JP3534989B2 - Component parts for film forming equipment - Google Patents
Component parts for film forming equipmentInfo
- Publication number
- JP3534989B2 JP3534989B2 JP29942097A JP29942097A JP3534989B2 JP 3534989 B2 JP3534989 B2 JP 3534989B2 JP 29942097 A JP29942097 A JP 29942097A JP 29942097 A JP29942097 A JP 29942097A JP 3534989 B2 JP3534989 B2 JP 3534989B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal film
- forming apparatus
- base material
- film forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Chemical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
- Physical Vapour Deposition (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は成膜装置内で使用さ
れる構成部品に関するものであり、更に詳しくは、スパ
ッタリング、ＣＶＤ、真空蒸着等の気相成長方法による
成膜装置の構成部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component used in a film forming apparatus, and more particularly to a component of a film forming apparatus using a vapor phase growth method such as sputtering, CVD or vacuum deposition. Is.
【０００２】[0002]
【従来の技術】ＬＳＩ、液晶ディスプレイ、光磁気ディ
スク、ハードディスク等は基板上へ目的に応じた成膜材
料による薄膜を形成させて製造されるが、この成膜時に
パーティクルと称される粒径数μｍ程度の微粒子が成膜
中の基板に付着し配線を短絡させるなどにより製品収率
を大幅に低下させるという看過できない問題がある。2. Description of the Related Art LSIs, liquid crystal displays, magneto-optical disks, hard disks, etc. are manufactured by forming a thin film of a film-forming material according to the purpose on a substrate. There is a problem that cannot be overlooked in that fine particles of about μm adhere to the substrate during film formation and short-circuit the wiring, thereby significantly reducing the product yield.
【０００３】これに対しては種々の対策が講じられてお
り、例えばスパッタリングによる成膜について言えば、
搬送系から持ち込まれるもの、ターゲット材から発生す
るものなどについてはほぼ解決され、現在では、薄膜を
形成させるべき基板以外の成膜装置用構成部品、例えば
防着板（成膜材料が基板以外の装置用構成部品へ付着す
ることを防ぐために、成膜源の周囲に配置される部品）
に付着し、時間の経過と共に厚く成長した成膜材料が成
膜途中に剥離脱落して飛散することがパーティクルの発
生を招く大きい要因とされている。しかし、付着成膜材
料が脱落する前に成膜装置の運転を停止して付着成膜材
料を頻繁にクリーニングすることは成膜装置の稼動時間
を大巾に低下させてコストを上昇させる。Various measures have been taken against this. For example, regarding film formation by sputtering,
Most of the problems such as those brought in from the transport system and those generated from the target material have been solved, and at present, film-forming apparatus components other than the substrate on which the thin film is to be formed, such as adhesion-preventing plates (where the film-forming material (Parts that are placed around the deposition source to prevent them from adhering to the equipment components)
It is considered that a large factor that causes the generation of particles is that the film-forming material that adheres to the substrate and grows thick with the passage of time is peeled off during the film formation and scattered. However, stopping the operation of the film forming apparatus and frequently cleaning the adhering film forming material before the film forming material drops off greatly reduces the operating time of the film forming apparatus and increases the cost.
【０００４】上記の問題に対して、特開平３−８７３５
６号、特開平３−８７３５７号、特開平３−１６６３６
１号、特開平３−１６６３６２号等の各公報には、エン
ボス加工により複数の凹凸を形成させた金属箔や蛇腹状
金属箔を成膜装置用構成部品の表面に取り付ける技術が
開示されている。そして、例えばエンボス加工によって
複数の凹凸を形成させた電解銅箔は既に市販されてお
り、成膜装置用構成部品の形状に応じてその表面を覆う
ように重ね、スポット溶接やリベットによって固定して
使用されている。そして電解銅箔は、成膜装置内で使用
され付着した成膜材料の剥離せんとする応力によって電
解銅箔自身が変形されて応力を緩和するので、付着成膜
材料の剥離脱落の防止に有効であるとされている。この
エンボス加工された電解銅箔は付着成膜材料の剥離脱落
の防止に効果的ではあるが、使い捨てであり取り付け取
り外しが面倒であるほか、付着成膜材料の厚さが限度を
越えると、剥離応力によって電解銅箔自身が引き裂かれ
て成膜装置用構成部品が露出するという問題も有してい
る。With respect to the above problem, Japanese Patent Laid-Open No. 3-8735
6, JP-A-3-87357, and JP-A-3-16636.
No. 1, JP-A-3-166362 and the like disclose techniques for attaching a metal foil or a bellows-shaped metal foil having a plurality of irregularities formed by embossing to the surface of a component for a film forming apparatus. . Then, for example, an electrolytic copper foil having a plurality of irregularities formed by embossing is already on the market, and is stacked so as to cover the surface according to the shape of the film forming apparatus component, and fixed by spot welding or rivets. It is used. The electrolytic copper foil is used in the film-forming equipment to relax the stress due to the peeling stress of the deposited film-forming material, which is effective in preventing the peeling-off of the deposited film-forming material. Is said to be. This embossed electrolytic copper foil is effective in preventing the exfoliation and removal of the deposited film material, but it is disposable and difficult to install and remove, and when the thickness of the deposited film material exceeds the limit, it is stripped. There is also a problem that the electrolytic copper foil itself is torn by the stress and the film forming apparatus components are exposed.
【０００５】これ以外の方法としては、成膜装置用構成
部品の表面に小径の鋼球を噴射させるショット・ブラス
トやガラス玉を噴射させるガラスビーズ・ブラスト（Ｇ
ＢＢ）を行って表面の清浄化をはかると共に、凹凸を形
成させ表面積を増大させて、付着成膜材料の付着力を増
大させようとする試みもあるが、付着成膜材料の剥離脱
落の防止効果は不十分であるほか、不十分であるが故に
ブラスト処理を何回も繰り返すことになり、成膜装置用
構成部品にブラスト時の衝撃熱による歪が蓄積され、破
損に至る場合もある。As another method, a shot blast for injecting a small-diameter steel ball or a glass bead blast (G for injecting a glass ball) onto the surface of a component for a film forming apparatus is used.
There is also an attempt to clean the surface by performing BB) and to increase the surface area by forming irregularities to increase the adhesive force of the deposited film forming material, but prevent peeling and dropping of the deposited film forming material. In addition to the effect being insufficient, the blasting process is repeated many times because of insufficient effect, and strains due to impact heat during blasting are accumulated in the components for the film forming apparatus, which may lead to damage.
