metal target 2 collide with plasma generated during sputtering. It will adhere to the first and second generated film adhesion preventing members 3 and 4 without going toward. Of course, in the case of this embodiment, the metal fine particles are not directly attached to the first and second generated film attachment preventing members 3 and 4, but are attached to the protective film 5.

As described above, by using the first and second generated film adhesion preventing members 3 and 4, a semiconductor wafer support, a film thickness monitor, a gold trap, etc. arranged in the chamber of a sputtering apparatus (not shown) can be used. It is possible to prevent metal fine particles from adhering to equipment.

When the frequency of such film formation processing increases and the amount of metal fine particles adhered to the first and second film formation prevention members 3 and 4 increases to form a film, the first and second film formation prevention members 3 and 4 are formed. By washing the generated film adhesion preventing members 3 and 4 with an acid solvent,
The adhered metal fine particles are removed. At this time,
Even if an acid-based solvent is used, both the generated film adhesion preventing members 3 and 4 are protected by the acid-resistant protective film 5, so that the first and second generated film adhesion preventing members 3 and 4 do not melt. I'm done. Moreover, when the protective film 5 is made of the above-mentioned PPSQ resin, the protective film 5 itself hardly dissolves in the acid-based solvent, so that repainting of the protective film 5 becomes unnecessary for a long time. That is, in the present embodiment, when the first and second generated film adhesion preventing members 3 and 4 are reused, it is only necessary to wash them with an acid solvent and do nothing else. Therefore, the running cost is low, which is economical, and the first and second generated film adhesion preventing members 3 and 4 are not melted and can be used semipermanently.

FIG. 2 shows another embodiment of the present invention.
In this embodiment, the acid-resistant protective film 5 is partially coated without covering the entire surfaces of the first and second generated film adhesion preventing members 3 and 4. Specifically, the protective film 5 is
The entire front and back surfaces of the first generated film adhesion preventing member 3 are coated, and the entire inner peripheral surface of the second generated film adhesion preventing member 4 is coated. That is, the interface with the protective film 5 is exposed at the inner peripheral edge and the outer peripheral edge of the window 3a in the first generated film adhesion preventing member 3, and the end surface of the small-diameter opening in the second generated film adhesion preventing member 4. The interface with the protective film 5 is exposed at the end face of the large-diameter opening.

In the case of this embodiment, in order to remove the adhered metal fine particles, an organic solvent is used to remove the adhered metal fine particles from the first and second generated film adhesion preventing members 3, 4 as in the lift-off method at the time of manufacturing a semiconductor device. By peeling off the protective film 5, it is possible to remove the metallic fine particles adhering to the protective film 5 together with the protective film 5.

Specifically, for example, if the first and second produced film adhesion preventing members 3 and 4 are immersed in a container filled with an organic solvent such as an anisole / xylene mixed solvent and washed, the exposed parts are exposed as described above. The organic solvent will invade from the interface between the generated film adhesion preventing members 3 and 4 and the protective film 5,
The protective film 5 is peeled off from here.

Moreover, since the organic solvent is used, the first and second generated film adhesion preventing members 3 and 4 themselves do not melt, and the surface condition thereof is kept rough. Therefore, in the case of reuse, it is sufficient to coat the acid-resistant protective films 3 and 4 on the first and second generated film adhesion preventing members 3 and 4 which are not damaged at all. As this coating method,
For example, it may be hand-painted by using a brush or a roller, or sprayed by using a spray.

The present invention is not limited to the above embodiment, and various external shapes of the first and second generated film adhesion preventing members 3 and 4 are conceivable. Further, as in the embodiment of FIG. 1, when the interface between the two generated film adhesion preventing members 3 and 4 and the protective film 5 is not exposed, it is considered that the protective film 5 is difficult to peel off. , Providing through holes or protrusions at appropriate places on the second generation film adhesion preventing members 3 and 4,
If the protective film 5 is not applied to the inner peripheral surface of the through hole or the outer peripheral surface of the protrusion and the interface between the two is exposed, the protective film 5
Can be easily peeled off. This through hole or protrusion is shown in FIG.
In the embodiment, it is effective in that case that the peeling time of the protective film 5 can be shortened.

[0028]

As described above, in the present invention, since the formed film adhesion preventing member is coated with the acid resistant protective film, when the metal fine particles adhered during the film formation are removed with an acid solvent. The produced film adhesion preventing member is not damaged. Therefore, the produced film adhesion preventing member can be reused by a simple process of washing with an acid-based solvent, and can be semi-permanently used, resulting in a low running cost.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a usage state of a generated film adhesion preventing member according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a usage state of a generated film adhesion preventing member according to another embodiment of the present invention.

FIG. 3 is a vertical cross-sectional view showing a usage state of a conventional generated film adhesion preventing member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Metal target 3 First generation film adhesion preventing member 4 Second generation film adhesion preventing member 5 Protective film

Claims (3)

[Claims] 1. A film formation preventing member for use in a film forming apparatus for a semiconductor substrate, which prevents metal fine particles separating from a metal target from adhering to equipment in a film forming chamber of the film forming apparatus. At least the surface facing the metal target is formed roughly, and the surface is coated with an acid-resistant protective film, which is a member for preventing adhesion of a formed film for a film forming apparatus. 2. The production film adhesion preventing member for a membrane production apparatus according to claim 1, wherein the main body is provided with a hole or a protrusion for exposing an interface between the main body and the acid-resistant protective film. A film formation preventing member for a film forming apparatus, characterized in that. 3. The production film adhesion preventing member for a membrane production apparatus according to claim 1, wherein the acid resistant protective film is PPS.
A formed film adhesion preventing member for a film forming apparatus, which is made of Q (polyphenylsilicesquioxane) resin.