【０００６】更には、成膜装置用構成部品の母材の表面
をショット・ブラストし、更にその上へ軟らかい金属を
溶射する方法、例えば、Ａｌ（アルミニウム）合金母材
の表面にＡｌ溶射膜を形成させる方法があり多用されて
いる。この方法は付着成膜材料の剥離応力を軟らかいＡ
ｌ溶射膜が変形して緩和させるという点では合理的であ
るが、成膜材料が剥離応力の大きいＴａ（タンタル）系
である場合には、付着成膜材料の厚さが０．５ｍｍ程度
になると、Ａｌ溶射膜とアルミニウム合金母材との間で
剥離を生じるという問題があり、現在のところ解決の方
法は見出されていない。Furthermore, a method of shot-blasting the surface of the base material of the components for the film forming apparatus and further spraying a soft metal thereon, for example, an Al sprayed film on the surface of the Al (aluminum) alloy base material. There is a method of forming it and it is widely used. This method softens the peeling stress of the deposited film forming material.
Although it is rational in that the sprayed film is deformed and relaxed, when the film-forming material is a Ta (tantalum) -based material with large peeling stress, the thickness of the deposited film-forming material is about 0.5 mm. In that case, there is a problem that delamination occurs between the Al sprayed film and the aluminum alloy base material, and no solution has been found so far.
【０００７】（従来例１）
上述のような問題を解決するものとして、本願出願人の
出願による特開平８ー２７７４６０号公報、「成膜装置
用構成部品及びその製造方法」には、例えば図４のＡの
部分平面図、同じくＢの部分側面図に示すように、Ａｌ
合金の板材の片面に機械加工によって縦横の両方向に２
ｍｍピッチで幅１ｍｍの溝を掘り、深さ２ｍｍとして形
成される山Ｍ、谷Ｎを丸めた母材とし、その凹凸面をシ
ョット・ブラスト処理した後、濃度１７％の硫酸に常温
で２４時間浸漬し、水洗、乾燥したものが開示されてい
る。そして、そのようにして作成される防着板はＴａが
厚さ５〜６ｍｍに付着しても剥離脱落せず、長期間にわ
たって成膜装置内にパーティクルを発生させない構成部
品として優れたものであった。(Conventional Example 1) As a solution to the above problems, Japanese Patent Laid-Open No. 8-277460, “Components for a film forming apparatus and a method for manufacturing the same” disclosed in Japanese Patent Application Laid-Open No. 4 is a partial plan view of A and a partial side view of B as shown in FIG.
Machined on one side of an alloy plate, 2 in both vertical and horizontal directions
After grooving a groove with a width of 1 mm at a pitch of 2 mm and rounding the peaks M and valleys N formed to have a depth of 2 mm, the uneven surface is shot and blasted and then subjected to sulfuric acid with a concentration of 17% at room temperature for 24 hours. It is disclosed that it is dipped, washed with water and dried. The deposition preventive plate thus produced is an excellent component as a component that does not peel off when Ta adheres to a thickness of 5 to 6 mm and does not generate particles in the film forming apparatus for a long period of time. It was
【０００８】[0008]
【発明が解決しようとする課題】成膜材料が付着した成
膜装置用構成部品は成膜装置のメンテナンス時などにお
いて、付着した成膜材料を取り除いて再使用することが
行なわれる。しかし、従来例１の成膜装置用構成部品は
成膜材料が厚く付着しても剥離脱落しないという点では
好ましいものであるが、成膜装置のメンテナンス時など
において、厚く付着した成膜材料を機械的に取り除くに
は困難があり、また成膜材料の付着した構成部品を例え
ば硫酸や硝酸に浸漬しても、成膜材料の種類によっては
付着成膜材料の溶解よりは構成部品の溶解の方が先に進
行する等、成膜装置用構成部品の再使用に関して問題が
あった。The constituent parts for the film forming apparatus to which the film forming material adheres are removed and reused at the time of maintenance of the film forming apparatus. However, the film forming apparatus component of Conventional Example 1 is preferable in that it does not peel off when the film forming material adheres thickly. It is difficult to remove mechanically, and even if the component with the film-forming material adhered to it is dipped in sulfuric acid or nitric acid, for example, depending on the type of film-forming material, it may be more difficult to dissolve the component than the film-forming material. There was a problem with the reuse of the components of the film forming apparatus, such as the first one.
【０００９】本発明は上記の問題に鑑みてなされ、成膜
時には成膜材料が厚く付着しても剥離脱落せず、成膜装
置のメンテナンス時などにおいては、付着成膜材料を取
り除いて容易に再使用し得る成膜装置用構成部品を提供
することを目的とする。The present invention has been made in view of the above problems, and even if a film-forming material is deposited thickly during film formation, the film-forming material does not peel off and fall off. Therefore, during maintenance of the film-forming apparatus, the deposited film-forming material can be easily removed. It is an object of the present invention to provide a film-forming apparatus component that can be reused.
【００１０】[0010]
【課題を解決するための手段】上記の課題は請求項１の
構成によって解決されるが、その解決手段を実施の形態
によって例示すれば、図１は成膜装置用構成部品の表面
部分の拡大断面図であり、同構成部品は金属の板材、例
えばアルミニウム合金（Ａ５０５２）の板材からなる母
材１の表面に、母材１と比較して無機酸に溶解し易い金
属、例えば銅からなる下層易溶性金属膜２を形成し、更
にその上にステンレス鋼（ＳＵＳ４２０Ｊ２）による多
孔性金属膜３を形成したものであり、このように形成し
た成膜装置用構成部品によって上記の課題は解決され
る。The above-mentioned problems can be solved by the constitution of claim 1, but if the solving means is exemplified by the embodiment, FIG. 1 shows the enlargement of the surface portion of the film-forming apparatus component. FIG. 3 is a cross-sectional view showing the same component on a surface of a base material 1 made of a metal plate material, for example, an aluminum alloy (A5052) plate, and a lower layer made of a metal that is more easily dissolved in an inorganic acid than the base material 1, for example, copper. The easily soluble metal film 2 is formed, and the porous metal film 3 made of stainless steel (SUS420J2) is further formed on the easily soluble metal film 2. The above-mentioned problems can be solved by the components for the film forming apparatus thus formed. .
【００１１】この成膜装置用構成部品を成膜装置内で使
用すると、付着する成膜材料の厚さは成膜時間の経過と
共に増大するが、成膜材料の剥離応力が大であっても、
表面を凹凸状とした母材とすることによって、成膜途中
には剥離脱落せず、メンテナンス時に取り外した成膜装
置用構成部品を無機酸に浸漬すると、構成部品の端部か
ら多孔性金属膜３を経由し浸入する無機酸、例えば硫酸
や硝酸、ないしはそれらの混酸によって下層易溶性金属
膜２が溶解され、厚く付着した成膜材料５が多孔性金属
膜３と共に比較的短時間で母材１から脱落するので母材
１を容易に再使用に供し得る。When the components for the film forming apparatus are used in the film forming apparatus, the thickness of the film forming material that adheres increases with the lapse of film forming time, but even if the peeling stress of the film forming material is large. ,
By using a base material with an uneven surface, it does not peel off during film formation, and when the components for the film formation device removed during maintenance are immersed in an inorganic acid, the porous metal film starts from the end of the component. The lower easily soluble metal film 2 is dissolved by an inorganic acid, such as sulfuric acid, nitric acid, or a mixed acid thereof, which enters through 3 and the thickly deposited film-forming material 5 together with the porous metal film 3 becomes a base material in a relatively short time. Since the base material 1 is removed from the base material 1, the base material 1 can be easily reused.
【００１２】[0012]
【発明の実施の形態】本発明の実施の形態による成膜装
置用構成部品は金属の板材、もしくは表面に凹凸を設け
た金属の板材を母材として作製される。金属の種類は特
に限定されないが、一般的にはアルミニウム合金（Ａ５
０５２）、アルミニウム、ステンレス鋼（ＳＵＳ３０
４）、チタン等が使用される。母材の表面に凹凸を設け
る場合には機械加工性の点でアルミニウム合金（Ａ５０
５２）またはアルミニウムとすることが好ましい。 表
面が凹凸状の母材の例を図３、図４に示した。図３は表
面に比較的角張った凹凸を設けた母材１を示し、図３の
Ａはその部分平面図、図３のＢは部分側面図である。す
なわち、厚さ５ｍｍの板状の母材の片面に、縦方向と横
方向にそれぞれ、２ｍｍピッチで幅１ｍｍの溝を掘り、
深さを２ｍｍとして形成される山Ｍと谷Ｎの角を丸めた
ものである。勿論、この凹凸の深さや幅のピッチは１ｍ
ｍ以下としてもよい。そのほか、図４のＡの部分平面
図、図４のＢの部分側面図に示すように、表面に丸味の
ある凹凸を設けた母材１’としてもよい。剥離応力が小
さい成膜材料の場合には表面が平面状の母材を使用して
もよいがその母材の図示は省略する。そして成膜装置用
構成部品は、例えば母材１について説明すれば、表面を
ガラスビーズ・ブラストまたはショット・ブラスト処理
して汚れを除きかつ粗面とした後、その表面部分の断面
図である図１に示すように、母材１の表面に母材１と比
較して無機酸に溶解し易い金属からなる下層易溶性金属
膜２を形成し、その上へ多孔性金属膜３を重ねて形成す
る。BEST MODE FOR CARRYING OUT THE INVENTION The film-forming apparatus component according to the embodiment of the present invention is manufactured by using a metal plate material or a metal plate material having irregularities on its surface as a base material. The type of metal is not particularly limited, but generally an aluminum alloy (A5
052) , aluminum, stainless steel (SUS30
4), titanium or the like is used. When unevenness is provided on the surface of the base material, aluminum alloy (A50
52) or aluminum. Examples of the base material having an uneven surface are shown in FIGS. 3 and 4. FIG. 3 shows a base material 1 having a relatively angular irregularity on its surface, FIG. 3A is a partial plan view thereof, and FIG. 3B is a partial side view thereof. That is, a groove having a width of 1 mm is dug in a longitudinal direction and a lateral direction at a pitch of 2 mm on one surface of a plate-shaped base material having a thickness of 5 mm,
The corners of the peaks M and valleys N formed with a depth of 2 mm are rounded. Of course, the pitch of the depth and width of this unevenness is 1 m
It may be m or less. In addition, as shown in the partial plan view of A of FIG. 4 and the partial side view of B of FIG. 4, a base material 1 ′ having rounded unevenness on the surface may be used. In the case of a film forming material having a small peeling stress, a base material having a flat surface may be used, but the base material is not shown. For example, in the case of the base material 1, the film-forming apparatus component is a cross-sectional view of the surface portion after the surface is subjected to glass bead blasting or shot blasting to remove dirt and roughen the surface. As shown in FIG. 1, a lower layer easily soluble metal film 2 made of a metal that is more soluble in an inorganic acid than the base material 1 is formed on the surface of the base material 1, and a porous metal film 3 is formed thereon. To do.
【００１３】図１に示す下層易溶性金属膜２は母材と比
較して硫酸、硝酸などの無機酸、ないしはそれらの混酸
に溶解し易い金属、例えばＣｕ（銅）を母材１の表面に
溶射して形成される。下層易溶性金属膜２の厚さに制限
はないが、コストと効用を考慮して厚さ０．０５〜０．
１５ｍｍの範囲内とするのが好ましい。因みに、２〜３
種の金属を濃度１７％の硫酸に常温浸漬した時の溶解速
度比は、例えば母材１の材料であるアルミニウム合金
（Ａ５０５２）を１として、Ｃｕは２５、Ｎｉ（ニッケ
ル）は２０、アルミニウム合金（Ａ２０１７）は２であ
った。勿論、下層易溶性金属膜２を形成させる金属はＣ
ｕ、Ｎｉに限らずアルミニウム合金（Ａ２０１７）でも
よく、母材１の材料と比較して溶解性が大であり、付着
した成膜材料５（図１において一点鎖線で示す）が多孔
性金属膜３と共に母材１から剥離し易いものであれば、
金属の種類は特に限定されない。勿論、合金であっても
よい。また、上記の溶解速度比は浸漬に使用する無機酸
の種類によって異なることは言うまでもない。The lower easily soluble metal film 2 shown in FIG. 1 has a metal, such as Cu (copper), which is more easily dissolved in an inorganic acid such as sulfuric acid and nitric acid or a mixed acid thereof as compared with the base material, on the surface of the base material 1. It is formed by thermal spraying. The thickness of the lower easily soluble metal film 2 is not limited, but the thickness of 0.05 to 0.
It is preferably within the range of 15 mm. By the way, 2-3
When the seed metal is immersed in sulfuric acid having a concentration of 17% at room temperature, the dissolution rate ratio is, for example, 1 for the aluminum alloy (A5052) which is the material of the base material 1, 25 for Cu, 20 for Ni (nickel), and 20 for aluminum alloy. (A2017) was 2. Of course, the metal forming the lower layer easily soluble metal film 2 is C
Not only u and Ni but also an aluminum alloy (A2017) may be used, which has a higher solubility than the material of the base material 1, and the deposited film material 5 (shown by the one-dot chain line in FIG. 1) is a porous metal film. If it is easy to peel from the base material 1 together with 3,
The type of metal is not particularly limited. Of course, it may be an alloy. Needless to say, the above dissolution rate ratio varies depending on the type of the inorganic acid used for dipping.
【００１４】また、下層易溶性金属膜２の上へ重ねて形
成される多孔性金属膜３は比較的高い融点を有する金
属、例えばステンレス鋼（ＳＵＳ４２０Ｊ２）を溶射し
て形成される。多孔性金属膜３の厚さも特に限定されな
いが、コストと効用を考慮して厚さ０．１〜０．３ｍｍ
の範囲内とするのが好ましい。周知のように、多孔性金
属膜３は溶射される金属微粒の表面が溶融し内部が完全
には溶融していない状態で成膜されることにより、例え
ば気孔率４〜１５％の連続気孔ｐを包含して形成され
る。すなわち、使用する金属の融点と溶射条件（溶射温
度、その他）との関連において各種の金属による多孔性
金属膜３を形成し得る。この多孔性金属膜３は、成膜材
料が付着した成膜装置用構成部品を無機酸に浸漬する時
に、連続気孔ｐが無機酸の通路となって無機酸が浸入
し、下層易溶性金属膜２を溶解することに寄与する。従
って、付着成膜材料５の剥離応力によって多孔性金属膜
３が破壊されることは望ましくなく、多孔性金属膜３の
形成には比較的剛性のある金属を使用することが好まし
い。勿論、浸漬する無機酸によって溶解され難い金属で
あることが必要である。それらの観点からは、上記のス
テンレス鋼（ＳＵＳ４２０Ｊ２）以外に、ＴａやＷ（タ
ングステン）等が適している。The porous metal film 3 formed on the lower layer easily soluble metal film 2 is formed by spraying a metal having a relatively high melting point, for example, stainless steel (SUS420J2). The thickness of the porous metal film 3 is not particularly limited either, but the thickness is 0.1 to 0.3 mm in consideration of cost and utility.
It is preferably within the range of. As is well known, the porous metal film 3 is formed in a state where the surface of the sprayed metal fine particles is melted and the inside thereof is not completely melted, so that, for example, continuous pores p having a porosity of 4 to 15% are formed. And is formed. That is, the porous metal film 3 made of various metals can be formed in relation to the melting point of the metal used and the spraying conditions (spraying temperature, etc.). In the porous metal film 3, when the components for the film forming apparatus to which the film forming material is attached are immersed in the inorganic acid, the continuous pores p serve as passages for the inorganic acid and the inorganic acid penetrates, and the lower layer easily soluble metal film is formed. Contributes to the dissolution of 2. Therefore, it is not desirable for the porous metal film 3 to be destroyed by the peeling stress of the deposited film forming material 5, and it is preferable to use a metal having a relatively rigidity for forming the porous metal film 3. Of course, it is necessary that the metal is hard to be dissolved by the inorganic acid to be dipped. From these viewpoints, Ta, W (tungsten) and the like are suitable in addition to the above stainless steel (SUS420J2).
【００１５】上述の様に構成される成膜装置用構成部品
は、成膜装置内での成膜時に付着成膜材料５が成長し厚
さ５ｍｍ程度となっても剥離脱落することはない。そし
て、成膜装置のメンテナンス時などにおいて、成膜装置
から付着成膜材料５が厚く成長した構成部品を取り出し
て例えば硫酸に浸漬すると、構成部品の端面部に露出し
ている多孔性金属膜３を経由して硫酸が浸入し下層易溶
性金属膜２が溶解され、５〜１５時間後には、付着成膜
材料５が多孔性金属膜３と共に母材１から脱落する。付
着成膜材料５が脱落した母材１は水洗し乾燥した後、再
びその表面に易溶性金属膜２を形成し、更にその上へ多
孔性金属膜３を形成することによって再使用される。The components of the film-forming apparatus configured as described above do not peel off when the deposited film-forming material 5 grows to a thickness of about 5 mm during film-forming in the film-forming apparatus. Then, for example, at the time of maintenance of the film forming apparatus, when the component part in which the deposited film forming material 5 has grown thick is taken out from the film forming device and immersed in, for example, sulfuric acid, the porous metal film 3 exposed at the end face part of the component part. Sulfuric acid infiltrates via the solution to dissolve the lower layer easily soluble metal film 2, and after 5 to 15 hours, the deposited film forming material 5 falls off from the base material 1 together with the porous metal film 3. The base material 1 from which the deposited film forming material 5 has fallen off is washed with water and dried, then the easily soluble metal film 2 is formed again on the surface thereof, and the porous metal film 3 is further formed thereon to be reused.
【００１６】上記の成膜装置用構成部品は母材１の表面
に下層易溶性金属膜２と多孔性金属膜３を形成させた二
層膜構成の場合であるが、図２に示すように、更にその
多孔性金属膜３の上へ下層易溶性金属膜２と同様な上層
易溶性金属膜４を形成させて三層膜構成としてもよく、
こうすることによって、付着成膜材料の剥離に要する無
機酸への浸漬時間がほぼ半減する。The above-mentioned components for the film forming apparatus have a two-layer film structure in which the lower layer easily soluble metal film 2 and the porous metal film 3 are formed on the surface of the base material 1, as shown in FIG. Further, an upper layer easily soluble metal film 4 similar to the lower layer easily soluble metal film 2 may be formed on the porous metal film 3 to form a three-layer film structure,
By doing so, the immersion time in the inorganic acid required for peeling off the deposited film forming material is almost halved.
【００１７】[0017]
【実施例】次に本発明の成膜装置用構成部品を実施例に
よって具体的に説明する。EXAMPLES Next, the components of the film forming apparatus of the present invention will be specifically described by way of examples.
【００１８】（実施例１）図３に示す角張った凹凸の表
面を有する母材１、すなわち、アルミニウム合金（Ａ５
０５２）の厚さ５ｍｍの板材の片面をエンドミルで切削
して、縦方向と横方向とのそれぞれに、２ｍｍピッチで
幅１ｍｍの溝を掘り、深さを２ｍｍとして形成される山
Ｍと谷Ｎの角を丸めた凹凸を有する母材１を用意した。
この母材１の凹凸面をガラスビーズ・ブラスト処理して
表面の汚れを除きかつ粗面とした。次いで、図１に示す
ように、母材１の表面に硫酸に溶解し易いＣｕを溶射し
て厚さ０．１ｍｍの下層易溶性金属膜２を形成し、更に
その上へステンレス鋼（ＳＵＳ４２０Ｊ２）を溶射して
厚さ０．２ｍｍの多孔性金属膜３を形成して二層金属膜
を有する板材とした。(Embodiment 1) A base material 1 having a square uneven surface as shown in FIG. 3, that is, an aluminum alloy (A5
052), one side of a plate material having a thickness of 5 mm is cut by an end mill, and a groove having a width of 1 mm is dug at a pitch of 2 mm in each of the vertical direction and the horizontal direction, and a mountain M and a valley N formed to have a depth of 2 mm. A base material 1 having irregularities with rounded corners was prepared.
The concavo-convex surface of the base material 1 was subjected to a glass bead blast treatment to remove surface stains and to make it a rough surface. Then, as shown in FIG. 1, Cu, which is easily dissolved in sulfuric acid, is sprayed on the surface of the base material 1 to form a lower-layer easily-soluble metal film 2 having a thickness of 0.1 mm, and stainless steel (SUS420J2) is further formed thereon. Was sprayed to form a porous metal film 3 having a thickness of 0.2 mm to obtain a plate material having a two-layer metal film.
【００１９】上記の二層金属膜の板材を複数枚用意し、
真空槽内でＴａをスッパタさせてガラス基板に成膜する
成膜装置のＴａターゲット板の周囲に、それらの板材を
凹凸面が内側となるように筒状に組み合わせて設置して
防着板とした。成膜操作を開始してバッチ数を重ねるに
従い、防着板へ付着するＴａからなる付着成膜材料５は
厚さが増大したが、厚さが５〜６ｍｍとなっても、剥離
応力が大きいとされるＴａの付着成膜材料５が剥離脱落
することはなかった。これは防着板に設けた凹凸が剥離
応力を分散させたことによる。Prepare a plurality of plate materials of the above two-layer metal film,
A Ta target plate of a film forming apparatus that sputters Ta in a vacuum chamber to form a film on a glass substrate is placed around the Ta target plate in a cylindrical shape so that the uneven surface is on the inside to form an adhesion-preventing plate. did. As the film forming operation was started and the number of batches was increased, the thickness of the adhered film forming material 5 made of Ta which adheres to the adhesion preventing plate increased, but the peeling stress was large even when the thickness was 5 to 6 mm. The Ta-deposited film forming material 5 considered to be peeled off did not fall off. This is because the unevenness provided on the adhesion-preventing plate dispersed the peeling stress.
【００２０】また、成膜操作の停止後、Ｔａが厚く付着
した防着板を成膜装置から取り外して、１７％濃度の硫
酸を張った浸漬槽に投入したが、およそ１０時間経過後
にＴａの付着成膜材料５が多孔性金属膜３と共に防着板
から脱落した。これは、硫酸がステンレス鋼（ＳＵＳ４
２０Ｊ２）による多孔性金属膜３内を浸入してＣｕの下
層易溶性金属膜２を溶解したことによる。このＴａ付着
物が脱落した母材１を浸漬槽から取り出し水洗乾燥した
後、上述した新品の母材１の場合と同様にしてその表面
にＣｕの下層易溶性金属膜２を形成し、ステンレス鋼
（ＳＵＳ４２０Ｊ２）の多孔性金属膜３を形成させて、
母材１を容易に再利用に供し得た。After the film-forming operation was stopped, the deposition-inhibitory plate with thick Ta was removed from the film-forming apparatus and placed in a dipping tank filled with 17% sulfuric acid. The deposited film forming material 5 dropped off together with the porous metal film 3 from the deposition preventive plate. This is because sulfuric acid is stainless steel (SUS4
20J2) penetrates the inside of the porous metal film 3 to dissolve the Cu lower layer easily soluble metal film 2. The base material 1 from which the Ta deposits have fallen is taken out of the dipping tank, washed with water and dried, and then a Cu lower layer easily soluble metal film 2 is formed on the surface of the base material 1 in the same manner as in the case of the new base material 1 described above. By forming a porous metal film 3 of (SUS420J2),
The base material 1 could be easily reused.
【００２１】（実施例２）実施例１で使用した母材１の
凹凸面をガラスビーズ・ブラスト処理して表面の汚れを
除きかつ粗面とした後、図２に示すように、母材１の表
面にＣｕを溶射して厚さ０．０５ｍｍの下層易溶性金属
膜２を形成した上へステンレス鋼（ＳＵＳ４２０Ｊ２）
を溶射して厚さ０．２ｍｍの多孔性金属膜３を形成し、
更にその上にＣｕを溶射して厚さ０．０５ｍｍの下層易
溶性金属膜４を形成して三層金属膜を有する板材とし
た。上記の三層金属膜の板材を、実施例１と同じ成膜装
置のＴａターゲット板の周囲に、それらの板材の凹凸面
が内側となるように、筒状に組み合わせて設置して防着
板とした。成膜のバッチ数を重ねるに従い、防着板へ付
着するＴａからなる付着成膜材料５は厚さが増大した
が、厚さが５〜６ｍｍとなっても剥離脱落することはな
かった。(Embodiment 2) The uneven surface of the base material 1 used in the embodiment 1 is subjected to glass bead blasting to remove stains on the surface and to make it a rough surface, and then, as shown in FIG. Cu is sprayed on the surface of the base material to form a lower layer easily soluble metal film 2 having a thickness of 0.05 mm, and then stainless steel (SUS420J2)
Is sprayed to form a porous metal film 3 having a thickness of 0.2 mm,
Further, Cu was sprayed thereon to form a lower layer easily soluble metal film 4 having a thickness of 0.05 mm to obtain a plate material having a three-layer metal film. The plate materials of the above-mentioned three-layer metal film are installed in combination around the Ta target plate of the same film forming apparatus as in Example 1 in a cylindrical shape so that the uneven surface of the plate materials is on the inside, and the deposition preventive plate And As the number of film forming batches increased, the thickness of the deposited film forming material 5 made of Ta that adhered to the deposition-inhibitory plate increased, but it did not peel off when the thickness was 5 to 6 mm.
【００２２】また、成膜操作の停止後、Ｔａが厚く付着
した防着板を取り外して、１７％濃度の硫酸に浸漬した
が、付着成膜材料５は約５時間で脱落し、実施例１の場
合と比較して脱落までの浸漬時間は半減した。これはス
テンレス鋼（ＳＵＳ４２０Ｊ２）の多孔性金属膜３内を
浸入した硫酸がＣｕの下層易溶性金属膜２と上層易溶性
金属膜４とを同時に溶解したことによると思われる。付
着成膜材料５の脱落した母材１を浸漬槽から取り出し水
洗乾燥した後、新品の母材１の場合と同様に、その表面
にＣｕによる下層易溶性金属膜２、ステンレス鋼（ＳＵ
Ｓ４２０Ｊ２）による多孔性金属膜３、Ｃｕによる下層
易溶性金膜４からなる三層金属膜を形成させることによ
り、母材１を容易に再利用し得た。Further, after stopping the film forming operation, the deposition preventive plate on which Ta was thickly adhered was removed and immersed in sulfuric acid having a concentration of 17%, but the adhered film forming material 5 fell off in about 5 hours. The immersion time until falling off was halved compared to the case of. It is considered that this is because the sulfuric acid infiltrating the porous metal film 3 of stainless steel (SUS420J2) simultaneously dissolved the lower layer easily soluble metal film 2 and the upper layer easily soluble metal film 4 of Cu. The base material 1 from which the deposited film forming material 5 has fallen off is taken out from the dipping tank, washed with water and dried, and thereafter, as in the case of the new base material 1, the lower easily soluble metal film 2 made of Cu, stainless steel (SU) on the surface thereof.
By forming a three-layer metal film composed of the porous metal film 3 of S420J2) and the lower soluble gold film 4 of Cu, the base material 1 could be easily reused.
【００２３】（実施例３）
図４に示す丸味のある凹凸の表面を有する母材１'、す
なわち、アルミニウム合金（Ａ５０５２）の厚さ５ｍｍ
の板材の片面をエンドミルで切削して、縦方向と横方向
とのそれぞれに、２ｍｍピッチで幅１ｍｍの溝を掘り、
深さを２ｍｍとして形成される山Ｍと谷ＮにＲ＝０．５
ｍｍの丸味を付けた凹凸を有する母材１'を用意した。
この母材１'の凹凸面をショット・ブラスト処理して表
面の汚れを除きかつ粗面とした。次いで、図１を援用し
て、母材１'の表面に硫酸に溶解し易いＮｉを溶射して
厚さ０．１ｍｍの下層易溶性金属膜２'を形成し、更に
その上へステンレス鋼（ＳＵＳ４２０Ｊ２）を溶射して
厚さ０．２ｍｍの多孔性金属膜３'を形成して、二層金
属膜を有する板材を作製した。Example 3 A base material 1'having a rounded and uneven surface shown in FIG. 4, that is, an aluminum alloy (A5052) having a thickness of 5 mm
One side of the plate material is cut with an end mill, and a groove having a width of 1 mm is dug at a pitch of 2 mm in each of the vertical direction and the horizontal direction,
R = 0.5 at the peak M and the valley N formed with a depth of 2 mm
A base material 1'having a rounded and rounded shape of mm was prepared.
The concavo-convex surface of the base material 1'was shot-blasted to remove surface stains and roughened. Then, with reference to FIG. 1, Ni that is easily dissolved in sulfuric acid is sprayed on the surface of the base material 1 ′ to form a lower layer easily soluble metal film 2 ′ having a thickness of 0.1 mm, and stainless steel ( SUS420J2) was sprayed to form a porous metal film 3'having a thickness of 0.2 mm, and a plate material having a two-layer metal film was produced.
【００２４】上記の二層金属膜の板材を複数枚用意して
真空槽の内壁材とした。すなわち、Ｓｉ（シリコン）基
板に形成されているＳｉＯ2 （酸化けい素）膜上のＴｉ
Ｎ（窒化チタン）薄膜の全面に、ＷＦ6 （６弗化タング
ステン）ガスとＨ2 （水素）ガスとによってＷ膜を形成
させるＣＶＤ法の成膜装置の真空槽の内壁面の一部に上
記の二層金属膜の内壁材を、それらの凹凸面が内側とな
るように取り付けた。成膜操作を開始してバッチ数を重
ねるに従い、内壁材の凹凸面におけるＷからなる付着成
膜材料５’の厚さは増大したが、厚さが５〜６ｍｍとな
っても、Ｗの付着成膜材料５’が脱落することはなかっ
た。A plurality of plate materials of the above-mentioned two-layer metal film were prepared and used as the inner wall material of the vacuum chamber. That is, Ti on the SiO 2 (silicon oxide) film formed on the Si (silicon) substrate
A W film is formed on the entire surface of the N (titanium nitride) thin film by WF 6 (tungsten hexafluoride) gas and H 2 (hydrogen) gas. The inner wall material of the two-layer metal film of No. 2 was attached so that the uneven surface thereof was on the inside. As the deposition operation was started and the number of batches was increased, the thickness of the deposited film-forming material 5'comprising W on the uneven surface of the inner wall material increased, but even if the thickness became 5 to 6 mm, the deposition of W The film forming material 5 ′ did not fall off.
【００２５】また、成膜操作の停止後、Ｗが厚く付着し
た内壁材を取り外して、１７％濃度の硫酸を張った浸漬
槽に投入したが、およそ１０時間経過後に付着物成膜材
料５’が多孔性金属膜３’と共に内壁材から脱落した。
また、実施例１と同様に、付着成膜材料５’の脱落した
母材１’を浸漬槽から取り出し水洗乾燥した後、上述し
た新品の母材１’の場合と同様にして、その表面にＮｉ
による下層易溶性金属膜２’、ステンレス鋼（ＳＵＳ４
２０Ｊ２）による多孔性金属膜３’形成して、母材１’
を容易に再利用し得た。After the film-forming operation was stopped, the inner wall material with thick W adhered was removed and placed in a dipping tank filled with 17% sulfuric acid. Fell off from the inner wall material together with the porous metal film 3 ′.
Further, as in Example 1, the base material 1 ′ from which the deposited film forming material 5 ′ was dropped was taken out from the dipping tank, washed with water, and dried, and then, on the surface thereof, in the same manner as in the case of the new base material 1 ′. Ni
Lower soluble metal film 2 ', stainless steel (SUS4
20J2) to form a porous metal film 3'and form a base material 1 '
Could be easily reused.
【００２６】本実施の形態の形態による成膜装置用構成
部品は以上の様に構成され作用するが、勿論、本発明は
これらに限られることなく、本発明の技術的思想に基づ
いて種々の変形が可能である。The components for the film forming apparatus according to the embodiment of the present invention are constructed and operate as described above, but of course the present invention is not limited to these, and various components can be used based on the technical idea of the present invention. Deformation is possible.
【００２７】例えば本実施の形態においては、成膜装置
用構成部品として防着板および真空槽の内壁面を例示し
たが、本発明の構成部品にはこれら以外の各種の構成部
品が含まれることは言うまでもない。構成部品は、成膜
装置の種類やタイプによっては同一部品を異なる名称で
呼ぶこともあるが、例えば、基板の周囲を抑えるカバー
リング、基板を固定するホールダ、基板へ所定形状に成
膜させるためのマスク、真空蒸着装置において金属蒸気
の流れを導くチムニー（煙突）や蒸発源を開閉するシャ
ッター、スパッタ装置においてターゲットに近接して設
置されるアースリング、ＣＶＤ装置において原料ガスを
吹き出させるシャワープレート等であり、換言すれば成
膜装置内で基板以外に成膜材料が付着する全ての構成部
品を指す。For example, in the present embodiment, the deposition preventive plate and the inner wall surface of the vacuum chamber are exemplified as the components for the film forming apparatus, but the components of the present invention include various components other than these. Needless to say. Depending on the type and type of film forming equipment, the same parts may be called by different names.For example, a cover ring that suppresses the periphery of the substrate, a holder that fixes the substrate, Mask, a chimney (chimney) that guides the flow of metal vapor in a vacuum deposition apparatus, a shutter that opens and closes an evaporation source, an earth ring installed near a target in a sputtering apparatus, a shower plate that blows out a source gas in a CVD apparatus, etc. That is, in other words, it refers to all components to which the film-forming material adheres in the film-forming apparatus other than the substrate.
【００２８】また本実施の形態においては、スパッタ
法、ＣＶＤ法の成膜装置における構成部品を例示した
が、本発明の成膜装置用構成部品は真空蒸着法による成
膜装置のほか気相成長方法による全ての成膜装置の構成
部品を含む。Further, in the present embodiment, the constituent parts of the film forming apparatus of the sputtering method and the CVD method are exemplified, but the constituent parts for the film forming apparatus of the present invention are not only the film forming apparatus of the vacuum deposition method but also the vapor phase growth. Includes all deposition equipment components by the method.
【００２９】また本実施の形態においては、アルミニウ
ム合金（Ａ５０５２）の平板の片面に縦方向、横方向に
２ｍｍピッチで幅１ｍｍの溝を掘り、深さ２ｍｍの溝と
して角張った凹凸、または丸味のある凹凸を形成した
が、この凹凸の形状や大きさは成膜材料に固有の剥離応
力に応じて適宜決定されるものであり、一概には定め得
ない。また、剥離応力の大きさは付着成膜材料の厚さに
比例するので、固有の剥離応力が小さい成膜材料が薄く
しか付着しない構成部品においては、母材を平面状とす
ることもことも可能である。Further, in the present embodiment, a flat plate of aluminum alloy (A5052) is dug in one side with a pitch of 2 mm in the vertical and horizontal directions to form a groove having a depth of 2 mm and angular irregularities or a rounded shape. Although a certain unevenness was formed, the shape and size of this unevenness are appropriately determined according to the peeling stress peculiar to the film forming material, and cannot be unconditionally determined. Further, since the magnitude of the peeling stress is proportional to the thickness of the deposited film forming material, the base material may be made flat in a component in which the film forming material having a small intrinsic peeling stress adheres only thinly. It is possible.
【００３０】また本実施の形態においては、構成部品の
母材１の片面に凹凸を設け、その表面に下層易溶性金属
膜２、多孔性金属膜３等を形成して成膜装置用構成部品
としたが、成膜装置用構成部品の形状と成膜材料の付着
状況によっては、母材１の両面に凹凸を設けて下層易溶
性金属膜２、多孔性金属膜３等を形成するようにしても
よい。この場合には、無機酸への浸漬に際し、必要によ
っては多孔性金属膜の一部を露出させる必要がある。Further, in the present embodiment, the base material 1 of the component is provided with irregularities on one surface, and the lower layer easily soluble metal film 2, the porous metal film 3 and the like are formed on the surface thereof to form a component for a film forming apparatus. However, depending on the shape of the components for the film-forming apparatus and the adhesion state of the film-forming material, unevenness may be provided on both surfaces of the base material 1 to form the lower-layer easily-soluble metal film 2, the porous metal film 3 and the like. May be. In this case, it is necessary to expose a part of the porous metal film during immersion in the inorganic acid, if necessary.
【００３１】また本実施の形態においては、下層易溶性
金属膜２を溶射法によって形成したが、これに代えて化
学めっき法または電解めっき法によって形成してもよ
い。Further, in this embodiment, the lower layer easily soluble metal film 2 is formed by the thermal spraying method, but instead of this, it may be formed by the chemical plating method or the electrolytic plating method.
【００３２】[0032]
【発明の効果】本発明の成膜装置用構成部品は上述のよ
うな形態で実施され、以下に述べるような効果を奏す
る。The components of the film forming apparatus according to the present invention are embodied in the above-described modes and have the effects described below.
【００３３】本発明の成膜装置用構成部品は成膜装置内
において使用される時、付着成膜材料が時間の経過と共
に成長しても脱落せず、成膜される基板を汚染しない。
また、成膜装置のメンテナンス時などにおいて、成膜装
置から成膜材料の付着した構成部品を取り出して無機酸
に浸漬することにより、多孔性金属膜を経由し無機酸が
浸入して下層易溶性金属膜を溶解し、付着成膜材料が母
材から脱落するので、母材の再使用が極めて容易とな
り、成膜装置の稼動率、生産性を向上させる。When the film-forming apparatus component of the present invention is used in the film-forming apparatus, the deposited film-forming material does not fall off even if it grows over time, and does not contaminate the substrate to be formed.
In addition, at the time of maintenance of the film forming device, by taking out the component parts to which the film forming material is attached from the film forming device and immersing it in the inorganic acid, the inorganic acid penetrates through the porous metal film and the lower layer is easily soluble. Since the metal film is melted and the deposited film forming material falls off from the base material, the base material can be reused very easily, and the operating rate and productivity of the film forming apparatus are improved.
【図１】実施例１の成膜装置用構成部品の表面部分の断
面図である。FIG. 1 is a cross-sectional view of a surface portion of a film forming apparatus component according to a first embodiment.
【図２】実施例２の成膜装置用構成部品の表面部分の断
面図である。FIG. 2 is a cross-sectional view of a surface portion of a film forming apparatus component according to a second embodiment.
【図３】角張った凹凸を表面に有する母材を示す図であ
り、Ａは部分平面図、Ｂは対応する部分側面図である。FIG. 3 is a view showing a base material having angular irregularities on its surface, where A is a partial plan view and B is a corresponding partial side view.
【図４】丸味のある凹凸を表面に有する母材を示す図で
あり、Ａは部分平面図、Ｂは対応する部分側面図であ
る。FIG. 4 is a diagram showing a base material having rounded irregularities on its surface, where A is a partial plan view and B is a corresponding partial side view.
１ 母材 １’ 母材 ２ 下層易溶性金属膜 ３ 多孔性金属膜 ４ 上層易溶性金属膜 ５ 付着成膜材料 ｐ 気孔 1 base material 1'base metal 2 Lower layer easily soluble metal film 3 Porous metal film 4 Upper layer easily soluble metal film 5 Adhesive film forming materials p pore
フロントページの続き (56)参考文献 特開 平８−277460（ＪＰ，Ａ) 特開 平３−166362（ＪＰ，Ａ) 特開 平８−176816（ＪＰ，Ａ) 特開 平２−285061（ＪＰ，Ａ) 特開 昭57−126962（ＪＰ，Ａ) 特開 平１−191768（ＪＰ，Ａ) 登録実用新案3003278（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 4/08 C23C 14/00 C23C 16/44 Continuation of front page (56) Reference JP-A-8-277460 (JP, A) JP-A-3-166362 (JP, A) JP-A-8-176816 (JP, A) JP-A-2-285061 (JP , A) JP 57-126962 (JP, A) JP 1-191768 (JP, A) Registered utility model 3003278 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) C23C 4/08 C23C 14/00 C23C 16/44
Claims (7)
する成膜装置用構成部品において、 前記母材の表面に前記母材と比較して無機酸に溶解し易
い金属からなる下層易溶性金属膜が形成されており、そ
の上に多孔性金属膜が形成されていることを特徴とする
成膜装置用構成部品。1. A component for a film forming apparatus, comprising a base material of a metal plate material having an uneven surface, wherein a lower layer made of a metal that is more easily dissolved in an inorganic acid than the base material on the surface of the base material. A component for a film-forming apparatus, wherein an easily soluble metal film is formed, and a porous metal film is formed thereon.
方向とに２ｍｍピッチで幅１ｍｍ、深さ２ｍｍの溝を掘
って形成されたものである請求項１に記載の成膜装置用
構成部品。 2. The surface of the base material is provided with the irregularities in a vertical direction and a horizontal direction.
Ditch a groove with a width of 1 mm and a depth of 2 mm at a pitch of 2 mm in the direction
The film forming apparatus according to claim 1, which is formed by
Components .
溶性金属膜と同様な上層易溶性金属膜が形成されている
請求項１または請求項２に記載の成膜装置用構成部品。 3. The component for a film forming apparatus according to claim 1, wherein an upper layer easily soluble metal film similar to the lower layer easily soluble metal film is further formed on the porous metal film.
溶性金属膜が銅、ニッケル、またはアルミニウム合金
（Ａ２０１７）によって形成されている請求項１から請
求項３までの何れかに記載の成膜装置用構成部品。 Wherein said lower layer readily soluble metal film and the upper layer readily soluble metal film is copper, nickel or aluminum alloy,
The film forming apparatus component according to any one of claims 1 to 3, which is formed of (A2017) .
ステンレス鋼（ＳＵＳ４２０Ｊ２）によって形成されて
いる請求項１から請求項４までの何れかに記載の成膜装
置用構成部品。 Wherein said porous metal film deposition apparatus for component according to claim 1 which is formed of tungsten or stainless steel (SUS420J2) to claim 4.
または前記上層易溶性金属膜よりも前記無機酸に溶解し
難いアルミニウム合金（Ａ５０５２）またはアルミニウ
ムの板材である請求項１から請求項５までの何れかに記
載の成膜装置用構成部品。 6. A claim of claims 1 plate of said metal is a plate of the lower layer readily soluble metal film or the upper layer readily soluble metal film than dissolved in the inorganic acid hardly aluminum alloy (A5052) or aluminum 5 The constituent part for a film-forming apparatus according to any one of the above.
膜、および前記上層易溶性金属膜がそれぞれ溶射法よっ
て形成されている請求項１から請求項６までの何れかに
記載の装置用構成部品。 7. The apparatus according to claim 1, wherein the lower layer easily soluble metal film, the porous metal film, and the upper layer easily soluble metal film are each formed by a thermal spraying method. Component part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29942097A JP3534989B2 (en) | 1997-10-16 | 1997-10-16 | Component parts for film forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29942097A JP3534989B2 (en) | 1997-10-16 | 1997-10-16 | Component parts for film forming equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11124661A JPH11124661A (en) | 1999-05-11 |
| JP3534989B2 true JP3534989B2 (en) | 2004-06-07 |
Family
ID=17872340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29942097A Expired - Lifetime JP3534989B2 (en) | 1997-10-16 | 1997-10-16 | Component parts for film forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3534989B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100476037C (en) * | 2003-02-19 | 2009-04-08 | 株式会社爱发科 | Film-forming apparatus component and method for cleaning same |
| JP4851700B2 (en) * | 2004-09-30 | 2012-01-11 | 株式会社東芝 | Components for vacuum film forming apparatus and vacuum film forming apparatus |
| JP5983428B2 (en) * | 2013-01-23 | 2016-08-31 | 住友金属鉱山株式会社 | Protective member, film forming apparatus equipped with the same, and method for maintaining protective member |
| KR102454433B1 (en) * | 2015-05-28 | 2022-10-17 | 삼성디스플레이 주식회사 | Apparatus of forming a film and cleaning method thereof |
| JP2021080524A (en) * | 2019-11-20 | 2021-05-27 | 株式会社荏原製作所 | Corrosive wear resistant and wear resistant alloy film and heat transfer pipe, method for manufacturing the same and method for repairing heat transfer pipe |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3003278U (en) | 1994-04-04 | 1994-10-18 | 株式会社エム・アイ・ケー | Rotary cooking equipment |
-
1997
- 1997-10-16 JP JP29942097A patent/JP3534989B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3003278U (en) | 1994-04-04 | 1994-10-18 | 株式会社エム・アイ・ケー | Rotary cooking equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11124661A (en) | 1999-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08277460A (en) | Parts constituting film forming device and their production | |
| JP3791829B2 (en) | Sputtering target with less generation of particles | |
| JPH05230628A (en) | Metal film forming device and metal recovery method in metal film forming device | |
| JP3434947B2 (en) | Shower plate | |
| JP3534989B2 (en) | Component parts for film forming equipment | |
| JP3076768B2 (en) | Method for manufacturing member for thin film forming apparatus | |
| US9481922B2 (en) | Process for forming porous metal coating on surfaces | |
| JP4820508B2 (en) | Sputtering target and manufacturing method thereof, sputtering apparatus, thin film manufacturing method, electronic component manufacturing method | |
| JP4999264B2 (en) | Thin film manufacturing apparatus and manufacturing method thereof | |
| CA2511833C (en) | Components for a film-forming device and method for cleaning the same | |
| JPH07102366A (en) | Thin film forming device | |
| JP4519416B2 (en) | Anti-contamination device for thin film forming equipment | |
| JP2663025B2 (en) | Thin film forming equipment | |
| JP4647249B2 (en) | Thin film forming apparatus component and method of manufacturing the same | |
| CA2511832C (en) | Components for a film-forming device and method for cleaning the same | |
| JP4464188B2 (en) | Method of manufacturing an adhesion prevention jig for semiconductor manufacturing equipment | |
| JP4485003B2 (en) | High strength electrolytic copper foil for particle getter, thin film forming apparatus having the copper foil disposed therein, and method for producing the electrolytic copper foil | |
| TW202311055A (en) | Antifouling film and use thereof that enhances quality and yield of products, and protects and reduces equipment loss | |
| JPH08277469A (en) | Regenerating method for wafer clamping device | |
| JP2000204469A (en) | Member for film forming device, film forming device, film formation and film-formed substrate for magnetic head | |
| JP2003049260A (en) | Member for film deposition apparatus and method for manufacturing the same | |
| JPH06220600A (en) | Washing method of vacuum thin film forming device or the like | |
| KR20020091336A (en) | method for removing titanium and titanium nitride deposited on titanium collimator using sacrificeal layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20040212 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040309 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040310 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20071108 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100319 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130319 Year of fee payment: 9 |